JPH03110892A - Heat-dissipating structure of electronic apparatus - Google Patents

Abstract

PURPOSE:To effectively cool an electronic apparatus housed in an enclosure without damaging a maintenance property by a method wherein a plurality of electronic apparatuses are attached to a heat-conducting pipe via a heat- transfer member. CONSTITUTION:A heat-conducting pipe 4 is attached to the center of a cylindrical hermetically-sealed enclosure 1; heating-element circuit blocks 8 composed of electronic apparatuses are arranged at its circumference so as to be a radial shape; heat generated at the heating-element circuit blocks 8 is conducted to the heat-conducting pipe via conductor parts 8. The heat-conducting pipe 4 is formed as a highly heat-conducting structure, e.g. a heat pipe or a boiling and cooling structure. The heat generated at the heating-element circuit blocks 8 composed of the electronic apparatuses is connected to a radiating filn 5 whose heat resistance is low and which has been attached to the outside of the enclosure by keeping a space; it is heat-exchanged with the outside air.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure for radiating heat generated from an electronic device that is shrunk inside a housing to the outside of the housing.

[Conventional technology]

When electronic components are installed, they are often shrunk into a housing to protect them, and especially when installed outdoors, they are usually housed in a case.

Furthermore, as electronic technology becomes smaller and more dense, a large number of electronic devices are increasingly housed in a small housing. In such cases, it is necessary to efficiently dissipate heat generated by the operation of the electronic device to the outside of the housing.

In response to these demands, Japanese Patent Application Laid-Open No. 63-50100 (Casing for Electronic Devices) has been proposed as a technique for cooling the heat generated by electronic devices within the case. This invention provides a cooling fluid flow path in the wall of the housing.

Moreover, in Utility Model Application Publication No. 59-66390 (inverter device), a heat generating member is attached in close contact with the inner surface of the casing, and the outer surface of the casing is liquid-cooled.

[Problem to be solved by the invention]

In the above-mentioned known technology, since the casing itself is used as a heat transfer member, there is a strong relationship between the casing and the cooling means. For example, a refrigerant pipe is connected to the casing, or the casing is connected to a cooling It is soaked inside. Therefore, it is difficult to remove the casing and inspect the internal electronic devices, or to take out and inspect the electronic components.

In the prior art, there has been a problem in that cooling efficiency decreases when attempting to improve the maintainability of electronic devices within the housing.

The present invention has been made in view of the above-mentioned circumstances, and a first aspect of the present invention is to provide a heat dissipation structure that can effectively cool an electronic device housed in a housing without impairing maintainability. purpose.

The second invention aims to further improve the heat dissipation efficiency by further improving the first invention.

A third invention aims to further improve the first invention to further improve the protection of electronic components by the casing, especially the protection against water.

A fourth invention aims to further improve maintainability by further improving the first invention.

A fifth invention aims to further improve the fourth invention, and to further facilitate simple inspection and maintenance of the electronic devices housed therein.

A sixth invention aims to further improve the first invention to make it easier to attach and detach the electronic device housed therein.

A seventh invention aims to further improve the sixth invention to further improve the heat dissipation of the electronic device without impairing the ease of attaching and detaching the electronic device.

An eighth invention aims to further improve the first invention and to further facilitate electrical connection and attachment/detachment of a plurality of housed electronic devices to each other.

A ninth object is to further improve the third invention to make electrical and optical connections and their attachment and detachment easier without impairing their watertightness.

[Means to solve the problem]

The first invention has a specific configuration for achieving the above-mentioned object, in which a casing for storing electronic components is configured in a cylindrical shape, and a heat conduction tube for heat radiation is arranged along the center line of the casing,
Further, a plurality of electronic devices are attached to the heat conduction tube via a member having good heat conductivity. Here, the member with good heat conductivity may be an adapter for attaching the electronic device to the heat conduction tube, or may be a part of the component of the electronic device.

