CN213746187U - High-coverage-rate infrared white-light bicolor LED lamp bead - Google Patents
High-coverage-rate infrared white-light bicolor LED lamp bead Download PDFInfo
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- CN213746187U CN213746187U CN202022662866.2U CN202022662866U CN213746187U CN 213746187 U CN213746187 U CN 213746187U CN 202022662866 U CN202022662866 U CN 202022662866U CN 213746187 U CN213746187 U CN 213746187U
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Abstract
The utility model discloses a double-colored LED lamp pearl of infrared white light of high coverage, it includes: the base is provided with a first mounting groove; the chip support is arranged at the bottom of the first mounting groove; the LED chip comprises an infrared LED chip and a white LED chip, wherein the infrared LED chip and the white LED chip are arranged in the chip bracket; the anode ring is arranged in the first mounting groove and is electrically connected with the chip; the cathode ring is arranged in the first mounting groove and arranged at the top of the insulating ring, and is electrically connected with the chip and insulated from the anode ring; the light shading ring is fixedly arranged on the first mounting groove; the lens is fixedly arranged in the light-transmitting hole; the base is fixedly arranged in the through groove; and the welding sheet is fixedly arranged in the welding disc. Realized, improve the life and the reduction in production cost of lamp pearl.
Description
Technical Field
The utility model relates to LED lamp pearl field especially involves a double-colored LED lamp pearl of infrared white light of high coverage.
Background
Along with the development of LED lamps and social requirements, in order to obtain better lighting effect, a single lamp bead is converted into a multi-color lamp bead with multiple lamp wicks integrated.
Present lamp pearl of unifying more generally is the wick fixed mounting with many different colours on same base plate, because the more relation of wick, wire on the base plate is laid, the welding is comparatively troublesome, and partial lamp pearl is for the convenience to carry out the connection and the installation of wick, generally can use electroplating technique or PCB board, but the higher while radiating effect of cost is relatively poor, the power is lower, the rosin joint or the phenomenon of splitting appear often, lead to the life of product lower and the light decay serious. And the part uses traditional gold thread welded lamp pearl, because need avoid bulky circuit more welding also very troublesome, installation, connection simultaneously are also inconvenient, and the production fault-tolerant rate is low.
And some LED lamp pearls that are used for the security protection illumination usefulness generally form through a white light LED lamp pearl and an infrared LED lamp pearl combination, or integrate infrared LED chip and white light LED chip on same lamp pearl, but the double-colored lamp pearl of current integrated combination mode design gains the effect relatively poor in mixing light and heat dissipation, and especially the coverage of infrared light is relatively poor, and actual illumination range width is less, and installation, connection are also comparatively inconvenient simultaneously.
Therefore, a need exists for a high coverage infrared white light bi-color LED lamp bead that can address one or more of the above problems.
SUMMERY OF THE UTILITY MODEL
For solving one or more problems that exist among the prior art, the utility model provides a double-colored LED lamp pearl of infrared white light of high coverage. The utility model discloses a solve the technical scheme that above-mentioned problem adopted and be: the utility model provides a double-colored LED lamp pearl of infrared white light of high coverage, it includes: the base is provided with a first mounting groove, the edge of the top surface of the base is provided with a side groove, the side surface of the base is provided with a vertical groove, and the vertical groove is connected with the side groove;
the chip support is provided with a die bonding through groove, the die bonding through grooves are arranged in a circumferential array and are even in number, a connecting groove is formed in the outer side of the die bonding through groove, and the chip support is fixedly installed at the bottom of the first installation groove;
the LED chip comprises an infrared LED chip and a white LED chip, wherein the infrared LED chip and the white LED chip are alternately arranged in the die bonding through groove;
the anode ring is characterized in that an anode copper foil extending inwards is arranged on the inner side wall of the anode ring, the anode copper foil is matched with the connecting grooves, a first connecting copper foil is arranged at the top of the anode ring, the first connecting copper foil is arranged on the side grooves and the vertical grooves, and the anode ring is fixedly arranged in the first mounting groove and is electrically connected with the infrared LED chip and the white LED chip;
the insulating ring is arranged on the top of the anode ring;
the cathode ring is fixedly arranged in the first mounting groove and arranged at the top of the insulating ring, and the cathode ring is electrically connected with the infrared LED chip and the white LED chip and is insulated from the anode ring;
the welding disc is provided with a through groove, the top of the welding disc is provided with at least two notches, and the base is fixedly installed in the through groove;
and the welding sheet is fixedly arranged in the notch and is respectively and electrically connected with the anode ring and the cathode ring. This is the basis.
