CN213093051U - Bus capacitor heat radiation structure and electric automobile controller - Google Patents
Bus capacitor heat radiation structure and electric automobile controller Download PDFInfo
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- CN213093051U CN213093051U CN202022006344.7U CN202022006344U CN213093051U CN 213093051 U CN213093051 U CN 213093051U CN 202022006344 U CN202022006344 U CN 202022006344U CN 213093051 U CN213093051 U CN 213093051U
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Abstract
The utility model provides a bus capacitor heat dissipation structure and an electric automobile controller, wherein the bus capacitor heat dissipation structure comprises a mounting plate, a bus capacitor and a heat conduction component, the mounting plate is made of metal materials, and the bus capacitor is mounted on the mounting plate; the bus capacitor comprises a first terminal group, the heat conducting member is connected with the first terminal group through a first insulating heat conducting medium, and the heat conducting member is further connected with the mounting plate and conducts heat of the first terminal group to the mounting plate. The utility model discloses a by heat conduction to the mounting panel of heat conduction component with first terminal group, improved the radiating efficiency and can carry out high-efficient heat dissipation cooling to bus-bar capacitance is inside to still increase area of contact through first insulating heat-conducting medium, make the high-efficient heat transfer to the heat conduction component on the first terminal group.
Description
Technical Field
The embodiment of the utility model provides a relate to power electronic equipment field, more specifically say, relate to a bus-bar capacitance heat radiation structure and electric automobile controller.
Background
With the vigorous advancement of the electric automobile industry in various countries around the world, inverters for electric automobiles are gradually developing in the directions of low cost, high power density, high reliability and long service life. In an electric vehicle controller, a dc bus capacitor is a very important component, and mainly plays a role in storing energy and smoothing bus voltage so as to protect a power battery and a motor controller of the electric vehicle.
In an electric automobile, the temperature of an inverter installation environment is generally high (the highest temperature can reach 105 ℃), and the ambient temperature of a bus capacitor can reach more than 100 ℃ due to self heating of the bus capacitor. However, the high temperature has a great influence on the service life of the bus capacitor, so if a good heat dissipation measure cannot be adopted to cool down the bus capacitor, the service life of the inverter is greatly shortened.
At present, in current dc-to-ac converter, bus-bar capacitance generally leans on radiator or water-cooling backplate through the shell on, shifts the heat on the bus-bar capacitance shell by radiator or water-cooling backplate to realize the heat dissipation cooling to bus-bar capacitance, but the radiating efficiency of this radiating mode is lower relatively, can't high-efficiently shift the inside heat of bus-bar capacitance, and the radiating effect is comparatively not enough.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a to above-mentioned current bus-bar capacitance's radiating efficiency low, can't high-efficient transfer bus-bar capacitance's inside heat and the comparatively not enough problem of radiating effect, provide a bus-bar capacitance heat radiation structure and electric automobile controller.
The embodiment of the utility model provides a solve above-mentioned technical problem's technical scheme is, provide a bus-bar capacitance heat radiation structure, including mounting panel, bus-bar capacitance and heat conduction component, wherein: the mounting plate is made of metal materials, and the bus capacitor is fixedly mounted on the mounting plate; the bus capacitor comprises a first terminal group, the heat conducting member is connected with the first terminal group through a first insulating heat conducting medium, and the heat conducting member is further connected with the mounting plate and conducts heat on the first terminal group to the mounting plate.
Preferably, the mounting plate comprises a heat dissipation surface and a first cooling liquid channel, and the heat dissipation surface is dissipated by cooling liquid flowing through the first cooling liquid channel; the bus capacitor is installed on the radiating surface, and the side surface of the radiating surface, which faces the bus capacitor, is respectively attached to the radiating surface.
Preferably, the heat conducting member is integral with the mounting plate; and a second cooling liquid channel is arranged in the heat conduction component, communicated to the mounting plate and used for dissipating heat of the heat conduction component through cooling liquid flowing through the second cooling liquid channel.
Preferably, the second coolant passage is connected in series within the first coolant passage.
Preferably, the heat conducting member is made of a heat conducting material, and the heat conducting member is integrated with the mounting board or connected to the heat radiating surface of the mounting board through a heat conducting medium.
Preferably, the bus capacitor further comprises a second terminal group for connecting a high-voltage direct-current power supply, the second terminal group and the first terminal group are located on the same side of the bus capacitor, and the second terminal group and the first terminal group are connected with the mounting plate through the heat conducting member.
Preferably, the bus capacitor further comprises a second terminal group for connecting a high voltage direct current power supply, the second terminal group and the first terminal group are located on different sides of the bus capacitor;
the heat conductive member includes a first sub-member connected between the first terminal set and the mounting board and a second sub-member connected between the second terminal set and the mounting board.
