CN214327950U - Cathode and anode adjusting device for electroplating line - Google Patents

Cathode and anode adjusting device for electroplating line Download PDF

Info

Publication number
CN214327950U
CN214327950U CN202023287815.2U CN202023287815U CN214327950U CN 214327950 U CN214327950 U CN 214327950U CN 202023287815 U CN202023287815 U CN 202023287815U CN 214327950 U CN214327950 U CN 214327950U
Authority
CN
China
Prior art keywords
hole
electroplating
liquid level
anode
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202023287815.2U
Other languages
Chinese (zh)
Inventor
马卓
杨广元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xunjiexing Technology Corp ltd
Original Assignee
Shenzhen Xunjiexing Technology Corp ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xunjiexing Technology Corp ltd filed Critical Shenzhen Xunjiexing Technology Corp ltd
Priority to CN202023287815.2U priority Critical patent/CN214327950U/en
Application granted granted Critical
Publication of CN214327950U publication Critical patent/CN214327950U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The utility model provides a negative and positive pole adjusting device of plating line, include: anode solid copper ball, treat the copper-clad plate of electroplating, electroplating cylinder bottom floating frame and electroplating liquid level top current baffle, the both sides of copper-clad plate are equallyd divide and do not are provided with anode solid copper ball, electroplating cylinder bottom floating frame set up in the below of copper-clad plate, the orientation of electroplating cylinder bottom floating frame the both sides of anode solid copper ball are provided with the curb plate, the curb plate seted up one row of first through-hole and multirow second through-hole, first through-hole is located the top of second through-hole, the multirow third through-hole has been seted up on the electroplating liquid level top current baffle. The utility model discloses be provided with the through-hole on electroplating cylinder bottom floating frame and electroplating liquid level top current baffle respectively for the middle part of electric current flow direction line is comparatively even, and upper and lower regional electric current flow direction is denser, thereby has decomposed the regional electric current of high current, has improved the copper facing homogeneity that the figure was electroplated.

