CN114375117A - Heat dissipation module applied to deep-sea high-power electronic device - Google Patents
Heat dissipation module applied to deep-sea high-power electronic device Download PDFInfo
- Publication number
- CN114375117A CN114375117A CN202111479918.5A CN202111479918A CN114375117A CN 114375117 A CN114375117 A CN 114375117A CN 202111479918 A CN202111479918 A CN 202111479918A CN 114375117 A CN114375117 A CN 114375117A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- power electronic
- electronic device
- heat
- dissipation substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000013535 sea water Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000004519 grease Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat radiation module applied to a deep sea high-power electronic device, which comprises a support protection part, resin glue, a high-power electronic device, a heat conduction material and a heat radiation substrate, wherein the support protection part is arranged on the support protection part; the supporting and protecting part is columnar, the upper end of the supporting and protecting part is opened, a cavity is formed in the supporting and protecting part, the radiating substrate is located at the center of the supporting and protecting part, and a vertical through hole is formed in the radiating substrate to form a seawater flow channel; the high-power electronic device is fixed on the side wall surface of the radiating substrate, and a heat conduction material is filled between the high-power electronic device and the radiating substrate; the cavity between the support protective part and the heat dissipation substrate is filled with resin glue to cover and support the high-power electronic device.
Description
Technical Field
The invention relates to the field of electronic heat dissipation equipment, in particular to a heat dissipation module applied to a deep sea high-power electronic device.
Background
Generally, electronic modules such as deep sea detectors have thick steel housings, are high in manufacturing cost and poor in economy, and deep sea electronic modules face a serious water sealing problem and electronic devices face short circuits or damage risks. Moreover, with the application of high power devices, overheating protection is caused due to high thermal power, and the system function is damaged. Therefore, the existing deep sea detector usually has the problems of heavy mass and poor heat dissipation of the electronic module.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the heat dissipation module applied to the deep sea high-power electronic device.
The purpose of the invention is realized by the following technical scheme:
a heat radiation module applied to a deep sea high-power electronic device comprises a support protection part, resin glue, a high-power electronic device, a heat conduction material and a heat radiation substrate; the supporting and protecting part is columnar, the upper end of the supporting and protecting part is opened, a cavity is formed in the supporting and protecting part, the radiating substrate is located at the center of the supporting and protecting part, and a vertical through hole is formed in the radiating substrate to form a seawater flow channel; the high-power electronic device is fixed on the side wall surface of the radiating substrate, and a heat conduction material is filled between the high-power electronic device and the radiating substrate; and resin glue is filled in a cavity between the support protection part and the heat dissipation substrate to cover and support the high-power electronic device.
Further, reinforcing ribs are arranged inside the supporting and protecting part.
Furthermore, the heat conducting material is heat conducting grease which is vertically distributed near the high-power electronic device, so that the vertical minimization of the heat conducting distance is ensured, and the thermal resistance is reduced.
Further, when the heat dissipation substrate is metal, the position of the peripheral face of the heat dissipation substrate close to the end portion is subjected to rough treatment, so that the resin adhesive and the heat dissipation substrate form a compact connection interface, and the resin adhesive is prevented from being peeled off from the heat dissipation substrate or playing a waterproof role.
Furthermore, the heat dissipation module also comprises filter screens fixed at the upper end and the lower end of the heat dissipation substrate, and the filter screens are used for filtering impurities in the seawater channel to prevent blockage; and a seawater flow channel is formed between the vertical through hole and the filter screen.
Further, when the high-power electronic device is provided with a circuit board, the heat conduction material is filled between the circuit board and the heat dissipation substrate.
The invention has the following beneficial effects:
(1) according to the heat dissipation module of the deep sea high-power electronic device, the resin adhesive is selected to transmit the deep sea pressure, a thick steel container is avoided, and the cost is saved;
(2) the heat dissipation module enables the high-power heating device to well discharge heat, works in a proper temperature environment, and efficiently solves the problem of overheat protection.
(3) The heat dissipation module has good sealing performance, and avoids loss of functions of electronic devices due to contact with seawater.
Drawings
FIG. 1 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the heat dissipation module of the invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments, and the objects and effects of the present invention will become more apparent, it being understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.
In the drawings of the embodiments of the present invention, in order to describe the heat dissipation module of the deep sea power electronic device more clearly, the size, the dimension and the shape of each component inside the structure cannot be limited.
As shown in fig. 1, one embodiment of the heat dissipation module applied to deep sea high power electronic devices of the present invention includes a support and protection member 1, a resin paste 2, a high power electronic device 3, a circuit board 4, a thermal grease 5, a heat dissipation substrate 6, and a filter 7.