Preferably, the first cooling liquid channel includes a heat dissipation branch channel disposed along a distribution direction of the first terminal group, and the heat conductive member is located directly above the heat dissipation branch channel.
An embodiment of the utility model provides an electric automobile controller is still provided, including the shell with as above arbitrary bus-bar capacitance heat radiation structure, just bus-bar capacitance heat radiation structure installs fixedly in the shell.
Preferably, the electric automobile controller further comprises a power module, and the power module is fixedly installed on the installation plate; the power module comprises a third terminal group, and the third terminal group is fixedly connected with the first terminal group; the mounting plate comprises a heat dissipation surface and a first cooling liquid channel, and the heat dissipation surface is dissipated by cooling liquid flowing through the first cooling liquid channel; the bus capacitor and the power module are respectively installed on the heat dissipation surface, and face the side face of the heat dissipation surface to be attached to the heat dissipation surface.
The utility model discloses bus-bar capacitance heat radiation structure and electric automobile controller have following beneficial effect: the heat conducting member is arranged, and the heat conducting member conducts heat on the first terminal group to the mounting plate, so that the first terminal group is directly radiated, and the radiating efficiency is effectively improved; because the first terminal group is connected to the interior of the bus capacitor, the heat in the bus capacitor can be efficiently transferred to the mounting plate by the first terminal group and the heat conducting member so as to efficiently dissipate heat and cool the interior of the bus capacitor, so that the heat dissipation structure of the bus capacitor has a high heat dissipation effect, and the service life of the bus capacitor is effectively prevented from being shortened due to overhigh temperature in the bus capacitor; and, make the heat conduction component be connected with first terminal group through first insulating heat-conducting medium, can not only play the insulating effect, guarantee the security, can also increase the area of contact between heat conduction component and the first terminal group, be favorable to the heat high efficiency on the first terminal group to shift to the heat conduction component to improve the radiating efficiency, make the radiating effect better.
Drawings
Fig. 1 is a schematic structural diagram of a bus capacitor heat dissipation structure provided in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a bus capacitor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a bus capacitor according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, it is the structural schematic diagram of the bus capacitor heat dissipation structure provided by the embodiment of the present invention, the bus capacitor heat dissipation structure can be applied to the field of power electronic devices, especially in an electric vehicle controller. Specifically, the bus capacitor heat dissipation structure in this embodiment includes the mounting plate 11, the bus capacitors 2 and the heat conducting member 4, where the mounting plate 11 is made of a metal material (for example, aluminum metal), and the bus capacitors 2 are respectively mounted and fixed on the mounting plate 11, so that the bus capacitors 2 can transfer heat on their housings through the mounting plate 11 made of a metal material, and thus heat dissipation and temperature reduction of the outside of the bus capacitors 2 are achieved.
The mounting plate 11 can be made of aluminum alloy, and the aluminum alloy is low in cost and high in heat conductivity, so that the heat dissipation efficiency of the shell of the bus capacitor 2 can be improved, and the temperature of the external shell can be reduced. Moreover, the mounting plate 11 is preferably a water-cooling plate, so that the mounting plate 11 has higher heat dissipation capability, the mounting plate 11 is kept at a lower temperature, and the heat dissipation failure of the bus capacitor 2 caused by low heat dissipation efficiency of the mounting plate 11 is effectively prevented.
The bus capacitor 2 includes a first terminal set 21, and the heat conducting member 4 is connected to the first terminal set 21 through a first insulating heat conducting medium 5 (e.g., a heat conducting silicone), and the heat conducting member 4 is further connected to the mounting board 11 and conducts heat on the first terminal set 21 to the mounting board 11. The heat conducting member 4 may be made of a metal material with high thermal conductivity (e.g., aluminum metal), so as to avoid the heat resistance from affecting the heat conduction efficiency. In practical application, the insulation paper is additionally arranged between the terminals of the first terminal group 21, so that the insulation performance of the bus capacitor heat dissipation structure is higher, and the insulation safety is ensured.
The bus capacitor heat dissipation structure is provided with the heat conduction member 4, and the heat on the first terminal group 21 is conducted to the mounting plate 11 through the heat conduction member 4, so that the first terminal group 21 is directly dissipated, the first terminal group 21 has high heat dissipation efficiency, and the heat generated on the first terminal group 21 is prevented from being conducted to the inside of the bus capacitor 2. Moreover, one end of the first terminal group 21 is connected to the inside of the bus capacitor 2, so that the temperature inside the bus capacitor 2 can be derived through the first terminal group 21 and then conducted to the mounting plate 11 through the heat conducting member 4, and efficient heat dissipation and cooling inside the bus capacitor 2 are realized, so that the bus capacitor heat dissipation structure has a high heat dissipation effect, and the problem that the service life of the bus capacitor 2 is shortened due to the fact that the temperature inside the bus capacitor 2 is too high and cannot be derived is effectively avoided.
