CN106498483B - A kind of electroplating technological parameter inter-linked controlling method - Google Patents
A kind of electroplating technological parameter inter-linked controlling method Download PDFInfo
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- CN106498483B CN106498483B CN201611071479.3A CN201611071479A CN106498483B CN 106498483 B CN106498483 B CN 106498483B CN 201611071479 A CN201611071479 A CN 201611071479A CN 106498483 B CN106498483 B CN 106498483B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of electroplating technological parameter inter-linked controlling methods, the control method is the proportionate relationship by each thickness of coating and corresponding coating bath setting electric current of each money product of determination, and then by adjusting one of current parameters, the electric current of other coating baths is according to this current ratio adjust automatically.The advantage of the invention is that：Electroplating technological parameter inter-linked controlling method of the present invention, set the current ratio relationship of each thickness of coating of product and corresponding coating bath, as long as and then by adjusting one of current parameters, the electric current of other coating baths is automatically adjusted according to this current ratio, and will not be had an impact to the proportionate relationship of each coating of product；Meanwhile the electroplating technological parameter inter-linked controlling method, it is easy to operate, and labor intensity is greatly reduced, but also it is more convenient when to other similar-type products setting electric currents, it ensure that the stability of properties of product significantly.
Description
Technical field
The invention belongs to electroplating technology, more particularly to a kind of electroplating technological parameter inter-linked controlling method.
Background technology
Plating is exactly to plate the process of the other metal or alloy of a thin layer on substrate material surface using electrolysis principle, is
The technique for making the surface of metal or other materials product adhere to layer of metal film using electrolysis prevents metal oxygen to play
Change（Such as corrosion）, improve wearability, electric conductivity, reflective, corrosion resistance（Sour sulphur copper etc.）And the effects that having improved aesthetic appearance.
In electroplating process, the technological parameter condition by controlling each coating bath is needed, it is existing to meet the plating conditions of each coating
The control method used, if adjusting the electroplating technological parameter of one of coating bath, such as electric current, other electroplating technological parameters also need
It carries out, one by one by manual adjustment, the exception of thickness of coating could not being led to, but the control method is relatively complicated, and labor
Fatigue resistance is larger.
Therefore, research and development are a kind of can reduce labor intensity and electroplating technological parameter inter-linked controlling method right and wrong easy to operate
Often it is necessary to.
Invention content
Labor intensity and electroplating technology easy to operate can be reduced the technical problem to be solved in the present invention is to provide a kind of
Parameter inter-linked controlling method.
In order to solve the above technical problems, the technical scheme is that：A kind of electroplating technological parameter inter-linked controlling method,
Innovative point is：The control method is the ratio by each thickness of coating and corresponding coating bath setting electric current of each money product of determination
Relationship, and then by adjusting one of current parameters, the electric current of other coating baths is according to this current ratio adjust automatically.
Further, the control method is specially using copper cell current I as variable quantity, and the electric current of preplating copper coating is
The electric current of 0.6I, half bright nickel coating are 0.7I, and the electric current of bright nickel coating is 0.6I and the electric current of nickel envelope coating is 0.6I.
The advantage of the invention is that：Electroplating technological parameter inter-linked controlling method of the present invention sets each thickness of coating of product
With the current ratio relationship of corresponding coating bath, as long as and then by adjusting one of current parameters, the electric currents of other coating baths according to
This current ratio is automatically adjusted, and will not be had an impact to the proportionate relationship of each coating of product；Meanwhile the electroplating technology is joined
Number inter-linked controlling method, it is easy to operate, and labor intensity is greatly reduced, but also when to other similar-type products setting electric currents
It is more convenient, it ensure that the stability of properties of product significantly.
Specific implementation mode
The following examples can make professional and technical personnel that the present invention be more fully understood, but therefore not send out this
It is bright to be limited among the embodiment described range.
Embodiment 1
The present embodiment electroplating technological parameter inter-linked controlling method, the control method are each coating by each money product of determination
The proportionate relationship of thickness and corresponding coating bath setting electric current, i.e., using copper cell current I as variable quantity, the electric current of preplating copper coating is
The electric current of 0.6I, half bright nickel coating are 0.7I, and the electric current of bright nickel coating is 0.6I and the electric current of nickel envelope coating is 0.6I, Jin Ertong
It crosses and adjusts one of current parameters, the electric current of other coating baths is according to this current ratio adjust automatically.
