CN114286502A - Heat radiation structure, underwater propeller and water carrying device of control circuit board - Google Patents
Heat radiation structure, underwater propeller and water carrying device of control circuit board Download PDFInfo
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- CN114286502A CN114286502A CN202111590752.4A CN202111590752A CN114286502A CN 114286502 A CN114286502 A CN 114286502A CN 202111590752 A CN202111590752 A CN 202111590752A CN 114286502 A CN114286502 A CN 114286502A
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- control circuit
- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The disclosure relates to a heat dissipation structure of a control circuit board, an underwater propeller and a water carrying device. The heat dissipation structure of the control circuit board comprises the control circuit board and a mounting seat, wherein a mounting cavity is formed in the mounting seat, and an opening for cooling media to enter the mounting cavity is formed in the mounting seat; the heat radiation structure further includes: the heat conduction part comprises a first heat conduction part and a second heat conduction part which are connected, the first heat conduction part is in heat conduction connection with the control circuit board, and the first heat conduction part and the control circuit board are arranged in the sealing cavity in a sealing mode; the second heat conduction part is located outside the sealing cavity and in the installation cavity, and the second heat conduction part exchanges heat with the cooling medium entering the installation cavity, so that the control circuit board can be well cooled, and the control reliability of the control circuit board is improved.
Description
Technical Field
The utility model relates to a delivery equipment technical field on water especially relates to a control circuit board's heat radiation structure, underwater propulsor and delivery device on water.
Background
In existing water vehicles, such as surfboards, standing paddles, etc., the control circuit board for controlling the propeller is typically located on the manned side of the paddle. During specific implementation, the manned side of the paddle board is provided with a battery box for accommodating batteries, and the control board is generally installed in the battery box. However, with the development of technology, people have higher and higher requirements on the performance of water carrying devices, and the power of the propeller is also increased continuously. Because the control circuit board integrates more power devices, the control circuit board in the battery box generates heat seriously during the operation of the carrying device, which not only leads to the increase of the power consumption of the propeller, but also reduces the control reliability of the control circuit board.
Disclosure of Invention
In order to solve the technical problem, the present disclosure provides a heat dissipation structure of a control circuit board, an underwater propeller and a water carrying device.
In a first aspect, the present disclosure provides a heat dissipation structure of a control circuit board, including a control circuit board and a mounting base having a mounting cavity therein, the mounting base being provided with an opening through which a cooling medium enters the mounting cavity;
the heat dissipation structure further comprises a heat conduction piece and a sealing piece with a sealing cavity inside, the sealing piece is located in the installation cavity and comprises a first heat conduction part and a second heat conduction part which are connected, the first heat conduction part is in heat conduction connection with the control circuit board, and the first heat conduction part and the control circuit board are arranged in the sealing cavity in a sealing mode; the second heat conduction part is located outside the sealed cavity and in the installation cavity, and the second heat conduction part exchanges heat with a cooling medium entering the installation cavity.
Optionally, the control circuit board includes a substrate and a heating element disposed on the substrate, the heat conducting member includes a heat dissipating plate, and the heat dissipating plate is disposed on a surface of the substrate away from the heating element.
Optionally, the heat dissipation plate includes a main body portion connected to the substrate, and an extension portion extending beyond an outer side of an edge of the substrate, a partial structure of the extension portion and the main body portion are located in the sealing cavity and form a first heat conduction portion, and a portion of the extension portion located outside the sealing cavity forms a second heat conduction portion.
Optionally, a partial structure of the protruding portion extends in the thickness direction of the substrate.
Optionally, the sealing element is made of a potting adhesive, and the first heat conduction portion and the control circuit board are both coated in the potting adhesive.
Optionally, the opening is formed in a wall of the installation cavity, which is not filled with the potting adhesive.
Optionally, a heat conductive silicone grease is further interposed between the substrate and the heat dissipation plate.
