CN105018988A - Cu-Zn-Sn ternary alloy electroplate liquid - Google Patents
Cu-Zn-Sn ternary alloy electroplate liquid Download PDFInfo
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- CN105018988A CN105018988A CN201510518319.8A CN201510518319A CN105018988A CN 105018988 A CN105018988 A CN 105018988A CN 201510518319 A CN201510518319 A CN 201510518319A CN 105018988 A CN105018988 A CN 105018988A
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Abstract
The invention relates to Cu-Zn-Sn ternary alloy electroplate liquid. The Cu-Zn-Sn ternary alloy electroplate liquid comprises, by concentration, 15-25 g/L of copper sulfate, 10-20 g/L of tin methane sulfonate, 20-40 g/L of zinc sulfate, 100-120 g/L of sulfuric acid, 10-20 mL/L of citric acid and 20-35 g/L of potassium citrate. The pH value of the electroplate liquid is regulated to range from 8.0 to 10.0 through a pH value regulating agent. An existing cyanide gold imitation electroplate technology can be replaced with the electroplate liquid, and the electroplate liquid can be applied to utilization of imitated 9K or imitated 18K or imitated 24K gold on the surfaces of decorative objects such as jewelry, clocks, watches and crafts.
Description
Technical field
The present invention relates to a kind of electroplate liquid, relate to a kind of alloy plating liquid further, be specifically related to a kind of Cu-Zn-Sn ternary alloys plating liquid, belong to field of electroplating.
Background technology
Imitation gold plating is a kind of decoration type alloy plating technology, the ornaments such as jewellery, artwork, home appliances, light fixture and clock and watch on the surface plating one deck decorative imitating gold plate just become bright and glittering, the effect identical with proof gold and Deposit appearance color and luster thereof can be reached, therefore imitation gold deposit extremely people like.
Imitation gold plating has prussiate to electroplate and cyanideless electro-plating two type, traditional gold simulating electroplating process is prussiate plating, and toxicity is large, waste water, liquid waste disposal difficulty, and environmental pollution is serious, but also can healthy to operator of serious harm, application is extremely restricted.And existing non-cyanide imitating gold electroplating mainly contains Cu-Zn binary imitation gold plating and Cu-Zn-Sn ternary gold simulating electroplating process, but existing technique all exists, and process parameters range is narrower, imitation gold deposit appearance luster is undesirable, surface pinholes is more, have the shortcomings such as pit existence, its technique still awaits improving further and optimizing.
Summary of the invention
Technical problem to be solved by this invention be provide a kind of for the state of the art and fill a prescription simply, all plating and the strong Cu-Zn-Sn ternary alloys plating liquid of hiding power.
The present invention solves the problems of the technologies described above adopted technical scheme: a kind of Cu-Zn-Sn ternary alloys plating liquid, comprises the component of following concentration:
Wherein, above-mentioned Cu-Zn-Sn ternary alloys plating liquid also comprises the component of following concentration:
Benzylideneacetone 20 ~ 25g/L;
Polyoxyethylene nonylphenol ether 60 ~ 70g/L;
Sodium metnylene bis-naphthalene sulfonate 15 ~ 20g/L.
Wherein, the above-mentioned component also comprising following concentration:
Quadrol 30 ~ 50g/L;
Nitrilotriacetic acid(NTA) 20 ~ 25g/L.
Wherein, described pH value adjusting agent is potassium hydroxide or sodium hydroxide.
Wherein, during described Cu-Zn-Sn ternary alloys plating liquid plating, required anode is stainless steel.
Wherein, the cathode current density of described Cu-Zn-Sn ternary alloys plating liquid is 2 ~ 4A/dm
2.
Compared with prior art, the invention has the advantages that: this Cu-Zn-Sn ternary alloys plating liquid is cyanide-free plating bath, wastewater and waste liquid treatment is easy, and environmental pollution is little, to health without harm; In addition, this plating solution formula is simple, be easy to control, process parameters range is wide, and its appearance luster is good, bath stability, and all plating and hiding power are by force, long service life, and batch production stability is high; The imitation gold deposit crystallization using this electroplate liquid to electroplate is careful, and porosity is low, without peeling, comes off and peeling.In addition, this electroplate liquid can replace existing prussiate gold simulating electroplating process, uses as imitative 9K, 18K or 24K gold in the decorative articles surfaces such as jewellery, clock and watch and artwork.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment 1
The Cu-Zn-Sn ternary alloys plating liquid of the present embodiment, comprises the component of following concentration:
The electroplate liquid of the present embodiment also comprises pH value adjusting agent---potassium hydroxide or sodium hydroxide, and for adjusting bath pH values to 8.0.
