CN213746231U

CN213746231U - Packaging structure of white light LED

Info

Publication number: CN213746231U
Application number: CN202022664282.9U
Authority: CN
Inventors: 唐勇; 林启程
Original assignee: Yonglin Electronics Co Ltd
Current assignee: Yonglin Electronics Co Ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-07-20
Anticipated expiration: 2030-11-17

Abstract

The utility model discloses a white light LED's packaging structure, it includes: the base is provided with a first mounting groove; the chip support is provided with a die bonding through groove and is fixedly installed at the bottom of the first installation groove; the anode ring is characterized in that an anode copper foil extending inwards is arranged on the inner side wall of the anode ring, a first connecting copper foil is arranged at the top of the anode ring, and the anode ring is fixedly installed in the first installation groove; the insulating ring is arranged on the top of the anode ring; the cathode ring is provided with a cathode copper foil extending inwards on the inner side wall of the cathode ring, a second connecting copper foil is arranged at the top of the cathode ring, and the cathode ring is fixedly installed in the first installation groove; the light shading ring is provided with a light transmission hole and is fixedly arranged on the first mounting groove; the service life of the lamp bead is prolonged, the light attenuation is reduced, and the production cost is reduced.

Description

Packaging structure of white light LED

Technical Field

The utility model relates to a LED lamp pearl field especially involves a white light LED's packaging structure.

Background

Along with the development of LED lamp pearl and the demand of society, in order to obtain better light efficiency effect, traditional LED packaging structure can not satisfy demands such as heat dissipation, light efficiency, life.

The conventional white light LED packaging structure generally fixes a chip and a welding gold wire on a substrate or fixes the chip on a PCB (printed circuit board) through fluorescent glue, but has poor heat dissipation effect and short service life; or the substrate is electroplated on the fixed mounting chip, but the cost is higher, the service life is general, and the process requirement is high.

The existing white light LED packaging structure is easy to have the phenomena of insufficient solder, fracture and short circuit in the production process, so that the actual use experience is poor. At present, a plurality of chips are integrated into one lamp bead for obtaining higher brightness and better light effect, the volume and the power are small, the heat dissipation of the lamp bead is kept up to the standard, and the light attenuation is lower. Meanwhile, the existing packaging structure is not very convenient in the welding and mounting processes.

Accordingly, there is a need for a package structure for a white LED that can solve one or more of the above problems.

SUMMERY OF THE UTILITY MODEL

In order to solve one or more problems existing in the prior art, the utility model provides a white light LED's packaging structure. The utility model discloses a solve the technical scheme that above-mentioned problem adopted and be: a packaging structure of a white light LED comprises: the device comprises a base, a first mounting groove and a second mounting groove, wherein the edge of the top surface of the base is provided with a side groove;

the chip support is provided with a die bonding through groove, a connecting groove is formed in the outer side of the die bonding through groove, and the chip support is fixedly installed at the bottom of the first installing groove;

the anode ring is characterized in that an anode copper foil extending inwards is arranged on the inner side wall of the anode ring and matched with the connecting groove, a first connecting copper foil is arranged at the top of the anode ring and installed on the side groove, and the anode ring is fixedly installed in the first installing groove;

the insulating ring is arranged on the top of the anode ring;

the cathode ring is characterized in that a cathode copper foil extending inwards is arranged on the inner side wall of the cathode ring, the cathode copper foil is matched with the connecting groove, a second connecting copper foil is arranged at the top of the cathode ring, the second connecting copper foil is arranged on the side groove, the cathode ring is fixedly arranged in the first mounting groove and is arranged at the top of the insulating ring, and the cathode ring is insulated from the anode ring;

the light shading ring is provided with a light transmitting hole and is fixedly installed on the first installation groove. This is the basis.

Further, still include: and the lens is fixedly arranged in the light-transmitting hole.

Further, still include: the die bonding device comprises a pressing frame, a die bonding through groove and a die bonding groove, wherein the pressing frame is provided with a support arm, the outer end part of the support arm is provided with a matching flange, the matching flange is matched with the die bonding through groove, and the bottom of the pressing frame is provided with a fixing bulge; the top of the chip support is provided with a fixing groove, the fixing groove is matched with the fixing bulge, and the pressing frame is fixedly installed at the top of the chip support.