Optionally, a through hole is formed in a position, corresponding to the heating element, on the substrate, a heat conducting metal covers one surface of the substrate, which is away from the heating element, and the heat conducting metal covers the through hole and is in heat conducting contact with the heat dissipation plate so as to transfer heat of the heating element to the heat dissipation plate through the heat conducting metal.
Optionally, a heat conductive silicone grease is interposed between the heat conductive metal and the heat dissipation plate to make the heat conductive metal in heat conductive contact with the heat dissipation plate.
Optionally, a positioning stop block is arranged on the cavity wall of the mounting cavity, the positioning stop block includes a stop portion clamped between the panel surface of the control circuit board and the cavity wall, and the stop portion is used for limiting displacement of the control circuit board along the thickness direction of the control circuit board.
Optionally, the positioning block further comprises a supporting portion connected to one side of the blocking portion, a positioning portion is arranged on the first heat conducting portion of the heat dissipation plate, and the positioning portion abuts against the side edge of the control circuit board, which deviates from the positioning block, so that the control circuit board is pressed on the supporting portion.
Optionally, the mounting seat includes the casing, and the casing includes the bottom plate and establishes first wallboard and the second wallboard on the bottom plate, still is equipped with first baffle and second baffle in the casing, and first wallboard, first baffle, second wallboard, second baffle end to end are in order to form the installation cavity.
In a second aspect, the present disclosure provides an underwater propeller, including a propeller main body and the heat dissipation structure of the control circuit board, wherein the control circuit board is hermetically disposed in a sealing member of the heat dissipation structure, a mounting seat is connected to the propeller main body, and the mounting seat is further used for connecting with a water carrying device.
In a third aspect, the present disclosure provides an aquatic carrying device, including a battery, a carrying portion and the above-mentioned underwater propeller, wherein the battery is electrically connected with the underwater propeller; the battery is arranged on the manned side of the bearing part, and the mounting seat in the underwater propeller is arranged on the water inlet side of the bearing part.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:
the utility model provides a control circuit board's heat radiation structure, underwater propulsor and delivery device on water, through the first heat-conducting portion and the control circuit board seal with heat-conducting piece in sealed intracavity, the second heat-conducting portion of heat-conducting piece exposes the sealing member and carries out the heat exchange with coolant, the heat that produces on the control circuit board like this will be followed heat-conducting piece by first heat-conducting portion transmission to second heat-conducting portion to dispel the heat through carrying out the heat exchange with coolant, the radiating effect to control circuit board is better.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic partial cross-sectional view of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure;
fig. 2 is a schematic structural diagram of a control circuit board according to an embodiment of the disclosure;
FIG. 3 is an enlarged view of a portion of FIG. 1 at A;
fig. 4 is another schematic partial cross-sectional view of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure;
fig. 5 is a schematic partial cross-sectional view of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure;
fig. 6 is a partial enlarged view of fig. 5 at B;
fig. 7 is a schematic view of a connection structure between a control circuit board and a heat dissipation plate according to an embodiment of the disclosure;
fig. 8 is a schematic structural diagram of an underwater propeller according to an embodiment of the present disclosure.
100, controlling a heat dissipation structure of the circuit board; 10. a mounting seat; 20. a mounting cavity; 21. an opening; 22. an end cap; 30. a seal member; 40. a control circuit board; 41. a substrate; 42. a heating element; 50. a heat conductive member; 51. a heat dissipation plate; 511. a main body portion; 512. a protruding portion; 513. a first heat-conducting portion; 514. a second heat conduction portion; 52. heat-conducting silicone grease; 60. positioning a stop block; 61. a stopper portion; 62. a positioning part; 63. a support portion; 70. a base plate; 71. a first wall panel; 72. a second wall panel; 73. a first baffle plate; 74. a second baffle; 75. a pressing part;
200. an underwater propeller; 201. a propeller body.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
Examples
Fig. 1 is a schematic partial cross-sectional view of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure.
