CN102548207B - Electroplating structure for golden fingers of flexible circuit board - Google Patents
Electroplating structure for golden fingers of flexible circuit board Download PDFInfo
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- CN102548207B CN102548207B CN201210061311.XA CN201210061311A CN102548207B CN 102548207 B CN102548207 B CN 102548207B CN 201210061311 A CN201210061311 A CN 201210061311A CN 102548207 B CN102548207 B CN 102548207B
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Abstract
The invention discloses an electroplating structure for the golden fingers of a flexible circuit board, which contains the pins of golden fingers and outer electroplating lines, wherein the pins of the golden fingers to be electroplated are arranged on a flexible circuit board, and the outer electroplating lines are connected with the pins of the golden fingers. The electroplating structure for the golden fingers of the flexible circuit board is characterized in that the pins of the golden fingers at least contain two pins with different widths. In each outer electroplating line connected with the pins with different widths, an area of which the width is not the same with the widths on other electroplating lines is arranged on at least one electroplating line. When the golden fingers are electroplated according to the structure disclosed by the invention, the thicknesses of the outer electroplating lines connected with an electroplating plate of a traction line are regulated by the electroplating plate of the traction line according to the thicknesses and the widths of the formed golden fingers, so that the current dispersing difference of each finger is reduced. After current is dispersed evenly, the trends of the directional reducing speeds of metal cations are consistent during electroplating, so that the roughness of an electroplating layer is consistent. The refractive effects of metal ions to light are approximately equivalent, so that the brightness of the surfaces of the golden fingers is uniform, and no color difference exists; and moreover, the thickness of the electroplating layer is uniform, a favorable appearance effect is presented, and the quality of the appearance of the circuit board is greatly enhanced.
Description
Technical field
The present invention relates to a kind of circuit board golden finger electroplated structural, relate in particular to a kind of golden finger of flexible circuit board electroplated structural, belong to electronic technology field.
Background technology
In prior art, flexible circuitry board electroplating often divides two kinds, and one is that plate face is gold-plated and skewer head is gold-plated, and plate face is gold-plated, and its gold layer requires thinner, has good conductivity and solderability; Skewer head is gold-plated, and to be commonly called as golden finger gold-plated, plating be hard gold, this is the alloy layer of the metallic elements such as a kind of CO of containing, Ni, Fb, Sb, its hardness, resistance to wear are all higher than proof gold coating, general Gold plated Layer requires thicker.Electrogilding is just can plate the in the situation that of extraneous electric current, thus need each pad Pad all can pull strings, and allow to pull strings just can plating.This surface treatment mode of pulling strings and electroplating, that impressed current makes coating anode betatopic generation oxidation reaction, become metal cation, displacement to negative electrode is subject to plating piece, obtains the electronics that anode loses and is reduced to metallic to be oriented to plating piece be flexible circuit board at negative electrode.In the time that golden finger of flexible circuit board is electroplated, due to the thickness width difference of the golden finger designing on circuit board, after plating, be prone to surface brightness inequality, have aberration, the unequal defect of thickness of coating, affect circuit board exterior quality.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of circuit board golden finger electroplated structural, adopt this structure can overcome the open defect occurring after gold finger galvanizing in prior art, make golden finger surface brightness after electroplating evenly, no color differnece, thickness of coating be even.
For solving the problems of the technologies described above, the invention provides a kind of electroplating structure for golden fingers of flexible circuit board, the golden finger pin that comprises the electroplated being located in flexible circuit board, the outside plating line being connected with golden finger pin, it is characterized in that, in described golden finger pin, at least comprise two kinds of pins that width is different, in the each outside plating line that the pin different from width connects, have at least the region that a width is not identical with width on other plating lines is set on a plating line.The not identical region of width arranging on this root plating line is adjusted into the different width direction adjustment of connected pin widths, if be the pin wider width that plating line connects, this root plating line arranges a width than the narrow region of width on other plating lines, if if the pin width that plating line connects is narrower, this root plating line arranges a width than the wide region of width on other plating lines.
The different pin of width comprises wide thick pin and narrow thin pin, on the plating line being connected, a reduced width region is set with described thick pin.
Described reduced width region is that to be arranged on symmetrical circular arc indent on plating line contraction-like.
On the film, the width of described plating line is carried out to above-mentioned setting.
The beneficial effect that the present invention reaches:
When structure of the present invention is carried out gold finger galvanizing, forming loop by plating line electroplates, adjust the thickness of the outside plating line being connected with golden finger according to being subject to surfacing size, thereby dwindle the electric current poor dispersion of each finger, after electric current is uniformly dispersed, when plating, the directed reduction rate trend of metal cation is consistent, make coating roughness consistent, metal ion is roughly suitable to the refraction effect of light, the surface brightness that makes golden finger evenly, no color differnece, and thickness of coating is even, present good appearance, greatly improved wiring board exterior quality.
Accompanying drawing explanation
Fig. 1 is one embodiment of the invention schematic diagram.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples are only for technical scheme of the present invention is more clearly described, and can not limit the scope of the invention with this.
