CN212811790U - Mobile phone motherboard shielding lid - Google Patents
Mobile phone motherboard shielding lid Download PDFInfo
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- CN212811790U CN212811790U CN202021791738.1U CN202021791738U CN212811790U CN 212811790 U CN212811790 U CN 212811790U CN 202021791738 U CN202021791738 U CN 202021791738U CN 212811790 U CN212811790 U CN 212811790U
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Abstract
The utility model discloses a mobile phone motherboard shield cover, which comprises a housin, a plurality of louvres have been seted up on the casing, the casing includes corrosion-resistant layer, shielding layer, high strength layer and high temperature resistant layer, the corrosion-resistant layer is located the surface of shielding layer, the shielding layer is located the surface of high strength layer, the high strength layer is located the surface on high temperature resistant layer, the surface of casing is scribbled and is equipped with the dope layer, the dope layer includes heat conduction coating and corrosion-resistant coating, the surface of corrosion-resistant coating is located to the heat conduction coating scribbling, the surface of corrosion-resistant layer is located to the corrosion-resistant coating, the heat conduction coating is heat conduction silicone grease, the corrosion-resistant coating is the epoxy paint. The utility model discloses a corrosion-resistant layer, shielding layer, high strength layer, high temperature resistant layer, heat conduction coating, corrosion-resistant coating and louvre mutually support, have solved present mobile phone motherboard shield cover corrosion resistance not good, lead to the problem that life is short.
Description
Technical Field
The utility model relates to the technical field of mobile phones, specifically a mobile phone motherboard shielding lid.
Background
The mobile phones are divided into smart phones and non-smart phones, the performance of the smart phones is better than that of the non-smart phones, but the performance of the non-smart phones is stable than that of the smart phones, most of the non-smart phones and the smart phones use a CPU (central processing unit) of the English ARM company framework, the master frequency of the smart phones is higher, the running speed is high, the program processing task is faster, and the daily convenience is higher; the main frequency of a non-smart phone is low, the running speed is low, a mobile phone mainboard is an important component of the mobile phone, a shielding cover needs to be installed on the mobile phone mainboard in order to prevent an external electric signal from influencing the running of the mobile phone mainboard, but the existing mobile phone mainboard shielding cover is poor in corrosion resistance and short in service life, and therefore the mobile phone mainboard shielding cover is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mobile phone motherboard shields lid possesses the good advantage of corrosion resistance, and it is not good to have solved present mobile phone motherboard shields lid corrosion resistance, leads to the short problem of life.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a mobile phone motherboard shielding cover, includes the casing, a plurality of louvres have been seted up on the casing, the casing includes corrosion-resistant layer, shielding layer, high strength layer and high temperature resistant layer, corrosion-resistant layer is located the surface of shielding layer, the shielding layer is located the surface of high strength layer, high strength layer is located the surface on high temperature resistant layer, the surface of casing is scribbled and is equipped with the dope layer, the dope layer includes heat conduction coating and corrosion-resistant coating.
Preferably, the heat-conducting coating is coated on the outer surface of the corrosion-resistant coating, and the corrosion-resistant coating is coated on the outer surface of the corrosion-resistant coating.
Preferably, the heat-conducting coating is heat-conducting silicone grease, and the corrosion-resistant coating is epoxy resin paint.
Preferably, the corrosion-resistant layer is stainless steel, and the shielding layer is copper albo-metal.
Preferably, the high-strength layer is made of high manganese steel, and the high-temperature resistant layer is made of hastelloy.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses a louvre, can play radiating effect, utilize the heat conduction coating, can further improve the heat dissipation cooling effect of casing, utilize corrosion-resistant coating, can play anticorrosive effect, avoid the casing to be corroded in the use, utilize corrosion-resistant layer, can further improve the corrosion resistance of casing, utilize the shielding layer, can play the effect of shielding outside signal of telecommunication, utilize the high strength layer, can improve the intensity of casing, utilize high temperature resistant layer, can improve the high temperature resistance of casing, avoid the casing to receive the high temperature influence to lead to life to shorten, it is not good to have solved present mobile phone motherboard shield cover corrosion resistance, lead to the short problem of life.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application, and in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the housing structure of the present invention;
fig. 3 is the structure diagram of the coating layer of the present invention.
In the figure: 1. a housing; 11. a corrosion-resistant layer; 12. a shielding layer; 13. a high-strength layer; 14. a high temperature resistant layer; 2. a coating layer; 21. a thermally conductive coating; 22. a corrosion-resistant coating; 3. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a casing 1, corrosion-resistant layer 11, shielding layer 12, high strength layer 13, high temperature resistant layer 14, dope layer 2, heat conduction coating 21, corrosion- resistant coating 22 and 3 parts of louvre are the parts that universal standard spare or field technician know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.