Particularly, when the heat dissipation structure is applied to an electric vehicle controller (such as an inverter), the bus capacitor heat dissipation structure with a high heat dissipation effect can solve the bottleneck of the inverter caused by the temperature limitation of the bus capacitor 2, that is, the output capacity limitation caused by the upper temperature limit of the bus capacitor 2, so as to improve the overload output capacity of the inverter, and enable the inverter to have high performance.
In addition, above-mentioned bus capacitor heat radiation structure still sets up first insulation heat-conducting medium 5 through between heat conduction component 4 and first terminal group 21, not only can play insulating effect like this, guarantees the insulating security between first terminal group 21 and the heat conduction component 4, can also indirectly increase the area of contact (being heat transfer area) between heat conduction component 4 and the first terminal group 21, is favorable to the heat efficient on the first terminal group 21 to shift to heat conduction component 4, further improves the radiating efficiency of first terminal group 21.
Specifically, the mounting plate 11 includes a heat dissipation surface and a first cooling liquid channel 111, and the first cooling liquid channel 111 is located below the heat dissipation surface and is close to the heat dissipation surface, so that the cooling liquid flowing through the first cooling liquid channel 111 can cool the heat dissipation surface to ensure the self heat dissipation efficiency of the heat dissipation surface and avoid the heat dissipation failure caused by the high self temperature of the mounting plate 11. Above-mentioned bus capacitor 2 installs on the cooling surface, and bus capacitor 2 laminates with the cooling surface respectively towards the side of cooling surface, and bus capacitor 2 direct lamination installs on the cooling surface promptly to can realize direct heat dissipation, avoid indirect installation to have great thermal resistance, influence the conduction efficiency that the heat on bus capacitor 2's the outside casing shifts to the mounting panel 11.
In practical applications, to improve the heat dissipation effect, at least a part of the first cooling liquid channel of the mounting plate 11 is preferably located directly below the bus capacitor 2.
The heat conductive member 4 and the mounting plate 11 of the present embodiment are integrally formed of a metal material (e.g., aluminum metal). Moreover, a second cooling liquid channel 41 is arranged in the heat conducting member 4, the second cooling liquid channel 41 is communicated with the mounting plate 11, and the heat conducting member 4 is cooled by cooling liquid flowing through the second cooling liquid channel 41, that is, the heat on the heat conducting member 4 can be directly transferred by the cooling liquid in the first cooling liquid channel 111, so that the heat dissipation efficiency of the heat conducting member 4 is improved, and the heat dissipation effect of the heat conducting member 4 is further ensured.
In particular, the second cooling liquid channel 41 is connected in series in the first cooling liquid channel 111, that is, the second cooling liquid channel 41 is communicated with the first cooling liquid channel 111, thereby effectively simplifying the structure of the mounting plate 11 and avoiding the repeated design of the cooling liquid channels. Of course, the second cooling liquid passage 41 may be connected directly in series in the first cooling liquid passage 111, or in series in one branch passage of the first cooling liquid passage 111; the structural design of the first coolant channel 111 can be determined in particular according to the actual circumstances.
In other embodiments, the heat conducting member 4 may be assembled with the mounting plate 11 by assembling, but the second cooling liquid channel 41 needs to be hermetically connected with the first cooling liquid channel 111 of the first mounting plate 11, which increases the assembling difficulty.
In an embodiment of the present invention, the heat conducting member 4 is made of a heat conducting material (e.g., a metal material, a plastic material, etc.), and the heat conducting member 4 is integrated with the mounting plate 11. Of course, the heat conducting member 4 may also be connected to the heat dissipating surface of the mounting plate 11 through a heat conducting medium, and when the heat conducting member 4 is connected to the mounting plate 11 through a heat conducting medium, although the contact area between the heat conducting member 4 and the mounting plate 11 may be increased through a heat conducting medium (e.g., heat conducting silicone), so as to increase the heat dissipating efficiency, it is difficult to implement a structure of providing a coolant passage in the heat conducting member 4.
