CN110602891B - Electroplating method capable of repeatedly utilizing plating accompanying plate - Google Patents
Electroplating method capable of repeatedly utilizing plating accompanying plate Download PDFInfo
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- CN110602891B CN110602891B CN201910782594.9A CN201910782594A CN110602891B CN 110602891 B CN110602891 B CN 110602891B CN 201910782594 A CN201910782594 A CN 201910782594A CN 110602891 B CN110602891 B CN 110602891B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of printed circuit boards, in particular to an electroplating method capable of recycling a plating accompanying plate. When the VCP is used for electroplating a production plate, the plating assistant plate electroplated with a nickel layer as an etching protective layer is used for plating, the plating assistant plate passes through an alkaline etching line once when the electroplating treatment of the production plate of each line is finished, a copper layer formed on the surface of the plating assistant plate in the electroplating treatment process is removed through the etching treatment, and the plating assistant plate is recovered to be in a state before use, so that the plating assistant plate can be used in the electroplating treatment again, the reuse of the plating assistant plate is realized, the problems of the plating assistant plate falling, clamp damage, copper cylinder pollution and the like in the electroplating process caused by poor appearance and heavy thickening of the existing plating assistant plate along with the increase of the use times are completely avoided, the production cost can be reduced and the production efficiency can be improved, and the production cost of the plating assistant plate of about 1.5 ten thousand yuan can be saved by the productivity of 10 ten thousand square meters.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to an electroplating method capable of recycling a plating accompanying plate.
Background
In the production of circuit boards, electroplating is an almost indispensable process, and at present, electroplating is generally performed using a gantry plating line or a vertical continuous plating apparatus (VCP), and due to the safety and economy of the vertical continuous plating apparatus, it has been a necessary trend to replace the gantry plating line.
When the vertical continuous electroplating equipment is used for electroplating, in order to ensure that the first plate and the last plate in the production plates of each line cannot burn due to overlarge current in the electroplating process of the production plates, the first plate and the last plate are respectively added with a plating accompanying plate before the first plate and after the last plate. The plating accompanying plate for VCP electroplating at present is formed by directly cutting a double-sided copper-clad plate used as a base material in circuit board production, the height of the plating accompanying plate is generally equivalent to that of a production plate, and the height difference is within the range of +/-3 cm. The copper surface on the plating accompanying plate is used for conducting electricity and distributing current, and plate burning of the first plate and the last plate in the production plate is avoided.
However, with the increase of the number of times of using the plating accompanying plate, especially the increase of the number of times of using the plating accompanying plate in the whole plate electroplating process, the amount of copper on the plating accompanying plate is obviously increased, the plating accompanying plate becomes thick and heavy, the appearance of the plating accompanying plate becomes poor, the problems of dropping of the plating accompanying plate, damage of a clamp, pollution of a copper cylinder and the like in the electroplating process are easily caused, the plating accompanying plate cannot be reused for a long time, and the plating accompanying plate needs to be frequently replaced, so that the production cost is increased and the production efficiency is influenced.
Disclosure of Invention
The invention provides an electroplating method capable of repeatedly utilizing an auxiliary plating plate so as to improve electroplating production efficiency and reduce production cost, aiming at the problems that the electroplating cost is increased and the production efficiency is influenced because the auxiliary plating plate used in the existing VCP electroplating can not be repeatedly used for a long time.
In order to achieve the purpose, the invention adopts the following technical scheme.
A plating method for recycling a plating accompanying plate comprises the following steps:
s1, cutting the double-sided copper-clad plate according to the size of the production plate to obtain a substrate;
s2, sequentially carrying out chemical nickel deposition, chemical gold deposition and electrogilding treatment on the substrate, and sequentially forming a nickel deposition layer, a gold deposition layer and an electrogilding layer on the copper surface of the substrate to obtain the plating assistant plate;
s3, electroplating the production plates by using vertical continuous electroplating equipment, and additionally arranging one plating accompanying plate in front of the first production plate and behind the last production plate respectively;
s4, passing the plating assistant plate used in the electroplating treatment of the previous step through an alkaline etching line, and carrying out etching treatment to remove a copper layer formed on the plating assistant plate in the electroplating treatment process;
s5, using the plating assistant plate after the previous etching treatment to carry out the electroplating treatment in the step S3;
s6, repeating the steps S4 and S5.
