CN109152303A - A kind of radiator structure of underwater electronic compartment - Google Patents
A kind of radiator structure of underwater electronic compartment Download PDFInfo
- Publication number
- CN109152303A CN109152303A CN201811184078.8A CN201811184078A CN109152303A CN 109152303 A CN109152303 A CN 109152303A CN 201811184078 A CN201811184078 A CN 201811184078A CN 109152303 A CN109152303 A CN 109152303A
- Authority
- CN
- China
- Prior art keywords
- heat
- plate
- heat dissipation
- underwater electronic
- collecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 56
- 239000004519 grease Substances 0.000 claims abstract description 13
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 13
- 230000005855 radiation Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of radiator structure of underwater electronic compartment, belongs to technical field of heat dissipation.The radiator structure of the underwater electronic compartment includes two groups of heat radiation modules, is separately mounted to two sides of radiating element；Wherein, the heat radiation module includes heat-conducting plate and collecting plate, and the heat-conducting plate is fixedly connected with collecting plate by adjusting screw；One side of the heat-conducting plate is arc surface, another side is equipped with broached-tooth design；One side of the collecting plate is plane, another side is equipped with broached-tooth design；The broached-tooth design of the broached-tooth design of the heat-conducting plate and the collecting plate is intermeshed.It is aided with heat-conducting silicone grease, radiating efficiency can be greatly improved, solve the heat dissipation problem of underwater electronic compartment, to improves the service life of underwater instrument.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure of an underwater electronic cabin.
Background
An underwater electronic cabin (also called an underwater sealed cabin) is a structure for installing an electronic circuit on underwater equipment, and is commonly used for various underwater equipment, such as underwater cameras, underwater robots, various depth measuring instruments and the like. Its casing does not have the problem in aqueous, and the heat dissipation does not have the problem, because the electronic compartment is watertight, can not trompil in the circumferencial direction, can't exert radial force to inside heat conduction structure spare, and equipment or device that generates heat can't closely laminate with the casing, leads to the radiating efficiency low, and easy overheated causes life to shorten, burns out the circuit board even.
At present, the common method in engineering is to improve the processing precision, reduce the gap between the heat dissipation plate and the shell, apply a radial force by using the elasticity of the sealing ring and reduce the gap between the internal heat conduction structure and the shell. The improvement of the processing precision of the former can cause the cost to be greatly increased, and the force which can be increased by the latter is very limited, so that the former and the latter have certain limitations.
Disclosure of Invention
The invention aims to provide a heat dissipation structure of an underwater electronic cabin, which aims to solve the problem that the existing underwater electronic cabin is low in heat dissipation efficiency.
In order to solve the technical problem, the invention provides a heat dissipation structure of an underwater electronic cabin, which comprises two groups of heat dissipation modules, a heat dissipation device and a heat dissipation device, wherein the two groups of heat dissipation modules are respectively arranged on two side surfaces of the heat dissipation device; wherein,
the heat dissipation module comprises a heat conduction plate and a heat collection plate, and the heat conduction plate and the heat collection plate are fixedly connected through adjusting screws; one side surface of the heat conducting plate is an arc surface, and the other side surface is provided with a sawtooth structure; one side surface of the heat collecting plate is a plane, and the other side surface of the heat collecting plate is provided with a sawtooth structure; the sawtooth structure of the heat conducting plate is meshed with the sawtooth structure of the heat collecting plate.
Optionally, a distance tube is arranged between the two sets of heat dissipation modules, and two ends of the distance tube are connected with the two sets of heat dissipation modules through fixing screws respectively.
Optionally, two ends of the heat collecting plate are provided with protrusions, and the heat conducting plate is fixedly connected to the protrusions through adjusting screws.
Optionally, the sawtooth structures of the heat conducting plate and the heat collecting plate are respectively and uniformly coated with heat conducting silicone grease.
Optionally, the joint surface of the heat collecting plate and the heat dissipation device is uniformly coated with heat-conducting silicone grease.
Optionally, the arc surface of the heat conducting plate is uniformly coated with heat conducting silicone grease.
Optionally, the protrusion is arc-shaped.
The invention provides a heat dissipation structure of an underwater electronic cabin, which comprises two groups of heat dissipation modules, a heat dissipation device and a heat dissipation device, wherein the two groups of heat dissipation modules are respectively arranged on two side surfaces of the heat dissipation device; the heat dissipation module comprises a heat conduction plate and a heat collection plate, wherein the heat conduction plate and the heat collection plate are fixedly connected through adjusting screws; one side surface of the heat conducting plate is an arc surface, and the other side surface is provided with a sawtooth structure; one side surface of the heat collecting plate is a plane, and the other side surface of the heat collecting plate is provided with a sawtooth structure; the sawtooth structure of the heat conducting plate is meshed with the sawtooth structure of the heat collecting plate. The heat-conducting silicone grease is used as an auxiliary material, so that the heat dissipation efficiency can be greatly improved, the heat dissipation problem of the underwater electronic cabin is solved, and the service life of an underwater instrument is prolonged.
