CN212750876U - Small radiator for microelectronic device - Google Patents
Small radiator for microelectronic device Download PDFInfo
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- CN212750876U CN212750876U CN202022088968.8U CN202022088968U CN212750876U CN 212750876 U CN212750876 U CN 212750876U CN 202022088968 U CN202022088968 U CN 202022088968U CN 212750876 U CN212750876 U CN 212750876U
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- radiating
- microelectronic device
- radiation structure
- heat radiation
- supporting
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Abstract
The utility model discloses a small-size radiator for microelectronic device, including supporting the chassis, the backup pad is installed at the top of supporting the chassis, and the supporting legs is installed in the four corners of supporting the chassis, and the spread groove has been seted up to the inner chamber of supporting legs, and heat radiation structure is installed at the top of backup pad, and heat radiation structure comprises a plurality of radiating fin, and open at heat radiation structure's four walls middle part has the rectangle mounting groove, and heat radiation structure's center department is equipped with circular mounting hole. The utility model provides a common radiator is great on the market, and be difficult for installing with electronic components cooperation, the relatively poor problem of radiating efficiency.
Description
Technical Field
The utility model relates to a radiator technical field specifically is a small-size radiator for microelectronic device.
Background
A large amount of heat can be produced in the working process of electronic components, if the heat is not discharged in time, the electronic components can be damaged due to overheating, a common radiator in the market is large, the common radiator is not easy to be installed in a matching mode with the electronic components, and the radiating efficiency is poor, so that a small radiator for microelectronic devices is designed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a be not enough to prior art, the utility model provides a small-size radiator for microelectronic device has solved ordinary radiator in the market great, and is difficult for and electronic components cooperation installation, the relatively poor problem of radiating efficiency.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a small-size radiator for microelectronic device, includes and supports the chassis, the backup pad is installed at the top of supporting the chassis, the supporting legs is installed in the four corners of supporting the chassis, the spread groove has been seted up to the inner chamber of supporting legs, heat radiation structure is installed at the top of backup pad, heat radiation structure comprises a plurality of radiating fin, open at heat radiation structure's four walls middle part has the rectangle mounting groove, heat radiation structure's center department is equipped with circular mounting hole.
In the small heat sink for the microelectronic device, the plurality of heat dissipation fins are arranged in a circumferential array along the side wall of the circular mounting hole, and the heat dissipation efficiency is improved by the plurality of heat dissipation fins.
According to the small radiator for the microelectronic device, the outer side of the radiating fin is divided into the first radiating plate and the second radiating plate, an angle of 10-15 degrees is formed between the first radiating plate and the second radiating plate, the outer side of the radiating fin is divided into two, the radiating area is increased, and therefore radiating is accelerated.
In the small-sized heat sink for the microelectronic device, the heat dissipation fins are integrally formed with the circular mounting holes, and the strength of the heat sink is enhanced by the integrally formed heat dissipation structure.
In the foregoing small heat sink for a microelectronic device, the heat dissipation fin is made of one of aluminum material and copper material.
In the small-sized radiator for the microelectronic device, the side wall of the inner cavity of the circular mounting hole is provided with the connecting thread, and the connecting thread is convenient for being connected with an electronic component.
In the small heat sink for a microelectronic device, the bottom of the supporting chassis is provided with a heat dissipation groove.
The utility model has the advantages that: a plurality of radiating fins are arranged along the side wall of the circular mounting hole in a circumferential array mode, the radiating fins increase the radiating efficiency, the outer sides of the radiating fins are divided into a first radiating plate and a second radiating plate, a 10-15-degree angle is formed between the first radiating plate and the second radiating plate, the outer sides of the radiating fins are divided into two, the radiating area is increased, the radiating is accelerated, meanwhile, the inner cavity side wall of the circular mounting hole is provided with connecting threads, the connecting threads are convenient to connect with electronic components, the problem that common radiators in the market are large, the radiators are not easy to be installed in a matched mode with the electronic components, and the radiating efficiency is poor is solved.
Drawings
Fig. 1 is a bottom view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
fig. 3 is a top view of the present invention.
