CN211088250U - Heat radiation structure and chip assembly - Google Patents
Heat radiation structure and chip assembly Download PDFInfo
- Publication number
- CN211088250U CN211088250U CN202020165471.9U CN202020165471U CN211088250U CN 211088250 U CN211088250 U CN 211088250U CN 202020165471 U CN202020165471 U CN 202020165471U CN 211088250 U CN211088250 U CN 211088250U
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- chip
- radiating fin
- heat dissipation
- bridge
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a chip protection technical field provides a heat radiation structure and chip subassembly, and wherein heat radiation structure includes: the first radiating fin is used for being connected to the chip; the second radiating fin is used for being connected to the shell and is arranged at intervals with the first radiating fin; the first bridging piece is connected between the first radiating fin and the second radiating fin and is an elastic piece; the second bridging piece is connected between the first radiating fin and the second radiating fin and arranged at an interval with the first bridging piece, and the second bridging piece is an elastic piece; the chip assembly comprises the heat dissipation structure and a chip; the utility model provides a heat radiation structure and chip subassembly has following advantage: be equipped with the elastic deformation chamber, and the both sides in elastic deformation chamber are arranged respectively in to chip and casing for when the casing receives the impact, the elastic deformation chamber can take place to warp in order to reduce to strike the influence to the chip, has ensured chip good performance.
Description
Technical Field
The utility model relates to a chip protection technical field, more specifically say, relate to a heat radiation structure and chip subassembly.
Background
Because the power consumption of electronic product chips is getting bigger and bigger, a large amount of heat can be generated during work, manufacturers usually conduct the chips to the metal shell of the product by directly connecting the chips to the metal shell of the product through leading the chips into media such as silica gel or heat pipes on the electronic products with metal shells to enhance the heat dissipation effect in order to enhance the heat dissipation effect of the electronic products. However, this design has the following disadvantages: when being impacted by external force, the chip can be subjected to larger impact force, so that the chip is exposed to larger failure risk.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat radiation structure and chip subassembly to solve the poor technical problem of protectiveness of the chip that exists among the prior art.
In order to achieve the above object, the utility model discloses a technical scheme is a heat radiation structure, include:
the first radiating fin is used for being connected to the chip;
the second cooling fin is used for being connected to the shell and is arranged at intervals with the first cooling fin;
the first bridging piece is connected between the first radiating fin and the second radiating fin and is an elastic piece; and
the second bridging piece is connected between the first radiating fin and the second radiating fin and arranged at an interval with the first bridging piece, and the second bridging piece is an elastic piece;
the first radiating fin, the second radiating fin, the first bridging piece and the second bridging piece are enclosed to form an elastic deformation cavity.
In one embodiment, the first bridge piece and/or the second bridge piece are "C" shaped in cross-section.
In one embodiment, the first bridge piece and/or the second bridge piece protrude towards the outside of the elastically deformable cavity.
In one embodiment, the first bridge piece and/or the second bridge piece protrude towards the interior of the elastically deformable cavity.
In one embodiment, the first bridge piece and/or the second bridge piece are/is an elastic piece formed by bending.
In one embodiment, the second fins extend towards both sides of the elastically deformable cavity.
In one embodiment, the first heat sink, the second heat sink, the first bridge piece and the second bridge piece are integrally formed.
In one embodiment, the bridge comprises at least two first bridge pieces and at least two second bridge pieces, and the first bridge pieces and the second bridge pieces are sequentially arranged adjacently.
In one embodiment, a side of the first heat sink away from the elastically deformable cavity is provided with a heat sink for attachment of the chip.
Another object of the present invention is to provide a chip assembly, which includes the above heat dissipation structure and a chip disposed on the heat dissipation structure.
The utility model provides a heat radiation structure and chip subassembly's beneficial effect lies in:
the heat of the first radiating fin is transferred to the second radiating fin through the first bridging fin and the second bridging fin, so that the heat of the chip is transferred to the shell, and the radiating effect is promoted; simultaneously, first fin, second fin, first bridging piece and second bridging piece enclose to close and form the elastic deformation chamber, and the both sides in elastic deformation chamber are arranged respectively in chip and casing for when the casing receives the impact, the elastic deformation chamber can take place to warp in order to reduce the impact to the influence of chip, ensured the good performance of chip.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a three-dimensional structure diagram of a heat dissipation structure provided in an embodiment of the present invention;
fig. 2 is an exploded view of a heat dissipation structure provided in an embodiment of the present invention;
fig. 3 is a front view of a heat dissipation structure provided by an embodiment of the present invention;
fig. 4 is an enlarged view at "a" of fig. 3.
The figures are numbered:
a heat dissipation structure-1; a first heat sink-11; a second heat sink-12; a first bridge piece-13; a second bridge piece-14;
a chip-2;
a shell-3;
a circuit board-4;
a heat sink-5.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention, and are not intended to indicate that a device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise. The following describes the specific implementation of the present invention in more detail with reference to specific embodiments:
as shown in fig. 1 to 4, an embodiment of the present invention provides a heat dissipation structure 1, where the heat dissipation structure 1 is used to set between a chip 2 and a housing 3, so that a preset distance is formed between the chip 2 and the housing 3 to increase the protection performance of the chip 2.