Furthermore, a second mounting groove is formed in the bottom of the first mounting groove, and a mounting through groove is formed in the bottom of the second mounting groove; further comprising: the heat dissipation copper seat, the heat dissipation copper seat is provided with the step, the step with the cooperation of second mounting groove, heat dissipation copper seat fixed mounting be in the logical inslot of installation.

Furthermore, a first matching notch is formed in the insulating ring, and the first matching notch is matched with the first connecting copper foil; and a second matching notch is arranged on the cathode ring and matched with the first connecting copper foil.

Furthermore, the top of the shading ring is provided with a welding groove matched with the first connecting copper foil and the second connecting copper foil.

Further, the length of the cathode copper foil is greater than or equal to the length of the anode copper foil.

The utility model discloses the beneficial value who gains is: the utility model realizes that single or multiple LED chips can be conveniently packaged, and meanwhile, the LED chips can be conveniently welded and the lamp beads can be conveniently welded with an external circuit by connecting the base, the chip bracket, the anode ring, the insulating ring, the cathode ring, the shading ring and other components together through an ingenious structure; structurally, sufficient heat dissipation can be carried out on the LED chip, so that the service life is prolonged, light attenuation is reduced, meanwhile, assembly and production are facilitated, and production cost is reduced. The utility model discloses a practical value has greatly improved above.

Drawings

Fig. 1 is an implementation perspective view of a white light LED package structure according to the present invention;

fig. 2 is an exploded view of the package structure of a white LED according to the present invention;

fig. 3 is a partial exploded view of a package structure of a white LED according to the present invention;

fig. 4 is a partial schematic view of a packaging structure of a white light LED according to the present invention;

fig. 5 is a partial schematic view of a white light LED package structure according to the present invention;

fig. 6 is a top view of an embodiment of a white LED package structure according to the present invention;

fig. 7 is a sectional view of an implementation plan view a-a of the white LED package structure of the present invention;

fig. 8 is a perspective view of the packaging structure of a white light LED of the present invention.

[ reference numerals ]

101. base

102. first mounting groove

103. second mounting groove

104. mounting through groove

105. side groove

106. vertical groove

110. heat dissipation copper seat

111. step

120. LED chip

201. chip support

202. solid crystal through groove

203. connecting groove

204. fixed groove

301. press frame

302. support arm

303. mating flange

304. fixed projection

401. anode ring

402. Anode copper foil

403. first connection copper foil

404. first groove

501 insulating ring

502. first mating notch

601. cathode ring

602. cathode copper foil

603. second connection copper foil

604 second trench

605. second fitting notch

701. shading ring

702. light hole

703. welding tank

704. flange

801. lens

901. welding disk

902. through groove

903. notch

904. welding sheet

905. clamping flange

906. fixed screw hole.

Detailed Description

In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention.

As shown in fig. 1-8, the utility model discloses a white light LED's packaging structure, it includes: the base 101 is provided with a first mounting groove 102, the edge of the top surface of the base 101 is provided with a side groove 105, the side surface of the base 101 is provided with a vertical groove 106, and the vertical groove 106 is connected with the side groove 105;

the chip support 201 is provided with at least two die bonding through grooves 202, connecting grooves 203 are formed in the outer sides of the die bonding through grooves 202, and the chip support 201 is fixedly installed at the bottom of the first installation groove 102;

the LED chip 120 is fixedly arranged in the die bonding through groove 202;

an anode ring 401, wherein an anode copper foil 402 extending inwards is arranged on the inner side wall of the anode ring 401, the anode copper foil 402 is matched with the connecting groove 203, a first connecting copper foil 403 is arranged at the top of the anode ring 401, the first connecting copper foil 403 is arranged on the side groove 105 and the vertical groove 106, and the anode ring 401 is fixedly arranged in the first mounting groove 102 and is electrically connected with the LED chip 120;

an insulating ring 501, wherein the insulating ring 501 is mounted on the top of the anode ring 401;

a cathode ring 601, wherein a cathode copper foil 602 extending inwards is arranged on the inner side wall of the cathode ring 601, the cathode copper foil 602 is matched with the connecting groove 203, a second connecting copper foil 603 is arranged on the top of the cathode ring 601, the second connecting copper foil 603 is arranged on the side groove 105 and the vertical groove 106, the cathode ring 601 is fixedly arranged in the first mounting groove 102 and is arranged on the top of the insulating ring 501, and the cathode ring 601 is electrically connected with the LED chip 120 and is insulated from the anode ring 401;

a light-shielding ring 701, wherein the light-shielding ring 701 is provided with a light-transmitting hole 702, and the light-shielding ring 701 is fixedly installed on the first installation groove 102;

a lens 801, wherein the lens 801 is fixedly installed in the light hole 702;

the welding disc 901 is provided with a through groove 902, the top of the welding disc 901 is provided with at least two notches 903, and the base 101 is fixedly installed in the through groove 902;

and the welding sheet 904 is fixedly installed in the notch 903, and the welding sheet 904 is electrically connected with the anode ring 401 and the cathode ring 601 respectively.

