CN210225927U

CN210225927U - PCB soldering tin bottom plate

Info

Publication number: CN210225927U
Application number: CN201921001263.9U
Authority: CN
Inventors: Xianwen Lian; 连先文
Original assignee: Shenzhen Hongguang Technology Co Ltd
Current assignee: Shenzhen Hongguang Technology Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-03-31
Anticipated expiration: 2029-06-28

Abstract

The utility model is suitable for a PCB soldering tin technical field provides a PCB soldering tin bottom plate, include: the device comprises a titanium alloy base plate, a PCB plate type position groove is formed in the titanium alloy base plate, and a soldering tin hole, a blocking plate and an element avoiding groove are formed in the bottom of the PCB plate type position groove; the soldering tin hole is corresponding with PCB board soldering tin position, the downthehole tin bar that keeps off that is equipped with of soldering tin, the cell wall thickness that the position groove was kept away to the component is 0.1-0.3mm, and tank bottom thickness is 0.2-0.5mm, just titanium alloy bottom plate surface coating has antiseized adhesion cladding material, has high strength, high rigidity, high temperature resistant and anti-deformation advantage such as, the cell wall and the tank bottom thickness that the position groove was kept away to the component are little, and precision is high, and wave crest soldering tin is of high quality, and the product defective rate is low to can effectually prevent that the phenomenon that titanium alloy bottom plate takes out its surface adhesion tin layer from the wave crest soldering furnace of high temperature from taking place, save time and cost of labor, guaranteed PCB board wave crest soldering tin quality.

Description

PCB soldering tin bottom plate

Technical Field

The utility model belongs to the technical field of PCB soldering tin, especially, relate to a PCB soldering tin bottom plate.

Background

Wave soldering is a process of assembling and connecting the plug-in boards by using a titanium alloy base plate for wave soldering in a specific operation process, wherein the titanium alloy base plate is required to be used for realizing the wave soldering of the plug-in boards. Hereinafter, "card" refers to the component to be soldered, and "titanium alloy backplane" refers to the carrier that carries the card through the wave soldering furnace for soldering purposes.

At present, PCB soldering tin bottom plate for wave-soldering usually only protects the bottom surface of PCB board on the market, but there is not better protection to the positive component of PCB board, although be equipped with component on some titanium alloy bottom plates and keep away a groove, but make by synthetic stone because of the titanium alloy bottom plate is many, hardness is lower, the cell wall and the tank bottom that its component kept away a groove set up thickness great, precision is lower, lead to wave crest soldering tin quality poor, the product defective rate is high, and the titanium alloy bottom plate takes out from the wave-soldering furnace of high temperature, its surface can the adhesion tin layer, be difficult to clear away after the high temperature cooling, waste time and cost of labor, influence PCB board wave crest soldering tin quality.

Disclosure of Invention

In order to solve the technical problem existing in the prior art, the utility model provides a PCB soldering tin bottom plate.

The utility model discloses a realize like this, a PCB soldering tin bottom plate, include: the device comprises a titanium alloy base plate, a PCB plate type position groove is formed in the titanium alloy base plate, and a soldering tin hole, a blocking plate and an element avoiding groove are formed in the bottom of the PCB plate type position groove; the tin soldering hole corresponds to the position of a tin soldering part of the PCB, a tin blocking strip is arranged in the tin soldering hole, the thickness of the groove wall of the element avoiding groove is 0.1-0.3mm, the thickness of the groove bottom is 0.2-0.5mm, and the surface of the titanium alloy bottom plate is coated with an anti-adhesion coating.

Preferably, the blocking plate is arranged between the adjacent soldering tin holes and used for blocking the soldering tin from splashing on the PCB.

Preferably, the groove wall of the element avoiding groove is connected with the blocking plate and the tin blocking strip; the bottom ends of the element avoiding groove, the barrier plate and the tin blocking strip are all flush.

Preferably, the thickness of the groove wall of the element avoiding groove is 0.2 mm.

Preferably, the thickness of the groove bottom of the element avoiding groove is 0.3 mm.

Preferably, the titanium alloy bottom plate is further provided with a fixing through hole.

Preferably, the fixing through hole is located outside one of opposite sides of the type position groove.

Preferably, the anti-adhesion coating is a teflon coating.

Preferably, the anti-adhesion coating is a tungsten alloy coating.

Preferably, the anti-adhesion coating is a ceramic crystal coating.

The embodiment of the utility model provides a PCB soldering tin bottom plate, adopt the titanium alloy to make, high strength has, high hardness, high temperature resistance and advantages such as shape of preapring for an unfavorable turn of events, the cell wall thickness in its component aversion groove can set up to 0.1-0.3mm, tank bottom thickness can set up to 0.2-0.5mm, cell wall and tank bottom thickness are little, high precision, crest soldering tin is of high quality, the product defective rate is low, and it has antiseized adhesion cladding material to coat on the titanium alloy bottom plate body, can effectually prevent that the phenomenon that the titanium alloy bottom plate takes out its surface adhesion tin layer from the crest soldering tin welding stove of high temperature from taking place, save time and cost of labor, PCB board crest soldering tin quality has been guaranteed, and is suitable for being.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

The drawings are only intended to illustrate and explain the present invention and do not limit the scope of the invention.

