CN217770781U

CN217770781U - Chip shielding cover

Info

Publication number: CN217770781U
Application number: CN202221830308.5U
Authority: CN
Inventors: 李正林
Original assignee: Xiamen Hongkai Electronic Technology Co ltd
Current assignee: Xiamen Hongkai Electronic Technology Co ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2022-11-08
Anticipated expiration: 2032-07-15

Abstract

The utility model relates to a shielding technology field discloses a chip shield cover. It includes: the upper shell and the lower shell are connected in a buckling manner; the upper shell comprises a cover plate, a side plate and a first connecting piece, wherein the side plate is connected to the periphery of the cover plate, and the first connecting piece is arranged on the side plate; the lower shell comprises a shell frame, a shell base, a notch and a second connecting piece, the shell base is connected with the shell frame, the shell frame is provided with the notch and the second connecting piece, and the second connecting piece is in buckling connection with the first connecting piece. Through the rationalization design to the shield cover, adopt casing and lower casing, the overlapping preparation of two-layer casing can reduce effectively taking up in the space, makes things convenient for the casing equipment, packs into electronic components and shielding effect better, realizes that the shield cover is installed firmly on the circuit board that corresponds, realizes corrosion-resistant, the heat dissipation is balanced, improves thermal diffusivity and shielding nature, this shield cover wide application is in actual circuit, as electronic components's shielding.

Description

Chip shielding cover

Technical Field

The utility model relates to a shielding technology field, concretely relates to chip shield cover.

Background

A shield is a means for shielding electronic signals. The function is to shield the influence of external electromagnetic wave on the internal circuit and the outward radiation of the internally generated electromagnetic wave. The shield cover has its shielded effect, can use in various circuits, along with the application of PCB circuit board, the shield cover is required to have higher shielding effect, PCB circuit board forms gradually and integrates, can arrange many various electronic components in very little region, under the circumstances of circular telegram work between the electronic components of difference, can produce different interference signal, influence electronic circuit's accurate work, can cover the shield cover to it to some special electronic components (chips), but the shield cover on the existing market has occupation space big, the shielding effect is poor, the equipment degree of difficulty is big, easily corroded, electronic device can produce the heat when work, the electronic components who covers the shield cover can the heat increase sharply, the not good shield cover of heat dissipation can make electronic components receive high temperature damage, the shield cover is big than electronic components, can produce idle region, the shield cover will make its inside be heated unevenly etc..

Therefore, the existing shield can is to be further improved in view of the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming some weak points that current shield cover exists: large occupied space, poor shielding effect, high assembly difficulty, easy corrosion, poor heat dissipation effect, uneven heat dissipation and the like. Through the reasonable design of the shielding cover, the upper shell and the lower shell are adopted, and the two layers of shells are manufactured in an overlapping mode, so that the space occupation can be effectively reduced; the upper shell and the lower shell are buckled and connected, so that the assembly of the shells, the checking and the replacement of electronic components and the like can be facilitated; the lower shell with the notch is adopted, so that electronic components can be better installed and the shielding effect can be better achieved; the adoption of the shell base can realize that the shielding cover is stably arranged on the corresponding circuit board; the upper shell and the lower shell which adopt the antioxidation layer, the shell layer, the graphene layer, the electrostatic adsorption layer and the protective layer can effectively realize corrosion resistance, balanced heat dissipation, improved heat dissipation, shielding property and the like, and the shielding case can be widely applied to actual circuits and used as the shielding of electronic components.

The upper shell comprises a cover plate, a side plate and a first connecting piece, wherein the side plate is connected to the periphery of the cover plate, and the first connecting piece is arranged on the side plate;

the lower shell comprises a shell frame, a shell base, a notch and a second connecting piece, wherein the shell base is connected with the shell frame, the shell frame is provided with the notch and the second connecting piece, and the second connecting piece is matched with the first connecting piece in a buckling connection mode.

The technical scheme of the utility model is specifically as follows:

a chip shield can, the shield can comprising: the upper shell and the lower shell are connected in a buckling manner;

the upper shell comprises a cover plate, a side plate and a first connecting piece, the side plate is connected to the periphery of the cover plate, and the first connecting piece is arranged on the side plate;

Furthermore, the first connecting piece is a convex block, the second connecting piece is a groove, and the convex block is matched with the groove.

Furthermore, the upper shell and the lower shell are both T-shaped shells, and the upper shell is correspondingly buckled on the lower shell.

