CN213184337U - Novel high-temperature-resistant high-power LED support - Google Patents
Novel high-temperature-resistant high-power LED support Download PDFInfo
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- CN213184337U CN213184337U CN202022664616.2U CN202022664616U CN213184337U CN 213184337 U CN213184337 U CN 213184337U CN 202022664616 U CN202022664616 U CN 202022664616U CN 213184337 U CN213184337 U CN 213184337U
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Abstract
The utility model discloses a novel high temperature resistant high-power LED support, it includes: the outer substrate is provided with an installation groove, and the bottom of the installation groove is provided with a through hole; the heat dissipation seat is fixedly arranged in the mounting groove; the ceramic pressure ring is fixedly arranged on the top surface of the heat radiating seat; the ceramic piece is fixedly arranged in the mounting groove; the upper end and the lower end of the outer side surface of the conductive column are respectively provided with an upper flange and a lower flange, and the conductive column is fixedly arranged on the inner side of the ceramic part; the support ring is provided with a light hole, the lower end part of the light hole is provided with an installation step, and the support ring is fixedly installed at the upper end part of the ceramic part; the LED chip is conveniently and quickly fixedly installed, the LED chip can be conveniently and electrically connected, and a better heat dissipation effect is provided.
Description
Technical Field
The utility model relates to LED equipment field especially involves a novel high temperature resistant high-power LED support.
Background
The conventional high-power LED bracket is generally formed by packaging LED plastic and metal, and then is mounted on an aluminum substrate or a ceramic base to serve as a bracket. For the COB packaged surface-mounted LED lamp bead, due to the small size, the support is generally not required to be large or provided with radiating fins, and the support can be conveniently installed, electrically connected and thermally transferred, and then is installed on a radiator to realize quick heat dissipation.
Because the LED plastic and metal packaged LED or the integrated LED bracket has poor heat resistance, the light attenuation is serious after long-term use, and the actual use experience is poor; and then, only through aluminium base board or at the cooperation clamping ring as the support, the radiating effect of LED chip lower extreme is better, and aluminium base board upside is relatively poor and the plastics system clamping ring of aluminium base board upside is heated ageing easily under long-term use, leads to installing the configuration on the clamping ring and appears the installation problem, and the lead of LED chip is not convenient for weld to the formula of digging hole mounting mode again.
Therefore, there is a need for a new high temperature and power resistant LED support that can solve one or more of the above problems.
SUMMERY OF THE UTILITY MODEL
For solving one or more problems that exist among the prior art, the utility model provides a novel high temperature resistant high-power LED support. The utility model discloses a solve the technical scheme that above-mentioned problem adopted and be: a novel high temperature resistant high power LED support, it includes: the outer substrate is provided with an installation groove, and the bottom of the installation groove is provided with a through hole;
the bottom of the heat dissipation seat is provided with a bulge matched with the through hole, and the heat dissipation seat is fixedly arranged in the mounting groove;
the ceramic pressure ring is fixedly arranged on the top surface of the heat radiating seat;
the ceramic piece is fixedly arranged in the mounting groove and arranged on the top surface of the ceramic compression ring;
the upper end and the lower end of the outer side surface of the conductive column are respectively provided with an upper flange and a lower flange, the upper flange is matched with the first clamping groove, the lower flange is matched with the second clamping groove, and the conductive column is fixedly arranged on the inner side of the ceramic piece and pressed on the top surface of the ceramic compression ring; the mounting groove is arranged on the upper end of the ceramic part, the mounting groove is matched with the mounting groove, the top surface of the supporting ring is provided with an annular groove, the lower end of the annular groove is provided with a mounting step, and the supporting ring is fixedly mounted on the upper end of the ceramic part. This is the basis.
Further, it is provided with the indent to lead electrical pillar bottom surface, pottery clamping ring top surface is provided with the welding groove, the indent with the welding groove cooperation, pottery piece bottom surface is provided with the cooperation arch, the cooperation arch with the welding groove cooperation.
Further, the ceramic piece is clamped with the outer substrate or in interference fit with the outer substrate.
Further, at least two conductive columns are arranged; the conductive columns are arranged in an array; the upper flange has a length greater than a length of the lower flange.