In the figure: 1. supporting chassis, 101, radiating groove, 2, backup pad, 3, supporting legs, 4, heat radiation structure, 5, radiating fin, 501, first heating panel, 502, second heating panel, 6, rectangle mounting groove, 7, circular mounting hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to FIGS. 1-2: a small-sized radiator for microelectronic devices comprises a supporting chassis 1, a radiating groove 101 is arranged at the bottom of the supporting chassis 1, a supporting plate 2 is arranged at the top of the supporting chassis 1, supporting legs 3 are arranged at four corners of the supporting chassis 1, a connecting groove 301 is formed in the inner cavity of each supporting leg 3, a radiating structure 4 is arranged at the top of the supporting plate 2 and consists of a plurality of radiating fins 5, each radiating fin 5 is made of one of aluminum materials or copper materials, the outer side of each radiating fin 5 is divided into a first radiating plate 501 and a second radiating plate 502, a 10-15-degree angle is formed between each first radiating plate 501 and each second radiating plate 502, a rectangular mounting groove 6 is formed in the middle of each wall of each radiating structure 4, a circular mounting hole 7 is formed in the center of each radiating structure 4, the plurality of radiating fins 5 are arranged in a circumferential array along the side wall of the circular mounting hole 7, and the radiating fins 5, the side wall of the inner cavity of the round mounting hole 7 is provided with connecting threads.
To sum up, the utility model discloses when using, heat radiation structure 4 is installed at the top of backup pad 2, heat radiation structure 4 comprises a plurality of radiating fin 5, a plurality of radiating fin 5 are circumference array form setting along the lateral wall of circular mounting hole 7, a plurality of radiating fin 5 increase radiating efficiency, radiating fin 5's the outside is divided into first heating panel 501 and second heating panel 502, be 10-15 degree angle between first heating panel 501 and the second heating panel 502, one in two outside with radiating fin 5, heat radiating area has been increased, thereby accelerate the heat dissipation, and simultaneously, the inner chamber lateral wall of circular mounting hole 7 is provided with connecting thread, be convenient for with electronic components through connecting thread and be connected, it is great to have solved ordinary radiator in the market, and be difficult for installing with electronic components cooperation, the relatively poor problem of radiating efficiency.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (7)
1. A compact heat sink for microelectronic devices, comprising a supporting chassis (1), characterized in that: the utility model discloses a support chassis, including support chassis (1), supporting legs (3), spread groove (301), heat radiation structure (4) are installed at the top of support chassis (1), supporting legs (3) are installed in the four corners of support chassis (1), spread groove (301) have been seted up to the inner chamber of supporting legs (3), heat radiation structure (4) are installed at the top of supporting legs (2), heat radiation structure (4) comprise a plurality of radiating fin (5), it has rectangle mounting groove (6) to open at the four walls middle part of heat radiation structure (4), the center department of heat radiation structure (4) is equipped with circular mounting hole (7).
2. A compact heat sink for a microelectronic device according to claim 1, wherein: the plurality of radiating fins (5) are arranged along the side wall of the circular mounting hole (7) in a circumferential array manner.
3. A compact heat sink for a microelectronic device according to claim 1, wherein: the outer side of the radiating fin (5) is divided into a first radiating plate (501) and a second radiating plate (502), and an angle of 10-15 degrees is formed between the first radiating plate (501) and the second radiating plate (502).
4. A compact heat sink for a microelectronic device according to claim 1, wherein: the radiating fins (5) and the round mounting holes (7) are integrally formed.
5. A compact heat sink for a microelectronic device according to claim 1, wherein: the radiating fins (5) are made of one of aluminum materials or copper materials.
6. A compact heat sink for a microelectronic device according to claim 1, wherein: and the side wall of the inner cavity of the circular mounting hole (7) is provided with connecting threads.
7. A compact heat sink for a microelectronic device according to claim 1, wherein: the bottom of the supporting underframe (1) is provided with a heat dissipation groove (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022088968.8U CN212750876U (en) | 2020-09-22 | 2020-09-22 | Small radiator for microelectronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022088968.8U CN212750876U (en) | 2020-09-22 | 2020-09-22 | Small radiator for microelectronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212750876U true CN212750876U (en) | 2021-03-19 |
Family
ID=74989800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022088968.8U Active CN212750876U (en) | 2020-09-22 | 2020-09-22 | Small radiator for microelectronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212750876U (en) |
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2020
- 2020-09-22 CN CN202022088968.8U patent/CN212750876U/en active Active
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