Preferably, in step S2, a nickel-deposited layer with a thickness of 3-5 μm is deposited on the substrate by electroless nickel deposition.
More preferably, the nickel precipitation time of the chemical nickel precipitation treatment is 20-30 min.
Preferably, in step S2, a gold-depositing layer with a thickness of 0.05-0.07 μm is deposited on the nickel-depositing layer of the substrate by a chemical gold-depositing process.
More preferably, in step S2, the electroless gold plating treatment is performed for a gold plating time of 10-15 min.
Preferably, in step S2, an electro-gold layer with a thickness of 0.20-0.30 μm is electroplated on the gold immersion layer of the substrate by an electro-gold plating process.
More preferably, in step S2, the current density of the gold electroplating treatment is 0.5ASD and the electroplating time is 180S.
Preferably, in step S1, the thickness of the copper layer of the double-sided copper-clad plate is H OZ.
Compared with the prior art, the invention has the beneficial effects that:
when the VCP is used for electroplating a production plate, the plating assistant plate electroplated with a nickel layer as an etching protective layer is used for plating, the plating assistant plate passes through an alkaline etching line once when the electroplating treatment of the production plate of each line is finished, a copper layer formed on the surface of the plating assistant plate in the electroplating treatment process is removed through the etching treatment, and the plating assistant plate is recovered to be in a state before use, so that the plating assistant plate can be used in the electroplating treatment again, the reuse of the plating assistant plate is realized, the problems of the plating assistant plate falling, clamp damage, copper cylinder pollution and the like in the electroplating process caused by poor appearance and heavy thickening of the existing plating assistant plate along with the increase of the use times are completely avoided, the production cost can be reduced and the production efficiency can be improved, and the production cost of the plating assistant plate of about 1.5 ten thousand yuan can be saved by the productivity of 10 ten thousand square meters. In addition, the plating accompanying plates are etched after the electroplating treatment of each line is finished, so that the states of the plating accompanying plates used in the electroplating treatment at each time can be ensured to be the same, the electroplating environments of the production plates of each line can be kept consistent as much as possible, and the electroplating quality is improved.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
The embodiment provides an electroplating method capable of recycling a plating accompanying plate, which comprises the steps of manufacturing the plating accompanying plate with a nickel-gold protective layer, and etching the plating accompanying plate after electroplating each time so that the plating accompanying plate can be repeatedly used in electroplating. The specific electroplating method comprises the following steps:
(1) and selecting a double-sided copper-clad plate with the copper layer of H OZ thickness, and cutting the double-sided copper-clad plate according to the size of the production plate to obtain the substrate. The height of the substrate is equivalent to that of the production plate, and the height difference is controlled within a range of +/-3 cm.
(2) And carrying out chemical nickel deposition, chemical gold deposition and electrogilding treatment on the substrate in sequence, and forming a nickel deposition layer, a gold deposition layer and an electrogilding layer on the copper surface of the substrate in sequence to obtain the plating accompanying plate.
Chemical nickel deposition treatment: depositing a nickel deposition layer with the thickness of 3-5 mu m on the substrate, wherein the nickel deposition time is controlled within the range of 20-30 min.
Chemical gold precipitation treatment: depositing a gold-depositing layer with the thickness of 0.05-0.07 mu m on the nickel-depositing layer of the substrate, and controlling the gold-depositing time within the range of 10-15 min.
Gold electroplating treatment: electroplating an electrogilding layer with the thickness of 0.20-0.30 μm on the immersion gold layer of the substrate, wherein the current density is 0.5ASD, and the electroplating time is 180S.
(3) And electroplating the production plates by using vertical continuous electroplating equipment, and additionally arranging the plating accompanying plates before the first production plate and after the last production plate.
