CN213746599U - High-power LED with high heat dissipation, high luminous efficiency and low light attenuation - Google Patents
High-power LED with high heat dissipation, high luminous efficiency and low light attenuation Download PDFInfo
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- CN213746599U CN213746599U CN202022664196.8U CN202022664196U CN213746599U CN 213746599 U CN213746599 U CN 213746599U CN 202022664196 U CN202022664196 U CN 202022664196U CN 213746599 U CN213746599 U CN 213746599U
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Abstract
The utility model discloses a high-power LED of low light decay of high heat dissipation high light efficiency, it includes: a mounting seat; the laser diode is fixedly arranged in the mounting seat; the pin base is arranged at the bottom of the mounting base; the cathode connecting ring is provided with a second conductive protrusion, an insulating groove is formed in the cathode connecting ring, a cathode outer pin is arranged at the bottom of the cathode connecting ring, and the cathode connecting ring is fixedly arranged at the bottom of the pin seat; the anode connecting ring is provided with a first conductive bulge, an insulating bulge is arranged on the anode connecting ring, an anode outer pin is arranged at the bottom of the anode connecting ring, and the anode connecting ring is arranged at the bottom of the cathode connecting ring and is separated by the insulating bulge and an insulating groove; fluorescent glue filled in the second mounting groove; the laser diode assembly device has the advantages that the laser diodes are conveniently assembled and connected, and the structure is simple, so that the follow-up production is facilitated.
Description
Technical Field
The utility model relates to LED lamp pearl field, in particular to high-power LED of high light efficiency low light decay of high heat dissipation.
Background
In order to obtain a relatively wide illumination effect, an optical device is generally mounted on a single lamp bead or a plurality of lamp bead integrated beams are arranged to mount the optical device, and for a high-power lamp bead, a radiator with a large volume and a large number of fins needs to be arranged in a matched manner due to large heat productivity, so that the cost is relatively high.
The scheme that a plurality of small-power lamp beads are used for integrating light beams to replace high-power lamp beads for illumination generally only comprises the steps that a plurality of lamp bead arrays are installed on a radiator and connected with the radiator, the lamp beads are more in arrangement, the operation of wiring and leading wires on the radiator is troublesome, and then the wires are easily clamped and broken when an end cover is installed.
Therefore, a high power LED with high heat dissipation, high luminous efficiency and low light attenuation, which can solve one or more of the above problems, is needed.
SUMMERY OF THE UTILITY MODEL
For solving one or more problems that exist among the prior art, the utility model provides a high-power LED of high light efficiency low light decay of high heat dissipation. The utility model discloses a solve the technical scheme that above-mentioned problem adopted and be: a high-power LED with high heat dissipation, high luminous efficiency and low light attenuation comprises: the mounting seat is provided with a first mounting groove, and a second mounting groove is formed in the first mounting groove;
the LED chip is fixedly arranged in the second mounting groove;
the LED chip comprises a mounting seat, a pin seat and a fixing groove, wherein the pin seat is provided with the fixing groove, the pin seat is fixedly arranged at the bottom of the mounting seat, and the fixing groove is used for fixing pins of the LED chip;
the cathode connecting ring is provided with a second conductive protrusion, the second conductive protrusion is matched with the fixing groove, the cathode connecting ring is provided with an insulating groove, the bottom of the cathode connecting ring is provided with a cathode outer pin, and the cathode connecting ring is fixedly arranged at the bottom of the pin base;
the anode connecting ring is provided with a first conductive bulge, the first conductive bulge is matched with the fixing groove and the insulating groove, the anode connecting ring is provided with an insulating bulge, the bottom of the anode connecting ring is provided with an anode outer pin, and the anode connecting ring is arranged at the bottom of the cathode connecting ring and is separated by the insulating bulge and the insulating groove;
the end cover is provided with a wire outlet hole which is matched with the anode outer pin and the cathode outer pin, and the end cover is fixedly arranged at the bottom of the mounting seat and used for wrapping and sealing the pin seat, the cathode connecting ring and the anode connecting ring;
fluorescent glue, fluorescent glue is filled in the second mounting groove.
Further, still include: the support, the support is provided with the light-emitting hole, the downthehole fixed mounting of light-emitting has first lens, the light-emitting hole with the cooperation of second mounting groove, support fixed mounting be in the first mounting groove.
