CN220856560U - Surrounding dam structure for gallium-based liquid metal - Google Patents
Surrounding dam structure for gallium-based liquid metal Download PDFInfo
- Publication number
- CN220856560U CN220856560U CN202322290198.9U CN202322290198U CN220856560U CN 220856560 U CN220856560 U CN 220856560U CN 202322290198 U CN202322290198 U CN 202322290198U CN 220856560 U CN220856560 U CN 220856560U
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- CN
- China
- Prior art keywords
- gallium
- liquid metal
- based liquid
- dam
- insulating layer
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 49
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052733 gallium Inorganic materials 0.000 title claims abstract description 48
- 239000010410 layer Substances 0.000 claims abstract description 59
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000002955 isolation Methods 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000006260 foam Substances 0.000 claims abstract description 14
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000004925 Acrylic resin Substances 0.000 claims description 14
- 229920000178 Acrylic resin Polymers 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 13
- 229920000098 polyolefin Polymers 0.000 claims description 9
- 238000003848 UV Light-Curing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 description 16
- 229910052582 BN Inorganic materials 0.000 description 10
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a surrounding dam structure for gallium-based liquid metal, which comprises an isolation insulating layer arranged on a main board element and arranged along the outer edge of a heating element, an elastic foam layer arranged on the isolation insulating layer and arranged along the outer edge of the heating element, a surrounding dam adhesive layer arranged along the top edge of the heating element and used for surrounding the gallium-based liquid metal, and a heat dissipation cold head arranged above the surrounding dam adhesive layer. The utility model can effectively avoid the short circuit of the electronic element caused by the leakage of the gallium-based liquid metal, so that the gallium-based liquid metal can be safely and effectively applied to the heat dissipation field of high-heating elements such as chips and the like.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a surrounding dam structure for gallium-based liquid metal.
Background
With the rapid development of very large scale integrated circuits and electronic devices, heat dissipation is a major problem affecting device performance and lifetime, and it is important to effectively dissipate heat generated during operation of the device. The conventional natural convection of air has a low heat transfer coefficient, and high-performance cooling needs to be achieved by using large-area fins, but the installation of the large-area fins is limited due to the limited space inside the equipment. Among the means of enhancing heat dissipation, increasing the heat transfer coefficient is the most effective approach, and therefore heat dissipation can be improved by selecting materials having high heat dissipation coefficients. Thermal interface materials based on silicone resins have been widely used and can easily adhere to rough interfaces, however, the thermal conductivity of these materials is generally low, and degradation phenomenon occurs at high temperature, greatly affecting heat dissipation performance, and gallium-based liquid metals are also used in the heat dissipation field due to their excellent performance. The gallium-based liquid metal has the characteristics of ageing resistance and high heat conductivity, can rapidly conduct heat of a chip, is a thermal interface heat conduction material with highest efficiency at present, but once the gallium-based liquid metal leaks after packaging, the gallium-based liquid metal can cause an electronic element to be instantaneously short-circuited and invalid due to the high electric conductivity of the gallium-based liquid metal, so that popularization and application of the gallium-based liquid metal in the heat dissipation field are seriously hindered.
Disclosure of utility model
Features and advantages of the utility model will be set forth in part in the description which follows, or may be obvious from the description, or may be learned by practice of the utility model.
In order to overcome the problems in the prior art, the utility model aims to provide the surrounding dam structure capable of effectively preventing the leakage of the gallium-based liquid metal, so that the situation of short circuit of electronic elements caused by the leakage of the surrounding dam structure is effectively avoided, and the gallium-based liquid metal can be safely and effectively applied to the heat dissipation field of high-heat-generating elements such as chips.
In order to achieve the above purpose, the technical scheme provided by the utility model is as follows:
the dam structure comprises an isolation insulating layer arranged on a main board element and along the outer edge of a heating element, an elastic foam layer arranged on the isolation insulating layer and along the outer edge of the heating element, and a dam adhesive layer arranged along the top edge of the heating element and used for surrounding the gallium-based liquid metal; and a heat dissipation cold head is arranged above the dam glue layer.
Preferably, the isolation insulating layer is made of polyepoxy acrylic resin; the material of the dam surrounding adhesive layer is polyolefin acrylic resin; the isolation insulating layer and the dam adhesive layer are subjected to UV curing treatment.