The embodiment provides a heat dissipation structure of a control circuit board. It should be noted that, in the present embodiment, the control circuit board is used to control the propeller of the water vehicle, and the control circuit board may be located under water as a whole. Of course, the control circuit board may also be used in other devices, and the description thereof is similar to that of the case where the control circuit board is used in other devices, and is not repeated below.
Referring to fig. 1, a heat dissipation structure 100 of a control circuit board includes a control circuit board 40 and a mounting base 10 having a mounting cavity 20 therein, wherein an opening 21 for a cooling medium to enter into the mounting cavity 20 is formed in the mounting base 10;
the heat dissipation structure 100 further includes a heat conduction member 50 and a sealing member 30 having a sealed cavity therein, the sealing member 30 is located in the mounting cavity 20, the heat conduction member 50 includes a first heat conduction portion 513 and a second heat conduction portion 514 connected to each other, the first heat conduction portion 513 is connected to the control circuit board 40 in a heat conduction manner, and the first heat conduction portion 513 and the control circuit board 40 are hermetically disposed in the sealed cavity; the second heat conduction portion 514 is located outside the sealed cavity and inside the mounting cavity 20, and the second heat conduction portion 514 exchanges heat with the cooling medium entering the mounting cavity 20.
In the above-described embodiment, the first heat conduction portion 513 of the heat conduction member 50 and the control circuit board 40 are sealed in the sealed cavity, and the second heat conduction portion 514 of the heat conduction member 50 is exposed from the sealing member 30 and exchanges heat with the cooling medium, so that the heat generated in the control circuit board 40 is transferred from the first heat conduction portion 513 of the heat conduction member 50 to the second heat conduction portion 514, and is dissipated by exchanging heat with the cooling medium, thereby achieving a good heat dissipation effect on the control circuit board 40.
Fig. 2 is a schematic structural diagram of a control circuit board according to an embodiment of the disclosure, and fig. 3 is a partially enlarged view of a portion a of fig. 1.
Referring to fig. 2, the control circuit board 40 includes a substrate 41 and a heating element 42 disposed on the substrate 41, where the heating element 42 is a component that generates heat seriously during operation. Such as high power capacitors, high power IGBTs, etc. The substrate 41 may be made of a material with a high thermal conductivity, and the higher the thermal conductivity, the better the thermal conductivity; in this embodiment, the substrate 41 may be a high thermal conductivity silicone sheet with a thermal conductivity of 6W and a thickness of 0.5 mm. It will be appreciated that other commonly used high thermal conductivity materials can be used for the substrate 41.
The heat conducting member 50 may include a heat dissipating plate 51, and the heat dissipating plate 51 is disposed on a surface of the substrate 41 facing away from the heat generating element 42. The heat dissipation plate 51 may be made of a metal having a high thermal conductivity, for example, an aluminum plate.
In order to transfer heat on the control circuit board 40 to the cooling medium, the heat dissipation plate 51 may include a main body portion 511 attached to the substrate 41, and a protruding portion 512 extending beyond the outer side of the edge of the substrate 41, and a part of the structure of the protruding portion 512 protrudes out of the sealed cavity and exchanges heat with the cooling medium entering the mounting cavity 20. At this time, the partial structure of the protruding portion 512 and the main body portion 511 are located in the sealed cavity and form the first heat-conducting portion 513, and the portion of the protruding portion 512 located outside the sealed cavity forms the second heat-conducting portion 514.
In order to improve the heat dissipation efficiency in a limited space, it is conceivable to increase the heat dissipation area of the heat dissipation plate 51, and it is conceivable to extend a partial structure of the extension portion 512 in the thickness direction H of the substrate 41. For example, referring to fig. 2, the extending portion 512 is bent at a substantially middle portion thereof, and the bent portion extends in the thickness direction H of the substrate 41, thereby increasing the extension length of the heat dissipation plate 51.