Further, still include: the adjusting lantern ring is installed at the lower end of the light emitting hole, and a second lens is fixedly installed in the adjusting lantern ring.
Further, still include: and the pressing ring is fixedly arranged in the light outlet hole and presses the first lens.
Further, still include: and the lens is fixedly arranged at the top of the first mounting groove and seals the first mounting groove.
Further, a heat dissipation ring groove is formed in the outer side wall of the mounting seat.
Further, a second connecting flange is arranged on the inner side of the cathode connecting ring, a second matching conductive bump is arranged on the second connecting flange, and the second matching conductive bump is used for being electrically connected with the pin of the LED chip;
the inner side of the anode connecting ring is provided with a first connecting flange, the first connecting flange is provided with a first matching conductive protrusion, and the first matching conductive protrusion is used for being electrically connected with a pin of the LED chip.
Further, at least two insulation bulges are arranged; the second mounting grooves are arranged in an array.
The utility model discloses the beneficial value who gains is: the utility model realizes the convenient parallel installation of a plurality of LED chips together by connecting the installation seat, the LED chips, the pin seat, the anode connecting ring, the cathode connecting ring, the end cover and other components together through an ingenious structure, obtains better light effect through the mode of an array light source, and has smaller and simpler structure size compared with the traditional mode so as to be convenient for subsequent assembly and production; the pins of the LED chips can be conveniently connected in parallel, so that the LED chips are conveniently connected with an external circuit and the wire clamping during assembly and installation is avoided. The utility model discloses a practical value has greatly improved above.
Drawings
FIG. 1 is a perspective view of a high power LED with high heat dissipation, high luminous efficiency and low light attenuation;
FIG. 2 is an exploded view of a high power LED with high heat dissipation, high luminous efficiency and low light attenuation;
FIG. 3 is a partial exploded view of a high power LED with high heat dissipation, high luminous efficiency and low light attenuation;
FIG. 4 is a schematic view of a mounting base of a high power LED with high heat dissipation, high luminous efficiency and low light attenuation;
fig. 5 is a top view of the high power LED with high heat dissipation, high luminous efficiency and low light attenuation;
fig. 6 is a cross-sectional view along the direction of the top view a-a of the high power LED with high heat dissipation, high luminous efficiency and low light attenuation of the present invention.
[ reference numerals ]
101 … mounting seat
102 … first mounting groove
103 … second mounting groove
104 … heat dissipation ring groove
110 … LED chip
201 … support
202 … light outlet
203 … first lens
204 … pressure ring
210 … adjusting collar
211 … second lens
301 … lens
401 … pinboard
402 … fixing groove
501 … Anode connecting ring
502 … first conductive bump
503 first connection flange 503 …
504 … first mating conductive bump
505 … insulation projection
506 … anode outer pin
601 … cathode connecting ring
602 … second conductive bump
603 … insulation groove
604 … second connecting flange
605 … second mating conductive bump
606 … cathode outer lead
701 … end cap
702 … outlet holes.
Detailed Description
In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention.
As shown in fig. 1-6, the utility model discloses a high-power LED of low light decay of high heat dissipation high light efficiency, it includes: the mounting structure comprises a mounting seat 101, wherein the mounting seat 101 is provided with a first mounting groove 102, and a second mounting groove 103 is arranged in the first mounting groove 102;
the LED chip 110 is fixedly arranged in the second mounting groove 103;
a pin base 401, wherein the pin base 401 is provided with a fixing groove 402, the pin base 401 is fixedly installed at the bottom of the mounting base 101, and the fixing groove 402 is used for fixing pins of the LED chip 110;
a cathode connection ring 601, wherein a second conductive protrusion 602 is arranged on the cathode connection ring 601, the second conductive protrusion 602 is matched with the fixing groove 402, an insulating groove 603 is arranged on the cathode connection ring 601, a cathode outer pin 606 is arranged at the bottom of the cathode connection ring 601, and the cathode connection ring 601 is fixedly arranged at the bottom of the pin base 401;
an anode connection ring 501, wherein a first conductive protrusion 502 is arranged on the anode connection ring 501, the first conductive protrusion 502 is matched with the fixing groove 402 and the insulating groove 603, an insulating protrusion 505 is arranged on the anode connection ring 501, an anode outer pin 506 is arranged at the bottom of the anode connection ring 501, and the anode connection ring 501 is arranged at the bottom of the cathode connection ring 601 and is separated by the insulating protrusion 505 and the insulating groove 603;
the end cover 701 is provided with a wire outlet hole 702, the wire outlet hole 702 is matched with the anode outer pin 506 and the cathode outer pin 606, and the end cover 701 is fixedly installed at the bottom of the installation seat 101 to wrap and seal the pin seat 401, the cathode connection ring 601 and the anode connection ring 501;
the fluorescent glue is filled in the second mounting groove 103 and fixes the LED chip 110 and the pins thereof;
the support 201 is provided with a light outlet 202, a first lens 203 is fixedly installed in the light outlet 202, the light outlet 202 is matched with the second installation groove 103, and the support 201 is fixedly installed in the first installation groove 102.