Further, still include: the die bonding device comprises a pressing frame, a die bonding through groove and a die bonding groove, wherein the pressing frame is provided with a support arm, the outer end part of the support arm is provided with a matching flange, the matching flange is matched with the die bonding through groove, and the bottom of the pressing frame is provided with a fixing bulge; the top of the chip support is provided with a fixing groove, the fixing groove is matched with the fixing protrusion, and the pressing frame is fixedly installed at the top of the chip support and fixes the infrared LED chip and the white LED chip at the bottom of the die bonding through groove.
Furthermore, a second mounting groove is formed in the bottom of the first mounting groove, and a mounting through groove is formed in the bottom of the second mounting groove; further comprising: the heat dissipation copper seat is provided with steps, the steps are matched with the second mounting groove, the infrared LED chip and the white LED chip are tightly attached to the top surface of the heat dissipation copper seat, and the heat dissipation copper seat is fixedly mounted in the mounting through groove.
Furthermore, a first matching notch is formed in the insulating ring, and the first matching notch is matched with the first connecting copper foil; and a second matching notch is arranged on the cathode ring and matched with the first connecting copper foil.
Furthermore, the first connecting copper foil and the second connecting copper foil are U-shaped and are reversely buckled on the side grooves and the vertical grooves.
Furthermore, a first groove is formed in the outer side wall of the first connecting copper foil, and a second groove is formed in the outer side wall of the second connecting copper foil; the inner side wall of the welding piece is provided with a clamping flange, and the clamping flange is matched and clamped with the first groove and the second groove.
Further, still include: the light shading ring is provided with a light transmission hole and is fixedly arranged on the first mounting groove;
the lens is fixedly arranged in the light-transmitting hole;
and the top of the shading ring is provided with a welding groove matched with the first connecting copper foil and the second connecting copper foil.
Further, a flange is arranged on the inner side wall of the light hole and used for matching and fixing the lens.
Further, the length of the cathode copper foil is greater than or equal to the length of the anode copper foil.
The utility model discloses the beneficial effect who gains is: the utility model discloses a will white light LED chip infrared LED chip the base the chip support the anode ring the dead ring the negative pole ring and other parts are in the same place through ingenious structural connection, have realized under the sufficient radiating condition of guarantee lamp pearl can be realized, will white light LED chip infrared LED chip is installed in turn on the chip support, and then gain better mixed light effect, lighting width for security protection is made a video recording and can be shot better picture, and can effectively avoid the gold thread to appear rosin joint, rupture phenomenon, and promote the radiating effect in order to improve life and reduce the light decay, simultaneously convenient equipment production. The utility model discloses a practical value has greatly improved above.
Drawings
FIG. 1 is a perspective view of a high coverage infrared white light bi-color LED lamp bead of the present invention;
FIG. 2 is an exploded view of a high coverage infrared white light bi-color LED lamp bead of the present invention;
FIG. 3 is a partial explosion diagram of the high-coverage infrared white light dual-color LED lamp bead of the present invention;
fig. 4 is a partial schematic view 1 of a high-coverage infrared white light double-color LED lamp bead of the present invention;
fig. 5 is a partial schematic view 2 of a high-coverage infrared white light double-color LED lamp bead of the present invention;
FIG. 6 is a top view of the high coverage infrared white light bi-color LED lamp bead of the present invention;
FIG. 7 is a cross-sectional view along the A-A direction of the top view of the high coverage infrared white light dual-color LED lamp bead of the present invention;
fig. 8 is the utility model relates to a local schematic diagram 3 of high infrared white light double-colored LED lamp pearl that covers.