In the embodiment of the present disclosure, the sealing element 30 may be made of a potting adhesive, and the control circuit board 40 and the first heat conducting portion 513 are both covered in the potting adhesive. During actual installation, the control circuit board 40 and the heat dissipation plate 51 may be fixed in the installation cavity 20, then liquid potting adhesive is poured into the installation cavity 20, after the potting adhesive is solidified, a sealed cavity may be formed in the solid potting adhesive, and the sealed cavity may just cover the main body portion 511 of the control circuit board 40 and the heat dissipation plate 51. It should be noted that the pouring sealant can also seal part of the structure of the protruding portion 512.
On one hand, the pouring sealant can better seal the control circuit board 40 to prevent the cooling medium from entering the control circuit board 40, and on the other hand, the pouring sealant also has certain heat conductivity, so that heat on the control circuit board 40 is more favorably transferred to the cooling medium. It should be understood that the sealing member 30 is described as an example of the potting adhesive, but the present disclosure is not limited thereto, and the sealing member 30 may be a hollow metal member as long as the control circuit board 40 and the main body portion 511 of the heat dissipation plate 51 can be sealed in the sealing cavity.
Fig. 3 is a partially enlarged view of a portion a of fig. 1.
Referring to fig. 2 and 3, in order to further improve the thermal conductivity of the thermal conductor 50, a thermal grease 52 may be interposed between the substrate 41 and the heat sink 51. The heat conductive silicone grease 52 has a certain viscosity before solidification, and can be used to fix the heat dissipation plate 51 and the substrate 41.
As mentioned above, the thermal conductive member 50 is connected to the control circuit board 40 in a thermal conductive manner, so that the thermal conductive member 50 is directly contacted with the control circuit board 40, and the heat of the control circuit board 40 is transferred to the thermal conductive member 50, or the thermal conductive member 50 is connected to the control circuit board 40 through a thermal conductive metal or the like.
In some examples, a through hole is disposed on the substrate 41 at a position corresponding to the heat generating element 42, a heat conducting metal covers a surface of the substrate 41 facing away from the heat generating element 42, and the heat conducting metal covers the through hole and is in heat conducting contact with the heat dissipation plate 51 to transfer heat of the heat generating element 42 to the heat dissipation plate 51 through the heat conducting metal. The heat conductive metal may be in heat conductive contact with the heat dissipation plate 51, and specifically, the heat conductive metal may be in direct contact with the heat dissipation plate 51; alternatively, the heat conductive silicone grease 52 may be interposed between the heat conductive metal and the heat dissipation plate 51, so that the heat conductive metal is in heat conductive contact with the heat dissipation plate 51, specifically, the heat conductive metal is in contact with the heat conductive silicone grease 52, and then the heat is transferred to the heat dissipation plate 51 by the heat conductive silicone grease 52.
Fig. 4 is another schematic partial cross-sectional view of a heat dissipation structure of a control circuit board according to an embodiment of the disclosure, fig. 5 is a schematic partial cross-sectional view of another heat dissipation structure of a control circuit board according to an embodiment of the disclosure, and fig. 6 is a partial enlarged view of a portion B of fig. 5.
The structure of the mounting cavity 20 of the present embodiment is explained below.
Referring to fig. 4 and 5, the mounting seat 10 includes a housing, the housing includes a bottom plate 70 and a first wall plate 71 and a second wall plate 72 provided on the bottom plate 70, a first baffle plate 73 and a second baffle plate 74 are further provided in the housing, and the first wall plate 71, the first baffle plate 73, the second wall plate 72, and the second baffle plate 74 are connected end to form the mounting cavity 20. It will be appreciated that the aforementioned potting compound is poured into the mounting cavity 20, with the top end of the potting compound being shown in phantom in fig. 4.