In order to further improve the heat dissipation efficiency of the first invention, a second invention uses a heat pipe or a boiling cooling structure as a heat conduction tube.

In a third aspect of the present invention, in order to more completely protect the electronic device by the housing of the first aspect, the housing has a sealed structure.

In a fourth invention, in order to further improve the maintainability of the electronic device of the first invention, the cylindrical casing is configured to be detachable from the heat conduction tube.

In order to further facilitate the simple inspection and maintenance of the electronic components of the fourth invention, a fifth invention provides a structure in which the casing can be temporarily held by shifting the casing relative to the heat conduction tube in the removal direction. do.

In a sixth invention, in order to make the electronic device in the first invention easier to attach and detach, the electronic device is configured as a plug-in unit with respect to the heat conduction tube.

In a seventh invention, in order to further improve the heat dissipation of the electronic device according to the sixth invention, the electronic device is arranged radially with respect to the heat conduction tube.

In an eighth invention, in order to further facilitate electrical connection, disconnection, and restoration of the plurality of electronic devices in the first invention, the electronic devices are connected via a flexible wiring board.

A ninth aspect of the invention provides a hermetically sealed connector that combines an electric cable connector and an optical cable connector in order to facilitate electrical and optical connection, disconnection, and restoration of electronic components according to the third aspect.

[Effect]

According to the configuration of the first invention, since the plurality of electronic devices are thermally connected to the heat conduction tube, heat is efficiently radiated, and the cylindrical casing is directly involved in heat radiation. Since it is a component that does not need to be attached, it is easy to attach and detach, and maintainability is good.

When the second invention is applied to configure the heat conduction tube with a heat pipe or boiling cooling structure, the heat dissipation efficiency can be further improved.

When the third invention is applied and the cylindrical casing is made into a sealed structure, the electronic device inside can be completely protected.

By applying the fourth aspect of the invention and creating a structure in which the cylindrical casing can be attached to and detached from the heat transfer tube, maintainability is further improved.

Furthermore, by applying the fifth aspect of the present invention, if the cylindrical casing is moved in the removal direction and has a structure that can be temporarily supported, it is convenient for simple inspection and maintenance of the electronic device.

When the electronic device is made into a plug-in unit by applying the sixth invention, the electronic device can be easily attached and detached, and its maintainability is further improved.

When the electronic component is attached to the heat conduction tube by applying the seventh aspect of the invention, the heat transfer resistance related to heat radiation of the electronic device is further reduced, and the heat is efficiently radiated.

When the eighth invention is applied to electrically connect electronic devices to each other via a flexible wiring board, the maintainability of the electronic devices becomes even better.

When the ninth invention is applied and an electrical/optical integrated connector is provided, electrical and optical connections, disconnections, and restorations can be easily performed without impairing waterproof properties.

〔Example〕

FIG. 1 is a cross-sectional view showing one embodiment of a heat dissipation structure for an electronic device according to the present invention, and FIG. 2 is a longitudinal cross-sectional view of the same.

A heat conduction tube 4 is attached to the center of a cylindrical sealed casing 1, and heat generating circuit blocks 8 made up of electronic devices are arranged radially around the heat conduction tube 4. The heat generated in the heating element circuit block 8 is conducted to the heat conduction tube via the connector section 7.

The advantage of arranging the heat generating circuit blocks radially is that the space between the blocks increases as it spreads toward the outer periphery, which increases the heat transfer effect due to internal convection, covers heat conduction loss, and increases the temperature inside the heat generating blocks. The distribution can be made uniform.

When carrying out the present invention, a polygonal cylindrical member may be used instead of the cylindrical sealed housing 1. Furthermore, depending on the conditions of use, it is not always necessary to have a completely sealed structure.

The heat conduction tube 4 has a high heat conduction structure (for example, a heat pipe or boiling cooling structure). As a result, the heat generated by the heat generating circuit block 8 made up of the electronic device is connected to the heat radiation fin 5 which has a low thermal resistance and is attached to the outside of the casing with a space, thereby exchanging heat with the outside air.