The utility model discloses the beneficial effect who gains is: the utility model discloses a will the outer base plate the radiating seat ceramic clamping ring ceramic spare the trunnion ring and other parts are in the same place through ingenious structural connection, have realized conveniently fixed mounting LED chip and have passed through the radiating seat cooperation the trunnion ring realizes better radiating effect and protection effect, can conveniently weld, connect the LED chip including installing simultaneously. The utility model discloses a practical value has greatly improved above.
Drawings
FIG. 1 is a perspective view of a novel high-temperature-resistant high-power LED bracket of the present invention;
FIG. 2 is a side view of the novel high-temperature-resistant high-power LED bracket of the present invention;
FIG. 3 is a sectional view along the A-A direction of a side view of the novel high-temperature-resistant high-power LED bracket of the present invention;
FIG. 4 is a partial enlarged view of the position I of the novel high-temperature-resistant high-power LED bracket of the present invention;
FIG. 5 is an exploded view of the novel high-temperature-resistant high-power LED bracket of the present invention;
fig. 6 is a schematic diagram of the ceramic part of the novel high-temperature-resistant high-power LED bracket of the present invention.
[ reference numerals ]
101. outer substrate
102. mounting groove
103. through hole
110. LED chip
120. fluorescent glue
201. heat radiation seat
202. bump
301. ceramic part
302. first card slot
303. second card slot
304. mating projection
401 ceramic pressure ring
402. welding tank
501 conductive post
502. upper flange
503. lower flange
504. indent
601. trunnion ring
602. light hole
603. ring groove
604. mounting steps.
Detailed Description
In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention.
As shown in fig. 1-6, the utility model discloses a novel high temperature resistant high-power LED support, an embodiment thereof is, includes: the outer substrate 101 is provided with a mounting groove 102, and the bottom of the mounting groove 102 is provided with a through hole 103;
the bottom of the heat dissipation seat 201 is provided with a protrusion 202 matched with the through hole 103, and the heat dissipation seat 201 is fixedly installed in the installation groove 102;
the LED chip 110 is fixedly arranged on the top surface of the heat radiating seat 201;
the ceramic pressure ring 401 is fixedly mounted on the top surface of the heat dissipation seat 201 and arranged on the outer side of the LED chip 110;
the top surface of the ceramic piece 301 is provided with a first clamping groove 302, the bottom surface of the ceramic piece 301 is provided with a second clamping groove 303, and the ceramic piece 301 is fixedly installed in the installation groove 102 and arranged on the top surface of the ceramic compression ring 401;
an upper flange 502 and a lower flange 503 are respectively arranged at the upper end and the lower end of the outer side surface of the conductive column 501, the upper flange 502 is matched with the first clamping groove 302, the lower flange 503 is matched with the second clamping groove 303, the conductive column 501 is electrically connected with the LED chip 110, and the conductive column 501 is fixedly installed on the inner side of the ceramic piece 301 and pressed on the top surface of the ceramic compression ring 401;
the supporting ring 601 is provided with a light hole 602 matched with the mounting groove 102, the top surface of the supporting ring 601 is provided with a ring groove 603, the lower end part of the light hole 602 is provided with a mounting step 604, and the supporting ring 601 is fixedly mounted at the upper end part of the ceramic piece 301;
It should be noted that the outer substrate 101 is generally made of an aluminum alloy material, and the heat dissipation seat 201 is a copper base, and further cooperates with the ceramic compression ring 401 and the ceramic member 301 to dissipate heat and perform an isolation function. The welding gold thread of LED chip 110 generally sets up ceramic clamping ring 401 upside, it presses on the welding gold thread to lead electrical pillar 501, through joint or interference fit between fluorescent glue 120 cooperation parts are fixed. Generally, the protrusion 202 is flush with or slightly lower than the bottom surface of the outer substrate 101, so that the applied silicone grease can achieve a good heat dissipation effect on the heat sink. The conductive post 501 is electrically connected to an external circuit through the upper flange 502.
It should be noted that, as shown in fig. 3 and 5, generally, the supporting ring 601 is disposed on a heat sink, and can cooperate with the heat sink to dissipate heat of the ceramic 301, and then mount an external optical component or mount a control board through the ring groove 603, so as to avoid directly pressing on the ceramic 301.
