CN102548207A - Electroplating structure for golden fingers of flexible circuit board - Google Patents
Electroplating structure for golden fingers of flexible circuit board Download PDFInfo
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- CN102548207A CN102548207A CN201210061311XA CN201210061311A CN102548207A CN 102548207 A CN102548207 A CN 102548207A CN 201210061311X A CN201210061311X A CN 201210061311XA CN 201210061311 A CN201210061311 A CN 201210061311A CN 102548207 A CN102548207 A CN 102548207A
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Abstract
The invention discloses an electroplating structure for the golden fingers of a flexible circuit board, which contains the pins of golden fingers and outer electroplating lines, wherein the pins of the golden fingers to be electroplated are arranged on a flexible circuit board, and the outer electroplating lines are connected with the pins of the golden fingers. The electroplating structure for the golden fingers of the flexible circuit board is characterized in that the pins of the golden fingers at least contain two pins with different widths. In each outer electroplating line connected with the pins with different widths, an area of which the width is not the same with the widths on other electroplating lines is arranged on at least one electroplating line. When the golden fingers are electroplated according to the structure disclosed by the invention, the thicknesses of the outer electroplating lines connected with an electroplating plate of a traction line are regulated by the electroplating plate of the traction line according to the thicknesses and the widths of the formed golden fingers, so that the current dispersing difference of each finger is reduced. After current is dispersed evenly, the trends of the directional reducing speeds of metal cations are consistent during electroplating, so that the roughness of an electroplating layer is consistent. The refractive effects of metal ions to light are approximately equivalent, so that the brightness of the surfaces of the golden fingers is uniform, and no color difference exists; and moreover, the thickness of the electroplating layer is uniform, a favorable appearance effect is presented, and the quality of the appearance of the circuit board is greatly enhanced.
Description
Technical field
The present invention relates to a kind of circuit board gold finger electroplated structural, relate in particular to a kind of flexible PCB gold finger galvanizing structure, belong to electronic technology field.
Background technology
In the prior art, the flexible circuitry board electroplating is normal to divide two kinds, and a kind of is that the plate face is gold-plated gold-plated with the skewer head, and the plate face is gold-plated, and its gold layer requires thinner, has good electrical conductivity and solderability; The skewer head is gold-plated, and to be commonly called as golden finger gold-plated, plating be hard gold, this is the alloy layer of metallic elements such as a kind of CO of containing, Ni, Fb, Sb, its hardness, resistance to wear all are higher than proof gold coating, general Gold plated Layer requires thicker.Electrogilding is under the situation of extraneous electric current, just can plate, thus need each pad Pad all can pull strings, and allow to pull strings just can plating.This surface treatment mode of pulling strings and electroplating; Be that impressed current makes coating anode betatopic generation oxidation reaction; Become metal cation, orientation moves to negative electrode and receives plating piece, obtains the electronics that anode loses at negative electrode and is reduced to metallic to be oriented to plating piece be FPC.To the flexible PCB gold finger galvanizing time, because the thickness width of the golden finger that designs is different on the circuit board, be prone to the surface brightness inequality after the plating, have aberration, the unequal defective of thickness of coating, influence the circuit board exterior quality.
Summary of the invention
Technical problem to be solved by this invention provides a kind of circuit board gold finger electroplated structural; Adopt this structure can overcome the open defect that occurs behind the gold finger galvanizing in the prior art, make after the plating the golden finger surface brightness evenly, no color differnece, thickness of coating be even.
For solving the problems of the technologies described above; The present invention provides a kind of FPC gold finger galvanizing structure, comprises the golden finger pin of the electroplated that is located on the FPC, the external electric plate wire that is connected with the golden finger pin; It is characterized in that; At least comprise two kinds of pins that width is different in the said golden finger pin, in each external electric plate wire that the pin different with width connects, have at least width zone inequality on a width and other plating lines is set on the plating line.The width zone inequality that is provided with on this root plating line is adjusted into the different width direction adjustment of connected pin widths; If be the pin wider width that plating line connects; Then this root plating line is provided with the zone of a width than narrow width on other plating lines; If if the pin width that plating line connected is narrower, then this root plating line is provided with a width than the wide zone of width on other plating lines.