According to the dam structure for the gallium-based liquid metal, as the polyolefin acrylic resin has excellent stacking performance, the polyolefin acrylic resin can be stacked to the required height as required, the operation is simple, flexible and adjustable, the dam adhesive layer is solidified after UV solidification, the solidified dam adhesive layer still has good compression performance and can bear certain extrusion force, when the gallium-based liquid metal is about to overflow, the pressure can be released by the dam adhesive layer, the surface tension of the gallium-based liquid metal is higher, and the gallium-based liquid metal can not be extruded to surrounding gaps, so that leakage is avoided. In addition, because the dam glue layer is viscous liquid before solidification, the contact position of the bottom and the heating element is firm, leakage is not easy to occur, and the top of the dam glue layer has good compression performance after UV solidification, so the dam glue layer is tightly contacted with a heat dissipation cold head at the top, a sealing effect on gallium-based liquid metal is formed, and leakage is avoided. The isolating insulating layer and the dam glue layer can not react with the gallium-based liquid metal, so that the excellent heat conduction performance of the gallium-based liquid metal is completely reserved, and meanwhile, the excellent insulating performance of the isolating insulating layer is ensured, and further, the main board element is not short-circuited. The gallium-based liquid metal in case of leakage is absorbed into the holes of the elastic foam layer through the elastic foam layer, so that further leakage of the gallium-based liquid metal is avoided, and short circuit caused by leakage of the gallium-based liquid metal is avoided.
Preferably, in order to improve the heat dissipation effect of the motherboard component, the isolating insulation layer further includes a plurality of heat conducting layers dispersed in the polyepoxy acrylic resin.
Preferably, the heat conductive layer is composed of boron nitride particles and/or aluminum nitride particles.
Preferably, in order to improve the supporting strength of the dam glue layer and the isolation effect of the isolation insulating layer, the UV curing treatment adopts UV curing, and the curing parameters are as follows: the exposure time is 10-22S, the power of the ultraviolet lamp is 2KW, and the ultraviolet intensity is 1200-2400mW/cm 2.
Preferably, in order to be absorbed by the elastic foam layer in case of leakage of gallium-based liquid metal, the elastic foam layer is made of polyolefin and is obtained through sulfur-free open-cell foaming process treatment.
The utility model has the beneficial effects that: the dam structure can effectively prevent leakage of gallium-based liquid metal, avoid corrosion of the gallium-based liquid metal to the dam structure, further effectively avoid short circuit of electronic elements caused by leakage, enable the gallium-based liquid metal to be safely and effectively applied to heat dissipation of high-heat-generating elements such as chips and the like, and prolong the service life of the high-heat-generating elements.
Drawings
The advantages and the manner of carrying out the utility model will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings, in which the content shown is meant to illustrate, but not to limit, the utility model in any sense, and wherein:
FIG. 1 is a schematic illustration of a dam structure for gallium-based liquid metal in accordance with an embodiment of the present utility model;
fig. 2 is a cross-sectional view of a dam structure for gallium-based liquid metal in accordance with an embodiment of the present utility model.
In the figure, the correspondence between the component names and the drawing numbers is:
The isolation insulating layer is 100, the elastic foam layer is 200, the gallium-based liquid metal is 300, the heat dissipation cooling head comprises the following components, by weight, a dam glue layer-400, a heat dissipation cooling head-500, a main board element-600 and a heating element-700.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
Example 1
As shown in fig. 1 and 2, the present utility model provides a dam structure for a gallium-based liquid metal 300, comprising an isolation insulating layer 100 disposed on a main board element 600 and along the outer edge of a heating element 700, an elastic foam layer 200 disposed on the isolation insulating layer 100 and along the outer edge of the heating element 700, and a dam glue layer 400 disposed along the top edge of the heating element 700 and used for surrounding the gallium-based liquid metal 300; a heat-dissipating cold head 500 is arranged above the dam glue layer 400; the isolation insulating layer 100 is made of polyepoxy acrylic resin; the dam glue layer 400 is made of polyolefin acrylic resin; the isolation insulating layer 100 and the dam glue layer 400 are all subjected to UV curing treatment. The polyolefin acrylic resin is colorless transparent viscous liquid, has excellent stacking performance, can be stacked to a required height as required, is simple and flexible and adjustable, enables the dam adhesive layer 400 to be solidified through UV (ultraviolet) solidification, has good compression performance, can bear a certain extrusion force, and can be released by the dam adhesive layer 400 when the gallium-based liquid metal 300 is about to overflow, and the surface tension of the gallium-based liquid metal 300 is high, so that the gallium-based liquid metal 300 can not be extruded to surrounding gaps, and leakage is avoided. The insulating layer 100 and the dam glue layer 400 do not react with the gallium-based liquid metal 300, so that the excellent heat conduction performance of the gallium-based liquid metal 300 is completely maintained, and meanwhile, the excellent insulating performance of the insulating layer 100 is ensured, so that the main board element 600 is not shorted. The gallium-based liquid metal 300 in case of leakage is absorbed into the holes of the elastic foam layer 200 through the elastic foam layer 200, so that further leakage of the gallium-based liquid metal 300 is avoided, and short circuit caused by leakage of the gallium-based liquid metal 300 is avoided.
