CN202524647U - Flexible circuit board golden finger electroplating structure - Google Patents
Flexible circuit board golden finger electroplating structure Download PDFInfo
- Publication number
- CN202524647U CN202524647U CN2012200873610U CN201220087361U CN202524647U CN 202524647 U CN202524647 U CN 202524647U CN 2012200873610 U CN2012200873610 U CN 2012200873610U CN 201220087361 U CN201220087361 U CN 201220087361U CN 202524647 U CN202524647 U CN 202524647U
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- Prior art keywords
- electroplating
- golden finger
- circuit board
- pin
- flexible circuit
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Abstract
The utility model discloses a flexible circuit board golden finger electroplating structure. The flexible circuit board golden finger electroplating structure comprises golden finger pins to be electroplated which are arranged on a flexible circuit board, and external electroplating wires which are connected with the golden finger pins. The flexible circuit board golden finger electroplating structure is characterized in that the golden finger pins comprise pins with at least two different widths, and at least one of the external electroplating wires connected with the pins with different widths is provided with one area which has a width different from the widths of other electroplating wires. By utilizing the flexible circuit board golden finger electroplating structure for electroplating the golden fingers, a wire-connected electroplating board adjusts sizes of the external electroplating wires which are connected with the wire-connected electroplating board according to widths of molded golden fingers, and thereby current dispersion difference of each golden finger is reduced, and metal cation orientation reduction speeds are almost consistent during electroplating after uniform current dispersion so as to make coating roughness consistent. As metal ions have roughly equal light refraction effects, the golden fingers have uniform surface brightness and no color difference; thickness of coating is uniform; appearance effects are good; and circuit board appearance is greatly improved.
Description
Technical field
The utility model relates to a kind of circuit board gold finger electroplated structural, relates in particular to a kind of flexible PCB gold finger galvanizing structure, belongs to electronic technology field.
Background technology
In the prior art, the flexible circuitry board electroplating is normal to divide two kinds, and a kind of is that the plate face is gold-plated gold-plated with the skewer head, and the plate face is gold-plated, and its gold layer requires thinner, has good electrical conductivity and solderability; The skewer head is gold-plated, and to be commonly called as golden finger gold-plated, plating be hard gold, this is the alloy layer of metallic elements such as a kind of CO of containing, Ni, Fb, Sb, its hardness, resistance to wear all are higher than proof gold coating, general Gold plated Layer requires thicker.Electrogilding is under the situation of extraneous electric current, just can plate, thus need each pad Pad all can pull strings, and allow to pull strings just can plating.This surface treatment mode of pulling strings and electroplating; Be that impressed current makes coating anode betatopic generation oxidation reaction; Become metal cation, orientation moves to negative electrode and receives plating piece, obtains the electronics that anode loses at negative electrode and is reduced to metallic to be oriented to plating piece be FPC.To the flexible PCB gold finger galvanizing time, because the thickness width of the golden finger that designs is different on the circuit board, be prone to the surface brightness inequality after the plating, have aberration, the unequal defective of thickness of coating, influence the circuit board exterior quality.
The utility model content
The utility model technical problem to be solved provides a kind of circuit board gold finger electroplated structural; Adopt this structure can overcome the open defect that occurs behind the gold finger galvanizing in the prior art, make after the plating the golden finger surface brightness evenly, no color differnece, thickness of coating be even.
For solving the problems of the technologies described above; The utility model provides a kind of FPC gold finger galvanizing structure, comprises the golden finger pin of the electroplated that is located on the FPC, the external electric plate wire that is connected with the golden finger pin; It is characterized in that; At least comprise two kinds of pins that width is different in the said golden finger pin, in each external electric plate wire that the pin different with width connects, have at least width zone inequality on a width and other plating lines is set on the plating line.The width zone inequality that is provided with on this root plating line is adjusted into the different width direction adjustment of connected pin widths; If be the pin wider width that plating line connects; Then this root plating line is provided with the zone of a width than narrow width on other plating lines; If if the pin width that plating line connected is narrower, then this root plating line is provided with a width than the wide zone of width on other plating lines.
The different pin of width comprises wide thick pin and narrow thin pin, and on the plating line that said thick pin is connected a reduced width region is set.
Said reduced width region is that to be arranged on the circular arc indent of the symmetry on the plating line contraction-like.
Width to said plating line on the film carries out above-mentioned setting.
