CN216905447U - PCB board hinder and weld structure of windowing - Google Patents
PCB board hinder and weld structure of windowing Download PDFInfo
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- CN216905447U CN216905447U CN202220594309.8U CN202220594309U CN216905447U CN 216905447 U CN216905447 U CN 216905447U CN 202220594309 U CN202220594309 U CN 202220594309U CN 216905447 U CN216905447 U CN 216905447U
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Abstract
The utility model discloses a solder mask windowing structure of a PCB (printed circuit board), which comprises a mounting main body, wherein two welding main bodies are welded on the outer wall of one side of the mounting main body, the mounting main body comprises the PCB, two solder paste grooves are formed in the outer wall of one side of the PCB, four circular windowing windows distributed in a rectangular structure are formed in the positions, close to the two solder paste grooves, of the outer wall of one side of the PCB, a first line windowing window is formed between every two adjacent circular windowing windows, four second line windowing windows are formed in the outer wall of one side of the PCB, and the four second line windowing windows are respectively communicated with the four circular windowing windows. The solder-resisting windowing structure has the advantages that the solder-resisting windowing structure formed by the circular windowing, the first linear windowing and the second linear windowing can reduce the difficulty of windowing in the original mode, improve windowing efficiency, avoid the phenomenon of connection error of the tail ends of the windowing during windowing, enable the bonding pad to be accurately inserted into the solder paste groove through the matching of the positioning plate on the bonding pad and the positioning groove, and improve alignment efficiency.
Description
Technical Field
The utility model relates to the technical field of circuit board manufacturing, in particular to a solder-resisting windowing structure of a PCB.
Background
Along with the circuit board technology becoming mature day by day, and circuit board manufacturing enterprise's competition is more and more violent for the production profit of circuit board is lower and lower. Therefore, circuit board production enterprises continuously improve and perfect the production technology, rework rate and defective rate of the circuit board in the production process are reduced, production investment is saved, and production cost is reduced.
If the authorization notice number is CN215421009U, the authorization notice date is 20220104, the PCB packaging alignment structure is arranged on the surface of the PCB, a patch area is further arranged on the surface of the PCB, a resistance welding window is arranged at the edge of the patch area, and the resistance welding window is of a linear groove structure. Because the resistance welding windowing is formed through the resistance welding process, the resistance welding process is easier to control than a printing process, so that the deviation of a resistance welding route is reduced, auxiliary alignment is facilitated, the production precision is improved, and meanwhile, the resistance welding windowing can also collect solder paste overflowing in the mounting process.
The above-mentioned and PCB board among the prior art hinders to weld the windowing structure comparatively complicated, leads to the increase of the degree of difficulty of windowing, influences the production of PCB board, and simultaneously, current PCB board windowing structure lacks location structure, easily leads to the pad to place the mistake, consequently, the eager need design a PCB board hinder and weld the windowing structure and solve above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a solder mask window structure of a PCB (printed circuit board) so as to solve the defects in the prior art.
In order to achieve the above purpose, the utility model provides the following technical scheme:
the utility model provides a PCB board hinder and weld structure of windowing, includes the installation main part, the welding has two welding main parts on installation main part one side outer wall, the installation main part includes the PCB board, two tin cream grooves have been seted up on the outer wall of PCB board one side, PCB board one side outer wall is close to two tin cream groove departments and all sets up four circular windowing that are the rectangular structure and distribute, adjacent two set up first line between the circular windowing and window, set up four second lines on the outer wall of PCB board one side and window, and four second lines are windowed and are link up each other in wherein four circular windowing respectively.
As a further description of the above technical solution: and overflow holes are formed in the inner wall of one side of the first line windowing, and the overflow holes are communicated with the solder paste groove.
As a further description of the above technical solution: the PCB is characterized in that lines between the two solder paste grooves are arranged on the outer wall of one side of the PCB and are electrically connected with the welding main body.
As a further description of the above technical solution: the welding main body comprises a welding disc, a connecting part is arranged on the outer wall of one side of the welding disc, and positioning plates are welded on the outer wall of one side of the welding disc, close to the bottom and at the top.
As a further description of the above technical solution: the first lines are opened window and are all seted up the constant head tank on one side inner wall wherein four, the locating plate joint is inside the constant head tank.
As a further description of the above technical solution: the PCB board includes the basic unit, the plating has the insulating layer on the outer wall of basic unit one side, and is provided with on the outer wall of insulating layer one side and covers the copper layer, it has the solder mask to cover the plating on the outer wall of copper layer one side, and all the spraying has the outer lacquer layer on solder mask, the outer wall of basic unit one side.