The supporting and protecting part 1 is cylindrical or cubic, the resin adhesive 2 is filled in the cavity of the supporting and protecting part 1, covers the high-power electronic device 3 and the circuit board 4 and bears the high pressure of seawater; the high-power electronic devices 3 are distributed on the circuit board 4, the other side of the circuit board 4 is connected with the heat dissipation substrate 6 through the heat conduction grease 5, and the heat conduction grease 5 is closely distributed near the high-power electronic devices 3 on the circuit board, so that the heat conduction distance is ensured to be vertically minimized, and the thermal resistance is reduced. The center of the heat dissipation substrate 6 is provided with a through hole 601, the installation direction of the through hole 601 needs to be vertical to the sea level, and the filter screens 7 are fixed at the upper end and the lower end of the through hole 601 of the heat dissipation substrate to filter impurities in a seawater channel and prevent blockage. The filter screen 7 and the through hole 601 form a seawater flow channel, the density of the seawater is reduced after the seawater is heated, the seawater flows upwards, natural circulation is formed, and heat is taken away efficiently.
The supporting protection part 1 is used for bearing the resin adhesive 2, so that the resin adhesive 2 can fill the cavity of the supporting protection part 1, and the resin adhesive can not overflow. In order to improve the strength of the whole supporting and protecting part 1, the supporting and protecting part 1 is internally distributed with force bearing reinforcing ribs 101.
When the heat dissipation substrate 6 is made of a metal material, the surface of the heat dissipation substrate should be processed to improve the roughness, so that a compact connection interface is formed between the resin adhesive and the metal, the heat dissipation substrate 6 and the resin adhesive are prevented from being peeled off, and the heat dissipation substrate has good waterproof performance.
As shown in fig. 2, another embodiment of the heat dissipation module applied to deep sea power electronic devices of the present invention, when the power electronic device 3 has no circuit board 4, the power electronic device (3) is directly connected to the heat dissipation substrate (6) through the thermal grease (5) to transfer the heat of the electronic device to the sea water through heat transfer, and the rest is the same as that shown in fig. 1.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and although the invention has been described in detail with reference to the foregoing examples, it will be apparent to those skilled in the art that various changes in the form and details of the embodiments may be made and equivalents may be substituted for elements thereof. All modifications, equivalents and the like which come within the spirit and principle of the invention are intended to be included within the scope of the invention.
Claims (6)
1. A heat radiation module applied to a deep sea high-power electronic device is characterized by comprising a support protection part (1), a resin adhesive (2), a high-power electronic device (3), a heat conduction material (5) and a heat radiation substrate (6); the supporting and protecting part (1) is columnar, the upper end of the supporting and protecting part is open, a cavity is formed in the supporting and protecting part, the heat dissipation substrate (6) is located at the center of the supporting and protecting part (1), and a vertical through hole is formed in the heat dissipation substrate (6) to form a seawater flow channel; the high-power electronic device (3) is fixed on the side wall surface of the heat dissipation substrate (6), and a heat conduction material (5) is filled between the high-power electronic device (3) and the heat dissipation substrate (6); and a cavity between the support protection part (1) and the heat dissipation substrate (6) is filled with resin glue (2) to cover and support the high-power electronic device (3).
2. The heat dissipation module for deep sea high power electronic devices according to claim 1, wherein the support and protection member (1) is internally provided with reinforcing ribs.
3. The heat dissipation module for deep sea high power electronic devices according to claim 1, wherein the heat conductive material (5) is a heat conductive grease, and is vertically distributed near the high power electronic devices (3), so as to ensure that the heat conduction distance is vertically minimized and reduce the thermal resistance.
4. The heat dissipation module for deep sea high power electronic devices according to claim 1, wherein when the heat dissipation substrate (6) is made of metal, the outer peripheral surface of the heat dissipation substrate (6) near the end is roughened, so that the resin adhesive (2) and the heat dissipation substrate (6) form a dense connection interface, and the resin adhesive (2) is prevented from peeling off from the heat dissipation substrate (6) or has a waterproof effect.
5. The heat dissipation module applied to deep sea high power electronic devices according to claim 1, further comprising filter screens (7) fixed at the upper and lower ends of the heat dissipation substrate (6) for filtering impurities in the sea water channel to prevent blockage; a seawater flow channel is formed between the vertical through hole and the filter screen (7).
6. The heat dissipation module for deep sea high power electronic devices according to claim 1, wherein the heat conductive material (5) is filled between the circuit board and the heat dissipation substrate (6) when the high power electronic device (3) is provided with the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111479918.5A CN114375117A (en) | 2021-12-06 | 2021-12-06 | Heat dissipation module applied to deep-sea high-power electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111479918.5A CN114375117A (en) | 2021-12-06 | 2021-12-06 | Heat dissipation module applied to deep-sea high-power electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114375117A true CN114375117A (en) | 2022-04-19 |
Family
ID=81139475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111479918.5A Pending CN114375117A (en) | 2021-12-06 | 2021-12-06 | Heat dissipation module applied to deep-sea high-power electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114375117A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321883A (en) * | 2023-05-17 | 2023-06-23 | 之江实验室 | High-water-tightness high-power device heat dissipation device applied to deep sea |
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| CN201044561Y (en) * | 2007-05-30 | 2008-04-02 | 张绍强 | Water jacket type heat radiator for high-power electron device |
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2021
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Cited By (2)
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