Specifically, as shown in fig. 3, 5, and 6, the bottom surface of the conductive post 501 is provided with a pressing groove 504, the top surface of the ceramic pressing ring 401 is provided with a welding groove 402, the pressing groove 504 is matched with the welding groove 402, the bottom surface of the ceramic piece 301 is provided with a matching protrusion 304, and the matching protrusion 304 is matched with the welding groove 402. So as to facilitate the welding and arrangement of the gold wires of the LED chip 110 and to connect the same; the lower flange 503 disposed on the conductive post 501 cooperates with the indent 504 to generally flatten the gold solder wire; the fitting protrusion 304 mainly plays a role in positioning and insulating, and separates the soldering gold wire from the outer substrate 101.
It should be noted that, generally, the ceramic piece 301 is clamped or in interference fit with the outer substrate 101 to achieve fixation; at least two conductive columns 501 are arranged, and when the LED chip 110 is provided with empty pins, three conductive columns 501 are arranged and are arranged in an array; generally, the upper flange 502 has a length greater than the lower flange 503 to facilitate attachment and installation.
To sum up, the utility model discloses a will outer base plate 101 the radiating seat 201 ceramic clamping ring 401 the pottery 301 the trunnion ring 601 and other parts are in the same place through ingenious structural connection, have realized conveniently fixed mounting LED chip and have passed through the radiating seat cooperation the trunnion ring realizes better radiating effect and protection effect, can conveniently weld, connect the LED chip including installing simultaneously. The utility model discloses a practical value has greatly improved above.
The above-described embodiments merely represent one or more embodiments of the present invention, which are described in detail and concrete, but are not to be construed as limiting the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. The utility model provides a novel high temperature resistant high-power LED support which characterized in that includes: the outer substrate is provided with an installation groove, and the bottom of the installation groove is provided with a through hole;
the bottom of the heat dissipation seat is provided with a bulge matched with the through hole, and the heat dissipation seat is fixedly arranged in the mounting groove;
the ceramic pressure ring is fixedly arranged on the top surface of the heat radiating seat;
the ceramic piece is fixedly arranged in the mounting groove and arranged on the top surface of the ceramic compression ring;
the upper end and the lower end of the outer side surface of the conductive column are respectively provided with an upper flange and a lower flange, the upper flange is matched with the first clamping groove, the lower flange is matched with the second clamping groove, and the conductive column is fixedly arranged on the inner side of the ceramic piece and pressed on the top surface of the ceramic compression ring;
the mounting groove is arranged on the upper end of the ceramic part, the mounting groove is matched with the mounting groove, the top surface of the supporting ring is provided with an annular groove, the lower end of the annular groove is provided with a mounting step, and the supporting ring is fixedly mounted on the upper end of the ceramic part.
2. The novel high-temperature-resistant high-power LED bracket according to claim 1, wherein the bottom surface of the conductive column is provided with a pressing groove, the top surface of the ceramic pressing ring is provided with a welding groove, the pressing groove is matched with the welding groove, the bottom surface of the ceramic part is provided with a matching protrusion, and the matching protrusion is matched with the welding groove.
3. The novel high-temperature-resistant high-power LED bracket as claimed in claim 1, wherein the ceramic part is clamped or in interference fit with the outer substrate.
4. The novel high-temperature-resistant high-power LED bracket as claimed in claim 1, wherein at least two conductive posts are provided.
5. The novel high-temperature-resistant high-power LED bracket as claimed in claim 4, wherein the conductive posts are arranged in an array.
6. The novel high-temperature and high-power LED bracket as claimed in claim 1, wherein the length of the upper flange is greater than that of the lower flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022664616.2U CN213184337U (en) | 2020-11-17 | 2020-11-17 | Novel high-temperature-resistant high-power LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022664616.2U CN213184337U (en) | 2020-11-17 | 2020-11-17 | Novel high-temperature-resistant high-power LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213184337U true CN213184337U (en) | 2021-05-11 |
Family
ID=75781499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022664616.2U Active CN213184337U (en) | 2020-11-17 | 2020-11-17 | Novel high-temperature-resistant high-power LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213184337U (en) |
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2020
- 2020-11-17 CN CN202022664616.2U patent/CN213184337U/en active Active
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