[ reference numerals ]
101 … base
102 … first mounting groove
103 … second mounting groove
104 … installation through groove
105 … side groove
106 … vertical slot
110 … heat dissipation copper seat
111 … step
120 … infrared LED chip
121 … white light LED chip
201 … chip support
202 … through groove for die bonding
203 … connecting groove
204 … securing groove
301 … pressing frame
302 … support arm
303 … fitting flange
304 … fixing projection
401 … anode ring
402 … anode copper foil
403 … first connection copper foil
404 … first groove
501 … insulating ring
502 … first mating notch
601 … cathode ring
602 … cathode copper foil
603 … second connecting copper foil
604 … second groove
605 … second mating notch
701 … shading ring
702 … light hole
703 … welding groove
704 … Flange
801 … lens
901 … welding disk
902 … through groove
903 … notch
904 … welding sheet
905 … clamping flange
906 … secure the screw holes.
Detailed Description
In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention.
As shown in fig. 1-8, the utility model discloses a double-colored LED lamp pearl of infrared white light of high coverage, it includes: the base 101 is provided with a first mounting groove 102, the edge of the top surface of the base 101 is provided with a side groove 105, the side surface of the base 101 is provided with a vertical groove 106, and the vertical groove 106 is connected with the side groove 105;
the chip support 201 is provided with die bonding through grooves 202, the die bonding through grooves 202 are arranged in a circumferential array and are even in number, connecting grooves 203 are formed in the outer sides of the die bonding through grooves 202, and the chip support 201 is fixedly installed at the bottom of the first installation groove 102;
the infrared LED chips 120 and the white LED chips 121 are alternately arranged in the die bonding through groove 202;
an anode ring 401, wherein an anode copper foil 402 extending inwards is arranged on the inner side wall of the anode ring 401, the anode copper foil 402 is matched with the connecting groove 203, a first connecting copper foil 403 is arranged at the top of the anode ring 401, the first connecting copper foil 403 is arranged on the side groove 105 and the vertical groove 106, and the anode ring 401 is fixedly arranged in the first mounting groove 102 and is electrically connected with the infrared LED chip 120 and the white LED chip 121;
an insulating ring 501, wherein the insulating ring 501 is mounted on the top of the anode ring 401;
a cathode ring 601, wherein a cathode copper foil 602 extending inwards is arranged on the inner side wall of the cathode ring 601, the cathode copper foil 602 is matched with the connecting groove 203, a second connecting copper foil 603 is arranged on the top of the cathode ring 601, the second connecting copper foil 603 is arranged on the side groove 105 and the vertical groove 106, the cathode ring 601 is fixedly arranged in the first mounting groove 102 and is arranged on the top of the insulating ring 501, and the cathode ring 601 is electrically connected with the infrared LED chip 120 and the white LED chip 121 and is insulated from the anode ring 401;
a light-shielding ring 701, wherein the light-shielding ring 701 is provided with a light-transmitting hole 702, the light-shielding ring 701 is fixedly installed on the first installation groove 102, and when the light-shielding ring 701 is not installed, a colloid is generally filled for fixation and sealing;
a lens 801, wherein the lens 801 is fixedly installed in the light hole 702;
the welding disc 901 is provided with a through groove 902, the top of the welding disc 901 is provided with at least two notches 903, and the base 101 is fixedly installed in the through groove 902;
and the welding sheet 904 is fixedly installed in the notch 903, and the welding sheet 904 is electrically connected with the anode ring 401 and the cathode ring 601 respectively.
It should be noted that, in order to solve the problems of non-true color, imaging blur, small imaging range, small width and the like of infrared night vision camera imaging in the night vision illumination of the security camera, the infrared LED chips 120 and the white LED chips 121 are alternately arranged and have the same number so as to improve the light mixing effect, thereby improving the overall imaging quality and the width of an observable area, and the efficiency and the quality are higher compared with the traditional parallel arrangement mode. Through the combination of a plurality of small power chips and the structure, heat can be dispersed at the edge as much as possible, so that heat dissipation is improved; and the anode ring 401 can be divided into two parts by adjusting the wiring mode of the anode ring 401 as required, one part is connected with the infrared LED chip 120, and the other part is connected with the white LED chip 121, so that the external independent driving of all the infrared LED chips 120 or all the white LED chips 121 is realized, and further, the function of matching illumination or only illumination is realized, thereby saving electric energy.