In addition, in order to facilitate the cooling medium to enter the installation cavity 20, an opening 21 is provided on the cavity wall of the installation cavity 20 not filled with the potting adhesive as a liquid inlet. For example, the opening 21 may be disposed at the top of the mounting cavity 20, or may be disposed on the sidewall of the mounting cavity 20.
It should be noted that, the mounting base 10 is generally used for connecting with a bearing part of a water carrying device, and when the opening 21 is arranged at the top of the mounting cavity, an end cover 22 can be arranged at the top of the mounting cavity 20 to cover the opening 21, and the end cover 22 is used for fixedly connecting with the bearing part. At this time, external water may pass through the fitting gap between the end cap 22 and the edge of the opening 21 of the mounting cavity 20, into the opening 21, and further into the inside of the mounting cavity 20.
Fig. 7 is a schematic view of a connection structure between a control circuit board and a heat dissipation plate according to an embodiment of the disclosure.
Referring to fig. 5, 6, and 7, the cavity wall of the mounting cavity 20 is provided with a positioning stopper 60, the positioning stopper 60 includes a stopper portion 61 interposed between the plate surface of the control circuit board 40 (substrate 41) and the cavity wall, and the stopper portion 61 is configured to limit displacement of the control circuit board 40 (substrate 41) in the thickness direction of the control circuit board 40 (substrate 41).
In some examples, a position on the cavity wall of the installation cavity 20 corresponding to the bottom end of the heat dissipation plate 51 is further provided with a clamping limiting portion (not shown), a position corresponding to the top end is further provided with a pressing portion 75, the bottom end of the heat dissipation plate 51 can be supported on the clamping limiting portion, and the pressing portion 75 presses the heat dissipation plate 51 between the pressing portion 75 and the clamping limiting portion from the top of the heat dissipation plate 51. Thus, the heat radiating plate 51 can be fixed with respect to the mounting cavity 20.
In addition, the positioning block 60 further includes a supporting portion 63 connected to one side of the stopping portion 61, a positioning portion 62 is disposed on the extending portion 512 of the heat dissipation plate 51, that is, the first heat conduction portion 513, and the positioning portion 62 is pressed against a side edge of the control circuit board 40 (the substrate 41) away from the positioning block 60, so as to press the control circuit board 40 (the substrate 41) against the supporting portion 63.
In the heat dissipation structure 100 of the control circuit board provided in this embodiment, the first heat conduction portion of the heat conduction member 50 and the control circuit board 40 are sealed in the sealed cavity, and the second heat conduction portion of the heat conduction member 50 is exposed out of the sealing member 30 and exchanges heat with the cooling medium, so that the heat generated on the control circuit board 40 is transferred from the first heat conduction portion of the heat conduction member 50 to the second heat conduction portion, and is dissipated by exchanging heat with the cooling medium, and the heat dissipation effect on the control circuit board 40 is good.
Fig. 8 is a schematic structural diagram of an underwater propeller according to an embodiment of the present disclosure.
Referring to fig. 8, the present embodiment further provides an underwater propeller 200, which includes a propeller main body 201 and the heat dissipation structure 100 of the control circuit board, wherein the control circuit board 40 is hermetically disposed in the sealing member 30 of the heat dissipation structure, the mounting base 10 is connected to the propeller main body 201, and the mounting base 10 is further used for connecting with a bearing portion in a water vehicle.
The embodiment further provides an aquatic carrying device, which comprises a battery, a carrying part and the underwater propeller 200, wherein the battery is electrically connected with the underwater propeller 200; the battery is arranged on the manned side of the carrying part, and the mounting seat 10 in the underwater propeller 200 is arranged on the water inlet side of the carrying part. Like this, the battery setting is on water, and control circuit board 40 sets up under water, and control circuit board 40 keeps away from the battery as the source that generates heat, is favorable to control circuit board 40's heat dissipation.