In the technical scheme, the solder-resisting windowing structure of the PCB (printed circuit board) provided by the utility model has the advantages that (1) through the circular windowing, the first line windowing and the second line windowing, the solder-resisting windowing structure formed by the circular windowing, the first line windowing and the second line windowing can reduce the difficulty of windowing in the original mode, improve the windowing efficiency and avoid the phenomenon of connection error of the windowing tail end during windowing; (2) through the positioning groove and the positioning plate, when the welding main body is welded on the PCB, the positioning plate on the bonding pad is matched with the positioning groove, so that the bonding pad can be accurately inserted into the tin paste groove, the alignment efficiency is improved, meanwhile, the positioning groove can also provide a positioning reference for peripheral printing equipment, and the precision of printing solder-resisting printing ink is effectively ensured; (3) through the overflow hole that sets up, when the welding main part aimed at the welding, inside too much solder paste of solder paste inslot can flow into windowing structure through the overflow hole inside, avoids the solder paste to spill over and causes harmful effects on the circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a schematic front view structure diagram provided in an embodiment of a solder resist windowing structure of a PCB according to the present invention.
Fig. 2 is a schematic structural diagram of an installation main body provided in an embodiment of a solder resist windowing structure of a PCB of the present invention.
Fig. 3 is a schematic structural diagram of a soldering main body provided in an embodiment of a solder resist windowing structure of a PCB according to the present invention.
Fig. 4 is a schematic diagram of a PCB structure provided in an embodiment of a solder resist windowing structure of a PCB of the present invention.
Description of reference numerals:
the circuit board comprises an installation main body 1, a welding main body 2, a PCB 3, lines 4, a circular windowing 5, a first line windowing 6, a second line windowing 7, a solder paste groove 8, a positioning groove 9, an overflow hole 10, a bonding pad 11, a positioning plate 12, a connecting part 13, a base layer 14, an outer paint layer 15, an insulating layer 16, a copper-clad layer 17 and a solder mask 18.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 4, the solder mask windowing structure of the PCB provided in the embodiment of the present invention includes a mounting main body 1, two soldering main bodies 2 are welded on an outer wall of one side of the mounting main body 1, the mounting main body 1 includes a PCB 3, two solder paste grooves 8 are formed on an outer wall of one side of the PCB 3, four circular windowing 5 distributed in a rectangular structure are formed at a position of the outer wall of one side of the PCB 3 near the two solder paste grooves 8, a first line windowing 6 is formed between two adjacent circular windowing 5, four second line windowing 7 are formed on an outer wall of one side of the PCB 3, and the four second line windowing 7 are respectively communicated with the four circular windowing 5.
Specifically, in the embodiment, the solder mask comprises a mounting body 1, two welding bodies 2 are welded on the outer wall of one side of the mounting body 1, the mounting body 1 comprises a PCB 3, two solder paste grooves 8 are formed on the outer wall of one side of the PCB 3, the solder paste grooves 8 can enable the welding bodies 2 to be welded on the PCB 3 through solder paste, four circular windows 5 distributed in a rectangular structure are formed on the outer wall of one side of the PCB 3 near the two solder paste grooves 8, the circular windows 5 can reduce the difficulty of windowing of a first line window 6 and a second line window 7, meanwhile, the circular windows 5 can be used as positioning holes to improve the positioning precision in subsequent printing, a first line window 6 is formed between two adjacent circular windows 5, four second line windows 7 are formed on the outer wall of one side of the PCB 3, and a solder mask windowing structure formed by the circular windows 5, the first line window 6 and the second line window 7 can reduce the difficulty of windowing in the original mode, the windowing efficiency is improved, and the four second linear windowing devices 7 are communicated with the four circular windowing devices 5 respectively.
According to the solder-resisting windowing structure of the PCB, the solder-resisting windowing structure formed by the circular windowing 5, the first line windowing 6 and the second line windowing 7 can reduce the difficulty of windowing in the original mode, improve windowing efficiency and avoid the phenomenon that the tail end of the windowing is connected in a wrong way during windowing.
In another embodiment of the present invention, as shown in fig. 2, the inner walls of the two first line strip windows 6 are respectively provided with an overflow hole 10, the overflow holes 10 can make the redundant solder paste flow into the window structure when the solder paste groove 8 is welded to the solder pad 11, so as to prevent the moved solder paste from causing adverse effects on the solder pad 11 and the PCB 3, and the overflow holes 10 and the solder paste groove 8 are communicated with each other.
In another embodiment of the present invention, as shown in fig. 1-2, a line 4 is disposed on an outer wall of one side of the PCB 3 and located between two solder paste grooves 8, and the line 4 is electrically connected to the soldering main body 2.
