CN218830766U - Circuit board with uniform plating of effective lifting holes - Google Patents
Circuit board with uniform plating of effective lifting holes Download PDFInfo
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- CN218830766U CN218830766U CN202222875418.XU CN202222875418U CN218830766U CN 218830766 U CN218830766 U CN 218830766U CN 202222875418 U CN202222875418 U CN 202222875418U CN 218830766 U CN218830766 U CN 218830766U
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Abstract
The utility model relates to the technical field of circuit boards, in particular to a circuit board with uniform plated lifting holes, which comprises a circuit board body; the circuit board body comprises a copper layer and an ink layer; the circuit board body consists of an invalid area and a plurality of effective areas; the circuit board body is provided with a plurality of electroplating holes in the effective area in a penetrating way; the ink layer of the invalid area is provided with a plurality of first solder resist windowing holes and a plurality of second solder resist windowing holes; the second solder resist windowing hole is formed in the periphery of the invalid area; the first solder resist windowing hole is formed in the middle of the invalid area; the aperture of the first solder resist opening is larger than the aperture of the second solder resist opening. The utility model discloses an increase the setting of windowing in the peripheral invalid area of different active areas to form first hinder and weld the hole of windowing and the second hinders and welds the hole of windowing and carry out the sharing electric current, can promote the electric current distribution homogeneity, increase incomplete copper rate size, finally reach and realize the thick even purpose of high current region electroplate hole electrocoppering.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to effective lifting hole plates even circuit board.
Background
In the manufacturing process of the circuit board, electroplating operation needs to be carried out on the hole of the circuit board; with the application of the vertical continuous plating line, compared with the traditional gantry plating line, the current density distribution of the copper cylinder of the vertical continuous plating line is changed, namely a high-low potential area is changed; as shown in fig. 1, in the electroplating process, the front end and the rear end of the vertical continuous electroplating device are respectively provided with an upper baffle and a lower baffle, so that the current density of the middle part of the vertical continuous electroplating device, namely the middle part of the circuit board, is higher, the electronic capability obtained by attraction is stronger, and the electroplating current distribution of the FPC double-sided hole product is gradually reduced from the middle high current to the periphery.
However, the problem that the middle area electricity Kong Konghuan is easy to be electroplated with copper and is excessively thick due to the reasons frequently occurs in the current electric hole products manufactured by the vertical continuous electroplating line, so that the problem that a circuit process always feeds back a pressed film is not practical or is not cleanly etched is solved, the electric hole products are mainly fine circuit products, the size of the surface copper is strictly required, only the electric hole copper is carried out, and the problem that the middle area electricity Kong Konghuan is electroplated with copper and is excessively thick due to large difference of high and low currents.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the above-mentioned among the prior art not enough, provide an effective lifting hole plates even circuit board.
The purpose of the utility model is realized through the following technical scheme: a circuit board with uniform plated effective lifting holes comprises a circuit board body; the circuit board body comprises a copper layer and an ink layer covering the surface of the copper layer;
the circuit board body consists of an invalid area and a plurality of effective areas; the circuit board body is provided with a plurality of electroplating holes in the effective area in a penetrating way;
the ink layer of the invalid area is provided with a plurality of first solder resist windowing holes and a plurality of second solder resist windowing holes; the first solder resist windowing hole and the second solder resist windowing hole are used for exposing the copper layer of the invalid area; the second solder resist windowing hole is formed in the periphery of the invalid area; the first resistance welding windowing hole is formed in the middle of the invalid area; the aperture of the first solder resist opening is larger than the aperture of the second solder resist opening.
The utility model is further arranged in such a way that the electroplating holes are evenly arranged in the effective area.
The utility model is further arranged that the invalid region comprises a first invalid region arranged in the middle of the circuit board body and a second invalid region arranged around the circuit board body;
the first solder resist windowing hole is formed in the first invalid area; the second resistance welding windowing hole is formed in the second invalid area.
The utility model discloses it is further set up to, a plurality of first hinder welds the window and evenly locates first invalid area.
The utility model discloses it is further set up to, a plurality of the second hinders to weld the hole of windowing and evenly locates the invalid region of second.
The utility model discloses further set up to, two adjacent first intervals that hinder to weld the fenestration are greater than two adjacent second and hinder the interval that welds the fenestration.
The utility model discloses further set up as, first cross sectional shape and the second of hindering to weld the fenestration are circular.
The utility model is further arranged that the effective area is provided with an upper effective area and a lower effective area in the middle of the circuit board body; the upper effective area and the lower effective area are arranged in a mirror surface manner; the first inactive area is disposed around the upper active area and the lower active area.