It should be noted that, the heat dissipation structure of the control circuit board in this embodiment has been described in detail in the foregoing, the structures of the heat dissipation structure are the same, and the same or similar technical effects can be brought.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A heat dissipation structure of a control circuit board is characterized by comprising the control circuit board and a mounting seat with a mounting cavity inside, wherein an opening for a cooling medium to enter the mounting cavity is formed in the mounting seat;
the heat dissipation structure further comprises a heat conduction piece and a sealing piece with a sealing cavity inside, the sealing piece is located in the installation cavity and comprises a first heat conduction part and a second heat conduction part which are connected, the first heat conduction part is in heat conduction connection with the control circuit board, and the first heat conduction part and the control circuit board are arranged in the sealing cavity in a sealing mode; the second heat conduction part is located outside the sealing cavity and in the mounting cavity, and the second heat conduction part exchanges heat with a cooling medium entering the mounting cavity.
2. The heat dissipation structure of claim 1, wherein the control circuit board comprises a substrate and a heat generating element disposed on the substrate, and the heat conducting member comprises a heat dissipation plate disposed on a surface of the substrate facing away from the heat generating element.
3. The heat dissipating structure of a control circuit board according to claim 2, wherein the heat dissipating plate includes a main body portion attached to the substrate, and an extension portion extending beyond an outer side of an edge of the substrate, a partial structure of the extension portion and the main body portion being located in the sealed cavity and forming the first heat conducting portion, and a portion of the extension portion located outside the sealed cavity forming the second heat conducting portion.
4. The heat dissipation structure of a control circuit board according to claim 3, wherein a partial structure of the protruding portion extends in a thickness direction of the substrate.
5. The heat dissipation structure of claim 3, wherein the sealing member is made of a potting adhesive, and the first heat conduction portion and the control circuit board are both encapsulated in the potting adhesive.
6. The heat dissipation structure of the control circuit board as claimed in claim 5, wherein the opening is formed on a wall of the mounting cavity not filled with the potting adhesive.
7. The heat dissipation structure of a control circuit board according to any one of claims 2 to 6, wherein a heat conductive silicone grease is further interposed between the substrate and the heat dissipation plate.
8. The heat dissipation structure of the control circuit board as claimed in any one of claims 2 to 6, wherein a through hole is formed in a position of the substrate corresponding to the heat generating element, and a heat conductive metal covers a surface of the substrate facing away from the heat generating element, and covers the through hole and is in heat conductive contact with the heat dissipation plate, so as to transfer heat of the heat generating element to the heat dissipation plate through the heat conductive metal.
9. The heat dissipation structure of a control circuit board according to claim 8, wherein a heat conductive silicone grease is interposed between the heat conductive metal and the heat dissipation plate so that the heat conductive metal is in heat conductive contact with the heat dissipation plate.
10. The heat dissipation structure of the control circuit board according to any one of claims 1 to 6, wherein a positioning stopper is disposed on a cavity wall of the mounting cavity, the positioning stopper includes a stopping portion interposed between a board surface of the control circuit board and the cavity wall, and the stopping portion is configured to limit displacement of the control circuit board in a thickness direction of the control circuit board.
11. The heat dissipating structure of the control circuit board according to claim 10, wherein the positioning block further comprises a supporting portion connected to one side of the blocking portion, and a positioning portion is disposed on the first heat conducting portion of the heat dissipating plate and abuts against a side edge of the control circuit board facing away from the positioning block, so as to press the control circuit board against the supporting portion.
12. The heat dissipation structure of the control circuit board as claimed in any one of claims 3 to 6, wherein the mounting base comprises a housing, the housing comprises a bottom plate and a first wall plate and a second wall plate which are arranged on the bottom plate, a first baffle plate and a second baffle plate are further arranged in the housing, and the first wall plate, the first baffle plate, the second wall plate and the second baffle plate are connected end to form the mounting cavity.