It should be noted that the infrared LED chip 120 and the white LED chip 121 are welded to the anode copper foil 402 and the cathode copper foil 602 by gold wires or wires; the infrared LED chip 120 and the white LED chip 121 are not suspended in the die bonding through groove 202, the die bonding through groove 202 limits the infrared LED chip 120 and the white LED chip 121 to move in the horizontal direction, and generally, the infrared LED chip 120 and the white LED chip 121 are clamped and fixed or fixed by using glue; the base 101 is made of a non-metal material, such as ceramic. The side grooves 105 and the vertical grooves 106 are provided to facilitate the fixed installation of the first connection copper foil 403 and the second connection copper foil 603, while leaving contact surfaces for facilitating the connection with an external circuit. When the light-shielding ring 701 is made of a plastic material, the top surface of the light-shielding ring 701 or the side surface of the base 101 cannot be welded, so that the light-shielding ring 701 is prevented from being melted, and at this time, welding needs to be performed on the welding sheet 904 which is arranged on the welding disc 901 in a sleeved manner, the welding disc 901 is fixed on the base 101 in an interference fit or clamping manner, and the welding sheet 904 is horizontally arranged, has a relatively large contact surface, and can be welded more conveniently and quickly. The lens 801 is used for sealing and adjusting the luminous efficiency of the plurality of infrared LED chips 120 and the white LED chips 121 which emit light together.
It should be noted that the anode ring 401 and the cathode ring 601 are separated by the insulating ring 501 for insulation to avoid short circuit, and the first connecting copper foil 403 and the second connecting copper foil 603 are generally disposed in different slots and may be symmetrically disposed, as shown in fig. 1. Can avoid like this being in trompil on the side of base 101, and then guarantee leakproofness and reduction in production degree of difficulty. The light-shielding ring 701 mainly functions to cut light and facilitate installation of the lens 801. The chip support 201 is used for facilitating arrangement, welding and fixing of the infrared LED chip 120 and the white light LED chip 121, and stability is improved.
Specifically, as shown in fig. 2 and 4, in another embodiment, the method further includes: the die bonding fixture comprises a pressing frame 301, wherein the pressing frame 301 is provided with a support arm 302, the outer end part of the support arm 302 is provided with a matching flange 303, the matching flange 303 is matched with the die bonding through groove 202, and the bottom of the pressing frame 301 is provided with a fixing protrusion 304; the top of the chip support 201 is provided with a fixing groove 204, the fixing groove 204 is matched with the fixing protrusion 304, and the pressing frame 301 is fixedly installed on the top of the chip support 201 and fixes the infrared LED chip 120 and the white LED chip 121 at the bottom of the die bonding through groove 202. When the infrared LED chip 120 and the white LED chip 121 cannot be fixed by using a glue, the pressing frame 301 is used to cooperate with the chip support 201 to effectively fix the infrared LED chip 120 and the white LED chip 121.
Specifically, as shown in fig. 2 and 4, in still another embodiment, a second installation groove 103 is provided at the bottom of the first installation groove 102, and an installation through groove 104 is provided at the bottom of the second installation groove 103; further comprising: the heat dissipation copper seat 110 is provided with a step 111, the step 111 is matched with the second mounting groove 103, the bottoms of the infrared LED chip 120 and the white LED chip 121 are tightly attached to the top surface of the heat dissipation copper seat 110, and the heat dissipation copper seat 110 is fixedly mounted in the mounting through groove 104. It should be noted that the bottom surface of the heat dissipation copper seat 110 is flush with or slightly lower than the bottom surface of the base 101, so as to realize better contact on a heat sink by matching with silicone grease, thereby improving heat dissipation efficiency; the infrared LED chip 120 and the white LED chip 121 are directly heat-dissipated on the heat-dissipating copper base 110, and then are heat-dissipated by being matched with the base 101.
