CN115775754B - Bonding separation jig and separation method thereof - Google Patents
Bonding separation jig and separation method thereof Download PDFInfo
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- CN115775754B CN115775754B CN202211476180.1A CN202211476180A CN115775754B CN 115775754 B CN115775754 B CN 115775754B CN 202211476180 A CN202211476180 A CN 202211476180A CN 115775754 B CN115775754 B CN 115775754B
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- 238000000926 separation method Methods 0.000 title claims abstract description 55
- 239000011159 matrix material Substances 0.000 claims abstract description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 230000004913 activation Effects 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 18
- 238000011010 flushing procedure Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention discloses a bonding separation jig and a bonding separation method, which belong to the technical field of bonding jigs and are used for separating a first bonding matrix and a second bonding matrix which are mutually attached after activation treatment, wherein the bonding separation jig comprises an upper jig and a lower jig which are stacked up and down, the top surface and the bottom surface of the upper jig are respectively provided with a bearing groove and a water drain opening, the bearing groove comprises a bearing section and a containing section, the top surface of the lower jig is provided with a bearing groove, and the lower jig is provided with a drainage structure for draining water in the bearing groove. The separation method comprises the steps of S1, preparing glassware, and sequentially placing a lower jig and an upper jig; s2, placing the large round part into the bearing section, and suspending the small round part in the accommodating section; s3, flushing the joint of the small round part and the second bonding matrix by water, and taking out the upper jig and the lower jig in sequence for cleaning when the second bonding matrix slides into the receiving groove. The separating process does not need to take part in by tweezers, and can be cleaned without transferring a jig after separation, so that the problems of dirt and scratch can be effectively avoided.
Description
Technical Field
The invention relates to the technical field of bonding jigs, in particular to a bonding separation jig and a separation method thereof.
Background
The wafer bonding technology is an emerging process method, can realize the organic combination between two parts of wafers (usually made of silicon or glass materials), achieves a certain bonding strength, and plays a technical foundation role in the aspects of electric connection of a micro-motor system, packaging combination of micro-electronic devices, film transfer technology of photoelectric communication software and the like. The bonding technology can be divided into two types, namely a direct bonding method and an intermediate layer bonding method according to the existence of an intermediate layer, and can be divided into two types, namely hydrophilic bonding and hydrophobic bonding according to the surface treatment and the subsequent bonding reaction characteristics. The direct bonding method has the advantages of simple process, wide temperature adaptability, high bonding strength and the like, and is a popular research field.
The wafer direct bonding technology is introduced in the manufacturing flow of the AVGG (Anti-alignment Glass-Glass Anti-halation Glass component), and the hydrophilic bonding method is adopted to assemble the AVG (Anti-alignment Glass) and the structural small piece (refer to fig. 9 and 10), which requires four steps of (1) cleaning, (2) surface treatment, (3) pre-bonding and (4) high-temperature annealing, and can refer to a borosilicate Glass hydrophilic bonding method disclosed in patent number of 202210617935.9. In the process of bonding the surface treatment in the second step, the surfaces of the AVG and the structural small pieces are required to be oppositely attached, a reaction reagent is added at an interface to improve the activation energy of a bonding surface, then water is added to separate after constant temperature reaction for a certain time, the AVG and the structural small pieces which are attached together are required to be placed in a container in the separation process, and water is added to enter the interface to realize separation, but due to the hydrophilic characteristic of the surface of the treated glass, the two components are mutually adsorbed, in the slow separation process under the flushing action of flowing water, the AVG part is required to be lifted by tweezers, the separation is assisted by the dead weight of the structural small pieces and the action of flowing water, and the separation is carried out and then transferred to respective cleaning jigs to be cleaned respectively, so that the reagents remained on the surfaces are removed. However, the above process has a number of disadvantages: 1. when the tweezers are used for clamping and contacting with the AVG part, dirt and scratch are easily caused, and when a plurality of groups of components are required to be separated, the efficiency of a mode of flushing and separating one by adopting the tweezers is too low; 2. the separation process needs a certain time of flushing, and AVG and a small structural piece falling into a vessel in the flushing process are easy to collide with each other to cause scratch; 3. after separation, the AVG and the structural small piece are required to be respectively transferred for cleaning, and the transfer process can increase pollution or scratch to products.