(4) And (3) passing the plating assistant plate used in the electroplating treatment in the last step through an alkaline etching line, and performing etching treatment to remove a copper layer formed on the plating assistant plate in the electroplating treatment process.
(5) Carrying out the electroplating treatment in the step (3) by using the co-plated plate subjected to the previous etching treatment;
(6) and (5) repeating the step (4) and the step (5).
The method of the embodiment is used for carrying out the whole-plate electroplating treatment on the production plate, and the production capacity accounting is carried out according to 10 ten thousand square meters, so that about 1.5 ten thousand yuan of cost can be saved in the manufacturing cost of the plating accompanying plate.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (8)
1. A plating method for recycling a plating accompanying plate comprises the following steps: s1, cutting the double-sided copper-clad plate according to the size of the production plate to obtain a substrate; it is characterized in that the following steps are included after the step S1:
s2, sequentially carrying out chemical nickel deposition, chemical gold deposition and electrogilding treatment on the substrate, and sequentially forming a nickel deposition layer, a gold deposition layer and an electrogilding layer on the copper surface of the substrate to obtain the plating assistant plate;
s3, electroplating the production plates by using vertical continuous electroplating equipment, and additionally arranging one plating accompanying plate in front of the first production plate and behind the last production plate respectively;
s4, passing the plating assistant plate used in the electroplating treatment of the previous step through an alkaline etching line, and carrying out etching treatment to remove a copper layer formed on the plating assistant plate in the electroplating treatment process;
s5, using the plating assistant plate after the previous etching treatment to carry out the electroplating treatment in the step S3;
s6, repeating the steps S4 and S5.
2. The plating method of claim 1, wherein a nickel-depositing layer with a thickness of 3-5 μm is deposited on the substrate by electroless nickel plating in step S2.
3. The plating method of the secondary plating plate capable of being recycled according to the claim 2, wherein the nickel deposition time of the chemical nickel deposition treatment in the step S2 is 20-30 min.
4. The plating method of claim 2, wherein in step S2, a gold immersion layer with a thickness of 0.05-0.07 μm is deposited on the nickel immersion layer of the substrate by chemical gold immersion.
5. The plating method of claim 4, wherein the chemical gold-plating process is performed for a gold-plating time of 10-15min in step S2.
6. The plating method of the plating assistant plate capable of being reused as recited in claim 4, wherein in step S2, a plating gold layer with a thickness of 0.20-0.30 μm is plated on the gold immersion layer of the substrate by a plating gold process.
7. The plating method of claim 6, wherein the current density of the plating gold treatment is 0.5ASD and the plating time is 180S in step S2.
8. The plating method of the secondary plating plate for recycling according to claim 1, wherein in step S1, the copper layer thickness of the double-sided copper-clad plate is H OZ.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910782594.9A CN110602891B (en) | 2019-08-22 | 2019-08-22 | Electroplating method capable of repeatedly utilizing plating accompanying plate |
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| CN201910782594.9A CN110602891B (en) | 2019-08-22 | 2019-08-22 | Electroplating method capable of repeatedly utilizing plating accompanying plate |
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| CN110602891A CN110602891A (en) | 2019-12-20 |
| CN110602891B true CN110602891B (en) | 2021-01-15 |
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| CN113737254B (en) * | 2021-08-03 | 2024-01-23 | 昆山沪利微电有限公司 | Device and method for recycling Dummy board in electroplating VCP production line |
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| CN109041440A (en) * | 2018-08-22 | 2018-12-18 | 安徽四创电子股份有限公司 | A kind of production method of the PCB coated plate of wet film full coverage type |
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| JP6753721B2 (en) * | 2016-07-29 | 2020-09-09 | Ｄｏｗａメタルテック株式会社 | Metal-ceramic circuit board and its manufacturing method |
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| JP2005252173A (en) * | 2004-03-08 | 2005-09-15 | Toyota Motor Corp | Method for manufacturing semiconductor device and device usable for it |
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| CN110602891A (en) | 2019-12-20 |
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