Further, the sealed casing 1 is provided with a sunshade 2 at the top to suppress the influence of solar radiation when installed outdoors, and is further thermally insulated from the heat conduction tube 4 by an airtight bushing 6 having high thermal resistance. 3 is a support column, and 9 is a connector which will be described later with reference to FIGS. 11 to 13. This structure provides a closed-casing cooling method that is less affected by installation environmental conditions and has good cooling efficiency.

FIG. 3 is a cross-sectional view of an embodiment different from the above, and FIG. 4 is a longitudinal cross-sectional view taken along the line AA'.

As shown in the figure (a heat conduction tube 4 is fixed to a housing base 10, and an electronic device 8 and a protection frame 11 are mounted radially on this. Also, the lower end of the cylindrical housing outer wall 1 and the housing base 10 are connected to each other). A U-shaped gasket 12 is interposed between them as shown by the solid line. When this cylindrical case outer wall 1 is fitted over the device from above, the U-shaped gasket 12 is inserted into the protective frame 1.
For example, by making the U-shaped gasket 12 of a suitable elastic material such as rubber, the outer wall of the cylindrical casing can be pushed down halfway as shown by the imaginary line 12', or Even when it is pulled down halfway, it can be temporarily held so that it does not fall easily. When the cylindrical housing outer wall 1 is fixed to the upper part of the heat conduction tube 4 with screws 14 and flat packing 13, a U-shaped packing 12 in contact with the housing base 10 can form a sealed structure.

Reference numeral 8 designates an electronic circuit unit as an electronic device similar to that in the embodiments of FIGS. 1 and 2.

The details of its structure will be explained with reference to FIG.

The wiring board 15 is mounted with heat-generating parts such as LS116, and is composed of a metal core 17 and insulating layers 18 on both sides of the metal core 17, and the metal core 17 is made of a metal with good thermal conductivity (aluminum, copper, iron, etc.). ). At the other end of the wiring board 15 there is a connector 1 for electrically connecting other parts, devices, etc.
9 is fixed.

FIG. 6 shows a state in which a heat generating component such as the LS 116 is thermally connected to the metal core 17.

A hole is made in the mounting position of the LS116 on one side of the two insulating layers 18 sandwiching the metal core 17, and the surface of the LS116 is placed in the metal core 1.
7 , and an electrical connection (soldering or the like) is made on the surface of the wiring board 15 .

According to this embodiment, the heat generated from the LS 116 is transferred to the insulating layer 1.
Since it is transmitted directly to the metal core 17 without going through LS116
Heat can be efficiently radiated through the metal core 17. Note that according to this embodiment, the LS 116 has the effect of suppressing the mounting height of the wiring board. Furthermore, not only the 5116 but also other components can be similarly mounted.

Details of the components connecting the metal core 17 shown in FIGS. 5 and 6 to the heat conduction tube 4 will be explained with reference to FIG. 7.

A board 15 on which a heat generating component such as an LSI is mounted has an insulator 18 having a circuit pattern on its surface or inside, and a metal core 17.
It is formed by The metal core is aluminum, iron,
It is made of a metal with good thermal conductivity, such as copper. A connector 19 is fixed on the board, while a flexible board side connector 21 is attached to the flexible board 20.

The flexible board side connector is fixed to the heat conduction tube 4 constituting the main heat radiation path, and by fitting the connector 19 and the flexible board side connector 21, the board 15
and the flexible substrate 20 are electrically connected. On the surface opposite to the mounting surface of the connector 19, a heat conduction member 22 is fixed to the substrate with rivets 23 and fixed to the heat transfer conduit 4 with screws 24. Heat conductive member 22. The rivet 23 and screw 24 are made of a metal with good thermal conductivity, such as aluminum.

