CN218414514U

CN218414514U - Semiconductor wafer carrier

Info

Publication number: CN218414514U
Application number: CN202222744012.8U
Authority: CN
Inventors: 李军
Original assignee: Suzhou Suna Photoelectric Co ltd
Current assignee: Suzhou Suna Photoelectric Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-01-31
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses a semiconductor wafer carrier, which comprises a carrier body, a positioning rod and a driving rod; the carrier body is provided with at least one wafer accommodating groove distributed along a first direction, and the wafer accommodating groove is provided with at least one notch; the positioning rod is connected with the carrier body and is provided with at least one positioning part distributed along a first direction, and each positioning part is arranged corresponding to one corresponding wafer accommodating groove; the shifting lever comprises a shifting piece part, a fulcrum part and an operation part which are sequentially connected, wherein the fulcrum part is movably arranged on the positioning rod and can move on the positioning rod along a first direction, the operation part executes a specified action along a second direction, the shifting piece part moves to a wafer accommodating groove corresponding to the selected positioning part along the second direction, and the second direction is crossed with the first direction. The utility model discloses semiconductor wafer carrier can satisfy the technology user demand of major diameter wafer, and the problem of the clamp of getting difficulty when solution 300mm, 350mm, 400mm, 450mm etc. that can be better loads the transportation in the technology is got.

Description

Semiconductor wafer carrier

Technical Field

The utility model belongs to the technical field of the semiconductor manufacturing, concretely relates to semiconductor wafer carrier.

Background

As is well known, wafers are the most common material for silicon chips of semiconductor integrated circuits and the most common carrier for integrated circuits, and in the development of modern semiconductor technology, wafers play very important roles and functions; in recent years, the development of wafer technology is very rapid, and 12-inch wafers are also used in large quantities in the market from conventional specifications of 4-inch, 5-inch, 6-inch, 8-inch and the like, and in our country, wafers exceeding 12-inch are more commonly used as units of millimeter, such as 300-mm wafers, 350-mm wafers, 400-mm wafers and 450-mm wafers; as we know, the larger the wafer is, the more ICs can be produced on the same wafer, so that the production cost can be greatly reduced; with the development of semiconductor technology in China, 8-inch wafers have been widely used in semiconductor manufacturing.

However, in the semiconductor manufacturing technology, the cleaning and process transferring of the wafer, and the carrier basket and pod of the wafer are also old traditional structures, and the old structures bear the large-sized wafer, so that a lot of defects and inconvenience exist, and especially in the research and development process and in a factory with low automation degree, the larger the wafer size is, the more difficult the extraction or the extraction is; if the tweezers are not used well, the surface of the wafer can be scratched and is extracted by hands, and the surface of the wafer is easy to be polluted; in general, the existing wafer cleaning baskets or cassettes used in the semiconductor industry have the disadvantages of difficult clamping and inconvenient taking when meeting wafers of more than 300 mm.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a semiconductor wafer carrier to overcome the disadvantages of the prior art.

In order to achieve the above object, the embodiment of the present invention adopts a technical solution comprising:

the utility model provides a semiconductor wafer carrier, which comprises a carrier body, a positioning rod and a driving rod;

the carrier body is provided with at least one wafer accommodating groove distributed along a first direction, and the wafer accommodating groove is provided with at least one notch;

the positioning rod is connected with the carrier body and provided with at least one positioning part distributed along a first direction, and each positioning part is arranged corresponding to one corresponding wafer accommodating groove;

the driving lever comprises a shifting piece part, a fulcrum part and an operating part which are sequentially connected, wherein the fulcrum part is movably arranged on the positioning rod and can move on the positioning rod along a first direction, when the fulcrum part is contacted with any selected positioning part, the driving lever forms a lever mechanism by taking the contact part of the fulcrum part and the selected positioning part as a fulcrum, and when the operating part executes appointed action along a second direction, the shifting piece part can move towards a wafer containing groove corresponding to the selected positioning part along the second direction and pushes a semiconductor wafer in the wafer containing groove from an appointed gap of the wafer containing groove, so that the semiconductor wafer is at least partially separated from the wafer containing groove, and the second direction is crossed with the first direction.

Furthermore, the carrier body is provided with a plurality of wafer accommodating grooves arranged at intervals along a first direction, and the positioning rod is provided with a plurality of positioning parts arranged at intervals along the first direction.

Furthermore, the carrier body comprises a first body and a second body, at least one first groove-shaped structure and at least one second groove-shaped structure which are arranged along a first direction are respectively arranged on the first body and the second body, each first groove-shaped structure and a corresponding second groove-shaped structure are oppositely arranged and matched to form a wafer accommodating groove, a gap is reserved between each first groove-shaped structure and the corresponding second groove-shaped structure, and the gap forms the designated notch.

Further, the first direction is a horizontal direction, and the second direction is a vertical direction; and/or the designated notch is positioned at the lower part of the wafer accommodating groove.

Further, the first body and the second body are integrally arranged.

Furthermore, the fulcrum part is provided with an annular structure, and the annular structure is movably sleeved on the positioning rod.