It should be noted that the LED chip 120 is welded to the anode copper foil 402 and the cathode copper foil 602 by gold wires or wires; the LED chip 120 is not suspended in the die bonding through groove 202, and the die bonding through groove 202 limits the LED chip 120 to move in the horizontal direction, generally, the LED chip 120 is clamped and fixed or fixed by glue; the base 101 is made of a non-metal material, such as ceramic. The side grooves 105 and the vertical grooves 106 are provided to facilitate the fixed installation of the first connection copper foil 403 and the second connection copper foil 603, while leaving contact surfaces for facilitating the connection with an external circuit. When the light-shielding ring 701 is made of a plastic material, the top surface of the light-shielding ring 701 or the side surface of the base 101 cannot be welded, so that the light-shielding ring 701 is prevented from being melted, and at this time, welding needs to be performed on the welding sheet 904 which is arranged on the welding disc 901 in a sleeved manner, the welding disc 901 is fixed on the base 101 in an interference fit or clamping manner, and the welding sheet 904 is horizontally arranged, has a relatively large contact surface, and can be welded more conveniently and quickly. The lens 801 functions to seal and adjust the luminous efficiency of the plurality of LED chips 120 emitting light together.

It should be noted that the anode ring 401 and the cathode ring 601 are separated by the insulating ring 501 for insulation to avoid short circuit, and the first connecting copper foil 403 and the second connecting copper foil 603 are generally disposed in different slots and may be symmetrically disposed, as shown in fig. 1. Can avoid like this being in trompil on the side of base 101, and then guarantee leakproofness and reduction in production degree of difficulty. The light-shielding ring 701 mainly functions to cut light and facilitate installation of the lens 801. The chip support 201 is used for facilitating arrangement, welding and fixing of the LED chip 120 and improving stability.

Specifically, as shown in fig. 2 and 4, in another embodiment, the method further includes: the die bonding fixture comprises a pressing frame 301, wherein the pressing frame 301 is provided with a support arm 302, the outer end part of the support arm 302 is provided with a matching flange 303, the matching flange 303 is matched with the die bonding through groove 202, and the bottom of the pressing frame 301 is provided with a fixing protrusion 304; the top of the chip support 201 is provided with a fixing groove 204, the fixing groove 204 is matched with the fixing protrusion 304, and the pressing frame 301 is fixedly installed at the top of the chip support 201 and fixes the LED chip 120 at the bottom of the die bonding through groove 202. When the LED chip 120 cannot be fixed by using a glue, the pressing frame 301 is used to cooperate with the chip support 201 to effectively fix the LED chip 120.

Specifically, as shown in fig. 2 and 4, in still another embodiment, a second installation groove 103 is provided at the bottom of the first installation groove 102, and an installation through groove 104 is provided at the bottom of the second installation groove 103; further comprising: the heat dissipation copper seat 110 is provided with a step 111, the step 111 is matched with the second mounting groove 103, the bottom of the LED chip 120 is tightly attached to the top surface of the heat dissipation copper seat 110, and the heat dissipation copper seat 110 is fixedly mounted in the mounting through groove 104. It should be noted that the bottom surface of the heat dissipation copper seat 110 is flush with or slightly lower than the bottom surface of the base 101, so as to realize better contact on a heat sink by matching with silicone grease, thereby improving heat dissipation efficiency; the bottom surface of the LED chip 120 directly radiates on the heat-dissipating copper seat 110, and then radiates with the base 101.

Specifically, as shown in fig. 2, a first fitting notch 502 is provided on the insulating ring 501, and the first fitting notch 502 is fitted with the first connecting copper foil 403; the cathode ring 601 is provided with a second matching notch 605, and the second matching notch 605 is matched with the first connecting copper foil 403 so as to facilitate installation.