According to this embodiment, the heat generated by the heat generating components mounted on the board is carried by the metal core to the end of the board, and the rivet 23. Heat conduction member 22. The heat is efficiently conducted to the heat transfer tube 4 via the screw 24. Note that fixing the substrate 15 and the heat conductive member 22 or the heat conductive tube 4 and the heat conductive member 22 does not necessarily need to use rivets or screws. It may be a method.

FIG. 8 shows another embodiment of the components that provide thermal connection from the substrate to the main heat dissipation path. The metal core 17 is exposed from the edge of the substrate 15 and is coated with an adhesive 2 with good thermal conductivity.
5, it is in direct contact. According to this embodiment, since it is not necessary to use heat conductive members, rivets, etc., it is possible not only to suppress an increase in the number of parts but also to reduce the number of assembly steps.

FIG. 9 shows an embodiment in which thermal connection is made using radiation fins without using a metal core. One end of the radiation fin 26 mounted on the board 15 protrudes longer than the end of the board, and is connected to the heat conduction tube 4 by a screw 24. Therefore, not only can heat radiation unique to the radiation fins be performed using air convection, but the heat radiation effect is further improved by heat conduction to the heat conduction tube 4 through the screws.

FIG. 10 (Δ) is a schematic diagram showing the mutual electrical connection of the electronic circuit units 8 in a further different embodiment from the above.

In FIG. 10(A), in order to simplify the drawing and make it easier to read, electrical connection components are extracted and drawn schematically, and components related to heat conduction are omitted.

This component provides an electrical interface between the electronic circuit packages 8 housed inside the casing, and connects the electronic circuit packages 8 and the connectors 21 that fit with each other using a flexible wiring board 20. There is. At both ends of the flexible wiring board 20 are provided connectors 27, 27' that can connect the ends, and by connecting the end connectors 27, 27', a loop of the flexible wiring board 20 is formed. FIG. 10(A) shows another example of the flexible wiring board 20 loop, in which one side of the flexible wiring board 20 of the connector 21 that fits with the electronic circuit package 8 is cut out. The connector 21 that fits into the electronic circuit package 8 is fixed to the central axis of the housing after being soldered to the flexible wiring board 20, and the connectors 27 and 27' at both ends of the flexible wiring board 20 are also connected to each other to form a wiring loop. is formed. The central axis of the housing is cylindrical, and the interface between the electronic circuit package 8 connected to this requires wiring along the cylinder. Connection can also be made directly between electronic circuit packages using connectors provided on the electronic circuit board. Furthermore, by forming a loop with the wiring, the connection distance between the electronic circuit packages 8 is shortened, which is advantageous in terms of circuit configuration due to less signal delay, and pattern accommodation on the flexible wiring board 20 is made uniform. The pattern accommodating property is good.Although the connection in the configuration shown in FIG. Connections can be made between the circuit packages 8. FIG. 10(B) is a developed view of the flexible circuit board 20.
When connecting the electronic circuit package 8 to the heat conduction tube, heat is radiated by transmitting heat from the electronic circuit to the heat conduction tube.In order to widen the heat transfer area at this time, the connection point between the electronic circuit package 8 and the heat conduction tube is The area of the peripheral substrate is reduced. Thereby, the amount of heat in the electronic circuit package 8 can be effectively transferred to the heat conduction tube.

In order to connect the electronic circuit unit 8 as an electronic device housed in the cylindrical housing 1 as described above to an external circuit, a connector shown in FIG. 11 is provided. Although the installation location of this connector can be selected arbitrarily, for example, in the case of FIG. 4, it is desirable to provide it on the housing base 10.

As shown in Figure 11, electricity is installed on the bottom of the cylindrical housing.

The connector block section 28 on which the light is mounted is connected to the O ring 3.
Attach airtight via 4. Connector block part 28
consists of an electrical connector block 29 and an optical connector block 30, and the electrical connector block is equipped with electrical connector terminals 31 at a high density, for example, at a pitch of 1.27 mm, and the optical connector block is equipped with optical connector terminals 32. are mounted at a high density with a pitch of 2 mm, for example.

