CN218042231U - Fin type heat dissipation plate - Google Patents
Fin type heat dissipation plate Download PDFInfo
- Publication number
- CN218042231U CN218042231U CN202221712819.7U CN202221712819U CN218042231U CN 218042231 U CN218042231 U CN 218042231U CN 202221712819 U CN202221712819 U CN 202221712819U CN 218042231 U CN218042231 U CN 218042231U
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- Prior art keywords
- heat dissipation
- fins
- heat
- heat sink
- dissipation plate
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- 230000017525 heat dissipation Effects 0.000 title abstract description 79
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 31
- 230000005855 radiation Effects 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The utility model relates to a fin formula heating panel, including the heating panel body, the heating panel body includes first cooling surface and the second cooling surface by corresponding setting with first cooling surface, first cooling surface has heavy groove, the array is equipped with one or more heat radiation fins in the heavy groove, every heat radiation fins's top does not surpass first cooling surface. The heat dissipation plate body protects the heat dissipation fins, and the heat dissipation fins are not easy to be impacted by external force and are not easy to deform or damage; simultaneously, the heat dissipation fins cannot increase the thickness of the heat dissipation plate body, and compared with the thickness superposition mode of the traditional fin type heat dissipation plate, the thickness of the fin type heat dissipation plate can be relatively reduced, and the thickness of the electronic equipment adopting the fin type heat dissipation plate can be further reduced.
Description
Technical Field
The utility model belongs to the technical field of heating element's heat dissipation technique and specifically relates to a fin formula heating panel is related to.
Background
In electronic devices, heat dissipation structures are generally disposed on components with large heat generation amount to ensure that the devices can operate normally, such as Central Processing Units (CPUs), display cards, light Emitting Diodes (LEDs), and the like. In the existing heat dissipation structure in the market, most of the front surface of the heat dissipation plate is contacted with the heating element, and the heat dissipation fins are arranged on the back surface of the heat dissipation plate, so that the heat dissipation effect is ensured, the cost is reduced, the heat dissipation fins are generally designed to be thinner, and the heat dissipation structure is easy to deform or damage once being impacted by external force in the processes of production, transportation, assembly and maintenance; in addition, because the heat dissipation fins are arranged on the back of the heat dissipation plate, the thickness of the fin type heat dissipation plate is larger, and the thickness of the corresponding electronic equipment is difficult to further reduce and needs to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a fin formula heating panel, under the prerequisite of guaranteeing the radiating effect, the thickness of heating panel is thinner, and heat radiation fins stability is good, can not lead to warping by external impact by light.
The utility model provides a technical scheme does: the utility model provides a fin formula heating panel, includes the heating panel body, the heating panel body include first cooling surface and with first cooling surface by the corresponding second cooling surface that sets up, first cooling surface has heavy groove, the array is equipped with one or more heat radiation fins in the heavy groove, heat radiation fins's top does not surpass first cooling surface.
Wherein each of the heat dissipation fins is arranged in parallel.
Wherein each radiating fin is arranged in a radial shape.
Wherein, each heat dissipation fin is a sectional structure.
The periphery of the sinking groove is also provided with a sinking platform, and the top end of each radiating fin is lower than the first radiating surface.
The second heat dissipation surface is provided with a groove, and the groove is used for accommodating the heating element.
And the grooves are formed at two ends of the second heat dissipation surface.
The sinking groove is located in the middle area of the first heat dissipation surface, and the side wall of the sinking groove is arranged in an inward inclined mode.
And heat-conducting glue is coated between the heating element and the bottom surface of the groove.
The section of the heat dissipation plate body is of an inclined surface structure which is in transition from thick to thin from the heating element to each heat dissipation fin.
The utility model has the advantages that: the fin type heat dissipation plate is provided with the sinking groove on the first heat dissipation surface, the heat dissipation fins are arranged in the sinking groove in an array mode, and the top ends of the heat dissipation fins do not exceed the first heat dissipation surface (which is equivalent to the fact that the heat dissipation fins are hidden in the sinking groove), so that the heat dissipation fins are protected by the heat dissipation plate body, are not easily impacted by external force and are not easily deformed or damaged; and because the radiating fins can not increase the thickness of the radiating plate body, compared with the thickness superposition mode of the traditional fin type radiating plate, the thickness of the fin type radiating plate can be relatively reduced, and the thickness of the electronic equipment adopting the fin type radiating plate can be further reduced.
Drawings
Fig. 1 is a perspective view of an embodiment of a fin-type heat sink according to the present invention.
Fig. 2 is a perspective view of an embodiment of a fin-type heat sink according to the present invention.
Fig. 3 is a schematic cross-sectional view of an embodiment of a fin-type heat sink according to the present invention.
Fig. 4 is a schematic view of an application scenario of the heat dissipation structure of the fin-type heat dissipation plate cooperating with the heating element of the present invention.
Fig. 5 is a schematic perspective view of a heat dissipation structure of the fin-type heat dissipation plate of the present invention cooperating with a heating element.
Fig. 6 is a schematic diagram of a half-section structure of a heat dissipation structure of the fin-type heat dissipation plate cooperating with a heating element.
Fig. 7 is a partial detail view of the heat dissipation structure of the fin-type heat dissipation plate cooperating with the heating element of the present invention.
Wherein, 1, a heat dissipation plate; 11. a heat dissipation plate body; 12. a first heat dissipation surface; 13. a second heat dissipation surface; 14. sinking a groove; 15. heat dissipation fins; 16. a groove; 17. sinking the platform; 2. a circuit board; 21. a heating element; 3. and (4) heat-conducting glue.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 to fig. 3, for the embodiment of the fin-type heat dissipation plate 1 of the present invention, including the heat dissipation plate body 11, the heat dissipation plate body 11 includes the first heat dissipation surface 12 and the second heat dissipation surface 13 correspondingly disposed with the first heat dissipation surface 12, the first heat dissipation surface 12 has the sinking groove 14, the sinking groove 14 is located in the middle region of the first heat dissipation surface 12, the side wall of the sinking groove 14 is inclined inward, one or more heat dissipation fins 15 are disposed in the inside of the sinking groove 14 by the array, and the top of the heat dissipation fins 15 does not exceed the first heat dissipation surface 12.
The first heat dissipation surface 12 of the fin-type heat dissipation plate is provided with the sinking groove 14, and one or more heat dissipation fins 15 are arranged in the sinking groove 14 in an array manner, because the top ends of the heat dissipation fins 15 do not exceed the first heat dissipation surface 12 (that is, the heat dissipation fins 15 are hidden in the sinking groove 14), the heat dissipation plate body 11 forms a protection effect on the heat dissipation fins 15, so that the heat dissipation fins 15 cannot be easily damaged by external acting force, and cannot be easily deformed or damaged; simultaneously heat radiation fin 15 is set up in the inside of heavy groove 14, can not lead to the increase of the thickness of heating panel body 11, consequently, than traditional heat radiation structure's thickness stack mode, the fin formula heating panel can make the thickness of heat radiation plate reduce relatively, thereby makes and adopts the electronic equipment of fin formula heating panel's thickness reduces relatively to reduce the whole volume of equipment, promote portability and use sense.
In this embodiment, one or more heat dissipation fins 15 may be arranged in parallel, radially, or in a segmented manner, and the arrangement of the heat dissipation fins 15 is diversified, which is not limited herein.
As shown in fig. 1 to 7, for the embodiment of the heat radiation structure is applied to fin type heat dissipation plate 1, the heat radiation structure includes circuit board 2, heating element 21, fin type heat dissipation plate 1 is applied to the heat radiation structure, fin type heat dissipation plate 1's second cooling surface 13 is equipped with recess 16, the both ends of second cooling surface 13 all are equipped with recess 16, recess 16 is used for holding heat radiation structure's heating element 21, heat dissipation plate 1 is fixed connection with circuit board 2, heating element 21 is fixed on circuit board 2, simultaneously heating element 21 is embedded into heat dissipation plate 1 and is just held by recess 16 on the second cooling surface 13. In the present embodiment, the circuit board 2 may be, but is not limited to, fixed to the heat dissipation plate 1 by screws. Through heat radiation structure circuit board 2 with the above-mentioned cooperation mode of fin formula heating panel 1 makes the adoption the whole equipment thickness of heat radiation structure's equipment can reduce the thickness of a heating element 21.
In a specific implementation scenario, the heating elements 21 are disposed at two ends of the heat dissipating fins 15, and the cross-sectional material of the heat dissipating plate body 11 is an inclined structure that transitions from thick to thin from the heating elements 21 to the heat dissipating fins 15, which conforms to the heat dissipating design principle, and can improve the heat conduction effect and increase the strength of the heat dissipating fins 15. The grooves 16 are preferably offset from the position of the radiator fins 15 to avoid affecting the height setting of the radiator fins 15.
In this embodiment, the heat conducting glue 3 is further coated between the heating element 21 and the bottom surface of the groove 16, so that the heat conducting effect is better, and the heat can be quickly conducted to the heat dissipation plate 1.
In this embodiment, the periphery of the sinking groove 14 is further provided with a sinking platform 17, so that the top end of the heat dissipating fin 15 is lower than the first heat dissipating surface 12, and the protection effect on the heat dissipating fin 15 is better.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A finned heat sink comprising:
the radiating plate body comprises a first radiating surface and a second radiating surface, wherein the second radiating surface is arranged corresponding to the first radiating surface, the first radiating surface is provided with a sinking groove, one or more radiating fins are arranged in the sinking groove in an array mode, and the top end of each radiating fin does not exceed the first radiating surface.
2. The finned heat sink of claim 1, wherein each of said heat fins are arranged in parallel.
3. The finned heat sink as claimed in claim 1, wherein each of said fins is arranged in a radial pattern.
4. The finned heat sink of claim 1 wherein each of said heat fins is a segmented structure.
5. The finned heat sink as claimed in claim 1, wherein the periphery of the sinking groove is further provided with a sinking platform, and the top end of each of the heat dissipating fins is lower than the first heat dissipating surface.
6. The finned heat sink as claimed in claim 1, wherein the second heat sink has a groove, the groove receiving a heat generating element.
7. The finned heat sink as claimed in claim 6, wherein the grooves are formed at both ends of the second heat dissipating surface.
8. The finned heat sink as claimed in claim 6, wherein the sinking groove is located in a middle region of the first heat dissipating surface, and a sidewall of the sinking groove is inclined inward.
9. The finned heat sink as claimed in claim 6, wherein a heat conductive adhesive is further coated between the heat generating elements and the bottom surface of the groove.
10. The finned heat sink as claimed in claim 6, wherein the cross section of the heat sink body is a slope structure from the heat generating element to each of the heat dissipating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221712819.7U CN218042231U (en) | 2022-07-05 | 2022-07-05 | Fin type heat dissipation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221712819.7U CN218042231U (en) | 2022-07-05 | 2022-07-05 | Fin type heat dissipation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218042231U true CN218042231U (en) | 2022-12-13 |
Family
ID=84379947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221712819.7U Active CN218042231U (en) | 2022-07-05 | 2022-07-05 | Fin type heat dissipation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218042231U (en) |
-
2022
- 2022-07-05 CN CN202221712819.7U patent/CN218042231U/en active Active
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