Furthermore, the upper shell is provided with at least 4 side plates, the side plates are mutually separated, and each side plate is provided with the first connecting piece.

Further, the shell frame comprises an upper cover plate and side brackets, the side brackets are connected to the periphery of the upper cover plate, and the notches are formed in the upper cover plate of the shell frame.

Further, the notch is provided at the center of the upper cover plate.

Further, it includes antioxidation layer, casing layer, graphite alkene layer, static adsorbed layer and inoxidizing coating to go up the casing, the upper surface coating on casing layer has the antioxidation layer, the antioxidation layer does go up the outmost of casing, the lower surface coating on casing layer has graphite alkene layer, the lower surface coating on graphite alkene layer has the static inoxidizing coating, the lower surface coating of static inoxidizing coating has the inoxidizing coating.

Further, the casing includes antioxidation layer, lower casing layer, graphite alkene layer, electrostatic absorption layer and inoxidizing coating down, the upper surface coating on lower casing layer has the antioxidation layer, the antioxidation layer does the outmost of casing down, the lower surface coating on casing layer has graphite alkene layer, the lower surface coating on graphite alkene layer has the electrostatic inoxidizing coating, the lower surface coating of electrostatic inoxidizing coating has the inoxidizing coating.

Furthermore, the upper shell and the lower shell are both a metal copper shell or a metal iron shell or a metal aluminum shell.

Further, the upper shell is an integrally formed shell.

Further, the lower shell is an integrally formed shell.

Advantageous effects

The utility model adopts the upper shell and the lower shell and the overlapping manufacture of the two shells through the rationalization design of the shielding cover, thereby effectively reducing the occupation of space; the upper shell and the lower shell are buckled and connected, so that the shell can be conveniently assembled, and electronic components can be conveniently checked and replaced; the lower shell with the notch is adopted, so that electronic components can be better installed and the shielding effect can be better achieved; the shielding cover can be stably installed on the corresponding circuit board by adopting the shell base; the upper shell and the lower shell which adopt the antioxidation layer, the shell layer, the graphene layer, the electrostatic adsorption layer and the protective layer can effectively realize corrosion resistance, balanced heat dissipation, improved heat dissipation, shielding property and the like, and the shielding case can be widely applied to actual circuits and used as the shielding of electronic components.

Drawings

Fig. 1 is a schematic structural diagram of a chip shielding case of the present invention.

Fig. 2 is a schematic diagram of an upper housing of a chip shielding case according to the present invention.

Fig. 3 is a schematic view of a lower housing of a chip shielding case according to the present invention.

Fig. 4 is a partial schematic view of a layer structure of a chip shielding case according to the present invention.

Reference numerals: 1. a "T" shaped cover plate; 2. a T-shaped upper shell; 3. a small side plate; 4. a bump; 5. a large side plate; 01. a T-shaped upper cover plate; 02. a square notch; 03. a T-shaped lower shell; 04. a groove; 05. a "T" shaped housing frame; 06. a "T" shaped housing base; 07. a side bracket; 11. an anti-oxidation layer; 12. a shell layer; 13. a graphene layer; 15. a protective layer; 16. and an electrostatic adsorption layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a chip shielding case, which includes: the T-shaped upper shell 2 and the T-shaped lower shell 03 are buckled and connected;

the T-shaped upper shell 2 comprises a T-shaped cover plate 1, side plates and convex blocks 4, the side plates comprise a large side plate 5 and a small side plate 3, the top side of the transverse part of the T-shaped cover plate 1 is connected with 4 large side plates 5 and 1 small side plate 3, the 4 large side plates 5 and the 1 small side plate 3 are distributed on the T-shaped cover plate 1 at equal intervals, the side parts of the transverse part of the T-shaped cover plate are respectively connected with 2 large side plates 5, the 2 large side plates 5 on each side part are distributed on the T-shaped cover plate 1 at equal intervals, the bottom side of the transverse part of the T-shaped cover plate 1 is connected with 1 large side plate 5 and 1 small side plate 3, the side part of the vertical part of the T-shaped cover plate 1 is respectively connected with 1 large side plate 5, the bottom of the vertical part of the T-shaped cover plate is connected with 3 large side plates 5, the 3 large side plates 5 are distributed on the T-shaped cover plate 1 at equal intervals, and the convex blocks 4 are arranged on the large side plates 5; the T-shaped upper shell 2 is an upper shell integrally formed and processed by stamping;