On the other hand, the sealed composite connector 9, which is connected from the outside, has an electrical connector 29' and an optical connector connector 30' arranged in positions facing the connector block part 28, respectively, and similarly electrical connector terminals 31' and optical connectors 29' and 30'. A connector terminal 32' is mounted. The sealed composite connector 9 is guided on its outer diameter by the connector block parts 28 and 28', and is pressed against the cylindrical housing bottom part 1 by the mating screw 33, and is
The ring 34' maintains the hermeticity of the connector section. Further, the sealed composite connector 9 is provided with a rubber hood 35, which maintains the sealing performance between the cable and the connector portion.

Here, FIG. 12 (A
) and (B). In this figure, (A) is an enlarged cross-sectional view of the main part of the connector on the electronic device side, and (B) is the main part of the connector on the connection cord side.

As previously mentioned, the connector block portions 28.28' are positioned with respect to each other with outer diameter guides, and the electrical connector blocks 28.29' and optical connector blocks 30.30' are roughly positioned. Next, electrical connector terminal 3L
31' are engaged, the optical connector terminals 30 and 30' are precisely positioned, and the optical connector terminals are connected with high precision through the precisely machined optical connector terminal hole 36. In addition, the characteristics of the connection of the optical connector terminal are stabilized by applying a pressing force using a spring 37.

In this embodiment, the reason why the electrical terminal block and the optical connector block are provided separately is that they can be constructed with higher precision and at a lower cost than if they were formed integrally.

That is, in the optical connector block 30, which requires a fitting accuracy of about 1 μm or less for connector terminals, the holes 36 need to be finished with high precision, whereas a fitting accuracy of about 0.1 mm for electrical connector terminals is allowed. In this way, since the electrical connector block 29 does not require high precision, it is much more advantageous to provide individual blocks.

If this mounting method is used in a telephone exchange with about 400 subscribers, it is estimated that about 800 electrical terminals will be required, and if optical subscribers are also taken into account, 30 to 50 optical terminals will be required. If the input/output wiring processing structure of this embodiment in which the number of terminals is arranged at the above pitch is used, the electrical connector block 13CTA
, the optical connector block is 2C11! It is possible to provide an extremely high-density sealed input/output wiring processing structure.

Next, another example of input/output wiring processing will be described using FIG. 13. In this example, the sealing performance is further improved.

It has an input/output wiring processing structure that achieves high wiring density.
A feature is that a directional conductive rubber 38 and an optical waveguide body 39 are used. Electrical connector terminal 31 on the bottom part 1 of the cylindrical housing
are connected to the directional conductive rubber 38 with high density, and the optical connector terminals 32 are similarly connected to the waveguide body 39 with high density. On the other hand, the cloth-closed composite connector 9 also includes an electrical connector terminal 31' and an optical connector terminal 32' mounted on an electrical connector block 29' and an optical connector block 30'.

When the sealed composite optical connector 9 is connected to the bottom surface 1 of the cylindrical housing with screws or the like, the electrical terminals 31-31' are connected via the directional conductive rubber 38 by the pressing force of the electrical terminals 31'. . At the same time, the optical connector terminals 32-32' are also connected via the waveguide body 39, but if the tip of the optical connector terminal 32' is processed with a ball lens, it is expected that a more stable connection will be made. .

In this way, in this embodiment that utilizes the directional conductive rubber 38 and the waveguide body 39, the inside and outside of the cylindrical casing are completely separated, so the sealing performance is greatly improved, and the Since the output terminals are connected via the directional conductive rubber and the waveguide body, it is possible to achieve a significantly high density mounting of the input/output terminals.