Referring to fig. 1-3, a mobile phone motherboard shielding cover comprises a housing 1, a plurality of heat dissipation holes 3 are formed on the housing 1, the housing 1 comprises a corrosion-resistant layer 11, a shielding layer 12, a high-strength layer 13 and a high-temperature-resistant layer 14, the corrosion-resistant layer 11 is located on the outer surface of the shielding layer 12, the corrosion-resistant layer 11 is made of stainless steel, the shielding layer 12 is made of cupronickel, the shielding layer 12 is located on the outer surface of the high-strength layer 13, the high-strength layer 13 is located on the outer surface of the high-temperature-resistant layer 14, the high-strength layer 13 is made of high manganese steel, the high-temperature-resistant layer 14 is made of hastelloy alloy, the outer surface of the housing 1 is coated with a coating layer 2, the coating layer 2 comprises a heat conduction coating 21 and a corrosion-resistant coating 22, the heat conduction coating 21 is coated on the outer surface of the corrosion-resistant coating 22, the corrosion-resistant coating 22 is, can play radiating effect, utilize heat conduction coating 21, can further improve casing 1's heat dissipation cooling effect, utilize corrosion-resistant coating 22, can play anticorrosive effect, avoid casing 1 to be corroded in the use, utilize corrosion-resistant layer 11, can further improve casing 1's corrosion resistance, utilize shielding layer 12, can play the effect of shielding outside signal of telecommunication, utilize high strength layer 13, can improve casing 1's intensity, utilize high temperature resistant layer 14, can improve casing 1's high temperature resistance, it leads to life to shorten to avoid casing 1 to receive the high temperature influence, it is not good to have solved present mobile phone motherboard shield cover corrosion resistance, lead to the problem that life is short.
During the use, through louvre 3, can play radiating effect, utilize heat conduction coating 21, can further improve casing 1's heat dissipation cooling effect, utilize corrosion-resistant coating 22, can play anticorrosive effect, avoid casing 1 to be corroded in the use, utilize corrosion-resistant layer 11, can further improve casing 1's corrosion resistance, utilize shielding layer 12, can play the effect of shielding outside signal of telecommunication, utilize high strength layer 13, can improve casing 1's intensity, utilize high temperature resistant layer 14, can improve casing 1's high temperature resistance, it leads to life to shorten to avoid casing 1 to receive the high temperature to influence, it is not good to have solved present mobile phone motherboard shield cover corrosion resistance, lead to the problem that life is short.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a mobile phone motherboard shielding lid, includes casing (1), its characterized in that: the heat dissipation device is characterized in that a plurality of heat dissipation holes (3) are formed in the shell (1), the shell (1) comprises a corrosion-resistant layer (11), a shielding layer (12), a high-strength layer (13) and a high-temperature-resistant layer (14), the corrosion-resistant layer (11) is located on the outer surface of the shielding layer (12), the shielding layer (12) is located on the outer surface of the high-strength layer (13), the high-strength layer (13) is located on the outer surface of the high-temperature-resistant layer (14), a coating layer (2) is coated on the outer surface of the shell (1), and the coating layer (2) comprises a heat conduction coating (21) and a corrosion-resistant coating (22).
2. The mobile phone motherboard shielding cover of claim 1, wherein: the heat conduction coating (21) is coated on the outer surface of the corrosion-resistant coating (22), and the corrosion-resistant coating (22) is coated on the outer surface of the corrosion-resistant coating (11).
3. The mobile phone motherboard shielding cover of claim 1, wherein: the heat-conducting coating (21) is heat-conducting silicone grease, and the corrosion-resistant coating (22) is epoxy resin paint.
4. The mobile phone motherboard shielding cover of claim 1, wherein: the corrosion-resistant layer (11) is made of stainless steel, and the shielding layer (12) is made of cupronickel.
5. The mobile phone motherboard shielding cover of claim 1, wherein: the high-strength layer (13) is made of high manganese steel, and the high-temperature resistant layer (14) is made of hastelloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021791738.1U CN212811790U (en) | 2020-08-25 | 2020-08-25 | Mobile phone motherboard shielding lid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021791738.1U CN212811790U (en) | 2020-08-25 | 2020-08-25 | Mobile phone motherboard shielding lid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212811790U true CN212811790U (en) | 2021-03-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021791738.1U Active CN212811790U (en) | 2020-08-25 | 2020-08-25 | Mobile phone motherboard shielding lid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212811790U (en) |
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2020
- 2020-08-25 CN CN202021791738.1U patent/CN212811790U/en active Active
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