Specifically, as shown in fig. 2, a first fitting notch 502 is provided on the insulating ring 501, and the first fitting notch 502 is fitted with the first connecting copper foil 403; the cathode ring 601 is provided with a second matching notch 605, and the second matching notch 605 is matched with the first connecting copper foil 403 so as to facilitate installation.
Specifically, as shown in fig. 2 and 3, the first connection copper foil 403 and the second connection copper foil 603 are U-shaped and are reversely buckled on the side grooves 105 and the vertical grooves 106, so as to facilitate fixed installation and connection with an external circuit.
Specifically, as shown in fig. 2 to 7, a first groove 404 is disposed on an outer side wall of the first connection copper foil 403, and a second groove 604 is disposed on an outer side wall of the second connection copper foil 603; a clamping flange 905 is arranged on the inner side wall of the welding sheet 904, and the clamping flange 904 is matched and clamped with the first groove 404 and the second groove 604. The function is to facilitate the soldering pad 901 to fix and mount the base 101 on the heat sink, the soldering pad 901 is generally provided with a fixing screw hole 906 for fixing on the heat sink, and the base 101 is fixed on the soldering pad 901 through the clamping flange 905, the first groove 404 and the second groove 604 and is electrically connected. And a welding groove 703 that is engaged with the first connection copper foil 403 and the second connection copper foil 603 is formed on the top of the light-shielding ring 701, and when the light-shielding ring 701 is made of a heat-resistant material and needs to be electrically connected to the top surface, the light-shielding ring can be easily welded by the welding groove 703.
It should be noted that a flange 704 is disposed on an inner side wall of the light hole 702, and the flange 704 is used for fixing the lens 801 in a matching manner. The length of the cathode copper foil 602 is greater than or equal to the length of the anode copper foil 402, so that short circuit caused by solder on the cathode copper foil 602 dropping onto the anode copper foil 402 during welding is avoided, and different lengths are set for staggering. Generally, the die bonding through grooves 202 are arranged in a circumferential array, the infrared LED chips 120 and the white LED chips 121 are arranged in six rows and are alternately installed, at this time, heat is mainly concentrated on the edge of the heat dissipation copper seat 110 and the inner edge of the first installation groove 102, and compared with the heat dissipation copper seat 110, heat dissipation and installation of more infrared LED chips 120 and white LED chips 121 are facilitated.
To sum up, the utility model discloses a will white light LED chip 121 infrared LED chip 120 base 101 chip support 201 anode ring 401 the insulator ring 501 cathode ring 601 and other parts are in the same place through ingenious structural connection, have realized that guarantee lamp pearl can realize under the sufficient radiating condition, will white light LED chip infrared LED chip installs in turn on the chip support, and then gain better mixed light effect, lighting width for the security protection is made a video recording and can be shot better picture, and can effectively avoid the gold thread false welding, fracture phenomenon to and promote the radiating effect in order to improve life and reduce the light decay, convenient equipment production simultaneously. The utility model discloses a practical value has greatly improved above.