The utility model discloses further set up to, go up effective area's shape and effective area's shape down and be L shape setting.
The utility model has the advantages that: the utility model discloses an increase the setting of windowing in the peripheral invalid area of different active areas to form first hinder and weld the hole of windowing and the second hinders and welds the hole of windowing and carry out the sharing electric current, can promote the electric current distribution homogeneity, increase incomplete copper rate size, finally reach and realize the thick even purpose of high current region electroplate hole electrocoppering.
Drawings
The invention is further described with the aid of the accompanying drawings, in which the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, without inventive step, other figures can be derived from the following figures.
FIG. 1 is a schematic view of the present invention during electroplating;
FIG. 2 is a schematic structural view of the present invention before windowing;
FIG. 3 is a schematic structural view after the window of the present invention is opened;
wherein: 1. a circuit board body; 11. a copper layer; 12. an ink layer; 2. an active area; 21. electroplating holes; 3. an invalid region; 31. a first solder mask aperture; 32. a second solder mask aperture; 41. a first ineffective area; 42. a second invalid region; 51. an upper effective area; 52. a lower effective area; 6. vertical continuous electroplating equipment; 61. an upper baffle plate; 62. and a lower baffle plate.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 2 to 3, the circuit board with uniform plated lifting holes of the embodiment includes a circuit board body 1; the circuit board body 1 comprises a copper layer 11 and an ink layer 12 covering the surface of the copper layer 11;
the circuit board body 1 consists of an invalid area 3 and a plurality of effective areas 2; the circuit board body 1 is provided with a plurality of electroplating holes 21 in the effective area 2 in a penetrating way;
the ink layer 12 of the invalid region 3 is provided with a plurality of first solder mask opening holes 31 and a plurality of second solder mask opening holes 32; the first solder resist opening 31 and the second solder resist opening 32 are used for exposing the copper layer 11 of the inactive area 3; the second solder resist opening holes 32 are formed around the ineffective area 3; the first welding-resistance opening hole 31 is arranged in the middle of the invalid area 3; the first solder resist opening 31 has a larger aperture than the second solder resist opening 32.
Specifically, the circuit board with uniform plating of the effective lifting holes in the embodiment is characterized in that on the basis of manufacturing of the effective areas 2, windowing arrangement is added in the ineffective areas 3 around different effective areas 2, so that a first anti-welding window hole 31 and a second anti-welding window hole 32 are formed to share current, and the current in the middle is larger than the current around, so that the aperture of the first anti-welding window hole 31 in the middle is larger than that of the second anti-welding window hole 32, the current distribution uniformity can be improved, the residual copper rate is increased, and the purpose of achieving uniform thickness of the electroplated copper in the electroplating holes 21 in the high-current area is finally achieved.
In the circuit board with uniform plating of the effective lifting holes in the embodiment, the plating holes 21 are uniformly formed in the effective area 2. Through the arrangement, the current distribution uniformity can be further improved, and the purpose of uniform thickness of the electroplated copper in the electroplating holes 21 in the high-current area is achieved.
In the circuit board with uniform plating of the effective lifting holes in this embodiment, the ineffective area 3 includes a first ineffective area 41 disposed in the middle of the circuit board body 1 and a second ineffective area 42 disposed around the circuit board body 1;
the first solder resist opening 31 is provided in the first ineffective area 41; the second solder resist opening 32 is provided in the second ineffective area 42.
Specifically, since the current in the middle is larger than the current around, the first ineffective area 41 is provided in the middle of the circuit board body 1, and the first solder resist opening hole 31 of the first ineffective area 41 has a larger hole diameter, so that the thickness of the plated copper in the plated hole 21 can be made uniform.
In the circuit board with uniform effective lift hole plating according to this embodiment, the first solder mask openings 31 are uniformly disposed in the first ineffective area 41. Through the arrangement, the current distribution uniformity can be further improved, so that the purpose of uniform electroplated copper thickness of the electroplating holes 21 in the high-current area is realized.
In the circuit board with uniform effective lift hole plating according to the embodiment, the second solder mask openings 32 are uniformly formed in the second inactive area 42. Through the arrangement, the current distribution uniformity can be further improved, so that the purpose of uniform electroplated copper thickness of the electroplating holes 21 in the high-current area is realized.
In the circuit board with uniform plated effective lift holes, the distance between two adjacent first solder resist opening holes 31 is greater than the distance between two adjacent second solder resist opening holes 32. Through the arrangement, the stability of the circuit board structure is ensured while the current in the middle part can be effectively shared.