Furthermore, the positioning part comprises positioning grooves distributed on the positioning rod, the supporting point part further comprises a lug structure arranged on the inner wall of the annular structure, and the lug structure can be movably embedded in the positioning grooves.

Furthermore, the axis of the wafer accommodating groove is arranged along the horizontal direction.

Further, the inner edge part of the poking piece part is used for contacting with the outer edge part of the semiconductor wafer and has an arc-shaped structure which is matched with a local area of the outer edge part of the semiconductor wafer.

Further, the semiconductor wafer carrier includes a cleaning basket or a pod.

Compared with the prior art, the utility model discloses following beneficial effect has:

the semiconductor wafer carrier of the utility model can better meet the process use requirements of large-diameter wafer wafers while keeping various advantages of the existing structure, and can better solve the problem of difficult clamping of wafer wafers of more than 300mm, 350mm, 400mm, 450mm and the like during loading and transferring in the process; the utility model discloses the structure is clear, simple manufacture, be convenient for installation dismantlement, extensive applicability are general to can provide a bearing process thinking for semiconductor and chip trade wide use wafer more than 300mm, make can improve the replenishment on work efficiency and the effective instrument, and have very extensive novel practical value.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic view of a semiconductor wafer carrier according to an embodiment of the present application.

Fig. 2 is a schematic structural view of the carrier body in fig. 1.

Fig. 3 is a schematic structural diagram of the positioning rod in fig. 1.

Fig. 4 is a schematic structural diagram of the shift lever in fig. 1.

Description of the reference numerals: 1. the wafer carrier comprises a carrier body, 11 wafer accommodating grooves, 12 threaded connecting holes, 13 first side plates, 14 second side plates, 15 first bodies, 16 second bodies, 2 positioning rods, 21 positioning grooves, 22 threaded structures, 3 deflector rods, 31 fulcrum parts, 32 operating parts, 33 deflector rod parts, 4 nuts and 5 bump structures.

Detailed Description

The present invention will be more fully understood from the following detailed description, which should be read in conjunction with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which can be embodied in various forms. Therefore, specific functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed embodiment.

In view of the defects of the prior art, the inventor of the present invention can provide the technical scheme of the utility model through long-term research and a great deal of practice, and particularly invents a semiconductor wafer carrier with a deflector rod, which has a very wide application market in the process of wafers with the thickness of more than 300mm, can bring great convenience to research and development and production personnel, and can also improve the yield in the chip manufacturing process, thereby greatly improving the production cost; the structure can also be used as an effective tool supplement for widely used wafers with the diameter of more than 300mm, thereby being a little bit of technical cushion for the development of large-size semiconductor wafers. The technical solution, its implementation and principles, etc. will be further explained as follows.

Examples

The embodiment of the utility model provides a semiconductor wafer carrier, as shown in fig. 1-4, comprising a carrier body 1, a positioning rod 2 and a shifting rod 3; the carrier body 1 is provided with at least one wafer accommodating groove 11 distributed along a first direction, and the wafer accommodating groove 11 is provided with at least one notch; the positioning rod 2 is connected with the carrier body 1, the positioning rod 2 is provided with at least one positioning part distributed along a first direction, and each positioning part is arranged corresponding to a corresponding wafer accommodating groove 11; the deflector rod 3 comprises a deflector rod part 33, a fulcrum part 31 and an operation part 32 which are connected in sequence, wherein the fulcrum part 31 is movably arranged on the positioning rod 2 and can move on the positioning rod 2 along a first direction, when the fulcrum part 31 is contacted with any selected positioning part 21, the deflector rod 3 forms a lever mechanism by taking the contact part of the fulcrum part 31 and the selected positioning part as a fulcrum, and when the operation part 32 executes a specified action along a second direction, the deflector rod part 33 can move towards the wafer accommodating groove 11 corresponding to the selected positioning part along the second direction and pushes the semiconductor wafer in the wafer accommodating groove 11 from the specified gap of the wafer accommodating groove 11, so that the semiconductor wafer is at least partially separated from the wafer accommodating groove 11, and the second direction is crossed with the first direction; specifically, in the present embodiment, the first direction is a horizontal direction, and the second direction is a vertical direction.

In the present embodiment, the carrier body 1 has a plurality of wafer accommodating grooves 11 arranged at intervals along a first direction, and the positioning rod 2 has a plurality of positioning portions arranged at intervals along the first direction; as shown in fig. 2, the specific structure of the carrier body 1 includes a first side plate 13, a second side plate 14, and a first body 15 and a second body 16 integrally disposed between the first side plate 13 and the second side plate 14, wherein the first body 15 and the second body 16 are respectively provided with at least one first groove-shaped structure and at least one second groove-shaped structure arranged along a first direction, each first groove-shaped structure and a corresponding second groove-shaped structure are oppositely disposed and matched to form a wafer accommodating slot 11, an axis of the wafer accommodating slot 11 is disposed along a horizontal direction, and a gap is left between each first groove-shaped structure and a corresponding second groove-shaped structure, the gap forms an assigned gap, and the assigned gap is located below the wafer accommodating slot 11; in this embodiment, the lower portions of the first side plate 13 and the second side plate 14 are both provided with inverted U-shaped concave portions, and the height of one inverted U-shaped concave portion is higher than that of the other inverted U-shaped concave portion.

