CN210381520U - Solder-resistant windowing structure of printed circuit board before nickel-gold electroplating - Google Patents
Solder-resistant windowing structure of printed circuit board before nickel-gold electroplating Download PDFInfo
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- CN210381520U CN210381520U CN201920983640.7U CN201920983640U CN210381520U CN 210381520 U CN210381520 U CN 210381520U CN 201920983640 U CN201920983640 U CN 201920983640U CN 210381520 U CN210381520 U CN 210381520U
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Abstract
The utility model discloses a structure of windowing is hindered to hindering before printed circuit board electroplates nickel gold, including the printed circuit board makeup of having made outer circuit figure, this printed circuit board makeup is including the shaping district that is located the centre and being located non-shaping district all around, forms a plurality of cell printed wiring boards that connect gradually in the shaping district, outside the four corners that corresponds the shaping district in non-shaping district to and the outside of the junction of per two cell printed wiring boards that correspond the shaping district is equipped with respectively hinders and welds the window of windowing, should hinder and weld the copper that the window corresponds the position and expose. According to the solder-resisting windowing structure, the solder-resisting windowing area is manufactured in the non-forming area of the printed circuit board makeup, copper in the solder-resisting windowing area is exposed, the existing board edge is replaced during subsequent nickel-gold electroplating, and the edge effect is decomposed, so that the thickness difference between the board edge of the forming area and the plating layer in the board is reduced, the thickness uniformity of the plating layer is improved, the technical problems that the effective pattern thickness of the board edge is large and the uniformity is poor are solved, the electroplating time is shortened, and the productivity is improved.
Description
Technical Field
The utility model relates to a PCB processing technology field, specific saying so relates to a printed circuit board electroplates hindering before nickel gold and welds windowing structure.
Background
When the PCB is manufactured, after the outer layer pattern is manufactured, a solder resist needs to be coated on the circuit and the base material which are not required to be welded on the PCB so as to protect the formed circuit pattern. After the solder resist process, nickel gold is also needed to be electroplated on the printed circuit board as an outer protective layer.
According to faraday's law and the associated physical laws: D100K Dk*t*ηkPer 60/rho (in the formula, D is the thickness of the coating layer, um, K is the electrochemical equivalent of the metal to be coated, g/(Ah), DkAs cathode current density, A/dm2T is plating time min ηkTo the cathodic current efficiency; rho is the density of the metal to be plated, g/cm3) It can be seen that the nickel-gold electroplating process is performed under the condition of consistent electroplating parameters, namely K, t and ηkAnd rho is constant, the plating thickness D and the cathode current density DkIn direct proportion, since the power lines at the edge of the printed circuit board are densely distributed, an edge (tip) effect is formed, resulting in a current density D at the edge of the boardkLarger than other areas, as shown in fig. 1, thereby resulting in an excessively thick plating layer thickness d and a poor uniformity of the plating layer thickness in the plate edge pattern during the electroplating process.
In order to improve the uniformity of the thickness of the plating layer, the current density needs to be reduced, and the reduction of the circuit density leads to the prolongation of the plating time, thus prolonging the cycle time and seriously affecting the productivity.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model provides a PCB board electroplates soldering and windowing structure before nickel gold, effectively solves the problem that current printing plate flange effective figure cladding material thickness is unusual super-thick, the homogeneity is poor.
The utility model discloses a solve the technical scheme that its technical problem adopted and be: the utility model provides a printed circuit board hinders and welds windowing structure before electroplating nickel gold, includes the printed circuit board makeup of having made outer circuit figure, and this printed circuit board makeup is including the shaping district that is located the centre and being located non-shaping district all around, form a plurality of little unit printed wiring boards that connect gradually in the shaping district non-shaping district corresponds outside the four corners in shaping district to and the outside of the junction of every two little unit printed wiring boards in corresponding shaping district is equipped with respectively hinders and welds the window, and the copper that should hinder and cut the window and correspond the position exposes.
As a further improvement, the utility model is located the outer four corners of shaping district hinder welds the windowing and be the L type.
As a further improvement of the utility model, the L-shaped resistance welds the length of two sections of mutually perpendicular of windowing and is 20 +/-3 mm respectively.
As a further improvement of the utility model, the solder-resisting windowing length of the outer side of the joint of every two small-unit printed circuit boards in the forming area is 30-40 mm.
The utility model has the advantages that: according to the solder-resisting windowing structure before nickel gold electroplating of the printed circuit board, the solder-resisting windowing is manufactured in the non-forming area of the printed circuit board makeup, copper in a solder-resisting windowing area is exposed, an existing board edge is replaced during subsequent nickel gold electroplating, and an edge effect is decomposed, so that the thickness difference between the board edge of the forming area and a plating layer in the board is reduced, the uniformity of the thickness of the plating layer is improved, the technical problems that the thickness of an effective graph of the existing board edge is large and the uniformity is poor are solved, the electroplating time is shortened, and the productivity is improved.
Drawings
FIG. 1 is a schematic diagram of a printed circuit board power line distribution;
FIG. 2 is a schematic diagram of a conventional printed circuit board structure;
fig. 3 is a schematic structural diagram of the present invention.
