CN216451743U - Shielding device and circuit board assembly - Google Patents
Shielding device and circuit board assembly Download PDFInfo
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- CN216451743U CN216451743U CN202122735604.9U CN202122735604U CN216451743U CN 216451743 U CN216451743 U CN 216451743U CN 202122735604 U CN202122735604 U CN 202122735604U CN 216451743 U CN216451743 U CN 216451743U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000002245 particle Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of electronic products, and discloses a shielding device and a circuit board assembly. The shielding device comprises a shielding cover, a heat dissipation assembly and a wave absorbing plate. The shield case is configured to be mounted on a circuit substrate and configured to cover at least a first electronic device provided on the circuit substrate and a second electronic device different from the first electronic device. The heat dissipation assembly is fixedly mounted on the shielding case and used for absorbing heat of at least the first electronic device and dissipating the absorbed heat to the outside of the shielding case. The wave absorbing plate is at least arranged on the surface of the shielding case facing the first electronic device and the second electronic device and used for absorbing electromagnetic waves generated by the first electronic device and the second electronic device. The shielding device and the circuit board assembly of the embodiment can effectively solve the problem of electromagnetic compatibility radiation disturbance.
Description
Technical Field
The embodiment of the utility model relates to the technical field of electronic products, in particular to a shielding device and a circuit board assembly with the shielding device.
Background
With the development of scientific technology, the frequency of signals in electronic products such as tablet computers and notebook computers is higher and higher. Among them, devices with high-speed signals, such as internal memory and CPU (Central Processing Unit ), etc., can generate a large amount of high-speed electromagnetic interference signals when working, which can result in that some standard requirements cannot be met when testing electromagnetic compatibility radiation disturbance items; for example, interference signals generated during memory operation may cause interference to the built-in WiFi antenna.
For products such as tablet computers and notebook computers, a shielding cover is separately added on a memory particle (or called a memory chip) of a board sticker, and a radiator is separately added on a CPU (central processing unit) at present, so that electromagnetic disturbance is inhibited and the problem of heat dissipation is solved.
However, this solution has the following drawbacks. Firstly, due to the adoption of the independent shielding cover and the independent radiator, the effect of electromagnetic compatibility radiation disturbance resistance cannot be simultaneously achieved on the CPU and the internal memory; the routing of high-speed signals between the CPU and the memory cannot be wrapped in the shielding cover, so that the shielding performance is reduced; the CPU cannot be completely sealed by the heat sink, so that the shielding performance is relatively poor; secondly, due to the adoption of the single shielding cover and the single radiator, the assembly needs to be divided into two parts during assembly in a production line, namely two working positions are needed, and two working procedures are correspondingly involved; this can be detrimental to line assembly.
SUMMERY OF THE UTILITY MODEL
The technical problem mainly solved by the embodiment of the utility model is to provide a shielding device for effectively solving electromagnetic compatibility radiation disturbance and a circuit board assembly with the shielding device.
In order to solve the above technical problem, one technical solution adopted by the embodiment of the present invention is: in one aspect, a shielding apparatus is provided that includes a shield, a heat dissipation assembly, and a wave absorbing plate. The shield case is configured to be mounted on a circuit substrate and configured to cover at least a first electronic device provided on the circuit substrate and a second electronic device different from the first electronic device. The heat dissipation assembly is fixedly mounted on the shielding case and used for absorbing heat of at least the first electronic device and dissipating the absorbed heat to the outside of the shielding case. The wave absorbing plate is at least arranged on the surface of the shielding case facing the first electronic device and the second electronic device and used for absorbing electromagnetic waves generated by the first electronic device and the second electronic device.
In some embodiments, the heat dissipation assembly comprises a heat sink; the first part of the heat radiator is arranged on a first side, away from the first electronic device, of the shielding case; the second part of the heat radiator opposite to the first part extends away from the shielding case, and the heat radiator is used for absorbing heat of the first electronic device and dissipating the absorbed heat to the outside of the shielding case.
In some embodiments, the first portion of the heat sink is fixedly connected to a first side of the shielding case facing away from the first electronic device.
In some embodiments, the heat dissipation assembly includes a heat spreader and a heat conductive plate; the heat conducting plate is used for being in heat conducting contact with a first plane of the first electronic device; the first part of the heat radiator is arranged on the heat conduction plate and is in heat conduction contact with the heat conduction plate; the second part of the radiator opposite to the first part extends away from the shielding case, and the radiator is used for absorbing heat of the heat conduction plate and radiating the absorbed heat out of the shielding case.