Pull strings while plating, form loop by plating line and electroplate, impressed current makes coating anode betatopic generation oxidation reaction, becomes metal cation, displacement to negative electrode is subject to plating piece, obtains the electronics that anode loses and is reduced to metallic to be oriented to plating piece be flexible circuit board at negative electrode.And also golden finger scattered current inequality on plating piece just of brightness disproportionation causes the directed reduction rate of metal cation inconsistent, making to be subject to coating is that golden finger surface roughness is inconsistent, makes metal ion variant to the refraction of light.
embodiment 1
As shown in Figure 1, in the present invention, in the time making the film by CAM Software for Design, flexible circuit board 1 golden finger 2 is improved to design, adjust the thickness of the outside plating line 3 being connected with golden finger 2 by be subject to surfacing size according to each pin pin in flexible circuit board 1 golden finger 2 terminal region, in golden finger 2, each pin pin is varied in size by surfacing, i.e. pin pin thickness width difference at least comprises two kinds of thick pin 21 and thin pins 22 that thickness is different.On plating line 3 in the present embodiment outside the moulding being connected with thick pin 21, a bottleneck 31 being set is that area reduces district, (other plating lines do not change to make to form on plating line 3 region that an area reduces, not shown), thereby dwindle the electric current poor dispersion that flows through thick pin 21 and thin pin 22, after electric current is uniformly dispersed, when plating, the directed reduction rate trend of metal cation is consistent, make coating roughness consistent, metal ion is roughly suitable to the refraction effect of light, the surface brightness that makes the each pin of golden finger evenly, no color differnece, and thickness of coating is even.After plating, outside golden finger 2 waste material is cut, become the shaped form needing.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvement and distortion, these improvement and distortion also should be considered as protection scope of the present invention.
Claims (4)
1. an electroplating structure for golden fingers of flexible circuit board, the golden finger pin that comprises the electroplated being located in flexible circuit board, the outside plating line being connected with golden finger pin, it is characterized in that, in described golden finger pin, at least comprise two kinds of pins that width is different, in the each outside plating line that the pin different from width connects, have at least the region that a width is not identical with width on other plating lines is set on a plating line; The not identical region of width arranging on this root plating line is adjusted into the different width direction adjustment of connected pin widths, if be the pin wider width that plating line connects, this root plating line arranges a width than the narrow region of width on other plating lines, and this width region narrower than width on other plating lines is also narrow than the width in these other regions of plating line; If if the pin width that plating line connects is narrower, this root plating line arranges a width than the wide region of width on other plating lines.
2. electroplating structure for golden fingers of flexible circuit board according to claim 1, is characterized in that, the different pin of width comprises wide thick pin and narrow thin pin, on the plating line being connected, a reduced width region is set with described thick pin.
3. electroplating structure for golden fingers of flexible circuit board according to claim 2, is characterized in that, described reduced width region is that to be arranged on symmetrical circular arc indent on plating line contraction-like.
4. according to the electroplating structure for golden fingers of flexible circuit board described in any one in claim 1-3, it is characterized in that, on the film, the width of described plating line is carried out to above-mentioned setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210061311.XA CN102548207B (en) | 2012-03-09 | 2012-03-09 | Electroplating structure for golden fingers of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210061311.XA CN102548207B (en) | 2012-03-09 | 2012-03-09 | Electroplating structure for golden fingers of flexible circuit board |
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| CN102548207A CN102548207A (en) | 2012-07-04 |
| CN102548207B true CN102548207B (en) | 2014-06-04 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507254B (en) * | 2014-12-31 | 2018-09-11 | 深圳市华星光电技术有限公司 | Flexible printed wiring board and liquid crystal display |
| CN105543946B (en) * | 2015-12-25 | 2017-10-31 | 深圳市景旺电子股份有限公司 | A kind of method and FPC for being used to control the thick uniformity of the tin plating finger tin of FPC |
| CN115003058B (en) * | 2022-05-16 | 2024-03-22 | 深圳市景旺电子股份有限公司 | Golden finger lead design method, golden finger lead structure and circuit board |
| CN115416381B (en) * | 2022-07-29 | 2024-03-08 | 广州方邦电子股份有限公司 | Metal foil, negative electrode material applied to battery and battery |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010232579A (en) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | Method of manufacturing printed wiring board |
| TW201106810A (en) * | 2009-08-03 | 2011-02-16 | Hon Hai Prec Ind Co Ltd | Flexible printed circuit board |
| US8064216B2 (en) * | 2008-12-15 | 2011-11-22 | Mitsubishi Electric Corporation | Edge connector |
| CN202524647U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board golden finger electroplating structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5345023B2 (en) * | 2009-08-28 | 2013-11-20 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
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2012
- 2012-03-09 CN CN201210061311.XA patent/CN102548207B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8064216B2 (en) * | 2008-12-15 | 2011-11-22 | Mitsubishi Electric Corporation | Edge connector |
| JP2010232579A (en) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | Method of manufacturing printed wiring board |
| TW201106810A (en) * | 2009-08-03 | 2011-02-16 | Hon Hai Prec Ind Co Ltd | Flexible printed circuit board |
| CN202524647U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board golden finger electroplating structure |
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| CN102548207A (en) | 2012-07-04 |
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