The different pin of width comprises wide thick pin and narrow thin pin, and on the plating line that said thick pin is connected a reduced width region is set.
Said reduced width region is that to be arranged on the circular arc indent of the symmetry on the plating line contraction-like.
Width to said plating line on the film carries out above-mentioned setting.
The beneficial effect that the present invention reached:
When structure of the present invention is carried out gold finger galvanizing, form the loop by plating line and electroplate, according to the thickness of the external electric plate wire that be connected with golden finger by the adjustment of surfacing size; Thereby dwindle the electric current poor dispersion of each finger, after electric current is uniformly dispersed, during plating; The directed reduction rate trend of metal cation is consistent, makes the coating roughness consistent, and metal ion is roughly suitable to the refraction effect of light; The surface brightness that makes golden finger evenly, no color differnece; And thickness of coating is even, demonstrates the good surface appearance effect, has improved the wiring board exterior quality greatly.
Description of drawings
Fig. 1 is one embodiment of the invention sketch map.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.Following examples only are used for technical scheme of the present invention more clearly is described, and can not limit protection scope of the present invention with this.
Pull strings when electroplating; Form the loop by plating line and electroplate, impressed current makes coating anode betatopic generation oxidation reaction, becomes metal cation; Orientation moves to negative electrode and receives plating piece, obtains the electronics that anode loses at negative electrode and is reduced to metallic to be oriented to plating piece be FPC.And brightness disproportionation also just on the plating piece golden finger scattered current uneven, cause the directed reduction rate of metal cation inconsistent, making and receiving coating is that the golden finger surface roughness is inconsistent, makes metal ion variant to the refraction of light.
Embodiment 1
As shown in Figure 1; Among the present invention, when making the film, FPC 1 golden finger 2 is improved design through the CAM software design; To receive the surfacing size to adjust the thickness of the external electric plate wire 3 that is connected with golden finger 2 according to each pin pin in FPC 1 golden finger 2 terminal region; Each pin pin is varied in size by surfacing in the golden finger 2, and promptly pin pin thickness width is different, comprises two kinds of thick pins 21 and thin pin 22 that thickness is different at least.In the present embodiment with moulding that thick pin 21 is connected outside plating line 3 on a bottleneck 31 is set is that area reduces the district, make the zone (other plating lines do not change, and are not shown) that forms an area on the plating line 3 and reduce; Thereby dwindle the electric current poor dispersion that flows through thick pin 21 and thin pin 22; After electric current was uniformly dispersed, during plating, the directed reduction rate trend of metal cation was consistent; Make the coating roughness consistent; Metal ion is roughly suitable to the refraction effect of light, the surface brightness that makes each pin of golden finger evenly, no color differnece, and thickness of coating is even.After the plating, again golden finger 2 outside waste materials are cut, become the shaped form that needs.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and distortion, these improvement and distortion also should be regarded as protection scope of the present invention.
Claims (4)
1. FPC gold finger galvanizing structure; The golden finger pin that comprises the electroplated that is located on the FPC; The external electric plate wire that is connected with the golden finger pin is characterized in that, comprises two kinds of pins that width is different in the said golden finger pin at least; In each external electric plate wire that the pin different with width connects, have at least width zone inequality on a width and other plating lines is set on the plating line.
2. FPC gold finger galvanizing structure according to claim 1 is characterized in that, the different pin of width comprises wide thick pin and narrow thin pin, and on the plating line that said thick pin is connected a reduced width region is set.
3. FPC gold finger galvanizing structure according to claim 2 is characterized in that, said reduced width region is that to be arranged on the circular arc indent of the symmetry on the plating line contraction-like.