In some embodiments, the thermally conductive plate is embedded on the shield can.
In some embodiments, the shielding case comprises a top plate and a side plate connected with the top plate, the top plate and the side plate enclose a containing chamber, and the containing chamber forms an opening on the side far away from the top plate; the top plate has a slot that receives a portion of the heat sink assembly.
In some embodiments, the shield and the heat dissipation assembly are a unitary structure.
In some embodiments, the heat dissipation assembly comprises a heat pipe.
In another aspect, an embodiment of the present invention further provides a circuit board assembly, which includes: a circuit substrate; a first electronic device; at least one second electronic device different from the first electronic device, the first and second electronic devices being disposed on the circuit substrate; a shielding device according to any one of the preceding claims. Wherein the shielding device is mounted on the circuit substrate and connected to the circuit substrate, the shielding cover covers the first electronic device and the second electronic device, and the heat dissipation assembly is thermally connected to at least the first electronic device.
In some embodiments, the circuit board assembly has at least one of the following features: the circuit substrate is provided with a plurality of clamping pieces, and each clamping piece clamps the side plate of the shielding cover; and the first electronic device is a CPU, and the second electronic device is a memory particle.
Compared with the prior art, in the shielding device and the circuit board assembly of the embodiment, as one shielding case is adopted to cover the first electronic device and the second electronic device, the routing of the high-speed signal between the first electronic device and the second electronic device can be wrapped in the shielding case, so that the shielding performance can be improved; moreover, when the first electronic device is a CPU, the first electronic device can be completely covered by the shielding case, so that the shielding performance can be improved while heat dissipation is carried out through the heat dissipation assembly; and the wave absorbing plate can absorb the electromagnetic waves generated by the first electronic device and the second electronic device, so that the problem of electromagnetic compatibility radiation disturbance is effectively solved. In addition, the radiating assembly is fixedly arranged on the shielding cover, so that the radiating assembly and the shielding cover are integrated together, and when the production line is assembled, the radiating assembly and the shielding cover are assembled by only one part of the shielding device formed by combining the radiating assembly and the shielding cover at one station, so that the production line is favorable for assembling, the working hours and the stations are saved, and the productivity is improved.
Drawings
One or more embodiments are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which elements having the same reference numeral designations represent like elements and in which the figures are not to scale unless specifically stated.
FIG. 1 is a perspective view of a shielding device according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the shielding device of FIG. 1;
fig. 3 is a schematic perspective view of a circuit board assembly according to an embodiment of the utility model;
fig. 4 is an exploded perspective view of the circuit board assembly shown in fig. 3.
The reference numbers in the detailed description are as follows:
| 200 | |
14 | |
| 201 | |
15 | |
| 202 | First |
16 | Slotting |
| 203 | Second |
20 | Heat radiation assembly |
| 204 | A |
21 | |
| 205 | |
22 | |
| 100 | |
23 | |
| 10 | |
24 | Heat conduction plate |
| 11 | |
30 | |
| 12 | |
40 | |
| 13 | Top board |
Detailed Description
In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It is noted that when an element is referred to as being "secured to"/"mounted to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used in this specification, the terms "upper," "lower," "inner," "outer," "vertical," "horizontal," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the utility model and simplicity in description, and do not indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operated in a particular orientation, and are not to be considered limiting of the utility model. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and fig. 2, which respectively show a perspective view and a cross-sectional view of a shielding apparatus 100 according to an embodiment of the present invention, the shielding apparatus 100 mainly includes a shielding can 10, a heat dissipation assembly 20 and a wave-absorbing plate 30. The shielding case 10 is used for shielding electronic signals, and functions to shield external electromagnetic waves from influencing internal circuits and to shield electromagnetic waves generated inside from radiating outwards. For example, the material of the shielding case 10 may be stainless steel, aluminum, copper, etc., or an alloy thereof, wherein copper is a metal shielding material that is easily coated with tin. The heat dissipation assembly 20 is assembled on the shielding case 10, and is used for dissipating heat generated when the electronic device operates.
With reference to fig. 3 and fig. 4, which respectively show a perspective view and an exploded perspective view of a circuit board assembly 200 according to an embodiment of the present invention, the shielding can 10 is configured to be mounted on a circuit substrate 201 of the circuit board assembly 200 and is configured to cover at least a first electronic device 202 disposed on the circuit substrate 201 and a second electronic device 203 different from the first electronic device 202. The first electronic device 202 and the second electronic device 203 may be mounted On the circuit substrate 201 in a Chip On Board (COB) manner, for example, and they may be high-speed signal devices with different functions.