Specifically, as shown in fig. 2 and 3, the first connection copper foil 403 and the second connection copper foil 603 are U-shaped and are reversely buckled on the side grooves 105 and the vertical grooves 106, so as to facilitate fixed installation and connection with an external circuit.

Specifically, as shown in fig. 2 to 7, a first groove 404 is disposed on an outer side wall of the first connection copper foil 403, and a second groove 604 is disposed on an outer side wall of the second connection copper foil 603; a clamping flange 905 is arranged on the inner side wall of the welding sheet 904, and the clamping flange 904 is matched and clamped with the first groove 404 and the second groove 604. The function is to facilitate the soldering pad 901 to fix and mount the base 101 on the heat sink, the soldering pad 901 is generally provided with a fixing screw hole 906 for fixing on the heat sink, and the base 101 is fixed on the soldering pad 901 through the clamping flange 905, the first groove 404 and the second groove 604 and is electrically connected. And a welding groove 703 that is engaged with the first connection copper foil 403 and the second connection copper foil 603 is formed on the top of the light-shielding ring 701, and when the light-shielding ring 701 is made of a heat-resistant material and needs to be electrically connected to the top surface, the light-shielding ring can be easily welded by the welding groove 703.

It should be noted that a flange 704 is disposed on an inner side wall of the light hole 702, and the flange 704 is used for fixing the lens 801 in a matching manner. The length of the cathode copper foil 602 is greater than or equal to the length of the anode copper foil 402, so that short circuit caused by solder on the cathode copper foil 602 dropping onto the anode copper foil 402 during welding is avoided, and different lengths are set for staggering. Generally, six die bonding through grooves 202 are arranged in a circumferential array, and six LED chips 120 are arranged, so that heat is mainly concentrated on the edge of the heat dissipation copper seat 110 and the inner edge of the first mounting groove 102, which is more beneficial for heat dissipation and more LED chips 120 than the heat dissipation through grooves are arranged in the center of the heat dissipation copper seat 110.

To sum up, the base 101, the chip support 201, the anode ring 401, the insulating ring 501, the cathode ring 601, the shading ring 701 and other components of the present invention are connected together through an ingenious structure, so that a single or multiple LED chips can be conveniently packaged, and meanwhile, the LED chips can be conveniently welded and the lamp beads can be conveniently welded with an external circuit; structurally, sufficient heat dissipation can be carried out on the LED chip, so that the service life is prolonged, light attenuation is reduced, meanwhile, assembly and production are facilitated, and production cost is reduced. The utility model discloses a practical value has greatly improved above.

The above-described embodiments merely represent one or more embodiments of the present invention, which are described in detail and concrete, but are not to be construed as limiting the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A packaging structure of a white light LED is characterized by comprising: the device comprises a base, a first mounting groove and a second mounting groove, wherein the edge of the top surface of the base is provided with a side groove;

the insulating ring is arranged on the top of the anode ring;

the light shading ring is provided with a light transmitting hole and is fixedly installed on the first installation groove.

2. The package structure of the white LED of claim 1, further comprising: and the lens is fixedly arranged in the light-transmitting hole.

3. The package structure of the white LED of claim 1, further comprising: the die bonding device comprises a pressing frame, a die bonding through groove and a die bonding groove, wherein the pressing frame is provided with a support arm, the outer end part of the support arm is provided with a matching flange, the matching flange is matched with the die bonding through groove, and the bottom of the pressing frame is provided with a fixing bulge; the top of the chip support is provided with a fixing groove, the fixing groove is matched with the fixing bulge, and the pressing frame is fixedly installed at the top of the chip support.

4. The package structure of a white LED of claim 1, wherein a second mounting groove is formed at the bottom of the first mounting groove, and a mounting through groove is formed at the bottom of the second mounting groove; further comprising: the heat dissipation copper seat, the heat dissipation copper seat is provided with the step, the step with the cooperation of second mounting groove, heat dissipation copper seat fixed mounting be in the logical inslot of installation.

5. The package structure of a white LED of claim 1, wherein the insulating ring has a first fitting notch, and the first fitting notch is fitted with the first connecting copper foil; and a second matching notch is arranged on the cathode ring and matched with the first connecting copper foil.

6. The package structure of a white LED of claim 1, wherein the top of the light shielding ring is provided with a solder groove for matching with the first connecting copper foil and the second connecting copper foil.

7. The package structure of the white LED of claim 1, wherein the length of the cathode copper foil is greater than or equal to the length of the anode copper foil.