It should be noted that, in order to ensure a stable structure, the number of the insulating protrusions 505 provided on the anode connection ring 501 is generally two or more, so as to avoid shaking after installation.
It should be noted that the LED chip 110 and the lens used in cooperation therewith are conventional devices, and are not described herein in detail. Particularly, the LED chip 110 is generally fixedly mounted in the second mounting groove 103 in a clamping manner, so as to prevent rotation during use; the lead seat 401 is made of an insulating material. Generally, for a more compact structure, the first conductive bump 502 on the anode connection ring 501 is connected to the fixing groove 402 on the lead seat 401 through the insulation groove 603, and then connected to the lead of the LED chip 110 through the fixing groove 402. The anode connecting ring 501 and the cathode connecting ring 601 are insulated.
Specifically, as shown in fig. 2 and 4, the method further includes: a lens 301, wherein the lens 301 is fixedly installed on the top of the first installation groove 102 and seals the first installation groove 102; the second mounting grooves 103 are generally provided with two or more, and the second mounting grooves 103 are arranged in an array, generally speaking, one second mounting groove 103 is provided at the center of the first mounting groove 102, and the rest second mounting grooves 103 are arranged in an array around the center.
Specifically, as shown in fig. 2-6, in another embodiment, a second connecting flange 604 is disposed inside the cathode connecting ring 601, a second mating conductive bump 605 is disposed on the second connecting flange 604, and the second mating conductive bump 605 is used for electrically connecting with the pin of the LED chip 110; a first connecting flange 503 is arranged on the inner side of the anode connecting ring 501, a first matching conductive protrusion 504 is arranged on the first connecting flange 503, and the first matching conductive protrusion 504 is used for electrically connecting with the pin of the LED chip 110. The function is as follows: when a multi-layer array is provided, it is possible to conveniently connect the pins inside the inner and outer layers in parallel while preventing the cathode connection ring 601 and the anode connection ring 501 from coming into contact, and without increasing the height and volume of the entire assembly. Generally, a heat dissipation ring groove 104 is provided on an outer side wall of the mounting seat 101 to facilitate heat dissipation, and particularly, the heat dissipation ring groove 104 can also be used for being snap-mounted on a heat sink.
Specifically, as shown in fig. 2 and fig. 6, in another embodiment, the method further includes: the adjusting lantern ring 210 is installed at the lower end of the light emitting hole 202, a second lens 211 is fixedly installed in the adjusting lantern ring 210, and the second lens 211 is matched with the first lens 203 to achieve light effect adjustment. In particular, when the adjusting collar 210 is screwed on the lower end of the light outlet 202, the distance can be conveniently adjusted, so that the adjustment can be conveniently performed by a worker. Generally, the first lens 203 and the second lens 211 are fixedly mounted by interference fit, snap fit or glue, and may also be fixedly mounted by providing a press ring 204 if necessary, wherein the press ring 204 is fixedly mounted in the light exit hole 202, the press ring 204 presses the first lens 203, and the second lens 211 is fixedly mounted in the same way.
It should be noted that, two pins of the LED chip 110 are respectively and fixedly mounted on the pin base 401, and are respectively and electrically connected to two pins of the LED chip 110 through the pin base 401, the anode connection ring 500 and the cathode connection ring 601, and are then connected to an external circuit through the anode outer pin 506 and the cathode outer pin 606 provided on the anode connection ring 501 and the cathode connection ring 601; for convenience of connection, clamping grooves may be further disposed on the anode outer pin 506 and the cathode outer pin 606.