13. An underwater propeller comprising a propeller body and a heat dissipating structure of a control circuit board according to any one of claims 1 to 12, wherein the control circuit board is sealingly disposed in a seal of the heat dissipating structure, and the mount is attached to the propeller body.
14. A water craft comprising a battery, a load bearing portion and an underwater vehicle as claimed in claim 13, said battery being electrically connected to said underwater vehicle; the battery is arranged on the manned side of the bearing part, and the mounting seat in the underwater propeller is arranged on the water inlet side of the bearing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111590752.4A CN114286502B (en) | 2021-12-23 | 2021-12-23 | Heat radiation structure of control circuit board, underwater propeller and water carrying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111590752.4A CN114286502B (en) | 2021-12-23 | 2021-12-23 | Heat radiation structure of control circuit board, underwater propeller and water carrying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114286502A true CN114286502A (en) | 2022-04-05 |
| CN114286502B CN114286502B (en) | 2023-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111590752.4A Active CN114286502B (en) | 2021-12-23 | 2021-12-23 | Heat radiation structure of control circuit board, underwater propeller and water carrying device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115562098A (en) * | 2022-09-08 | 2023-01-03 | 广东逸动科技有限公司 | Control method, single/double control device, water area movable equipment and control system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104610A (en) * | 1999-07-29 | 2000-08-15 | Tilton; Charles L. | EMI shielding fluid control apparatus |
| CN204244632U (en) * | 2014-12-09 | 2015-04-01 | 平煤神马机械装备集团河南电气有限公司 | A kind of radiator structure and the electric cabinet based on this radiator structure |
| US20180352685A1 (en) * | 2017-06-05 | 2018-12-06 | Sungrow Power Supply Co., Ltd. | Inverter power cabinet |
| CN112236004A (en) * | 2020-10-15 | 2021-01-15 | 中国建筑第八工程局有限公司 | One-way heat conducting device |
| CN112399787A (en) * | 2020-11-28 | 2021-02-23 | 华为技术有限公司 | Power adapter |
| CN213502860U (en) * | 2020-11-13 | 2021-06-22 | 广东逸动科技有限公司 | Marine propulsion equipment cooling system and marine propulsion equipment |
| US20210380211A1 (en) * | 2018-10-23 | 2021-12-09 | Oriental Recreational Products (Shanghai) Co., Ltd | Underwater thruster |
-
2021
- 2021-12-23 CN CN202111590752.4A patent/CN114286502B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104610A (en) * | 1999-07-29 | 2000-08-15 | Tilton; Charles L. | EMI shielding fluid control apparatus |
| CN204244632U (en) * | 2014-12-09 | 2015-04-01 | 平煤神马机械装备集团河南电气有限公司 | A kind of radiator structure and the electric cabinet based on this radiator structure |
| US20180352685A1 (en) * | 2017-06-05 | 2018-12-06 | Sungrow Power Supply Co., Ltd. | Inverter power cabinet |
| US20210380211A1 (en) * | 2018-10-23 | 2021-12-09 | Oriental Recreational Products (Shanghai) Co., Ltd | Underwater thruster |
| CN112236004A (en) * | 2020-10-15 | 2021-01-15 | 中国建筑第八工程局有限公司 | One-way heat conducting device |
| CN213502860U (en) * | 2020-11-13 | 2021-06-22 | 广东逸动科技有限公司 | Marine propulsion equipment cooling system and marine propulsion equipment |
| CN112399787A (en) * | 2020-11-28 | 2021-02-23 | 华为技术有限公司 | Power adapter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115562098A (en) * | 2022-09-08 | 2023-01-03 | 广东逸动科技有限公司 | Control method, single/double control device, water area movable equipment and control system |
| CN115562098B (en) * | 2022-09-08 | 2023-10-17 | 广东逸动科技有限公司 | Control method, single/double control device, water area movable equipment and control system |
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| Publication number | Publication date |
|---|---|
| CN114286502B (en) | 2023-09-05 |
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