CN211654808U - Diode with miniature heat radiation structure - Google Patents
Diode with miniature heat radiation structure Download PDFInfo
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- CN211654808U CN211654808U CN202020703291.1U CN202020703291U CN211654808U CN 211654808 U CN211654808 U CN 211654808U CN 202020703291 U CN202020703291 U CN 202020703291U CN 211654808 U CN211654808 U CN 211654808U
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- diode
- heat conductor
- heat
- cylindrical cavity
- miniature
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Abstract
The utility model discloses a diode with miniature heat radiation structure, including the heat conductor, cylindrical cavity has transversely been seted up in the centre of heat conductor, and is provided with the diode main part in the cylindrical cavity, and the both ends of diode main part are provided with the diode pin respectively, and the diode pin is located outside the cylindrical cavity, the top of heat conductor is provided with radiator fan, the vertical bar groove of having seted up on the outer wall of heat conductor, and this bar groove is about the outer wall evenly distributed all around of heat conductor, the middle vertical through-hole of having seted up of heat conductor, the through-hole is provided with a plurality ofly, and the position of through-hole and cylindrical cavity staggers mutually, the screw hole has been seted up respectively in the top four corners of heat conductor. The diode with the miniature heat dissipation structure adopts the structural design that the heat conductor and the diode main body are combined into a whole, so that the heat dissipation performance of the diode main body can be greatly improved, and the influence of overhigh temperature can be effectively reduced.
Description
Technical Field
The utility model relates to a diode technical field specifically is a diode with miniature heat radiation structure.
Background
A diode is a device having two electrodes in an electronic component, and only allows current to flow in a single direction, and many applications use the rectifying function. And the varactor is used as an electronically tunable capacitor. The current directivity that most diodes have is commonly referred to as the "rectifying" function. The most common function of a diode is to allow current to pass in a single direction (referred to as forward biasing) and to block current in the reverse direction (referred to as reverse biasing). Thus, the diode can be thought of as an electronic version of the check valve.
The diode has obvious heating when too big and load is great at the operation in-process electric current, and the high potential safety hazard then exists of temperature, and traditional diode lacks heat radiation structure, and is not enough to some extent.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a diode with miniature heat radiation structure to the diode of the system that proposes in solving above-mentioned background art lacks heat radiation structure's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a diode with miniature heat radiation structure, includes the heat conductor, cylindrical cavity has transversely been seted up in the centre of heat conductor, and is provided with the diode main part in the cylindrical cavity, and the both ends of diode main part are provided with the diode pin respectively, and the diode pin is located outside the cylindrical cavity, the top of heat conductor is provided with radiator fan.
Preferably, the outer wall of the heat conductor is vertically provided with a strip-shaped groove, and the strip-shaped groove is uniformly distributed on the peripheral outer wall of the heat conductor.
Preferably, the middle of the heat conductor is vertically provided with a plurality of through holes, and the positions of the through holes and the cylindrical cavity are staggered.
Preferably, threaded holes are respectively formed in four corners of the top of the heat conductor, and the heat conductor is connected with the cooling fan through the threaded holes through screws.
Preferably, the periphery of the bottom of the heat conductor is provided with a convex edge.
Preferably, the bottom of the heat conductor is provided with a support bar, the support bar is symmetrically arranged on two sides of the bottom of the heat conductor, and the support bar and the heat conductor are of an integrated structure.
Preferably, a filling layer is arranged between the diode main body and the inner wall of the cylindrical cavity, and the filling layer is made of silicone grease.
Compared with the prior art, the beneficial effects of the utility model are that: the diode with the miniature heat dissipation structure adopts the structural design that the heat conductor and the diode main body are combined into a whole, so that the heat dissipation performance of the diode main body can be greatly improved, and the influence of overhigh temperature can be effectively reduced.
Drawings
Fig. 1 is a front view of a diode with a micro heat dissipation structure according to the present invention;
fig. 2 is a top view of a diode heat conductor with a micro heat dissipation structure according to the present invention;
fig. 3 is a top view of a diode heat dissipation fan with a micro heat dissipation structure according to the present invention;
fig. 4 is a bottom view of the diode heat conductor with the micro heat dissipation structure of the present invention.