4. according to any described FPC gold finger galvanizing structure among the claim 1-3, it is characterized in that the width to said plating line on the film carries out above-mentioned setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210061311.XA CN102548207B (en) | 2012-03-09 | 2012-03-09 | Electroplating structure for golden fingers of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210061311.XA CN102548207B (en) | 2012-03-09 | 2012-03-09 | Electroplating structure for golden fingers of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN102548207A true CN102548207A (en) | 2012-07-04 |
| CN102548207B CN102548207B (en) | 2014-06-04 |
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| CN201210061311.XA Active CN102548207B (en) | 2012-03-09 | 2012-03-09 | Electroplating structure for golden fingers of flexible circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507254A (en) * | 2014-12-31 | 2015-04-08 | 深圳市华星光电技术有限公司 | Flexible printed circuit board and liquid crystal display |
| CN105543946A (en) * | 2015-12-25 | 2016-05-04 | 深圳市景旺电子股份有限公司 | Method used for controlling uniformity of tin thickness of tin-plated fingers of flexible printed circuit (FPC) and FPC |
| CN115003058A (en) * | 2022-05-16 | 2022-09-02 | 深圳市景旺电子股份有限公司 | Golden finger lead design method, golden finger lead structure and circuit board |
| CN115416381A (en) * | 2022-07-29 | 2022-12-02 | 广州方邦电子股份有限公司 | Metal foil, negative electrode material applied to battery and battery |
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| JP2010232579A (en) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | Method of manufacturing printed wiring board |
| TW201106810A (en) * | 2009-08-03 | 2011-02-16 | Hon Hai Prec Ind Co Ltd | Flexible printed circuit board |
| US20110048791A1 (en) * | 2009-08-28 | 2011-03-03 | Nitto Denko Corporation | Printed circuit board and method of manufacturing the same |
| US8064216B2 (en) * | 2008-12-15 | 2011-11-22 | Mitsubishi Electric Corporation | Edge connector |
| CN202524647U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board golden finger electroplating structure |
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2012
- 2012-03-09 CN CN201210061311.XA patent/CN102548207B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8064216B2 (en) * | 2008-12-15 | 2011-11-22 | Mitsubishi Electric Corporation | Edge connector |
| JP2010232579A (en) * | 2009-03-30 | 2010-10-14 | Oki Networks Co Ltd | Method of manufacturing printed wiring board |
| TW201106810A (en) * | 2009-08-03 | 2011-02-16 | Hon Hai Prec Ind Co Ltd | Flexible printed circuit board |
| US20110048791A1 (en) * | 2009-08-28 | 2011-03-03 | Nitto Denko Corporation | Printed circuit board and method of manufacturing the same |
| CN202524647U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board golden finger electroplating structure |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507254A (en) * | 2014-12-31 | 2015-04-08 | 深圳市华星光电技术有限公司 | Flexible printed circuit board and liquid crystal display |
| WO2016106827A1 (en) * | 2014-12-31 | 2016-07-07 | 深圳市华星光电技术有限公司 | Flexible printed circuit board and liquid crystal display |
| US9804457B2 (en) | 2014-12-31 | 2017-10-31 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Flexible printed circuit board and liquid crystal display |
| CN105543946A (en) * | 2015-12-25 | 2016-05-04 | 深圳市景旺电子股份有限公司 | Method used for controlling uniformity of tin thickness of tin-plated fingers of flexible printed circuit (FPC) and FPC |
| CN115003058A (en) * | 2022-05-16 | 2022-09-02 | 深圳市景旺电子股份有限公司 | Golden finger lead design method, golden finger lead structure and circuit board |
| CN115003058B (en) * | 2022-05-16 | 2024-03-22 | 深圳市景旺电子股份有限公司 | Golden finger lead design method, golden finger lead structure and circuit board |
| CN115416381A (en) * | 2022-07-29 | 2022-12-02 | 广州方邦电子股份有限公司 | Metal foil, negative electrode material applied to battery and battery |
| CN115416381B (en) * | 2022-07-29 | 2024-03-08 | 广州方邦电子股份有限公司 | Metal foil, negative electrode material applied to battery and battery |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102548207B (en) | 2014-06-04 |
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