As shown in fig. 2, the bus capacitor 2 further includes a second terminal set 22 for connecting a high-voltage dc power supply, the second terminal set 22 and the first terminal set 21 are located on the same side of the bus capacitor 2, and are synchronously connected to the mounting plate 11 through the heat conducting member 4, so as to conduct heat of the second terminal set 22 to the mounting plate 11, thereby achieving heat dissipation and temperature reduction of the second terminal set 22. Moreover, one end of the second terminal group 22 is also connected to the inside of the bus capacitor 2, so that the heat inside the bus capacitor 2 can be conducted out through the second terminal group 22, the heat dissipation effect on the inside of the bus capacitor 2 is further improved, the capacitance value density of the bus capacitor 2 can be effectively increased, the power density is further increased, in addition, the selectivity of the use specification of the bus capacitor 2 can be improved, and the cost reduction operation of the bus capacitor 2 is realized.
In another embodiment of the present invention, as shown in fig. 3, the bus capacitor 2 further includes a second terminal group 23 for connecting the high voltage dc power supply, and the second terminal group 23 and the first terminal group 21 are located on different sides of the bus capacitor 2. In addition, the heat conducting member 4 includes a first sub-member and a second sub-member, the first sub-member is connected between the first terminal set 21 and the mounting plate 11, and the second sub-member is connected between the second terminal set 23 and the mounting plate 11, that is, the first terminal set 21 and the second terminal set 23 are respectively and separately connected with the mounting plate 11, the first terminal set 21 conducts heat to the mounting plate 11 through the first sub-member to achieve heat dissipation and temperature reduction, and the second terminal set 23 conducts heat to the mounting plate 11 through the second sub-member to achieve heat dissipation and temperature reduction.
In an embodiment of the present invention, the first cooling liquid channel 111 of the mounting plate 11 includes a heat dissipation branch channel 111a disposed along the distribution direction of the first terminal group 21, and the heat conducting member 4 is located directly above the heat dissipation branch channel 111a, so as to avoid the heat dissipation capability of the heat dissipation member 4 from being greatly affected by the distance between the heat dissipation member 4 and the heat dissipation branch channel 111 a. In particular, it is preferable to arrange the heat dissipating member 4 in a direction perpendicular to the heat dissipating surface of the mounting plate 11, which is advantageous in shortening the length of the heat dissipating member 4 and preventing the thermal resistance from increasing due to the large length, which affects the heat transfer efficiency.
The embodiment of the utility model provides an electric automobile controller is still provided, and this electric automobile controller includes shell 1 and foretell bus-bar capacitance heat radiation structure, and the installation of bus-bar capacitance subassembly heat radiation structure fixes in shell 1, specifically is bus-bar capacitance heat radiation structure's mounting panel and 1 fixed connection of shell. Moreover, the first terminal group 21 of the bus capacitor 2 is connected with the housing 1 through a second insulating heat-conducting medium (e.g., heat-conducting silica gel), so that the insulating safety of the bus capacitor 2 is ensured, and the heat on the first terminal group 21 can be directly conducted to the housing 1 through the second insulating heat-conducting medium, thereby realizing the efficient heat dissipation of the first terminal group 21.
In addition, the electric automobile controller further comprises a power module 3, and the power module 3 is fixedly installed on the mounting plate 11. Specifically, the power module 3 includes a third terminal set 31, and the third terminal set 31 is fixedly connected to the first terminal set of the bus capacitor 2. Because the first terminal group 21 has thermal conductivity, the heat conducting member 4 can conduct heat on the first terminal group 21 and the second terminal group 31 to the mounting plate 11 at the same time, so as to realize synchronous heat dissipation of the bus capacitor 2 and the power module 1, thereby ensuring the heat dissipation effect, simplifying the overall structure design and further reducing the manufacturing cost. Of course, the second terminal set 31 may be directly connected to and in contact with the heat conductive member 4.
Since the mounting board includes a heat dissipation surface (specifically, a surface close to the first cooling liquid channel 111) and the first cooling liquid channel 111, and the cooling liquid in the first cooling liquid channel 111 dissipates heat for the heat dissipation surface, it is preferable to mount the bus capacitor 2 and the power module 3 on the heat dissipation surface, and attach the sides of the bus capacitor 2 and the power module 3 facing the heat dissipation surface to the heat dissipation surface, respectively.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022006344.7U CN213093051U (en) | 2020-09-14 | 2020-09-14 | Bus capacitor heat radiation structure and electric automobile controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022006344.7U CN213093051U (en) | 2020-09-14 | 2020-09-14 | Bus capacitor heat radiation structure and electric automobile controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213093051U true CN213093051U (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022006344.7U Active CN213093051U (en) | 2020-09-14 | 2020-09-14 | Bus capacitor heat radiation structure and electric automobile controller |
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| CN (1) | CN213093051U (en) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215000 52 tianedang Road, Yuexi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |
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| CP03 | Change of name, title or address |