In order to further optimize the above technical solution and improve the heat conducting performance of the insulating layer 100, the insulating layer 100 further includes a plurality of heat conducting layers dispersed in the poly epoxy acrylic resin. The heat conducting layer can be arranged according to actual requirements. "plurality" means an amount of ≡2.
Further, the heat conductive layer is composed of boron nitride particles and/or aluminum nitride particles, that is, one of the preferred embodiments of the heat conductive layer is composed of boron nitride particles, the other preferred embodiment of the heat conductive layer is composed of aluminum nitride particles, and as another preferred embodiment of the present utility model, the heat conductive layer is composed of boron nitride particles and aluminum nitride particles, and in this embodiment, preferably, the addition amount of boron nitride in all boron nitride particles is 10% of the total mass of the whole insulating layer 100, the addition amount of aluminum nitride in all aluminum nitride particles is 7% of the total mass of the whole insulating layer 100, and the boron nitride particles are prepared in a granular form by mixing boron nitride powder with a small amount of polyepoxy acrylic resin; the aluminum nitride particles are prepared into particles by adding a small amount of polyepoxy acrylic resin into aluminum nitride powder and mixing; of course, the boron nitride powder and the aluminum nitride powder can be mixed and then added with a small amount of polyepoxy acrylic resin to prepare particles; by adding boron nitride particles and/or aluminum nitride particles, the thermal conductivity of the insulating layer 100 is improved, so that heat generated during operation of the motherboard element 600 is dissipated in time.
Further, the UV curing treatment adopts ultraviolet curing, and the curing parameters are as follows: the exposure time is 10-22S, the power of the ultraviolet lamp is 2KW, and the ultraviolet intensity is 1200-2400mW/cm 2, so as to achieve good curing effect and provide good supporting effect for the gallium-based liquid metal 300.
Further, the elastic foam layer 200 is made of polyolefin, and is obtained through a sulfur-free open-cell foaming process, which is a processing method of polyolefin foam, and is not described herein. The elastic foam layer 200 after the sulfur-free open-cell foaming treatment does not react with the gallium-based liquid metal 300, and can rapidly absorb the liquid metal so as to achieve a good leakage prevention effect.
While the preferred embodiments of the present utility model have been illustrated by reference to the accompanying drawings, those skilled in the art will appreciate that many modifications are possible in carrying out the utility model without departing from the scope and spirit thereof. For example, features illustrated or described as part of one embodiment can be used on another embodiment to yield still a further embodiment. The foregoing description and drawings are merely illustrative of preferred embodiments of the present utility model and are not intended to limit the scope of the claims, but rather to cover all modifications within the scope of the present utility model.
Claims (2)
1. The dam structure for the gallium-based liquid metal is characterized by comprising an isolation insulating layer which is arranged on a main board element and is arranged along the outer edge of a heating element, an elastic foam layer which is arranged on the isolation insulating layer and is arranged along the outer edge of the heating element, and a dam adhesive layer which is arranged along the top edge of the heating element and is used for surrounding the gallium-based liquid metal; and a heat dissipation cold head is arranged above the dam glue layer.
2. The dam structure for gallium-based liquid metal according to claim 1, wherein the isolating insulating layer is made of polyepoxy acrylic resin; the material of the dam surrounding adhesive layer is polyolefin acrylic resin; the isolation insulating layer and the dam adhesive layer are subjected to UV curing treatment.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320307685 | 2023-02-15 | ||
| CN2023203076859 | 2023-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220856560U true CN220856560U (en) | 2024-04-26 |
Family
ID=90780247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322290198.9U Active CN220856560U (en) | 2023-02-15 | 2023-08-24 | Surrounding dam structure for gallium-based liquid metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220856560U (en) |
-
2023
- 2023-08-24 CN CN202322290198.9U patent/CN220856560U/en active Active
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