Drawings
FIG. 1 is a schematic view of a heat dissipation structure of an underwater electronic compartment provided by the present invention;
FIG. 2(a) is a top view of the heat-conducting plate;
FIG. 2(b) is a side view of the heat-conducting plate;
FIG. 3(a) is a plan view of the heat collecting plate;
FIG. 3(b) is a side view of the heat collecting plate;
FIG. 3(c) is a front view of the heat collecting plate;
figure 4 is a schematic view of the construction of the spacer tube;
fig. 5 is a schematic structural view of a heat dissipation structure of an underwater electronic cabin provided by the invention when in use.
Detailed Description
The heat dissipation structure of an underwater electronic cabin according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The invention provides a heat dissipation structure of an underwater electronic cabin, which comprises two groups of heat dissipation modules which are respectively arranged on two side surfaces of a heat dissipation device, as shown in figure 1. Specifically, a single heat dissipation module comprises a heat conduction plate 1 and a heat collection plate 2, wherein the heat conduction plate 1 and the heat collection plate 2 are fixedly connected through an adjusting screw 3.
Specifically, referring to fig. 2(a) and 2(b), one side surface of the heat conducting plate 1 is a circular arc surface, as shown in fig. 2 (a); the other side is provided with a sawtooth structure 10 as shown in fig. 2(b), and a screw hole 11 is formed on the heat conducting plate 1 for mounting the adjusting screw 3. Referring to fig. 3(a), 3(b) and 3(c), one side surface of the heat collecting plate 2 is a plane, as shown in fig. 3(a), and the other side surface is provided with a saw tooth structure 20, as shown in fig. 3(b), and arc-shaped protrusions 21 are provided at both ends of the heat collecting plate 2, and screw holes 22 are provided on the protrusions 21 for mounting the adjusting screws 3. The heat collecting plate 2 is provided with a screw hole 22 for connecting with the distance tube 4 through a fixing screw. The heat conducting plate 1 is fixedly connected on the bulge 21 through an adjusting screw 3. Further, the sawtooth structure 10 of the heat conduction plate 1 is engaged with the sawtooth structure 20 of the heat collection plate 2; further, the sawtooth structures 10 and 20 are uniformly coated with heat-conducting silicone grease.
The two groups of heat dissipation modules are respectively installed on two side surfaces of the heat dissipation device, a distance pipe 4 is arranged between the two groups of heat dissipation modules, the structural schematic diagram of the distance pipe 4 is shown in fig. 4, and screw holes 40 are formed in two ends of the distance pipe 4 and are respectively connected with the two groups of heat dissipation modules through fixing screws.
When the heat dissipation module is used, heat conduction silicone grease is uniformly coated on the sawtooth structures 10 and 20 respectively, and is attached according to sawteeth, connected by the adjusting screws 3 and screwed in to form a single heat dissipation module; and installing a heat radiating device on the plane of the heat collecting plate 2, coating heat-conducting silicone grease on the binding surface, and fixing by using screws. The two groups of heat dissipation modules are reversely installed, a distance tube 4 is arranged between the two groups of heat dissipation modules, and two ends of the distance tube 4 are respectively connected with the two groups of heat dissipation modules through fixing screws.
The arc surface of the heat conducting plate 1 is evenly coated with heat conducting silicone grease, and the whole part is put into the cylinder 5 until the bottom, as shown in fig. 5. Adjusting the adjusting screw 3 to tightly press the heat conducting plate 1 on the inner wall of the cylinder 5. End covers 6 and glass 7 are arranged at two ends of the cylinder 5 and are sealed by O-shaped rings, so that water tightness is realized.
The axial force applied by the adjusting screw 3 is transmitted through the sawtooth structures of the heat collecting plate 2 and the heat conducting plate 1 and converted into radial force, so that the arc surface of the heat conducting plate 1 is tightly pressed on the inner wall of the cylinder 5, heat can be well transmitted to the wall of the cylinder 5, and the heat dissipation condition is good because the outer side of the cylinder 5 is water, thereby realizing the heat dissipation of the whole heat dissipation device underwater. The radiating structure of the underwater electronic cabin can convert the axial force of the adjusting screw into radial force, so that the internal heat conducting structure is tightly attached to the outer shell, and the heat conducting silicone grease is used for assistance, so that the radiating efficiency can be greatly improved, the radiating problem of the underwater electronic cabin is solved, and the service life of an underwater instrument is prolonged.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (7)
1. A heat dissipation structure of an underwater electronic cabin is characterized by comprising two groups of heat dissipation modules which are respectively arranged on two side surfaces of a heat dissipation device; wherein,
the heat dissipation module comprises a heat conduction plate and a heat collection plate, and the heat conduction plate and the heat collection plate are fixedly connected through adjusting screws; one side surface of the heat conducting plate is an arc surface, and the other side surface is provided with a sawtooth structure; one side surface of the heat collecting plate is a plane, and the other side surface of the heat collecting plate is provided with a sawtooth structure; the sawtooth structure of the heat conducting plate is meshed with the sawtooth structure of the heat collecting plate.