In the figure: 1. radiator fan, 2, heat conductor, 3, support bar, 4, filling layer, 5, diode main part, 6, diode pin, 7, cylindrical cavity, 8, screw hole, 9, through-hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a diode with a miniature heat dissipation structure comprises a heat conductor 2, a cylindrical cavity 7 is transversely formed in the middle of the heat conductor 2, the heat conductor 2 is made of aluminum profiles and can have high heat conductivity, a diode main body 5 is arranged in the cylindrical cavity 7, the diode main body 5 is fixed in the cylindrical cavity 7 in a matching manner, a filling layer 4 is arranged between the diode main body 5 and the inner wall of the cylindrical cavity 7, the filling layer 4 is made of silicone grease, the structure enables the connection between the diode main body 5 and the cylindrical cavity 7 to be tighter and enables the temperature to be transmitted more efficiently and stably, diode pins 6 are respectively arranged at two ends of the diode main body 5, the diode pins 6 are positioned outside the cylindrical cavity 7 and can be normally connected with other components, a heat dissipation fan 1 is arranged at the top of the heat conductor 2, and the model of the heat dissipation fan 1 is GM0502PFV1-8, the heat conductor 2 can absorb the heat of the diode main body 5, the heat dissipation efficiency is improved by utilizing larger heat dissipation area, the heat dissipation fan 1 can promote air flow to form air cooling effect on the heat conductor 2, the outer wall of the heat conductor 2 is vertically provided with a strip-shaped groove which is uniformly distributed on the peripheral outer wall of the heat conductor 2, the surface area of the heat conductor 2 can be increased by the strip-shaped groove, the heat dissipation performance is further provided, the middle of the heat conductor 2 is vertically provided with a through hole 9, the through holes 9 are provided with a plurality of through holes 9, the positions of the through holes 9 are staggered with the position of the cylindrical cavity 7, air can flow in the through holes 9, the temperature dissipation is faster, the four corners at the top of the heat conductor 2 are respectively provided with threaded holes 8, the heat conductor 2 is connected with the heat dissipation fan 1 through the threaded holes 8 by screws, the threaded holes 8 can be connected with screws, the bottom of heat conductor 2 is provided with protruding edge all around, this structure can increase the bottom area of heat conductor 2, let heat conductor 2 install the back more steady firm, the bottom of heat conductor 2 is provided with support bar 3, support bar 3 sets up about the bottom bilateral symmetry of heat conductor 2, and support bar 3 and heat conductor 2 structure as an organic whole, support bar 3 can erect heat conductor 2, make 2 bottoms of heat conductor keep unsettled, thereby can let through-hole 9 link up from top to bottom, the circulation of the air of being convenient for, the radiating effect is improved.
The working principle is as follows: when the diode with the micro heat dissipation structure is used, whether parts are damaged or not firmly connected is checked, the diode is used after the parts are checked to be correct, the diode main body 5 is positioned in the cylindrical cavity 7 in the middle of the heat conductor 2, the diode main body 5 and the heat conductor 2 are combined into a whole, when the diode main body 5 generates heat, the heat conductor 2 can absorb the emitted heat, the heat is dissipated through the larger surface area of the heat conductor 2 to form a heat dissipation effect, meanwhile, the heat dissipation fan 1 operates, the heat dissipation fan 1 can drive air to circulate, the heat dissipated by the heat conductor 2 is blown away more quickly, the heat dissipation efficiency is further improved, the heat conductor 2 and the diode main body 5 are combined into a whole, the heat dissipation performance of the diode main body 5 is greatly improved, and the influence of overhigh temperature can be effectively reduced, this is the working principle of the diode with the miniature heat dissipation structure.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. The utility model provides a diode with miniature heat radiation structure which characterized in that: including heat conductor (2), cylindrical cavity (7) have transversely been seted up in the centre of heat conductor (2), and are provided with diode main part (5) in cylindrical cavity (7), and the both ends of diode main part (5) are provided with diode pin (6) respectively, and diode pin (6) are located outside cylindrical cavity (7), the top of heat conductor (2) is provided with radiator fan (1).
2. The diode with the miniature heat dissipation structure of claim 1, wherein: a strip-shaped groove is vertically formed in the outer wall of the heat conductor (2), and the strip-shaped groove is uniformly distributed on the peripheral outer wall of the heat conductor (2).
3. The diode with the miniature heat dissipation structure of claim 1, wherein: the middle of the heat conductor (2) is vertically provided with a plurality of through holes (9), and the positions of the through holes (9) and the cylindrical cavity (7) are staggered.
4. The diode with the miniature heat dissipation structure of claim 1, wherein: threaded holes (8) are formed in four corners of the top of the heat conductor (2) respectively, and the heat conductor (2) is connected with the radiating fan (1) through the threaded holes (8) through screws.
5. The diode with the miniature heat dissipation structure of claim 1, wherein: and convex edges are arranged around the bottom of the heat conductor (2).
6. The diode with the miniature heat dissipation structure of claim 1, wherein: the bottom of heat conductor (2) is provided with support bar (3), and support bar (3) set up about the bottom bilateral symmetry of heat conductor (2), and support bar (3) and heat conductor (2) structure as an organic whole.
7. The diode with the miniature heat dissipation structure of claim 1, wherein: a filling layer (4) is arranged between the diode main body (5) and the inner wall of the cylindrical cavity (7), and the filling layer (4) is made of silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020703291.1U CN211654808U (en) | 2020-04-30 | 2020-04-30 | Diode with miniature heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020703291.1U CN211654808U (en) | 2020-04-30 | 2020-04-30 | Diode with miniature heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211654808U true CN211654808U (en) | 2020-10-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020703291.1U Expired - Fee Related CN211654808U (en) | 2020-04-30 | 2020-04-30 | Diode with miniature heat radiation structure |
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| Country | Link |
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| CN (1) | CN211654808U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270381A (en) * | 2021-05-18 | 2021-08-17 | 如皋市大昌电子有限公司 | Axial diode with high heat dissipation performance |
-
2020
- 2020-04-30 CN CN202020703291.1U patent/CN211654808U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270381A (en) * | 2021-05-18 | 2021-08-17 | 如皋市大昌电子有限公司 | Axial diode with high heat dissipation performance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211116 Address after: 215000 Dazhuang village, Huangqiao street, Xiangcheng District, Suzhou City, Jiangsu Province Patentee after: Suzhou Yaodi Electronics Co.,Ltd. Address before: No. 888, Chengyang Road, Chengyang street, Xiangcheng economic and Technological Development Zone, Suzhou, Jiangsu 215000 Patentee before: Suzhou Yongjie Electronic Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201009 |