Fig. 1 is a schematic structural diagram of a PCB soldering tin bottom plate according to an embodiment of the present invention;

fig. 2 is a sectional structural view of the anti-adhesion coating layer according to the embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the embodiments of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, which is only for convenience of description and simplification of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, as such, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.

In addition, in the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The following detailed description is provided for the specific embodiments of the present invention.

Examples

Referring to fig. 1-2, the present embodiment provides a PCB solder bottom plate, including: the titanium alloy base plate 100 is provided with a PCB (printed circuit board) type position groove 110, the bottom of the position groove 110 is provided with a soldering tin hole 111, a blocking plate 112 and an element avoiding groove 113, the soldering tin hole 111 corresponds to the soldering tin position of the PCB, a tin blocking strip 114 is arranged in the soldering tin hole 111, the thickness of the groove wall of the element avoiding groove 113 is 0.1-0.3mm, the thickness of the groove bottom is 0.2-0.5mm, and the surface of the titanium alloy base plate 100 is coated with an anti-adhesion coating layer 120; preferably, the thickness of the element avoiding groove 113 may be 0.2 mm; the thickness of the bottom of the element avoiding groove 113 is 0.3 mm; the anti-adhesion coating 120 can be a teflon coating, a tungsten alloy coating or a ceramic coating; have high strength, high rigidity, high temperature resistant and advantage such as shape of preapring for an unfavorable turn of events, the cell wall and the tank bottom thickness in component aversion groove are little, and precision is high, and wave soldering tin is of high quality, and the product defective rate is low to can effectually prevent that the phenomenon that the titanium alloy bottom plate takes out its surface adhesion tin layer from the wave soldering stove of high temperature from taking out takes place, save time and cost of labor, guaranteed PCB board wave peak soldering tin quality, be fit for using widely.

In the foregoing, specifically, the blocking plate 112 is disposed between the adjacent solder holes 111 to block solder from splashing onto the PCB, and the groove wall of the component avoiding groove 113 is connected to the blocking plate 112 and the solder blocking bar 114; the bottom ends of the element avoiding groove 113, the barrier plate 112 and the tin blocking strip 114 are all flush, the precision is high, the wave soldering quality is good, and the product reject ratio is low.

In the foregoing, specifically, the titanium alloy base plate 100 is further provided with a fixing through hole 130; preferably, the fixing through hole 130 is located at an outer side of one of opposite sides of the position groove 110, so that the structure is simple and the installation is convenient.

The embodiment of the utility model provides a PCB soldering tin bottom plate, adopt titanium alloy to make, high strength has, high hardness, high temperature resistance and advantages such as shape of preapring for an unfavorable turn of events, the cell wall thickness in its component aversion groove can set up to 0.1-0.3mm, tank bottom thickness can set up to 0.2-0.5mm, cell wall and tank bottom thickness are little, high precision, wave crest soldering tin is of high quality, the product defective rate is low, and it has antiseized adhesion cladding material to coat on titanium alloy bottom plate body, can effectually prevent that the phenomenon that titanium alloy bottom plate takes out its surface adhesion tin layer from the wave crest soldering tin furnace of high temperature from taking place, save time and cost of labor, PCB board wave crest soldering tin quality has been guaranteed, and is suitable for being generalized.

The following points need to be explained:

(1) unless otherwise defined, in the embodiments and drawings of the present invention, the same reference numerals represent the same meanings.

(2) In the drawings of the embodiments of the present invention, only the structures related to the embodiments of the present invention are referred to, and other structures may refer to general designs.

(3) The thickness of a layer or region is exaggerated in the figures used to describe embodiments of the present invention for clarity. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.

(4) In the case of conflict, features of the same embodiment and different embodiments of the present invention may be combined with each other.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A PCB solder pot, comprising: the device comprises a titanium alloy base plate, a PCB plate type position groove is formed in the titanium alloy base plate, and a soldering tin hole, a blocking plate and an element avoiding groove are formed in the bottom of the PCB plate type position groove; the tin soldering hole corresponds to the position of a tin soldering part of the PCB, a tin blocking strip is arranged in the tin soldering hole, the thickness of the groove wall of the element avoiding groove is 0.1-0.3mm, the thickness of the groove bottom is 0.2-0.5mm, and the surface of the titanium alloy bottom plate is coated with an anti-adhesion coating.

2. The PCB solder pot of claim 1, wherein the barrier is disposed between adjacent solder apertures to prevent solder from splashing onto the PCB.

3. A PCB solder bottom plate according to claim 2, wherein the wall of the component avoiding groove is connected to the blocking plate and the solder bar; the bottom ends of the element avoiding groove, the barrier plate and the tin blocking strip are all flush.

4. A PCB solder pot according to claim 1, wherein the component clearance groove has a wall thickness of 0.2 mm.

5. The PCB solder pot of claim 4, wherein the component clearance pocket has a pocket bottom thickness of 0.3 mm.

6. A PCB solder bottom according to claim 1, wherein the titanium alloy bottom is further provided with fixing through holes.

7. The PCB solder pot of claim 6, wherein the securing through-hole is located outside an opposite side of the profile slot.

8. A PCB solder pot according to claim 1, wherein the anti-adhesion coating is a teflon coating.

9. The PCB solder pot of claim 1, wherein the anti-adhesion plating is a tungsten alloy plating.

10. The PCB solder pot of claim 1, wherein the anti-adhesion plating is a ceramic plating.