Description

Cathode and anode adjusting device for electroplating line
Technical Field
The utility model relates to the field of circuit board manufacturing, in particular to a cathode and anode adjusting device for an electroplating line.
Background
At present, the accessory in the industry is common, namely a triangular frame, and the current effect of decomposing a high-current area at the bottom is not good, so that the pattern electroplating copper plating is uneven. The current electroplating method which is commonly used in the industry is to reduce the electroplating current, produce small current for a long time, seriously affect the production yield, and still can not meet the quality requirements of isolated lines, isolated double lines and isolated holes.
SUMMERY OF THE UTILITY MODEL
The utility model provides a cathode and anode adjusting device of an electroplating line, which aims to solve at least one technical problem.
In order to solve the above problems, according to an aspect of the present invention, there is provided a cathode/anode adjusting device for a plating line, comprising: anode solid copper ball, treat the copper-clad plate of electroplating, electroplating cylinder bottom floating frame and electroplating liquid level top current baffle, the both sides of copper-clad plate are equallyd divide and do not are provided with anode solid copper ball, electroplating cylinder bottom floating frame set up in the below of copper-clad plate, the orientation of electroplating cylinder bottom floating frame the both sides of anode solid copper ball are provided with the curb plate, the curb plate seted up one row of first through-hole and multirow second through-hole, first through-hole is located the top of second through-hole, the multirow third through-hole has been seted up on the electroplating liquid level top current baffle.
Preferably, the height of the floating frame at the bottom of the electroplating cylinder is 15cm, the aperture of the first through hole is 15mm, the aperture of the second through hole is 10mm, the hole interval of the first through hole is 15mm, and the hole interval of the second through hole is 10 mm.
Preferably, the side plate is provided with four rows of second through holes.
Preferably, the maximum aperture of the third through hole is 10mm, the hole pitch of the third through hole is 10mm, and the thickness of the current baffle at the top of the electroplating liquid level is 2 mm.
Preferably, the electroplating liquid level top current baffle is made of a PP material.
Preferably, five rows of third through holes are formed in the current baffle plate at the top of the electroplating liquid level.
In the technical scheme, the utility model discloses be provided with the through-hole on electroplating cylinder bottom floating frame and electroplating liquid level top current baffle respectively for the middle part of electric current flow direction line is comparatively even, and upper and lower regional electric current flow direction is intensive, thereby has decomposed the regional electric current of high current, has improved the copper facing homogeneity that the figure was electroplated.
Drawings
Fig. 1 schematically shows a schematic structural view of the present invention;
fig. 2 schematically shows a structural view of a side plate;
FIG. 3 schematically shows a structural view of a current baffle at the top of the electroplating liquid level.
Reference numbers in the figures: 1. liquid level line of liquid medicine; 2. an anodic solid copper ball; 3. copper-clad plate; 4. a current flow direction line; 5. a floating frame at the bottom of the electroplating tank; 6. a current baffle plate at the top of the electroplating liquid level; 7. a side plate; 8. a first through hole; 9. a second through hole; 10. a third via.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As one aspect of the utility model, a cathode and anode adjusting device for an electroplating line is provided, comprising: anode solid copper ball 2, treat electroplated copper-clad plate 3, electroplating cylinder bottom floating frame 5 and electroplating liquid level top current baffle 6, the both sides of copper-clad plate 3 are equallyd divide and do not are provided with anode solid copper ball 2, electroplating cylinder bottom floating frame 5 set up in the below of copper-clad plate 3, electroplating cylinder bottom floating frame 5's orientation anode solid copper ball 2's both sides are provided with curb plate 7, curb plate 7 seted up one row of first through-hole 8 and multirow second through-hole 9, first through-hole 8 is located the top of second through-hole 9, electroplating liquid level top current baffle 6 is last to have seted up multirow third through-hole 10.
Preferably, the height of the floating frame 5 at the bottom of the electroplating cylinder is 15cm, the aperture of the first through hole 8 is 15mm, the aperture of the second through hole 9 is 10mm, the hole pitch of the first through hole 8 is 15mm, and the hole pitch of the second through hole 9 is 10 mm. Preferably, the side plate 7 is provided with four rows of second through holes 9.
Preferably, the maximum aperture of the third through hole 10 is 10mm, the hole pitch of the third through hole 10 is 10mm, and the thickness of the electroplating liquid level top current baffle 6 is 2 mm. Preferably, the electroplating liquid level top current baffle 6 is made of PP material. Preferably, five rows of third through holes 10 are formed in the electroplating liquid level top current baffle 6.
In the technical scheme, the utility model discloses be provided with the through-hole on electroplating cylinder bottom floating frame 5 and electroplating liquid level top current baffle 6 respectively for the middle part of electric current flow direction line 4 is comparatively even, and upper and lower regional electric current flow direction is more intensive (belongs to the regional easy board that burns of high current, and copper thickness is thick during the copper facing), thereby has decomposed the regional electric current of high current, has improved the copper facing homogeneity that the figure was electroplated.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. A cathode and anode adjusting device for an electroplating line is characterized by comprising: anode solid copper ball (2), treat electroplated copper-clad plate (3), electroplating cylinder bottom floating frame (5) and electroplating liquid level top current baffle (6), the both sides of copper-clad plate (3) are equallyd divide and do not are provided with anode solid copper ball (2), electroplating cylinder bottom floating frame (5) set up in the below of copper-clad plate (3), the orientation of electroplating cylinder bottom floating frame (5) the both sides of anode solid copper ball (2) are provided with curb plate (7), curb plate (7) seted up one row of first through-hole (8) and multirow second through-hole (9), first through-hole (8) are located the top of second through-hole (9), electroplate liquid level top current baffle (6) and go up and seted up multirow third through-hole (10).
2. The cathode and anode adjusting device of the electroplating line according to claim 1, wherein the height of the floating frame (5) at the bottom of the electroplating cylinder is 15cm, the aperture of the first through hole (8) is 15mm, the aperture of the second through hole (9) is 10mm, the hole pitch of the first through hole (8) is 15mm, and the hole pitch of the second through hole (9) is 10 mm.
3. The cathode and anode adjusting device for the electroplating line according to claim 1, wherein the side plate (7) is provided with four rows of second through holes (9).
4. The cathode and anode adjusting device of the electroplating line according to claim 1, wherein the maximum aperture of the third through hole (10) is 10mm, the hole pitch of the third through hole (10) is 10mm, and the thickness of the electroplating liquid level top current baffle plate (6) is 2 mm.
5. The cathode and anode adjusting device of the electroplating line according to claim 4, wherein the electroplating liquid level top current baffle (6) is made of PP material.
6. The cathode and anode adjusting device for the electroplating line as claimed in claim 4, wherein the current baffle (6) at the top of the electroplating liquid level is provided with five rows of third through holes (10).
CN202023287815.2U 2020-12-30 2020-12-30 Cathode and anode adjusting device for electroplating line Active CN214327950U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023287815.2U CN214327950U (en) 2020-12-30 2020-12-30 Cathode and anode adjusting device for electroplating line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023287815.2U CN214327950U (en) 2020-12-30 2020-12-30 Cathode and anode adjusting device for electroplating line

Publications (1)

Publication Number Publication Date
CN214327950U true CN214327950U (en) 2021-10-01

Family

ID=77903989

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023287815.2U Active CN214327950U (en) 2020-12-30 2020-12-30 Cathode and anode adjusting device for electroplating line

Country Status (1)

Country Link
CN (1) CN214327950U (en)

Similar Documents

Publication Publication Date Title
CN101054701B (en) Method of increasing electroplating evenness
CN204874804U (en) Copper facing groove
CN104862767B (en) Copper plating tank
CN201534890U (en) Pure tin electroplating device
CN106167913B (en) Plating bath device
CN214327950U (en) Cathode and anode adjusting device for electroplating line
CN115852412A (en) Integrated alkaline electrolytic tank bipolar plate
CN103233250B (en) A kind of thick layer gold gold finger galvanizing method
CN205420584U (en) Negative pole floating frame and PCB electro -coppering production line
CN201924097U (en) Electroplating device
CN102534733A (en) Electroplating device and electroplating method
CN101760770B (en) Electroplating equipment for electrode of silicon solar cell slice
CN202881424U (en) Anode baffle for electroplating
CN202509147U (en) Electroplating bath
CN204303565U (en) A kind of conductive plate
CN104204307B (en) Operate the anode and method of electrolysis cells
CN201713591U (en) Plating equipment for electrode of silicon solar battery plate
CN211689284U (en) Double-layer titanium mesh anode for horizontal electroplating of PCB
CN112888169B (en) Current shunting method for pattern electroplating
CN212713809U (en) Improved floating frame structure of electroplating cylinder
CN218830766U (en) Circuit board with uniform plating of effective lifting holes
CN218175185U (en) Electroplating anode baffle and electroplating equipment
CN217104127U (en) Cathode double-layer floating frame for electroplating
CN215713466U (en) Auxiliary jig for electroplating substrate
CN219430164U (en) Reverse V-shaped anode layout electroplating bath body

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant