CN214338375U

CN214338375U - Controller and heat radiation structure thereof

Info

Publication number: CN214338375U
Application number: CN202022125970.8U
Authority: CN
Inventors: 夏莉; 杨文雄; 张广权; 李一雄; 汤磊; 陈进华
Original assignee: Shanghai Panhu Power Technology Co ltd
Current assignee: Shanghai Panhu Power Technology Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-10-01
Anticipated expiration: 2030-09-24

Abstract

The utility model provides a controller heat radiation structure, including controller end shell, locate the PCBA in the controller end shell, arranged a plurality of components and parts on the PCBA, be equipped with the heat conduction structure with each components and parts laminating on the inner wall face of controller end shell. The inner wall of the controller end shell is provided with the heat conduction structure, the heat conduction structure is attached to the PCBA upper component, and when the controller works, heat on the component is conducted to the controller end shell through the heat conduction structure, so that the component and the inner wall surface of the controller end shell obtain a smaller heat dissipation distance, and the heat dissipation efficiency is improved. The utility model also provides a controller.

Description

Controller and heat radiation structure thereof

Technical Field

The utility model relates to a controller technical field, more specifically say, relate to a controller and heat radiation structure thereof.

Background

The components and parts on the controller circuit board are main heating sources, the shell is a main heat dissipation way, components and parts with different sizes are distributed on one circuit board and comprise chips, resistors, capacitors and the like, the components and parts with large volumes increase the height of the circuit board, so that the flat components and parts on the mainboard are far away from the shell, and the heat dissipation of the whole controller is not facilitated.

Therefore, how to improve the heat dissipation efficiency of the controller is a problem to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a controller heat dissipation structure to improve the heat dissipation efficiency of the controller; the utility model also provides a controller.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a controller heat radiation structure, includes controller end shell, locates the PCBA in the controller end shell, the last a plurality of components and parts of having arranged of PCBA, be equipped with on the inner wall face of controller end shell with each the heat conduction structure of components and parts laminating.

Preferably, in the controller heat radiation structure, the components include a first group of components and a second group of components which extend out of the PCBA and have different plate heights, and the heat conduction structure is a first heat conduction structure and a second heat conduction structure which are respectively in close fit with the first group of components and the second group of components and have different arrangement heights with the inner wall surface of the controller end shell.

Preferably, in the controller heat dissipation structure, the first heat conduction structure is a heat dissipation caulking groove arranged on an inner wall surface of the controller end shell in a sinking manner.

Preferably, in the controller heat dissipation structure, the second heat conduction structure is a heat dissipation boss protruding from an inner wall surface of the controller end housing.

Preferably, in the above controller heat dissipation structure, the first group of components includes columnar components whose outer peripheral surfaces are cylindrical structures, and the heat dissipation caulking grooves include heat dissipation caulking grooves whose inner end surfaces are arc surfaces.

Preferably, in the heat dissipation structure for a controller, the second component includes a flat component having a flat structure, and the heat dissipation boss includes a heat dissipation protrusion having a protruding end face having a planar structure.

Preferably, in the controller heat dissipation structure, heat dissipation ribs for dissipating heat of the controller end housing protrude from an outer wall surface of the controller end housing.

Preferably, in the above controller heat dissipation structure, the heat dissipation rib includes a plurality of heat dissipation ribs arranged radially around the circumference of the controller end shell.

A controller comprises a controller end shell and a PCBA arranged in the controller end shell, wherein the controller end shell is provided with the controller heat dissipation structure which dissipates heat of the PCBA.

The utility model provides a controller heat radiation structure, including controller end shell, locate the PCBA in the controller end shell, arranged a plurality of components and parts on the PCBA, be equipped with the heat conduction structure with each components and parts laminating on the inner wall face of controller end shell. The inner wall of the controller end shell is provided with the heat conduction structure, the heat conduction structure is attached to the PCBA upper component, and when the controller works, heat on the component is conducted to the controller end shell through the heat conduction structure, so that the component and the inner wall surface of the controller end shell obtain a smaller heat dissipation distance, and the heat dissipation efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic diagram of a PCBA structure in a controller heat dissipation structure provided by the present invention;

FIG. 2 is a schematic structural view of an inner end face of a controller end housing in the heat dissipation structure of the controller in FIG. 1;

fig. 3 is a schematic structural diagram of an outer end face of a controller terminal housing in the heat dissipation structure of the controller in fig. 1.

Detailed Description

The utility model discloses a controller heat radiation structure, which improves the heat radiation efficiency of the controller; the utility model also provides a controller.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1-3, fig. 1 is a schematic diagram of a PCBA structure in a controller heat dissipation structure provided by the present invention; FIG. 2 is a schematic structural view of an inner end face of a controller end housing in the heat dissipation structure of the controller in FIG. 1; fig. 3 is a schematic structural diagram of an outer end face of a controller terminal housing in the heat dissipation structure of the controller in fig. 1.

The embodiment provides a controller heat radiation structure, including controller end shell 1, locate PCBA2 in controller end shell 1, arranged a plurality of components and parts on PCBA2, be equipped with the heat conduction structure with each components and parts laminating on the inner wall face of controller end shell 1. The inner wall of the controller end shell 1 is provided with a heat conduction structure, the heat conduction structure is attached to the PCBA2 upper component, and when the controller works, heat on the component is conducted to the controller end shell 1 through the heat conduction structure, so that the component and the inner wall surface of the controller end shell 1 obtain a smaller heat dissipation distance, and the heat dissipation efficiency is improved.

In a specific embodiment of the present disclosure, the components include a first group of components 21 and a second group of components 22 that extend out of the PCBA2 and have different board heights, and the heat conducting structures are respectively in close fit with the first group of components 21 and the second group of components 22 and have different arrangement heights with the inner wall surface of the controller end housing, i.e., the first heat conducting structure 11 and the second heat conducting structure 12. Different components and parts on PCBA2, it is different to stretch out the height on the PCBA2 face, set up first group components and parts 21 and second group components and parts 22 with components and parts on PCBA2 according to the difference in height, correspondingly, the position that the heat conduction structure corresponds first group components and parts 21 and second group components and parts 22 sets up to two sets of, and set up to first heat conduction structure 11 and second heat conduction structure 12 of different arrangement height, through the grouping arrangement to components and parts in the controller end shell 1, optimize the heat conduction structure.

In the present embodiment, the first heat conducting structure 11 is a heat dissipating caulking groove disposed on the inner wall surface of the controller end housing 1 in a sinking manner. The second heat conducting structure 12 is a heat dissipating boss protruding from the inner wall surface of the controller end housing 1.

In order to avoid increasing the heat conduction structure, the first heat conduction structure 11 and the second heat conduction structure 12 are arranged to increase the overall structure thickness of the controller end shell 1, and the first heat conduction structure 11 and the second heat conduction structure 12 are respectively arranged to extend out of the inner wall surface of the controller end shell 1 in two directions.

Specifically, the first heat conducting structure 11 is a heat dissipation caulking groove, the second heat conducting structure 12 is a heat dissipation boss, and the arrangement of the heat dissipation caulking groove enables the outer wall surface of the control end shell 1 to protrude outwards, so that the whole thickness of the end shell of the controller is reduced as much as possible. The distance between the inner wall surface of the control end shell 1 and the PCBA2 board is reduced due to the arrangement of the radiating embedded grooves, the radiating protrusions protrude out of the inner wall surface of the controller end shell 1, the radiating protrusions are in contact with the second group of components 22, the second group of components are in direct contact with the controller end shell, and the radiating distance is increased.

In an embodiment of the present disclosure, the first group of components 21 includes a cylindrical component whose outer peripheral surface is a cylindrical structure, and the heat dissipation caulking groove includes a heat dissipation caulking groove whose inner end surface is an arc surface.

The second component 22 includes a flat component with a flat structure, and the heat dissipation boss includes a heat dissipation protrusion with a planar protruding end face.

The components and parts on PCBA2 face include two kinds of structures of column components and parts and flat components and parts, adapt to column components and parts, and the heat dissipation caulking groove sets up the arc surface heat dissipation caulking groove of indent arrangement in controller end shell internal face, and the terminal surface that stretches out of heat dissipation boss sets up planar structure's heat dissipation arch, with the surperficial full contact of flat components and parts, increase heat radiating area.

In an embodiment of the present disclosure, heat dissipation ribs 13 for dissipating heat of the controller end housing 1 protrude from an outer wall surface of the controller end housing. Because components and parts pass through heat dissipation caulking groove and the protruding direct contact of heat dissipation on the PCBA2, heat direct transfer to controller end shell 1 on flat components and parts and the column components and parts sets up heat dissipation rib 13 in the outer wall of controller end shell 1, improves heat conduction efficiency.

Preferably, the heat dissipation ribs 13 include a plurality of heat dissipation ribs arranged radially around the circumference of the controller end housing 1. Through setting up radial heat dissipation rib, guarantee the radiating effect.

Based on the controller heat radiation structure that provides in the above-mentioned embodiment, the utility model also provides a controller, including the controller end shell, locate PCBA in it, be equipped with on this controller end shell carry out radiating controller heat radiation structure as in the above-mentioned embodiment to PCBA and provide.

Because the controller adopts the controller heat dissipation structure of the above embodiment, please refer to the above embodiment for the beneficial effects brought by the controller heat dissipation structure.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A controller heat radiation structure is characterized by comprising a controller end shell and a PCBA (printed Circuit Board Assembly) arranged in the controller end shell, wherein a plurality of components are arranged on the PCBA, and a heat conduction structure attached to each component is arranged on the inner wall surface of the controller end shell;

the components comprise a first group of components and a second group of components which extend out of the PCBA and are different in board height, and the heat conduction structure is matched with the first group of components and the second group of components and has a first heat conduction structure and a second heat conduction structure which are different in arrangement height from the inner wall surface of the end shell of the controller.

2. The controller heat dissipation structure of claim 1, wherein the first and second heat conduction structures are respectively in close fit with the first and second sets of components.

3. The controller heat dissipation structure according to claim 2, wherein the first heat conduction structure is a heat dissipation caulking groove that is sunk in an inner wall surface of the controller end housing.

4. The controller heat dissipation structure of claim 3, wherein the second heat conduction structure is a heat dissipation boss protruding from an inner wall surface of the controller end housing.

5. The controller heat dissipation structure of claim 4, wherein the first group of components includes columnar components having a cylindrical outer peripheral surface, and the heat dissipation caulking grooves include heat dissipation caulking grooves having arc-shaped inner end surfaces.

6. The controller heat dissipation structure of claim 5, wherein the second group of components comprises flat components with flat structures, and the heat dissipation bosses comprise heat dissipation protrusions with planar protruding end faces.

7. The controller heat dissipation structure according to any one of claims 1 to 6, wherein heat dissipation ribs for dissipating heat therefrom are arranged to protrude from an outer wall surface of the controller end housing.

8. The controller heat dissipation structure of claim 7, wherein the heat dissipation ribs comprise a plurality of heat dissipation ribs arranged radially around a circumference of the controller end housing.

9. A controller comprising a controller end housing and a PCBA disposed therein, wherein the controller end housing is provided with a controller heat sink structure according to any one of claims 1 to 8 for dissipating heat from the PCBA.