JPS6061790U - High density pattern cooling device - Google Patents

High density pattern cooling device

Info

Publication number
JPS6061790U
JPS6061790U JP15284183U JP15284183U JPS6061790U JP S6061790 U JPS6061790 U JP S6061790U JP 15284183 U JP15284183 U JP 15284183U JP 15284183 U JP15284183 U JP 15284183U JP S6061790 U JPS6061790 U JP S6061790U
Authority
JP
Japan
Prior art keywords
high density
cooling device
density pattern
heat radiating
pattern cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15284183U
Other languages
Japanese (ja)
Inventor
川田　淳一郎
川嶋　三郎
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP15284183U priority Critical patent/JPS6061790U/en
Publication of JPS6061790U publication Critical patent/JPS6061790U/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は、本考案に係る高密度パターンの冷
却装置で用いられるプリント板の一例を示す斜視構成図
及び側面構成図、第３図及び第４図は本考案の一実施例
による高密度パターンの冷却装置を概念的に示す平面構
成図及び側面構成図、第５図は本考案の他の実施例に従
った概念的な斜視構成図である。 １・・・・・・金属ベース材、２・・・・・・導体パタ
ーン、３・・・・・・放熱部、４，５・・・・・・ヒー
トパイプ。1 and 2 are perspective and side configuration diagrams showing an example of a printed board used in a high-density pattern cooling device according to the present invention, and FIGS. 3 and 4 are an embodiment of the present invention. FIG. 5 is a conceptual perspective view of a high-density pattern cooling device according to another embodiment of the present invention. 1... Metal base material, 2... Conductor pattern, 3... Heat dissipation section, 4, 5... Heat pipe.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）・金属ベース材上に絶縁下に導体パターンを高密
度に形成したプリント板において、該プリント板に放熱
部を設け、該放熱部に接触配置したヒートパイプを具備
してなる高密度パターンの冷却装置。(1) - In a printed board in which a conductor pattern is formed at high density under insulation on a metal base material, the printed board is provided with a heat radiating part, and a high density pattern is provided with a heat pipe placed in contact with the heat radiating part. cooling system. （２）前記プリント板の複数枚を各々の放熱部を介して
上記ヒートパイプに連設するようにした実用新案登録請
求の範囲（１）の高密度パターンの冷却装置。(2) The high-density pattern cooling device according to claim (1), wherein a plurality of the printed boards are connected to the heat pipe via respective heat radiating parts.
JP15284183U 1983-09-30 1983-09-30 High density pattern cooling device Pending JPS6061790U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15284183U JPS6061790U (en) 1983-09-30 1983-09-30 High density pattern cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15284183U JPS6061790U (en) 1983-09-30 1983-09-30 High density pattern cooling device

Publications (1)

Publication Number Publication Date
JPS6061790U true JPS6061790U (en) 1985-04-30

Family

ID=30338316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15284183U Pending JPS6061790U (en) 1983-09-30 1983-09-30 High density pattern cooling device

Country Status (1)

Country Link
JP (1) JPS6061790U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110892A (en) * 1989-09-26 1991-05-10 Hitachi Ltd Heat-dissipating structure of electronic apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589390A (en) * 1981-07-08 1983-01-19 住友電気工業株式会社 Method of producing printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589390A (en) * 1981-07-08 1983-01-19 住友電気工業株式会社 Method of producing printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110892A (en) * 1989-09-26 1991-05-10 Hitachi Ltd Heat-dissipating structure of electronic apparatus

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