As shown in fig. 2 and 3, two ends of the positioning rod 2 are provided with screw structures 22, and the bottom of the outer side of the second body 16 is symmetrically provided with screw connection holes 12, and as shown in fig. 1, the positioning rod 2 and the second body 16 are connected and fixed through the screw structures 22 and the screw connection holes 12 and are locked through nuts 4.

As shown in fig. 1, 3 and 4, the fulcrum portion 31 has an annular structure movably sleeved on the positioning rod 2, the positioning portion includes positioning slots 21 distributed on the positioning rod 2, the fulcrum portion 31 further includes a bump structure 5 disposed on an inner wall of the annular structure, the bump structure 5 can be movably embedded in the positioning slots 21, an inner edge portion of the pick-up portion 33 is used for contacting with an outer edge portion of the semiconductor wafer, and has an arc-shaped structure matching with a local area of the outer edge portion of the semiconductor wafer.

This embodiment is at the concrete implementation in-process, and the semiconductor wafer carrier can regard as washing basket of flowers, also can regard as the wafer boat box, specifically, the utility model discloses a structure is used in semiconductor wafer washing process just as a washing basket of flowers, just uses as the wafer boat box when this structure is used in the carrier of wafer, and it is when meetting full load wafer in the concrete use, or the great weight of size of wafer is great when, for example when exceeding 300mm, when pressing from both sides the difficulty with tweezers, just can slide driving lever 3 to the constant head tank 21 position of needs, then utilize lever principle to press operating portion 32, driving lever portion 33 just can hold up the wafer of needs, makes things convenient for taking of wafer.

The cleaning flower basket or the wafer boat box which is commonly used in the market at present is rarely applied to the products with the diameter of more than 300mm wafers in view of the size; from the structural point of view, the structure form of the invention of the utility model does not exist; the washing basket of flowers or the wafer boat box of traditional structure when filling with the wafer, or load jumbo size wafer, presss from both sides with tweezers and gets the difficulty, if tweezers use not well, can fish tail wafer surface, with the hand extraction, the finger can not stretch into, makes dirty the wafer surface again easily to lead to the defective rate of product to be very high, invisibly increased the manufacturing cost of enterprise or mill.

The structure of the utility model can not only improve the defect of cleaning the flower basket or the crystal boat box without the deflector rod, but also bring great convenience for research and development and production personnel, improve the working efficiency and improve the yield in the chip manufacturing process, thereby directly reducing the production cost and improving the profit for enterprises or factories; the structure can also be used as an effective tool supplement for widely used wafers with the diameter of more than 300mm, thereby being a little bit of technical cushion for the development of large-size semiconductor wafers.

While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.

Claims

1. A semiconductor wafer carrier is characterized by comprising a carrier body, a positioning rod and a deflector rod;

2. A semiconductor wafer carrier as claimed in claim 1 wherein: the carrier body is provided with a plurality of wafer accommodating grooves arranged at intervals along a first direction, and the positioning rod is provided with a plurality of positioning parts arranged at intervals along the first direction.

3. A semiconductor wafer carrier as claimed in claim 2 wherein: the carrier body comprises a first body and a second body, at least one first groove-shaped structure and at least one second groove-shaped structure are arranged on the first body and the second body respectively, each first groove-shaped structure and one corresponding second groove-shaped structure are arranged oppositely and matched to form a wafer accommodating groove, a gap is reserved between each first groove-shaped structure and one corresponding second groove-shaped structure, and the gap forms the designated notch.

4. A semiconductor wafer carrier as claimed in claim 3 wherein: the first direction is a horizontal direction, and the second direction is a vertical direction; and/or the designated notch is positioned at the lower part of the wafer accommodating groove.

5. A semiconductor wafer carrier as claimed in claim 3 wherein: the first body and the second body are integrally arranged.

6. The semiconductor wafer carrier of claim 1, wherein: the fulcrum part is provided with an annular structure, and the annular structure is movably sleeved on the positioning rod.

7. The semiconductor wafer carrier of claim 6, wherein: the positioning part comprises positioning grooves distributed on the positioning rod, the fulcrum part further comprises a lug structure arranged on the inner wall of the annular structure, and the lug structure can be movably embedded in the positioning grooves.

8. A semiconductor wafer carrier as claimed in claim 1 or 2 wherein: the axis of the wafer accommodating groove is arranged along the horizontal direction.

9. The semiconductor wafer carrier of claim 1, wherein: the inner edge part of the poking piece part is used for contacting with the outer edge part of the semiconductor wafer and has an arc-shaped structure which is matched with a local area of the outer edge part of the semiconductor wafer.

10. The semiconductor wafer carrier of claim 1, wherein: the semiconductor wafer carrier includes a cleaning basket or pod.