2. The heat dissipation structure for underwater electronic modules as claimed in claim 1, wherein a distance tube is disposed between the two sets of heat dissipation modules, and two ends of the distance tube are respectively connected to the two sets of heat dissipation modules through fixing screws.
3. The heat dissipation structure of an underwater electronic compartment as recited in claim 2, wherein protrusions are provided at both ends of the heat collection plate, and the heat conduction plate is fixedly coupled to the protrusions by means of adjustment screws.
4. The heat dissipation structure of an underwater electronic compartment as recited in claim 3, wherein the saw-tooth structure of the heat conductive plate and the saw-tooth structure of the heat collecting plate are uniformly coated with heat conductive silicone grease, respectively.
5. The heat dissipating structure of an underwater electronic module as recited in claim 4, wherein the adhesion surface between the heat collecting plate and the heat dissipating device is uniformly coated with heat conductive silicone grease.
6. The heat dissipation structure of an underwater electronic compartment as claimed in claim 5, wherein the arc surface of the heat conductive plate is uniformly coated with heat conductive silicone grease.
7. The heat dissipating structure of an underwater electronic compartment of claim 3, wherein the projection is arcuate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811184078.8A CN109152303A (en) | 2018-10-11 | 2018-10-11 | A kind of radiator structure of underwater electronic compartment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811184078.8A CN109152303A (en) | 2018-10-11 | 2018-10-11 | A kind of radiator structure of underwater electronic compartment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109152303A true CN109152303A (en) | 2019-01-04 |
Family
ID=64811091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811184078.8A Pending CN109152303A (en) | 2018-10-11 | 2018-10-11 | A kind of radiator structure of underwater electronic compartment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109152303A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411773A (en) * | 2019-08-20 | 2019-11-05 | 大连理工大学 | A kind of land test platform of underwater robot electronic compartment |
| CN114375117A (en) * | 2021-12-06 | 2022-04-19 | 之江实验室 | Heat dissipation module applied to deep-sea high-power electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841996A (en) * | 2010-05-07 | 2010-09-22 | 浙江大学 | Elastic heat dissipating bracket for deep-sea seal cavity |
| EP2487327A1 (en) * | 2011-02-09 | 2012-08-15 | Siemens Aktiengesellschaft | Subsea electronic system |
| CN104763855A (en) * | 2015-02-28 | 2015-07-08 | 美钻能源科技(上海)有限公司 | Adjustable pipe connection device |
| CN106413351A (en) * | 2016-11-22 | 2017-02-15 | 江苏科技大学 | Water-cooled heat dissipation type pressure-resistant electronic cabin |
| CN108260323A (en) * | 2016-12-28 | 2018-07-06 | 中国船舶重工集团公司第七○五研究所昆明分部 | A kind of radiator structure of submarine navigation device welding chamber in-vivo device |
| CN209283643U (en) * | 2018-10-11 | 2019-08-20 | 无锡市海鹰加科海洋技术有限责任公司 | A kind of radiator structure of underwater electronic compartment |
-
2018
- 2018-10-11 CN CN201811184078.8A patent/CN109152303A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841996A (en) * | 2010-05-07 | 2010-09-22 | 浙江大学 | Elastic heat dissipating bracket for deep-sea seal cavity |
| EP2487327A1 (en) * | 2011-02-09 | 2012-08-15 | Siemens Aktiengesellschaft | Subsea electronic system |
| CN104763855A (en) * | 2015-02-28 | 2015-07-08 | 美钻能源科技(上海)有限公司 | Adjustable pipe connection device |
| CN106413351A (en) * | 2016-11-22 | 2017-02-15 | 江苏科技大学 | Water-cooled heat dissipation type pressure-resistant electronic cabin |
| CN108260323A (en) * | 2016-12-28 | 2018-07-06 | 中国船舶重工集团公司第七○五研究所昆明分部 | A kind of radiator structure of submarine navigation device welding chamber in-vivo device |
| CN209283643U (en) * | 2018-10-11 | 2019-08-20 | 无锡市海鹰加科海洋技术有限责任公司 | A kind of radiator structure of underwater electronic compartment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411773A (en) * | 2019-08-20 | 2019-11-05 | 大连理工大学 | A kind of land test platform of underwater robot electronic compartment |
| CN110411773B (en) * | 2019-08-20 | 2024-05-31 | 大连理工大学 | Land test platform for electronic cabin of underwater robot |
| CN114375117A (en) * | 2021-12-06 | 2022-04-19 | 之江实验室 | Heat dissipation module applied to deep-sea high-power electronic device |
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