In the circuit board with uniform effective lift hole plating according to the embodiment, the cross-sectional shapes of the first solder resist opening hole 31 and the second solder resist opening hole 32 are both circular. The arrangement can effectively increase the residual copper rate.
In the circuit board with uniform plating of the effective lifting holes in the embodiment, the effective area 2 is provided with an upper effective area 51 and a lower effective area 52 in the middle of the circuit board body 1; the upper effective area 51 and the lower effective area 52 are arranged in a mirror surface manner; the first inactive area 41 is disposed around the upper active area 51 and the lower active area 52. Through the arrangement, the current distribution uniformity can be further improved, and the purpose of uniform thickness of the electroplated copper in the electroplating holes 21 in the high-current area is achieved.
In the circuit board with uniform plated effective lifting holes according to this embodiment, the shape of the upper effective area 51 and the shape of the lower effective area 52 are L-shaped.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. The utility model provides an effective lifting hole plates even circuit board which characterized in that: comprises a circuit board body (1); the circuit board body (1) comprises a copper layer (11) and an ink layer (12) covering the surface of the copper layer (11);
the circuit board body (1) consists of an invalid area (3) and a plurality of effective areas (2); the circuit board body (1) is provided with a plurality of electroplating holes (21) in the effective area (2) in a penetrating way;
the ink layer (12) of the invalid region (3) is provided with a plurality of first welding-resistant window holes (31) and a plurality of second welding-resistant window holes (32); the first solder resist opening (31) and the second solder resist opening (32) are used for exposing the copper layer (11) of the invalid region (3); the second anti-welding window holes (32) are formed around the invalid area (3); the first welding-resistant window hole (31) is arranged in the middle of the invalid area (3); the first solder resist opening hole (31) has a larger aperture than the second solder resist opening hole (32).
2. The circuit board of claim 1, wherein the effective lift hole plating is uniform, and the effective lift hole plating comprises: the electroplating holes (21) are uniformly arranged in the effective area (2).
3. The circuit board of claim 1, wherein the effective lift hole plating is as follows: the invalid region (3) comprises a first invalid region (41) arranged in the middle of the circuit board body (1) and second invalid regions (42) arranged on the periphery of the circuit board body (1);
the first solder resist opening (31) is provided in the first ineffective area (41); the second solder resist opening (32) is provided in the second ineffective area (42).
4. The circuit board of claim 3, wherein the effective lift hole plating is uniform, and the effective lift hole plating comprises: the plurality of first solder resist opening holes (31) are uniformly formed in the first ineffective area (41).
5. The circuit board of claim 3, wherein the effective lift hole plating is uniform, and the effective lift hole plating comprises: the second plurality of solder resist opening holes (32) are uniformly provided in the second ineffective area (42).
6. The circuit board of claim 1, wherein the effective lift hole plating is uniform, and the effective lift hole plating comprises: the distance between two adjacent first solder resist opening holes (31) is larger than the distance between two adjacent second solder resist opening holes (32).
7. The circuit board of claim 1, wherein the effective lift hole plating is uniform, and the effective lift hole plating comprises: the cross-sectional shape of the first solder resist opening hole (31) and the cross-sectional shape of the second solder resist opening hole (32) are both circular.
8. The circuit board of claim 3, wherein the effective lift hole plating is as follows: the middle part of the circuit board body (1) of the effective area (2) is provided with an upper effective area (51) and a lower effective area (52); the upper effective area (51) and the lower effective area (52) are arranged in a mirror surface manner; the first inactive area (41) is disposed around an upper active area (51) and a lower active area (52).
9. The circuit board of claim 8, wherein the effective lift hole plating is uniform, and the effective lift hole plating comprises: the shape of the upper effective area (51) and the shape of the lower effective area (52) are arranged in an L shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222875418.XU CN218830766U (en) | 2022-10-27 | 2022-10-27 | Circuit board with uniform plating of effective lifting holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222875418.XU CN218830766U (en) | 2022-10-27 | 2022-10-27 | Circuit board with uniform plating of effective lifting holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218830766U true CN218830766U (en) | 2023-04-07 |
Family
ID=87261453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222875418.XU Active CN218830766U (en) | 2022-10-27 | 2022-10-27 | Circuit board with uniform plating of effective lifting holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218830766U (en) |
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2022
- 2022-10-27 CN CN202222875418.XU patent/CN218830766U/en active Active
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