Disclosure of Invention
The invention aims to solve the technical problems, and provides a bonding separation jig and a separation method thereof, wherein tweezers are not needed to participate in the separation process, so that the problems of dirt and scratch are avoided in lifting, the cleaning requirement of a first bonding substrate and a second bonding substrate after separation can be effectively met, the cleaning of a transfer jig is not needed, the problem of scratch in the transfer process is avoided, and the second bonding substrate falling into a receiving groove cannot collide with the first bonding substrate, so that the problem of collision and scratch is avoided.
In order to achieve the above object, the present invention provides the following solutions: the invention discloses a bonding separation jig which is used for separating a first bonding matrix and a second bonding matrix which are mutually attached after activation treatment, wherein the first bonding matrix is formed by a small round part attached to the second bonding matrix and a large round part with the diameter larger than that of the small round part coaxially, and the second bonding matrix is a round sheet with the diameter identical to that of the small round part and comprises an upper jig and a lower jig which are stacked up and down; the top surface and the bottom surface of the upper jig are respectively provided with a bearing groove and a water drain opening allowing the second bonding matrix to pass through, the bearing groove and the water drain opening are mutually communicated, and the bearing groove comprises a bearing section for the axis of the large round part to be placed in the horizontal direction and a containing section for the small round part to be suspended; the top surface of lower tool is equipped with and is used for accepting from hold the section dropping second bonding base member accept groove, be equipped with on the lower tool will accept inslot water drainage structure.
Preferably, the distance between the notch of the receiving groove and the groove bottom of the accommodating section is smaller than the diameter of the second bonding base body, and the distance between the groove bottom of the receiving groove and the groove bottom of the accommodating section is larger than the diameter of the second bonding base body.
Preferably, the drainage structure comprises a drainage groove and a drainage outlet, wherein the drainage groove is positioned at one side of the receiving groove and communicated with the receiving groove, the drainage outlet is positioned at the bottom surface of the lower jig, and the drainage groove and the receiving groove are both communicated with the drainage outlet.
Preferably, the drainage structure further comprises a drainage groove which is positioned at the other side of the receiving groove and communicated with the receiving groove, and the drainage groove is communicated with the drainage outlet.
Preferably, the upper jig is provided with a plurality of mutually communicated bearing grooves, the bearing grooves are distributed along the axis and face the same direction, the top surface of the lower jig is provided with bearing grooves with the same number as the bearing grooves, the bearing grooves are distributed along the axis at intervals and face the same direction, and the drainage grooves between the adjacent bearing grooves are mutually communicated.
Preferably, the top surface of lower tool is equipped with the constant head tank.
Preferably, the lifting handle is detachably connected with the upper jig and the lower jig.
Preferably, the handle comprises a connecting vertical rod and a connecting cross rod which are connected in a mutually perpendicular mode, a threaded head is arranged at one end, away from the connecting cross rod, of the connecting vertical rod, an upper threaded hole matched with the threaded head is formed in the upper jig, and a lower threaded hole matched with the threaded head is formed in the lower jig.
The invention also discloses a separation method adopting the bonding separation jig, which comprises the following steps:
s1, preparing glassware, placing the lower jig in the glassware, and stacking the upper jig on the lower jig;
s2, placing large round parts of the first bonding matrix and the second bonding matrix which are mutually attached after surface treatment into a bearing section of a bearing groove of the upper jig, and suspending small round parts in the accommodating section;
s3, washing the joint of the small round part and the second bonding matrix from the upper part slowly by water flow, and taking out the upper jig and the lower jig in sequence after the second bonding matrix gradually slides into the bearing groove of the lower jig under the action of gravity, and cleaning the first bonding matrix in the upper jig and the second bonding matrix in the lower jig respectively.
Preferably, in step S3, the threaded head is mounted in the upper threaded hole, the upper fixture is lifted out of the glassware by lifting the connecting cross rod, then the threaded head is detached, the threaded head is screwed into the lower threaded hole, the connecting cross rod is lifted up, the lower fixture is lifted out of the glassware, and then the threaded head is detached.
Compared with the prior art, the invention has the following technical effects:
1. in the pre-bonding jig, the small round part of the first bonding matrix is suspended, the second bonding matrix naturally drops under water flow flushing, tweezers are not used for contacting products in the whole separation process, impurities are not additionally introduced, pollution and scratching of the products are avoided, the upper jig and the lower jig are in a vertically stacked mode, the upper jig and the lower jig can be detached after separation to directly clean the two parts independently, the first bonding matrix and the second bonding matrix do not need to be transferred, pollution caused by contacting products in the process of transferring the jigs can be avoided, and the bonding separation jig can be widely applied to various materials such as glass, silicon, III-V materials and the like, and is particularly suitable for the manufacturing process of AVGG products.
2. In the pre-bonding jig, the distance between the groove opening of the receiving groove and the groove bottom is smaller than the diameter of the second bonding matrix, and the second bonding matrix enters the receiving groove when being separated from the small round part, so that rollover of the second bonding matrix is avoided when the second bonding matrix falls down; meanwhile, the distance between the bottom of the receiving groove and the bottom of the accommodating section is larger than the diameter of the second bonding matrix, the vertical fall meets the height of the product, the first bonding matrix and the second bonding matrix are not contacted with each other after separation, and collision scratch cannot be caused under water flow flushing.
3. In the pre-bonding jig, the upper jig and the lower jig are designed in multiple grooves, a single separating jig can realize the separation of a plurality of first bonding matrixes and second bonding matrixes at one time, if a large container is adopted, the plurality of separating jigs can be placed at one time, the quantity of products separated in the same time can be adjusted according to the quantity of the products, the quantity of the products separated in the same time is increased by more than a plurality of times, and compared with the condition that the products are lifted one by using tweezers, the operation efficiency is remarkably improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a three-dimensional structure diagram of a bonding separation jig;
FIG. 2 is a perspective view of the upper fixture;
FIG. 3 is a perspective view of the lower fixture;
FIG. 4 is a perspective view of the upper fixture after the second bonding matrix falls;
FIG. 5 is a perspective view of a lower fixture with a second bonding matrix received therein;
FIG. 6 is a perspective view of the handle;
FIG. 7 is a perspective view of the lower fixture after the upper handle is installed;
FIG. 8 is a cross-sectional view of a bond separating jig;
FIG. 9 is a block diagram showing the first and second bond substrates attached to each other after surface activation;
fig. 10 is a structural view of the first bonding matrix and the second bonding matrix after separation.
Reference numerals illustrate: 1. an upper jig; 2. a lower jig; 3. a handle; 4. a first bonding matrix; 5. a second bonding matrix; 101. a water discharge port; 102. a support section; 103. a receiving section; 104. an upper threaded hole; 201. a receiving groove; 202. a drainage channel; 203. a water drain tank; 204. a water outlet; 205. a positioning groove; 206. a lower threaded hole; 301. a thread head.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The embodiment discloses bonding separation jig for separating a first bonding matrix 4 and a second bonding matrix 5 which are mutually attached after activation treatment, wherein the first bonding matrix 4 is formed by a small round part and a large round part coaxially, the diameter of the large round part is larger than that of the small round part, the small round part is attached to the second bonding matrix 5, and the second bonding matrix 5 is a round sheet with the same diameter as that of the small round part. As shown in fig. 1 to 10, the bonding separation jig includes an upper jig 1 and a lower jig 2, and the upper jig 1 and the lower jig 2 can be stacked up and down. The top surface and the bottom surface of the upper jig 1 are respectively provided with a bearing groove and a water drain 101, the bearing groove and the water drain 101 are mutually communicated, and the water drain 101 is sized to allow the second bonding matrix 5 flushed by water flow to fall down and pass through. The bearing groove comprises a bearing section 102 and a containing section 103, the bearing section 102 is used for installing an enlarged round part, after the large round part is installed on the bearing section 102, the axis of the large round part is in the horizontal direction, and the small round part and the second bonding matrix 5 are suspended in the containing section 103. The top surface of the lower jig 2 is provided with a receiving groove 201, the receiving groove 201 is used for receiving the second bonding base body 5 falling from the receiving section 103, as the groove width of the receiving groove 201 is preferably slightly larger than the thickness of the second bonding base body 5, the receiving groove 201 corresponds to the receiving section 103, and as shown in fig. 8, the lower jig 2 is provided with a drainage structure for draining water in the receiving groove 201, the drainage structure is not limited to a specific structure, as long as drainage can be performed, i.e. drainage through holes or rectangular drainage through holes are densely distributed on the top surface of the lower jig 2, and the like. The holding groove may be provided with one or a plurality of holding grooves for simultaneously separating the plurality of sets of first bonding substrates 4 and second bonding substrates 5. The number of the corresponding receiving grooves 201 is the same as the number of the bearing grooves, and the number of the corresponding receiving grooves can be one or a plurality of the corresponding receiving grooves. The bonding separation jig can be widely applied to various materials, such as glass, silicon, III-V materials and the like, and is particularly suitable for the manufacturing process of AVGG products, namely, the first bonding matrix 4 is an AVG product, and the second bonding matrix 5 is a small structural piece.
Working principle: after the upper jig 1 and the lower jig 2 are stacked together and placed in one container, the small round portions and the activation surfaces (i.e., the bonding surfaces) of the second bonding substrates 5 are slowly washed down from above the first bonding substrate 4 and the second bonding substrate 5 with pure water, the second bonding substrate 5 slowly falls down from the containing section 103 (as shown in fig. 1) under the self weight and the water flow washing, then falls into the containing groove 201 of the containing groove 201 through the water drain 101 (as shown in fig. 5), the first bonding substrate 4 is left in the upper jig 1 (as shown in fig. 4) to finish the separation, and the upper jig 1 and the lower jig 2 can be taken out in sequence in the later stage to be taken out for cleaning. The whole separation process is free from using tweezers to contact products, impurities are not additionally introduced, the products are not polluted and scratched, the upper and lower parts can be separated, the jigs are not required to be transferred after separation, the upper jig 1 and the lower jig 2 can be directly cleaned independently, and pollution caused by contact of the products in the jig transferring process is avoided.
In this embodiment, as shown in fig. 1 to 10, the distance between the slot opening of the receiving groove 201 and the slot bottom of the accommodating section 103 is smaller than the diameter of the second bonding matrix 5, so that when the second bonding matrix 5 is about to break away from the small round portion, the second bonding matrix 5 can already enter the receiving groove 201, and rollover when falling down is avoided. Meanwhile, the distance between the bottom of the receiving groove 201 and the bottom of the accommodating section 103 is larger than the diameter of the second bonding matrix 5, so that the groove bottom of the receiving groove 201 is guaranteed to have enough drop, the second bonding matrix 5 is completely separated from the small round part of the first bonding matrix 4 after falling into the receiving groove 201, the second bonding matrix 5 and the first bonding matrix 4 are guaranteed not to be contacted with each other after separation, and collision scratch cannot be caused under water flow flushing.
In this embodiment, as shown in fig. 1 to 10, the drainage structure includes a drainage groove 202 located at one side of the receiving groove 201 and a drainage opening 204 located at the bottom surface of the lower fixture 2, the drainage groove 202 is located at one side of the receiving groove 201 near the supporting section 102, the drainage groove 202 is communicated with the receiving groove 201, and both the drainage groove 202 and the receiving groove 201 are communicated with the drainage opening 204.
Further, in order to improve the drainage capability of the lower fixture 2, in this embodiment, as shown in fig. 1 to 10, the drainage structure further includes a drainage groove 203 located at the other side of the receiving groove 201, and the drainage groove 203 communicates with the drainage port 204.