〔Effect of the invention〕

As explained above, according to the heat dissipation structure for an electronic device according to the present invention, it is possible to effectively cool down the heat generated from the electronic device housed in the housing, and at the same time, there is no possibility that the maintainability of the electronic device will be impaired. There is no

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing one embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view of the above-mentioned embodiment. FIG. 3 is a cross-sectional view of an embodiment different from the above, and FIG. 4 is a longitudinal cross-sectional view thereof. FIG. 5 is a perspective view of an electronic circuit unit as an electronic device used in each of the embodiments described above, and FIG. 6 is a sectional view of the electronic circuit unit. FIGS. 7 to 9 are cross-sectional views showing the connection structure between an electronic device and a heat conduction tube in an embodiment of the present invention, respectively. FIG. 10 shows electrical connections between electronic devices in one embodiment of the present invention, (8) is a schematic perspective view, and (B
) is also a developed view. Fig. 11 is a partial cross-sectional view showing an embodiment of a connector for connecting an electronic device inside a cylindrical housing and external wiring, and Fig. 12 (A) and (B) are enlarged cross-sectional views of the main parts thereof. be. FIG. 13 is a partial sectional view showing a different embodiment of the connector from the above. 1... Cylindrical sealed casing as an example of a cylindrical casing, 2.
... Sunshade, 3... Support, 4... Heat conduction pipe, Death...
External heat radiation fin, 6... Airtight bushing, 7... Cooling connector, 8... Electronic circuit unit, 9... Sealed connector, 10... Housing base, 11... Protection frame,
12... U-shaped packing, 13... Flat packing, 1
4... Sealing screw, 15... Wiring board, 16... LS
I, 17... Metal core, 18... Insulating layer, 19...
Wiring board connector, 20...Flexible board, 21.
...Flexible board connector, 22... Heat conduction member, 23... Rivet, 24... Screw, 25... Adhesive, 26... Board radiation fin, 27... Loop connector, 28・・・Connector Pro Nk, 29...
Electrical connector block, 30... Optical connector block, 31... Electrical connector terminal, 32... Optical connector terminal, 33... Gun mating, 34... 0 ring, 3
5...Rubber hood, 36...Optical connector terminal hole, 3
7... Spring, 38... Directional conductive rubber, 39...
Optical waveguide body.

Claims (9)

[Claims] 1. a cylindrical casing; a heat transfer tube for heat dissipation disposed along the central axis of the cylindrical casing, and a plurality of electronic devices connected to the heat transfer tube; A heat dissipation structure for an electronic device, characterized in that it is attached through. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the heat conduction tube for heat dissipation is a heat pipe or a boiling cooling structure. 3. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the cylindrical casing is a member with a sealed structure. 4. According to claim 1, the cylindrical casing having a sealed structure has a structure that can be attached to and detached from the heat transfer tube while the electronic device remains attached to the heat transfer tube. Heat dissipation structure of the electronic device described. 5. The cylindrical casing having a sealed structure is provided with a support member that can temporarily hold the cylindrical casing when the cylindrical casing is released from the heat transfer tube and moved in the removal direction with respect to the heat transfer tube. The heat dissipation structure for an electronic device according to claim 4, characterized in that: 6. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the plurality of electronic devices are arranged radially with respect to the heat conduction tube and are configured as a plug-in unit with respect to the heat conduction tube. 7. The electronic device has a structure in which an electronic component that generates heat during operation is attached to a heat conductive member, and the heat conductive member is thermally connected to the heat conduction tube. The heat dissipation structure for an electronic device according to claim 6. 8. The plurality of electronic devices are electrically connected to each other within the cylindrical casing, and the connection is made via a flexible wiring board arranged in a loop. A heat dissipation structure for an electronic device according to claim 1. 9. The above-mentioned electronic device has a structure in which it is connected to a circuit outside the case through a connector attached to a case with a sealed structure, and the above-mentioned connector is a sealed lump-sum connection that combines an electric cable connection and an optical cable connector. The heat dissipation structure for an electronic device according to claim 3, wherein the heat dissipation structure is a connector.