The heat dissipation assembly 20 is fixedly mounted on the shielding can 10, and is used for absorbing heat of at least the first electronic device 202 and dissipating the absorbed heat to the outside of the shielding can 10. The heat sink assembly 20 may be fixedly mounted to the shield 10 by, for example, welding, screws, etc., so that the two may form an integral unit.
The wave absorbing plate 30 is disposed at least on a surface of the shield case 10 facing the first electronic device 202 and the second electronic device 203. For example, the wave-absorbing plate 30 may be arranged on the second side 12 of the shielding cage 10 facing the first electronic device 202, i.e. on a portion of the inner side surface of the top plate 13. Further, the wave-absorbing plate 30 may be provided on a part or the whole of the inner side surface of the side plate 14. The wave absorbing material of the wave absorbing plate 30 can absorb the energy of the electromagnetic waves projected to the surface of the wave absorbing plate, so that the problem of electromagnetic compatibility radiation disturbance can be effectively solved.
In the shielding apparatus 100 of the above embodiment, since one shielding case 10 is used to cover the first electronic device 202 and the second electronic device 203, the high-speed signal traces between the first electronic device 202 and the second electronic device 203 can be wrapped in the shielding case 10, so that the shielding performance can be improved. Furthermore, when the first electronic device 202 is a CPU, it can be completely covered by the shielding case 10, so that the shielding performance can be improved while heat is dissipated through the heat dissipating assembly 20; and the wave absorbing plate can absorb the electromagnetic waves generated by the first electronic device and the second electronic device, so that the problem of electromagnetic compatibility radiation disturbance is effectively solved. In addition, the heat dissipation assembly 20 is fixedly mounted on the shielding case 10, so that the heat dissipation assembly 20 and the shielding case 10 are integrated, and therefore, when the assembly is carried out in a production line, the shielding device 100 formed by combining the heat dissipation assembly 20 and the shielding case 10 only needs to be assembled in one part at one station, which is beneficial to the assembly of the production line, saves labor and stations, and improves the productivity. In addition, the first and second substrates are,
in some embodiments, as shown in fig. 1 and 2, the heat dissipation assembly 20 includes a heat sink 21. The first part 22 of the heat sink 21 is arranged on the first side 11 of the shielding cap 10 facing away from the first electronic component 202; a second portion 23 of the heat radiator 21 opposite to the first portion 22 extends away from the shield case 10. The heat radiator 21 is configured to absorb heat of the first electronic device 202 and radiate the absorbed heat to the outside of the shield case 10. The heat dissipation member 21 may be, for example, a copper sheet, a copper tube, or the like with good heat dissipation performance, and may be fixedly connected in the shielding case 10; when a copper tube is used, the copper tube may be flattened so that the flattened first portion 22 has a larger heat conducting area, and the heat dissipation performance may be increased, and the strength of the heat dissipation body 21 may be increased. The first portion 22 may be a first end of the heat radiator 21, and the second portion 23 may be a second end of the heat radiator 21. In this way, the heat of the first electronic device 202, such as a CPU, covered in the shield case 10 can be transferred to the first portion 22 of the heat radiator 21 and then transferred to the second portion 23 outside the shield case 10 for heat radiation. Further, a heat radiation fan may be further provided near the second portion 23 to accelerate the heat radiation of the second portion 23.
In some embodiments, as shown in fig. 1 and 2, the first portion 22 of the heat dissipation body 21 may be fixedly connected to the first side 11 of the shielding case 10 facing away from the first electronic device 202 by means of, for example, welding. In this way, the heat radiator 21 and the shield case 10 are firmly combined and are not easy to loosen.
In some embodiments, as shown in fig. 1 and 2, the heat dissipation assembly 20 includes the heat dissipation body 21, and may further include a heat conduction plate 24. The thermally conductive plate 24 is adapted to be in thermally conductive contact with a first planar surface 204 (see fig. 4) of the first electronic device 202. The first part 22 of the heat sink 21 is arranged on the heat conducting plate 24 and is in heat-conducting contact with the heat conducting plate 24. A second portion 23 of the heat radiator 21 opposite to the first portion 22 extends away from the shield case 10. The heat radiator 21 is configured to radiate heat absorbed from the heat conductive plate 24 to the outside of the shield case 10. The heat conducting plate 24 may be, for example, a copper plate, and may be in direct thermal contact with the first plane 204 of the first electronic device 202 to increase the heat absorbing area, so as to transfer the heat of the first electronic device 202 to the heat dissipation body 21 as quickly and uniformly as possible. It should be noted that a liquid or paste heat conducting medium such as a heat conducting agent may be further disposed between the heat conducting plate 24 and the first electronic device 202 to make the heat conduction more sufficient.