In order to improve the separation efficiency, in this embodiment, as shown in fig. 1 to 10, a plurality of mutually communicated supporting grooves are formed on the upper fixture 1, and the plurality of supporting grooves are arranged along the axis and face the same direction, so as to form a space arrangement mode of the supporting section 102, the accommodating section 103, the supporting section 102 and the accommodating section 103. The top surface of the lower jig 2 is provided with bearing grooves 201 with the same number as the bearing grooves, a plurality of bearing grooves 201 are distributed along the axis at intervals and face the same direction, and the drainage grooves 202 and the drainage grooves 203 between the adjacent bearing grooves 201 are mutually communicated. Taking fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 7 and fig. 8 as an example, 11 supporting grooves are provided in the upper jig 1, and 11 supporting grooves 201 are provided in the lower jig 2, so that 11 groups of first bonding substrates 4 and second bonding substrates 5 can be separated at a time, and in the use process, the number of products which can be separated according to the need can be matched with the containers with proper sizes, and of course, the number of the supporting grooves and the supporting grooves 201 is not limited to 11 grooves.
In this embodiment, as shown in fig. 1 to 10, the top surface of the lower fixture 2 is provided with a positioning groove 205, which is convenient for quick placement and stabilization after placement of the upper fixture 1.
In this embodiment, as shown in fig. 1 to 10, the bonding separation jig further includes a handle 3 detachably connected to the upper jig 1 and the lower jig 2, so as to sequentially lift the upper jig 1 and the lower jig 2 out of the container.
Further, in this embodiment, as shown in fig. 1 to 10, the handle 3 includes a connecting vertical rod and a connecting cross rod that are connected vertically, one end of the connecting vertical rod, which is far away from the connecting cross rod, is provided with a threaded head 301, the upper fixture 1 is provided with an upper threaded hole 104 that is matched with the threaded head 301, and the lower fixture 2 is provided with a lower threaded hole 206 that is matched with the threaded head 301.
Example 2
The present embodiment provides a separation method using the bonding separation jig according to embodiment 1, as shown in fig. 1 to 3, comprising the steps of:
s1, preparing glassware, placing a lower jig 2 in the glassware, and stacking an upper jig 1 on the lower jig 2;
s2, placing large round parts of the first bonding matrix 4 and the second bonding matrix 5 which are mutually attached after surface treatment into a bearing section 102 of a bearing groove of the upper jig 1, and suspending small round parts in a containing section 103;
s3, washing the joint of the small round part and the second bonding matrix 5 slowly by water flow from the upper part, taking out the upper jig 1 and the lower jig 2 in sequence after the second bonding matrix 5 gradually slides into the receiving groove 201 of the lower jig 2 under the action of gravity, and cleaning the first bonding matrix 4 in the upper jig 1 and the second bonding matrix 5 in the lower jig 2 respectively.
In this embodiment, as shown in fig. 1 to 10, in step S3, the upper screw head 301 is mounted in the upper screw hole 104, the upper jig 1 is lifted out of the glass vessel by lifting up the connecting rail, and then the screw head 301 is detached and sent to washing. The screw head 301 is screwed into the lower threaded hole 206, the connecting cross bar is lifted up, the lower jig 2 is lifted up from the glassware, and the screw head 301 is detached and sent for cleaning. Removing the handle 3 during cleaning avoids the gap from remaining with contaminants or particles.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (10)
1. The utility model provides a bonding separation tool for separate the first bonding base member and the second bonding base member that laminate each other after the activation treatment, first bonding base member is by the little circle portion and the bight coaxial constitution of diameter greater than little circle portion that laminate with the second bonding base member, the second bonding base member is the diameter with little circle portion the same circular thin slice, its characterized in that includes upper jig and lower jig that stacks from top to bottom; the top surface and the bottom surface of the upper jig are respectively provided with a bearing groove and a water drain opening allowing the second bonding matrix to pass through, the bearing groove and the water drain opening are mutually communicated, and the bearing groove comprises a bearing section for the axis of the large round part to be placed in the horizontal direction and a containing section for the small round part to be suspended; the top surface of lower tool is equipped with and is used for accepting from hold the section dropping second bonding base member accept groove, be equipped with on the lower tool will accept inslot water drainage structure.