The beneficial effect that the utility model reached:
When the structure of the utility model is carried out gold finger galvanizing, form the loop by plating line and electroplate, according to the thickness of the external electric plate wire that be connected with golden finger by the adjustment of surfacing size; Thereby dwindle the electric current poor dispersion of each finger, after electric current is uniformly dispersed, during plating; The directed reduction rate trend of metal cation is consistent, makes the coating roughness consistent, and metal ion is roughly suitable to the refraction effect of light; The surface brightness that makes golden finger evenly, no color differnece; And thickness of coating is even, demonstrates the good surface appearance effect, has improved the wiring board exterior quality greatly.
Description of drawings
Fig. 1 is the utility model one embodiment sketch map.
Embodiment
Below in conjunction with accompanying drawing the utility model is further described.Following examples only are used for more clearly explaining the technical scheme of the utility model, and can not limit the protection range of the utility model with this.
Pull strings when electroplating; Form the loop by plating line and electroplate, impressed current makes coating anode betatopic generation oxidation reaction, becomes metal cation; Orientation moves to negative electrode and receives plating piece, obtains the electronics that anode loses at negative electrode and is reduced to metallic to be oriented to plating piece be FPC.And brightness disproportionation also just on the plating piece golden finger scattered current uneven, cause the directed reduction rate of metal cation inconsistent, making and receiving coating is that the golden finger surface roughness is inconsistent, makes metal ion variant to the refraction of light.
Embodiment 1
As shown in Figure 1; In the utility model, when making the film, FPC 1 golden finger 2 is improved design through the CAM software design; To receive the surfacing size to adjust the thickness of the external electric plate wire 3 that is connected with golden finger 2 according to each pin pin in FPC 1 golden finger 2 terminal region; Each pin pin is varied in size by surfacing in the golden finger 2, and promptly pin pin thickness width is different, comprises two kinds of thick pins 21 and thin pin 22 that thickness is different at least.In the present embodiment with moulding that thick pin 21 is connected outside plating line 3 on a bottleneck 31 is set is that area reduces the district, make the zone (other plating lines do not change, and are not shown) that forms an area on the plating line 3 and reduce; Thereby dwindle the electric current poor dispersion that flows through thick pin 21 and thin pin 22; After electric current was uniformly dispersed, during plating, the directed reduction rate trend of metal cation was consistent; Make the coating roughness consistent; Metal ion is roughly suitable to the refraction effect of light, the surface brightness that makes each pin of golden finger evenly, no color differnece, and thickness of coating is even.After the plating, again golden finger 2 outside waste materials are cut, become the shaped form that needs.
The above only is the preferred implementation of the utility model; Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model know-why, can also make some improvement and distortion, these improvement and distortion also should be regarded as the protection range of the utility model.
Claims (4)
1. FPC gold finger galvanizing structure; The golden finger pin that comprises the electroplated that is located on the FPC; The external electric plate wire that is connected with the golden finger pin is characterized in that, comprises two kinds of pins that width is different in the said golden finger pin at least; In each external electric plate wire that the pin different with width connects, have at least width zone inequality on a width and other plating lines is set on the plating line.
2. FPC gold finger galvanizing structure according to claim 1 is characterized in that, the different pin of width comprises wide thick pin and narrow thin pin, and on the plating line that said thick pin is connected a reduced width region is set.
3. FPC gold finger galvanizing structure according to claim 2 is characterized in that, said reduced width region is that to be arranged on the circular arc indent of the symmetry on the plating line contraction-like.
4. according to any described FPC gold finger galvanizing structure among the claim 1-3, it is characterized in that the width to said plating line on the film carries out above-mentioned setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200873610U CN202524647U (en) | 2012-03-09 | 2012-03-09 | Flexible circuit board golden finger electroplating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200873610U CN202524647U (en) | 2012-03-09 | 2012-03-09 | Flexible circuit board golden finger electroplating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202524647U true CN202524647U (en) | 2012-11-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200873610U Expired - Fee Related CN202524647U (en) | 2012-03-09 | 2012-03-09 | Flexible circuit board golden finger electroplating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202524647U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548207A (en) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | Electroplating structure for golden fingers of flexible circuit board |
| CN104507254A (en) * | 2014-12-31 | 2015-04-08 | 深圳市华星光电技术有限公司 | Flexible printed circuit board and liquid crystal display |
-
2012
- 2012-03-09 CN CN2012200873610U patent/CN202524647U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548207A (en) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | Electroplating structure for golden fingers of flexible circuit board |
| CN102548207B (en) * | 2012-03-09 | 2014-06-04 | 昆山亿富达电子有限公司 | Electroplating structure for golden fingers of flexible circuit board |
| CN104507254A (en) * | 2014-12-31 | 2015-04-08 | 深圳市华星光电技术有限公司 | Flexible printed circuit board and liquid crystal display |
| US9804457B2 (en) | 2014-12-31 | 2017-10-31 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Flexible printed circuit board and liquid crystal display |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20140309 |