Further, the heat conduction plate 24 is embedded on the shield case 10. The heat conducting plate 24 may be welded to the first portion 22 of the heat dissipation body 21, or may be welded or screwed to the shielding case 10, or may be combined with the above connection. In this way, the heat dissipation body 21, the heat conduction plate 24 and the shield case 10 can be firmly combined into an integral component, so that the subsequent assembly is facilitated, and meanwhile, the heat dissipation body 21 and the heat conduction plate 24 can be in closer contact, and the heat transfer effect is better. For example, the shielding device 100 may be mounted on the circuit substrate 201 by screwing the screw 40 through the shielding case 10 and onto the circuit substrate 201; the screw 40 may be screwed to the circuit board 201 after passing through the shield case 10 and the heat conduction plate 24.
In some embodiments, as shown in fig. 1 and 2, the shielding cage 10 includes a top plate 13 and side plates 14 connected to the top plate 13. The top plate 13 and the side plate 14 enclose a containing chamber 15, and the containing chamber 15 is open at the side far away from the top plate 13. The top plate 13 has a slot 16, and the slot 16 receives a portion of the heat sink assembly 20. The top plate 13 may have a flat plate shape, and the side plates 14 may extend in the same direction from one side of the top plate 13; the side plates 14 are attached to the entire periphery of the top plate 13 so as to enclose the receiving chamber 13 having an opening only at one side. In this way, better shielding sealability can be achieved. In addition, since the heat conduction plate 24 needs to be embedded in the shield case 10, the slot 16 is provided to receive the heat conduction plate 24. The slot 16 may be a hole through the top plate 13 or a U-shaped slot.
In some embodiments, as shown in fig. 1 and 2, the shield can 10 and the heat dissipation assembly 20 are a unitary structure. As described above, the heat dissipation assembly 20 may be fixedly mounted on the shielding can 10 by various mounting methods, so that the two are integrated into a single structure, thereby facilitating assembly in a production line.
In some embodiments, the heat sink assembly 20 may comprise a heat pipe. For example, the heat dissipation body 21 may be configured as a heat pipe to rapidly transfer heat of the first electronic device 202, such as a CPU, out of the shield case 10 through the heat pipe by making full use of the heat conduction principle and the rapid heat transfer property of the phase change medium.
In addition, as shown in fig. 3 and 4, an embodiment of the present invention further provides a circuit board assembly 200, which may include: a circuit substrate 201; a first electronic device 202; at least one second electronic device 203, said second electronic device 203 being different from said first electronic device 202, said first electronic device 202 and said second electronic device 203 being disposed on said circuit substrate 201; and a shielding device 100 according to any of the above. Wherein the shielding apparatus 100 is mounted on the circuit substrate 201 and connected to the circuit substrate 201, the shielding case 10 covers the first electronic device 202 and the second electronic device 203, and the heat dissipation assembly 20 is connected to at least the first electronic device 202 in a heat conducting manner.
The circuit substrate 201 may be a substrate having a circuit thereon; for example, the Circuit substrate 201 may be a Printed Circuit Board (PCB). The first electronic device 202 and the second electronic device 203 are arranged on the circuit substrate 201; for example, the first electronic device 202 may be a CPU, and the second electronic device 203 may be a memory pellet, etc.
In some embodiments, as shown in fig. 3 and 4, a plurality of clamping members 205 are disposed on the circuit substrate 201, and each clamping member 205 is used for clamping the side plate 14 of the shielding case 10. For example, each of the clamping members 205 may include two opposing jaws forming a clamping slot therebetween; thus, the side plate 14 of the shield case 10 can be inserted into the holding groove, and the clamping by the holding member 205 can be achieved. Further, these holding members 205 may be connected to a ground line provided on the circuit substrate 201 for achieving grounding.
Further, as shown in fig. 3 and 4, the plurality of holding members 205 are located within one square track, that is, the plurality of holding members 205 may be distributed at the positions corresponding to the four side plates 14. For example, one of the side plates 14 may be clamped using two clamping members 205, and the other side plate opposite to the one side plate 14 may also be clamped using two clamping members 205; the other two opposing side plates may be clamped using one or two clamps 205. This arrangement is particularly suitable for rectangular shielding devices 100. By providing the holding members 205 for fixing the shielding apparatus 100 at positions corresponding to the circumference of the shielding apparatus 100, the shielding apparatus 100 can be easily fixed, thereby ensuring the grounding property and stability of the shielding apparatus 100.