2. The bonding separation jig according to claim 1, wherein a distance between a notch of the receiving groove and a groove bottom of the accommodating section is smaller than a diameter of the second bonding base body, and a distance between a groove bottom of the receiving groove and a groove bottom of the accommodating section is larger than a diameter of the second bonding base body.
3. The bonding separation jig according to claim 1 or 2, wherein the drainage structure comprises a drainage groove which is positioned at one side of the receiving groove and communicated with the receiving groove, and a drainage opening which is positioned at the bottom surface of the lower jig, and the drainage groove and the receiving groove are both communicated with the drainage opening.
4. A bonding separation jig according to claim 3, wherein the drain structure further comprises a drain groove which is located at the other side of the receiving groove and communicates with the receiving groove, the drain groove communicating with the drain opening.
5. The bonding separation jig according to claim 4, wherein the upper jig is provided with a plurality of mutually communicated supporting grooves, the plurality of supporting grooves are arranged along an axis and face the same direction, the top surface of the lower jig is provided with bearing grooves with the same number as the supporting grooves, the plurality of bearing grooves are arranged along an axis at intervals and face the same direction, and the drainage grooves between the adjacent bearing grooves are mutually communicated.
6. The bonding separation jig according to claim 5, wherein a positioning groove is formed in the top surface of the lower jig.
7. The bonding separation jig according to claim 1 or 2, further comprising a handle detachably connectable to both the upper jig and the lower jig.
8. The bonding separation jig according to claim 7, wherein the handle comprises a connecting vertical rod and a connecting cross rod which are connected vertically, a threaded head is arranged at one end, far away from the connecting cross rod, of the connecting vertical rod, an upper threaded hole matched with the threaded head is formed in the upper jig, and a lower threaded hole matched with the threaded head is formed in the lower jig.
9. A separation method using the bonding separation jig according to any one of claims 1 to 8, comprising the steps of:
s1, preparing glassware, placing the lower jig in the glassware, and stacking the upper jig on the lower jig;
s2, placing large round parts of the first bonding matrix and the second bonding matrix which are mutually attached after surface treatment into a bearing section of a bearing groove of the upper jig, and suspending small round parts in the accommodating section;
s3, washing the joint of the small round part and the second bonding matrix from the upper part slowly by water flow, and taking out the upper jig and the lower jig in sequence after the second bonding matrix gradually slides into the bearing groove of the lower jig under the action of gravity, and cleaning the first bonding matrix in the upper jig and the second bonding matrix in the lower jig respectively.
10. A separation method according to claim 9, wherein the bonding separation jig according to claim 8 is used, and in step S3, the screw head is mounted in the upper screw hole, the upper jig is lifted out of the glass vessel by lifting up the connection cross bar, then the screw head is removed, and the screw head is screwed into the lower screw hole, the connection cross bar is lifted up, the lower jig is lifted out of the glass vessel, and then the screw head is removed.
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|---|---|---|---|---|
| KR20110063420A (en) * | 2011-05-24 | 2011-06-10 | 주식회사 에이에스이 | Wafer separator and transferring device |
| CN111300205A (en) * | 2020-03-17 | 2020-06-19 | 东莞市晶博光电有限公司 | Edge sweeping jig |
| CN112420512A (en) * | 2020-11-23 | 2021-02-26 | 上海新微科技集团有限公司 | Method for separating thin film wafer from residual wafer in bonding structure |
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| CN115775754A (en) | 2023-03-10 |
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Denomination of invention: A bonding separation fixture and its separation method Effective date of registration: 20231129 Granted publication date: 20230714 Pledgee: Bank of Hangzhou Co.,Ltd. Fuyang Jiangnan Shopping Mall Small and Micro Enterprises Exclusive Sub branch Pledgor: Hangzhou Bangqizhou Technology Co.,Ltd. Registration number: Y2023980068019 |