Embodiment 2
Compared with Example 1, when copper cell current I becomes 0.2I, the electric current of other coating is according to this electric current ratio for the present embodiment
Example adjust automatically, the i.e. electric current of preplating copper coating are 0.12I, and the electric current of half bright nickel coating is 0.14I, and the electric current of bright nickel coating is
The electric current of 0.12I and nickel envelope coating is 0.12I.
Embodiment 3
Compared with Example 1, when copper cell current I becomes 0.5I, the electric current of other coating is according to this electric current ratio for the present embodiment
Example adjust automatically, the i.e. electric current of preplating copper coating are 0.3I, and the electric current of half bright nickel coating is 0.35I, and the electric current of bright nickel coating is
The electric current of 0.3I and nickel envelope coating is 0.3I.
Electroplating technological parameter inter-linked controlling method of the present invention, it is easy to operate, and labor intensity is greatly reduced, but also right
It is more convenient when other similar-type products setting electric currents, it ensure that the stability of properties of product significantly.
The basic principles and main features and advantages of the present invention of the present invention have been shown and described above.The skill of the industry
Art personnel it should be appreciated that the present invention is not limited to the above embodiments, the above embodiments and description only describe
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (1)
1. a kind of electroplating technological parameter inter-linked controlling method, it is characterised in that：The control method is by each money product of determination
Each thickness of coating and corresponding coating bath setting electric current proportionate relationship, and then by adjusting one of current parameters, other
The electric current of coating bath is according to this current ratio adjust automatically；The control method is specially the copper pre-plating using copper cell current I as variable quantity
The electric current of coating is 0.6I, and the electric current of half bright nickel coating is 0.7I, and the electric current of bright nickel coating is the electric current that 0.6I and nickel seal coating
For 0.6I.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611071479.3A CN106498483B (en) | 2016-11-29 | 2016-11-29 | A kind of electroplating technological parameter inter-linked controlling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611071479.3A CN106498483B (en) | 2016-11-29 | 2016-11-29 | A kind of electroplating technological parameter inter-linked controlling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106498483A CN106498483A (en) | 2017-03-15 |
| CN106498483B true CN106498483B (en) | 2018-10-23 |
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| CN201611071479.3A Active CN106498483B (en) | 2016-11-29 | 2016-11-29 | A kind of electroplating technological parameter inter-linked controlling method |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114808084B (en) * | 2021-01-29 | 2024-07-02 | 泰科电子(上海)有限公司 | Electroplating device and electroplating system |
| CN114381792B (en) * | 2021-11-12 | 2023-09-19 | 武汉钢铁有限公司 | Method for stably controlling electroplating solution |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1138639A (en) * | 1995-06-22 | 1996-12-25 | 徐叔炎 | Electroplating current density automatic regulating meter |
| CN101748471A (en) * | 2009-12-01 | 2010-06-23 | 华南理工大学 | Barrel plating current intensity real-time online testing device |
| CN202465936U (en) * | 2012-01-04 | 2012-10-03 | 江阴三知工控机械有限公司 | Device for automatically adjusting current setting according to number of steel wires |
| CN104532334A (en) * | 2015-01-01 | 2015-04-22 | 深圳市兴达线路板有限公司 | Plating line current abnormality detection and current regulation method and device |
| CN106011983A (en) * | 2016-07-16 | 2016-10-12 | 厦门建霖工业有限公司 | Intelligent electroplating equipment and application method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6793796B2 (en) * | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| DE102006033721A1 (en) * | 2006-03-21 | 2007-09-27 | Daimlerchrysler Ag | Method and device for predicting the paint layer thickness |
-
2016
- 2016-11-29 CN CN201611071479.3A patent/CN106498483B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1138639A (en) * | 1995-06-22 | 1996-12-25 | 徐叔炎 | Electroplating current density automatic regulating meter |
| CN101748471A (en) * | 2009-12-01 | 2010-06-23 | 华南理工大学 | Barrel plating current intensity real-time online testing device |
| CN202465936U (en) * | 2012-01-04 | 2012-10-03 | 江阴三知工控机械有限公司 | Device for automatically adjusting current setting according to number of steel wires |
| CN104532334A (en) * | 2015-01-01 | 2015-04-22 | 深圳市兴达线路板有限公司 | Plating line current abnormality detection and current regulation method and device |
| CN106011983A (en) * | 2016-07-16 | 2016-10-12 | 厦门建霖工业有限公司 | Intelligent electroplating equipment and application method thereof |
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| Publication number | Publication date |
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| CN106498483A (en) | 2017-03-15 |
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