The above-described embodiments merely represent one or more embodiments of the present invention, which are described in detail and concrete, but are not to be construed as limiting the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. The utility model provides a double-colored LED lamp pearl of infrared white light of high coverage, its characterized in that includes: the base is provided with a first mounting groove, the edge of the top surface of the base is provided with a side groove, the side surface of the base is provided with a vertical groove, and the vertical groove is connected with the side groove;
the chip support is provided with a die bonding through groove, the die bonding through grooves are arranged in a circumferential array and are even in number, a connecting groove is formed in the outer side of the die bonding through groove, and the chip support is fixedly installed at the bottom of the first installation groove;
the LED chip comprises an infrared LED chip and a white LED chip, wherein the infrared LED chip and the white LED chip are alternately arranged in the die bonding through groove;
the anode ring is characterized in that an anode copper foil extending inwards is arranged on the inner side wall of the anode ring, the anode copper foil is matched with the connecting grooves, a first connecting copper foil is arranged at the top of the anode ring, the first connecting copper foil is arranged on the side grooves and the vertical grooves, and the anode ring is fixedly arranged in the first mounting groove and is electrically connected with the infrared LED chip and the white LED chip;
the insulating ring is arranged on the top of the anode ring;
the cathode ring is fixedly arranged in the first mounting groove and arranged at the top of the insulating ring, and the cathode ring is electrically connected with the infrared LED chip and the white LED chip and is insulated from the anode ring;
the welding disc is provided with a through groove, the top of the welding disc is provided with at least two notches, and the base is fixedly installed in the through groove;
and the welding sheet is fixedly arranged in the notch and is respectively and electrically connected with the anode ring and the cathode ring.
2. The high-coverage infrared white light bicolor LED lamp bead according to claim 1, further comprising: the die bonding device comprises a pressing frame, a die bonding through groove and a die bonding groove, wherein the pressing frame is provided with a support arm, the outer end part of the support arm is provided with a matching flange, the matching flange is matched with the die bonding through groove, and the bottom of the pressing frame is provided with a fixing bulge; the top of the chip support is provided with a fixing groove, the fixing groove is matched with the fixing protrusion, and the pressing frame is fixedly installed at the top of the chip support and fixes the infrared LED chip and the white LED chip at the bottom of the die bonding through groove.
3. The high-coverage infrared white light bicolor LED lamp bead according to claim 1, wherein a second mounting groove is formed in the bottom of the first mounting groove, and a mounting through groove is formed in the bottom of the second mounting groove; further comprising: the heat dissipation copper seat is provided with steps, the steps are matched with the second mounting groove, the infrared LED chip and the white LED chip are tightly attached to the top surface of the heat dissipation copper seat, and the heat dissipation copper seat is fixedly mounted in the mounting through groove.
4. The high-coverage infrared white light bicolor LED lamp bead according to claim 1, wherein a first matching notch is arranged on the insulating ring, and the first matching notch is matched with the first connecting copper foil; and a second matching notch is arranged on the cathode ring and matched with the first connecting copper foil.
5. The high-coverage infrared white light bicolor LED lamp bead according to claim 1, wherein the first connecting copper foil and the second connecting copper foil are U-shaped and are reversely buckled on the side grooves and the vertical grooves.
6. The high-coverage infrared white light bicolor LED lamp bead according to claim 5, wherein a first groove is formed on the outer side wall of the first connecting copper foil, and a second groove is formed on the outer side wall of the second connecting copper foil; the inner side wall of the welding piece is provided with a clamping flange, and the clamping flange is matched and clamped with the first groove and the second groove.
7. The high-coverage infrared white light bicolor LED lamp bead according to claim 1, further comprising: the light shading ring is provided with a light transmission hole and is fixedly arranged on the first mounting groove;
the lens is fixedly arranged in the light-transmitting hole;
and the top of the shading ring is provided with a welding groove matched with the first connecting copper foil and the second connecting copper foil.
8. The high-coverage infrared white light bicolor LED lamp bead according to claim 7, wherein a flange is arranged on the inner side wall of the light hole and used for matching and fixing the lens.
9. The high-coverage infrared white light bicolor LED lamp bead according to claim 1, wherein the length of the cathode copper foil is greater than or equal to the length of the anode copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022662866.2U CN213746187U (en) | 2020-11-17 | 2020-11-17 | High-coverage-rate infrared white-light bicolor LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022662866.2U CN213746187U (en) | 2020-11-17 | 2020-11-17 | High-coverage-rate infrared white-light bicolor LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213746187U true CN213746187U (en) | 2021-07-20 |
Family
ID=76825888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022662866.2U Active CN213746187U (en) | 2020-11-17 | 2020-11-17 | High-coverage-rate infrared white-light bicolor LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213746187U (en) |
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2020
- 2020-11-17 CN CN202022662866.2U patent/CN213746187U/en active Active
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