In summary, in the shielding apparatus 100 of the above embodiment, the shielding cover 10 and the heat dissipating assembly 20 can be integrated into a single assembly, which is beneficial to assembly in a production line, saves labor hours and work stations, and improves productivity. In addition, the shielding case 10 and the heat dissipation assembly 20 are integrated, and the inner side is adhered with the wave absorbing plate 30, so that the shielding and heat dissipation technologies are integrated, the shielding performance of the memory and the CPU can be enhanced, and meanwhile, the wave absorbing material in the interior has the effect of absorbing electromagnetic waves, so that the problem of electromagnetic compatibility radiation disturbance can be effectively solved, and the heat dissipation problem can be solved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A shielding device, comprising:
a shield case for mounting on a circuit substrate and for covering at least a first electronic device provided on the circuit substrate and a second electronic device different from the first electronic device;
the heat dissipation assembly is fixedly arranged on the shielding cover and used for absorbing heat of at least the first electronic device and dissipating the absorbed heat to the outside of the shielding cover; and
the wave absorbing plate is at least arranged on the surface of the shielding case facing the first electronic device and the second electronic device and used for absorbing the electromagnetic waves generated by the first electronic device and the second electronic device.
2. Shielding device according to claim 1,
the heat dissipation assembly comprises a heat dissipation body; the first part of the heat radiator is arranged on a first side, away from the first electronic device, of the shielding case; a second portion of the heat spreader opposite the first portion extends away from the shield; the heat radiator is used for absorbing heat of the first electronic device and radiating the absorbed heat to the outside of the shielding case.
3. Shielding device according to claim 2,
the first part of the heat radiator is fixedly connected to the first side, away from the first electronic device, of the shielding case.
4. Shielding device according to claim 1,
the heat dissipation assembly comprises a heat dissipation body and a heat conduction plate; the heat conducting plate is used for being in heat conducting contact with a first plane of the first electronic device; the first part of the heat radiator is arranged on the heat conduction plate and is in heat conduction contact with the heat conduction plate; the second part of the radiator opposite to the first part extends away from the shielding case, and the radiator is used for absorbing heat of the heat conduction plate and radiating the absorbed heat out of the shielding case.
5. Shielding device according to claim 4,
the heat conduction plate is embedded on the shielding cover.
6. Shielding device according to claim 1,
the shielding cover comprises a top plate and a side plate connected with the top plate, the top plate and the side plate enclose an accommodating chamber, and an opening is formed in one side of the accommodating chamber far away from the top plate; the top plate has a slot that receives a portion of the heat dissipation assembly.
7. Shielding device according to claim 1,
the shielding cover and the heat dissipation assembly are of an integrated structure.
8. Shielding device according to any of claims 1-7,
the heat dissipation assembly includes a heat pipe.
9. A circuit board assembly, comprising:
a circuit substrate;
a first electronic device;
at least one second electronic device, different from the first electronic device, the first and second electronic devices being disposed on the circuit substrate; and
the shielding device according to any one of claims 1-8;
wherein the shielding device is mounted on the circuit substrate and connected to the circuit substrate, the shielding cover covers the first electronic device and the second electronic device, and the heat dissipation assembly is thermally connected to at least the first electronic device.
10. The circuit board assembly of claim 9,
the circuit board assembly has at least one of the following features:
the circuit substrate is provided with a plurality of clamping pieces, and each clamping piece clamps the side plate of the shielding cover; and
the first electronic device is a central processing unit, and the second electronic device is a memory particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122735604.9U CN216451743U (en) | 2021-11-09 | 2021-11-09 | Shielding device and circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122735604.9U CN216451743U (en) | 2021-11-09 | 2021-11-09 | Shielding device and circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216451743U true CN216451743U (en) | 2022-05-06 |
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ID=81352563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122735604.9U Active CN216451743U (en) | 2021-11-09 | 2021-11-09 | Shielding device and circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216451743U (en) |
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2021
- 2021-11-09 CN CN202122735604.9U patent/CN216451743U/en active Active
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Effective date of registration: 20231108 Address after: 518000, 4th Floor, No. 31, Xiacun Community, Gongming Street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Baoxinchuang Information Technology Co.,Ltd. Address before: 518000 2nd floor, no.6, huidebao Industrial Park, No.11, second industrial zone, Baihua community, Guangming Street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shenzhen baoxinchuang Technology Co.,Ltd. |
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