the T-shaped lower shell 03 comprises a T-shaped shell frame 05, a T-shaped shell base 06, a square notch 02 and a groove 04, wherein the T-shaped shell frame 05 is connected to the T-shaped shell base 06, the inner side of the T-shaped shell frame 05 is smoothly connected with the inner side of the T-shaped shell base 06, the distance between the outer side of the T-shaped shell frame 05 and the inner side of the T-shaped shell frame is smaller than the distance between the outer side of the T-shaped shell base 06 and the inner side of the T-shaped shell base 06, the T-shaped shell frame 05 comprises a T-shaped upper cover plate 01 and side brackets 07, the periphery of the T-shaped upper cover plate 01 is connected with the side brackets 07, the square notch 02 is arranged on the upper cover plate 01 of the T-shaped shell frame 05, the square notch 02 is arranged at the center of the upper cover plate 01, the groove 04 is arranged on the side brackets 07 and corresponds to the lug 4, the groove 04 is in a buckled fit with the lug 4, and the T-shaped lower shell is integrally formed by stamping;

the T-shaped upper shell 2 comprises an oxidation resistant layer 11, a shell layer 12, a graphene layer 13, a static adsorption layer 16 and a protection layer 15, wherein the oxidation resistant layer 11 is coated on the upper surface of the shell layer 12, the oxidation resistant layer 11 is the outermost layer of the T-shaped upper shell 2, the graphene layer 13 is coated on the lower surface of the shell layer 11, the static protection layer 16 is coated on the lower surface of the graphene layer 13, and the protection layer 15 is coated on the lower surface of the static protection layer 16;

the T-shaped lower shell 03 comprises an oxidation resistant layer 11, a lower shell layer (also a shell layer 12), a graphene layer 13, a static adsorption layer 16 and a protection layer 15, wherein the oxidation resistant layer 11 is coated on the upper surface of the lower shell layer, the oxidation resistant layer 11 is the outermost layer of the T-shaped lower shell 03, the graphene layer 13 is coated on the lower surface of the shell layer, the static protection layer 16 is coated on the lower surface of the graphene layer 13, and the protection layer 15 is coated on the lower surface of the static protection layer 16;

wherein, the T-shaped upper shell 2 and the T-shaped lower shell 03 are both metal copper shells.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A chip cage, the cage comprising: the upper shell and the lower shell are connected in a buckling manner;

2. The chip shielding case according to claim 1, wherein the first connecting member is a protrusion, the second connecting member is a groove, and the protrusion and the groove are engaged with each other.

3. The chip shielding case according to claim 1, wherein the upper housing and the lower housing are both T-shaped housings, and the upper housing is correspondingly fastened to the lower housing.

4. The chip shielding case according to claim 1, wherein the upper housing has at least 4 side plates, the side plates are separated from each other, and each of the side plates has the first connecting member.

5. The chip shielding case according to claim 1, wherein the housing frame comprises an upper cover plate and side brackets, the side brackets are connected to the periphery of the upper cover plate, and the notch is formed in the upper cover plate of the housing frame.

6. The chip shield according to claim 5, wherein the notch is provided at a center of the upper cover plate.

7. The chip shielding case according to claim 1, wherein the upper housing comprises an oxidation resistant layer, a housing layer, a graphene layer, an electrostatic adsorption layer and an overcoat layer, the oxidation resistant layer is coated on an upper surface of the housing layer, the oxidation resistant layer is an outermost layer of the upper housing, the graphene layer is coated on a lower surface of the housing layer, the electrostatic overcoat layer is coated on a lower surface of the graphene layer, and the overcoat layer is coated on a lower surface of the electrostatic overcoat layer.

8. The chip shielding case according to claim 1, wherein the lower housing comprises an oxidation resistant layer, a lower housing layer, a graphene layer, an electrostatic adsorption layer and an overcoat layer, wherein the oxidation resistant layer is coated on an upper surface of the lower housing layer, the oxidation resistant layer is an outermost layer of the lower housing, the graphene layer is coated on a lower surface of the housing layer, the electrostatic overcoat layer is coated on a lower surface of the graphene layer, and the overcoat layer is coated on a lower surface of the electrostatic overcoat layer.

9. The chip shielding case according to claim 1, wherein the upper housing and the lower housing are both a metal copper housing or a metal iron housing or a metal aluminum housing.

10. The chip shield according to claim 1, wherein the upper housing or the lower housing is an integrally formed housing.