Configure according to the above ratio, stir, during the plating of Cu-Zn-Sn ternary alloys plating liquid, required anode is stainless steel; The cathode current density of Cu-Zn-Sn ternary alloys plating liquid is 2 ~ 4A/dm
2; The temperature of Cu-Zn-Sn ternary alloys plating liquid is room temperature.
Embodiment 2
The Cu-Zn-Sn ternary alloys plating liquid of the present embodiment, comprises the component of following concentration:
The electroplate liquid of the present embodiment also comprises pH value adjusting agent---potassium hydroxide or sodium hydroxide, and for adjusting bath pH values to 9.0.
Parameter reference embodiment 1 when the Cu-Zn-Sn ternary alloys plating liquid of the present embodiment is electroplated.
Embodiment 3
The Cu-Zn-Sn ternary alloys plating liquid of the present embodiment, comprises the component of following concentration:
The electroplate liquid of the present embodiment also comprises pH value adjusting agent---potassium hydroxide or sodium hydroxide, and for adjusting bath pH values to 10.0.
Parameter reference embodiment 1 when the Cu-Zn-Sn ternary alloys plating liquid of the present embodiment is electroplated.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (6)
1. a Cu-Zn-Sn ternary alloys plating liquid, is characterized in that, comprises the component of following concentration:
2. Cu-Zn-Sn ternary alloys plating liquid according to claim 1, is characterized in that, also comprise the component of following concentration:
Benzylideneacetone 20 ~ 25g/L;
Polyoxyethylene nonylphenol ether 60 ~ 70g/L;
Sodium metnylene bis-naphthalene sulfonate 15 ~ 20g/L.
3. Cu-Zn-Sn ternary alloys plating liquid according to claim 1, is characterized in that, also comprise the component of following concentration:
Quadrol 30 ~ 50g/L;
Nitrilotriacetic acid(NTA) 20 ~ 25g/L.
4. Cu-Zn-Sn ternary alloys plating liquid according to claim 1, is characterized in that: described pH value adjusting agent is potassium hydroxide or sodium hydroxide.
5. Cu-Zn-Sn ternary alloys plating liquid according to claim 1, is characterized in that: during described Cu-Zn-Sn ternary alloys plating liquid plating, required anode is stainless steel.
6. Cu-Zn-Sn ternary alloys plating liquid according to claim 1, is characterized in that: the cathode current density of described Cu-Zn-Sn ternary alloys plating liquid is 2 ~ 4A/dm
2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510518319.8A CN105018988A (en) | 2015-08-21 | 2015-08-21 | Cu-Zn-Sn ternary alloy electroplate liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510518319.8A CN105018988A (en) | 2015-08-21 | 2015-08-21 | Cu-Zn-Sn ternary alloy electroplate liquid |
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| CN105018988A true CN105018988A (en) | 2015-11-04 |
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| CN201510518319.8A Pending CN105018988A (en) | 2015-08-21 | 2015-08-21 | Cu-Zn-Sn ternary alloy electroplate liquid |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
| CN108385142A (en) * | 2018-03-27 | 2018-08-10 | 苏州东吴黄金文化发展有限公司 | For gold-plated cyanide-free gold plating solution |
| CN109778263A (en) * | 2017-11-10 | 2019-05-21 | 丹阳市金地生态园林发展有限公司 | A kind of metal alloy bright plating liquid containing epoxychloropropane |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709494A (en) * | 2009-12-14 | 2010-05-19 | 昆明理工大学 | Cu-Zn-Sn ternary alloy cyanide-free imitation gold plating solution and use method thereof |
| CN102443827A (en) * | 2011-12-19 | 2012-05-09 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Sn-Zn alloy electroplating solution |
| CN104313580A (en) * | 2014-09-23 | 2015-01-28 | 明光旭升科技有限公司 | Chemical deplating solution suitable for removing tin-nickel plating layer on brass surface |
-
2015
- 2015-08-21 CN CN201510518319.8A patent/CN105018988A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709494A (en) * | 2009-12-14 | 2010-05-19 | 昆明理工大学 | Cu-Zn-Sn ternary alloy cyanide-free imitation gold plating solution and use method thereof |
| CN102443827A (en) * | 2011-12-19 | 2012-05-09 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Sn-Zn alloy electroplating solution |
| CN104313580A (en) * | 2014-09-23 | 2015-01-28 | 明光旭升科技有限公司 | Chemical deplating solution suitable for removing tin-nickel plating layer on brass surface |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
| CN109778263A (en) * | 2017-11-10 | 2019-05-21 | 丹阳市金地生态园林发展有限公司 | A kind of metal alloy bright plating liquid containing epoxychloropropane |
| CN108385142A (en) * | 2018-03-27 | 2018-08-10 | 苏州东吴黄金文化发展有限公司 | For gold-plated cyanide-free gold plating solution |
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Application publication date: 20151104 |