The following description is made with reference to the accompanying drawings:
1-printed circuit board makeup; 2-non-forming zone;
3-small unit printed circuit board; and 4, solder mask windowing.
Detailed Description
The following description of a preferred embodiment of the present invention will be made in conjunction with the accompanying drawings. However, the scope of the present invention is not limited to the following embodiments, and all simple equivalent changes and modifications made by the claims and the contents of the specification are still included in the scope of the present invention.
Refer to fig. 3, do, a printed circuit board electroplates hindering structure of windowing before nickel gold (wherein, fig. 2 is current printed circuit board), including the printed circuit board makeup 1 of having made outer line pattern, this printed circuit board makeup 1 is including being located the shaping district in the middle of and being located non-shaping district 2 all around, form a plurality of connected gradually's of formation district cell printed wiring board 3 non-shaping district corresponds outside the four corners in shaping district to and the outside of the junction of every two cell printed wiring boards that correspond the shaping district is equipped with respectively and hinders and welds window 4, should hinder and weld the copper that the window corresponds the position and expose.
The solder mask windows positioned outside the four corners of the molding area are L-shaped; the lengths of two mutually perpendicular sections of the L-shaped solder mask windowing window are respectively 20 +/-3 mm; the length of the solder resisting windowing window positioned at the outer side of the connection part of every two small unit printed circuit boards in the molding area is 30-40 mm.
The solder-resisting windowing structure before nickel gold electroplating of the printed circuit board is used for manufacturing the solder-resisting windowing in the non-forming area of the printed circuit board makeup, so that the edge effect is transferred to the solder-resisting windowing at the periphery of the non-forming area of the board edge, namely, the copper area under the solder-resisting windowing equal to the non-forming area of the board edge becomes the board edge of the whole board, the current density of the board edge graph of the forming area is equivalently reduced, the purpose of reducing the thickness of the plating layer of the board under the same electroplating parameters is achieved, the thickness difference between the board edge of the forming area and the plating layer in the board is reduced, and the thickness uniformity of the plating layer is improved.
Therefore, the solder-resisting windowing structure before the nickel gold electroplating of the printed circuit board has the advantages that the solder-resisting windowing is manufactured in the non-forming area of the printed circuit board makeup, copper in the solder-resisting windowing area is exposed, the existing board edge is replaced during subsequent nickel gold electroplating, the edge effect is decomposed, the thickness difference between the board edge in the forming area and the plating layer in the board is reduced, the thickness uniformity of the plating layer is improved, the technical problems that the effective graph of the existing board edge is large in thickness and poor in uniformity are solved, the electroplating time is shortened, and the productivity is improved.
Claims (4)
1. The utility model provides a printed circuit board electroplates preceding hindering structure of opening window of hindering of nickel gold, has accomplished printed circuit board makeup (1) of outer circuit figure including making, this printed circuit board makeup (1) is including being located the shaping district in the middle of and being located non-shaping district (2) all around, form a plurality of little unit printed wiring board (3) that connect gradually in the shaping district, its characterized in that: and solder-resisting windows (4) are respectively arranged outside the four corners of the non-molding area corresponding to the molding area and outside the joint of every two small-unit printed circuit boards corresponding to the molding area, and copper at the corresponding positions of the solder-resisting windows is exposed.
2. The printed circuit board nickel-gold electroplating front solder resist windowing structure of claim 1, wherein: the solder mask windows positioned outside the four corners of the molding area are L-shaped.
3. The printed circuit board nickel-gold electroplating front solder resist windowing structure of claim 2, wherein: the lengths of two mutually perpendicular sections of the L-shaped solder mask windowing window are respectively 20 +/-3 mm.
4. The printed circuit board nickel-gold electroplating front solder resist windowing structure of claim 1, wherein: the length of the solder resisting windowing window positioned at the outer side of the connection part of every two small unit printed circuit boards in the molding area is 30-40 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920983640.7U CN210381520U (en) | 2019-06-27 | 2019-06-27 | Solder-resistant windowing structure of printed circuit board before nickel-gold electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920983640.7U CN210381520U (en) | 2019-06-27 | 2019-06-27 | Solder-resistant windowing structure of printed circuit board before nickel-gold electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210381520U true CN210381520U (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920983640.7U Active CN210381520U (en) | 2019-06-27 | 2019-06-27 | Solder-resistant windowing structure of printed circuit board before nickel-gold electroplating |
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| CN (1) | CN210381520U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278664A (en) * | 2019-06-27 | 2019-09-24 | 江苏普诺威电子股份有限公司 | Welding resistance fenestration before printed circuit board electronickelling gold |
| CN113645770A (en) * | 2021-08-17 | 2021-11-12 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
-
2019
- 2019-06-27 CN CN201920983640.7U patent/CN210381520U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278664A (en) * | 2019-06-27 | 2019-09-24 | 江苏普诺威电子股份有限公司 | Welding resistance fenestration before printed circuit board electronickelling gold |
| CN113645770A (en) * | 2021-08-17 | 2021-11-12 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
| CN113645770B (en) * | 2021-08-17 | 2022-09-06 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
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