In another embodiment of the present invention, as shown in fig. 3, the welding main body 2 includes a bonding pad 11, a connecting portion 13 is disposed on an outer wall of one side of the bonding pad 11, the connecting portion 13 is in a shape of a needle bar, so that the bonding pad 11 is fastened inside the solder paste slot 8 through solder paste, positioning plates 12 are welded on the outer wall of one side of the bonding pad 11 near the bottom and the top, and the positioning plates 12 cooperate with the positioning slots 9 to improve the welding precision of the welding main body 2 on the mounting main body 1.
In another embodiment of the present invention, as shown in fig. 2, the inner walls of the four first line strip windows 6 are respectively provided with a positioning groove 9, the positioning grooves 9 cooperate with the positioning plate 12 to improve the accuracy of the welding of the bonding pad 11 in the solder paste groove 8, and the positioning plate 12 is clamped in the positioning grooves 9.
In another embodiment of the present invention, as shown in fig. 4, the PCB 3 includes a base layer 14, an insulating layer 16 is plated on an outer wall of one side of the base layer 14, the insulating layer 16 prevents the copper-clad layer 17 from being electrically connected to the base layer 14, the copper-clad layer 17 is disposed on an outer wall of one side of the insulating layer 16, a solder resist layer 18 is plated on an outer wall of one side of the copper-clad layer 17, and an outer paint layer 15 is sprayed on the solder resist layer 18 and the outer wall of one side of the base layer 14, and the outer paint layer 15 can improve the corrosion resistance of the PCB 3.
The working principle is as follows: when windowing, can open out the tin cream groove 8 on PCB board 3 with windowing equipment earlier, then round windowing 5 is being seted up around every tin cream groove 8, it is inside to insert circular windowing 5 with windowing equipment afterwards, make windowing equipment open out first line 6 and second line 7 of windowing afterwards, later the staff pours the tin cream into tin cream groove 8 into again, then peg graft welding main part 2 that will prepare inside tin cream groove 8, the inside tin cream that overflows of tin cream groove 8 this moment can flow into inside the windowing structure through overflow hole 10, when welding pad 11 welding is inside tin cream groove 8 simultaneously, can realize the accurate alignment to welding main part 2 through the cooperation of locating plate 12 with constant head tank 9, improve the welded precision, later when printing ink, avoid printing ink to print on welding main part 2.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.
Claims (6)
1. The utility model provides a PCB board hinder and weld windowing structure, includes installation main part (1), its characterized in that, the welding has two welding main parts (2) on installation main part (1) one side outer wall, installation main part (1) includes PCB board (3), two tin cream grooves (8) have been seted up on PCB board (3) one side outer wall, PCB board (3) one side outer wall is close to two tin cream grooves (8) department and all sets up four circular windowing (5) that are the distribution of rectangle structure, adjacent two first line (6) of windowing have been seted up between circular windowing (5), set up four second lines on PCB board (3) one side outer wall and windowed (7), and four second lines of windowing (7) are link up each other in wherein four circular windowing (5) respectively.
2. The solder mask window structure of the PCB as claimed in claim 1, wherein the inner wall of one side of the two first line strip windows (6) is provided with an overflow hole (10), and the overflow hole (10) is communicated with the solder paste groove (8).
3. The solder mask window structure of the PCB as claimed in claim 1, wherein the outer wall of one side of the PCB (3) is provided with a line (4) between the two solder paste grooves (8), and the line (4) is electrically connected with the soldering main body (2).
4. The structure of claim 1, wherein the welding body (2) comprises a welding pad (11), a connecting part (13) is arranged on the outer wall of one side of the welding pad (11), and the positioning plate (12) is welded on the outer wall of one side of the welding pad (11) close to the bottom and the top.
5. The PCB solder mask window structure as claimed in claim 4, wherein the four first line windows (6) are all provided with a positioning groove (9) on one side inner wall, and the positioning plate (12) is clamped inside the positioning groove (9).
6. The PCB resistance welding windowing structure according to claim 1, characterized in that the PCB (3) comprises a base layer (14), an insulating layer (16) is plated on the outer wall of one side of the base layer (14), a copper-coated layer (17) is arranged on the outer wall of one side of the insulating layer (16), a solder-resistant layer (18) is plated on the outer wall of one side of the copper-coated layer (17), and an outer paint layer (15) is sprayed on the outer walls of the solder-resistant layer (18) and the base layer (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220594309.8U CN216905447U (en) | 2022-03-18 | 2022-03-18 | PCB board hinder and weld structure of windowing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220594309.8U CN216905447U (en) | 2022-03-18 | 2022-03-18 | PCB board hinder and weld structure of windowing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216905447U true CN216905447U (en) | 2022-07-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220594309.8U Active CN216905447U (en) | 2022-03-18 | 2022-03-18 | PCB board hinder and weld structure of windowing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216905447U (en) |
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2022
- 2022-03-18 CN CN202220594309.8U patent/CN216905447U/en active Active
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