To sum up, the present invention connects the mounting base 101, the LED chip 110, the pin base 401, the anode connecting ring 501, the cathode connecting ring 601, the end cap 701 and other components together through an ingenious structure, so as to conveniently connect a plurality of LED chips in parallel, obtain better lighting effect through the array light source, and have a smaller and more compact structure size compared with the conventional one, so as to facilitate the subsequent assembly and production; the pins of the LED chips can be conveniently connected in parallel, so that the LED chips are conveniently connected with an external circuit and the wire clamping during assembly and installation is avoided. The utility model discloses a practical value has greatly improved above.
The above-described embodiments merely represent one or more embodiments of the present invention, which are described in detail and concrete, but are not to be construed as limiting the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. The utility model provides a high-power LED of high light efficiency low light decay that dispels heat which characterized in that includes: the mounting seat is provided with a first mounting groove, and a second mounting groove is formed in the first mounting groove;
the LED chip is fixedly arranged in the second mounting groove;
the LED chip comprises a mounting seat, a pin seat and a fixing groove, wherein the pin seat is provided with the fixing groove, the pin seat is fixedly arranged at the bottom of the mounting seat, and the fixing groove is used for fixing pins of the LED chip;
the cathode connecting ring is provided with a second conductive protrusion, the second conductive protrusion is matched with the fixing groove, the cathode connecting ring is provided with an insulating groove, the bottom of the cathode connecting ring is provided with a cathode outer pin, and the cathode connecting ring is fixedly arranged at the bottom of the pin base;
the anode connecting ring is provided with a first conductive bulge, the first conductive bulge is matched with the fixing groove and the insulating groove, the anode connecting ring is provided with an insulating bulge, the bottom of the anode connecting ring is provided with an anode outer pin, and the anode connecting ring is arranged at the bottom of the cathode connecting ring and is separated by the insulating bulge and the insulating groove;
the end cover is provided with a wire outlet hole which is matched with the anode outer pin and the cathode outer pin, and the end cover is fixedly arranged at the bottom of the mounting seat and used for wrapping and sealing the pin seat, the cathode connecting ring and the anode connecting ring;
fluorescent glue, fluorescent glue is filled in the second mounting groove.
2. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation of claim 1, further comprising: the support, the support is provided with the light-emitting hole, the downthehole fixed mounting of light-emitting has first lens, the light-emitting hole with the cooperation of second mounting groove, support fixed mounting be in the first mounting groove.
3. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation of claim 2, further comprising: the adjusting lantern ring is installed at the lower end of the light emitting hole, and a second lens is fixedly installed in the adjusting lantern ring.
4. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation of claim 2, further comprising: and the pressing ring is fixedly arranged in the light outlet hole and presses the first lens.
5. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation of claim 1, further comprising: and the lens is fixedly arranged at the top of the first mounting groove and seals the first mounting groove.
6. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation as claimed in claim 1, wherein the outer side wall of the mounting seat is provided with a heat dissipation ring groove.
7. The high-power LED with high heat dissipation, high luminous efficiency and low light attenuation as claimed in claim 1, wherein a second connecting flange is arranged on the inner side of the cathode connecting ring, a second matching conductive bump is arranged on the second connecting flange, and the second matching conductive bump is used for being electrically connected with the pin of the LED chip;
the inner side of the anode connecting ring is provided with a first connecting flange, the first connecting flange is provided with a first matching conductive protrusion, and the first matching conductive protrusion is used for being electrically connected with a pin of the LED chip.
8. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation as claimed in claim 1, wherein at least two of said insulation protrusions are provided.
9. The high power LED with high heat dissipation, high luminous efficiency and low light attenuation as claimed in claim 1, wherein the second mounting grooves are arranged in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022664196.8U CN213746599U (en) | 2020-11-17 | 2020-11-17 | High-power LED with high heat dissipation, high luminous efficiency and low light attenuation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022664196.8U CN213746599U (en) | 2020-11-17 | 2020-11-17 | High-power LED with high heat dissipation, high luminous efficiency and low light attenuation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213746599U true CN213746599U (en) | 2021-07-20 |
Family
ID=76825527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022664196.8U Active CN213746599U (en) | 2020-11-17 | 2020-11-17 | High-power LED with high heat dissipation, high luminous efficiency and low light attenuation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213746599U (en) |
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2020
- 2020-11-17 CN CN202022664196.8U patent/CN213746599U/en active Active
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