The heat dissipation structure 1 includes:
the first heat sink 11 is used for being connected to the chip 2, and the area of the connection surface of the first heat sink 11 and the chip 2 is larger than that of the chip 2, so that the heat dissipation effect of the first heat sink 11 is improved;
a second heat sink 12 connected to the housing 3 and spaced apart from the first heat sink 11;
the first bridging piece 13 is connected between the first radiating fin 11 and the second radiating fin 12, and the first bridging piece 13 is an elastic piece; and
a second bridging piece 14 connected between the first heat sink 11 and the second heat sink 12 and spaced from the first bridging piece 13 by a predetermined distance, the second bridging piece 14 being an elastic piece;
the first radiating fin 11, the second radiating fin 12, the first bridging piece 13 and the second bridging piece 14 enclose to form an elastic deformation cavity.
The heat dissipation and protection principle of the heat dissipation structure 1 provided by the embodiment is as follows:
placing the shell 3 and the chip 2 on two sides of the heat dissipation structure 1, specifically, the shell 3 is connected to the second heat dissipation plate 12, the chip 2 is connected to the first heat dissipation plate 11, and the first bridging plate 13 and the second bridging plate 14 transfer the heat of the first heat dissipation plate 11 to the second heat dissipation plate 12; first fin 11, second fin 12, first bridging piece 13 and second bridging piece 14 enclose to close simultaneously and form the elastic deformation chamber, and when casing 3 received the impact, because of first bridging piece 13 and second bridging piece 14 have elastic deformation ability, consequently the elastic deformation chamber can take place deformation to the impact force that slows down chip 2 and receive ensures that chip 2's performance is good.
It should be further noted that, generally, the chip 2 is disposed on the circuit board 4, and is disposed on a side of the chip 2 away from the circuit board 4, and the heat dissipation structure 1 is disposed between the chip 2 and the housing 3.
The utility model provides a heat radiation structure 1's beneficial effect lies in:
the heat of the first heat sink 11 is transferred to the second heat sink 12 through the first bridging pieces 13 and the second bridging pieces 14, so that the heat of the chip 2 is transferred to the housing 3, and the heat dissipation effect is promoted; meanwhile, the first radiating fins 11, the second radiating fins 12, the first bridging pieces 13 and the second bridging pieces 14 are enclosed to form an elastic deformation cavity, and the chip 2 and the shell 3 are respectively arranged on two sides of the elastic deformation cavity, so that when the shell 3 is impacted, the elastic deformation cavity can deform to reduce the impact on the chip 2, and the good performance of the chip 2 is guaranteed.
In one embodiment, the first and second bridge pieces 13 and 14 have a cross-sectional shape of a "C". In another embodiment, the first bridge piece 13 or the second bridge piece 14 has a cross-sectional shape of a "C". Preferably, the first and second bridging pieces 13 and 14 have a cross-sectional shape of a letter "C", the first and second bridging pieces 13 and 14 are respectively provided at both ends of the first and second heat radiating fins 11 and 12, and the first and second bridging pieces 13 and 14 support the first and second heat radiating fins 11 and 12 such that the elastically deformable cavity can be maintained.
Optionally, the first 13 and second 14 bridge pieces protrude towards the outside of the elastically deformable cavity. It will be appreciated that by projecting the first bridging piece 13 and the second bridging piece 14 outward, the transition at the junction of the first bridging piece 13 and the first heat sink 11, the junction of the first bridging piece 13 and the second heat sink 12, and the transition at the junction of the second bridging piece 14 and the first heat sink 11, the junction of the second bridging piece 14 and the second heat sink 12, can be made more gradual, facilitating the manufacture of the entire heat dissipation structure 1.
Optionally, the first 13 and second 14 bridge pieces protrude towards the inside of the elastically deformable cavity. It can be understood that, by protruding the first bridging piece 13 and the second bridging piece 14 towards the inside, the volume of the heat dissipation structure 1 can be reduced, the integration level of the electronic product can be improved, and the volume of the electronic product can be reduced.
Of course, the protruding directions of the first bridging piece 13 and the second bridging piece 14 may be opposite or the same, for example, the first bridging piece 13 protrudes toward the inside of the elastic deformation cavity, and the second bridging piece 14 protrudes toward the outside of the elastic deformation cavity, or the first bridging piece 13 protrudes toward the outside of the elastic deformation cavity, and the second bridging piece 14 protrudes toward the inside of the elastic deformation cavity, so as to adapt to different requirements of electronic products.
In one embodiment, the first bridge piece 13 and the second bridge piece 14 are elastic pieces formed by bending. In other embodiments, the first bridging piece 13 or the second bridging piece 14 is an elastic piece formed by bending. It will be appreciated that the method of manufacture of the spring formed by bending is simple, and in particular the spring may be formed by bending a sheet of material into a "Z" shape.
In one embodiment, the second fins 12 extend towards both sides of the elastically deformable cavity. In this embodiment, the area of the connection surface of the second heat sink 12 and the housing 3 is larger than the area of the first heat sink 11, so as to enhance the heat dissipation performance of the second heat sink 12, and meanwhile, increasing the area of the second heat sink 12 can reduce the pressure of the second heat sink 12 when the impact force is applied, reduce the influence of the impact force on the second heat sink 12, and further reduce the influence on the chip 2.
In one embodiment, the first heat sink 11, the second heat sink 12, the first bridge piece 13 and the second bridge piece 14 are integrally formed. In the present embodiment, the first heat sink 11, the second heat sink 12, the first bridging piece 13 and the second bridging piece 14 are integrally formed, so that the heat dissipation effect of the heat dissipation structure 1 is better; specifically, the heat dissipation structure 1 may be formed by bending a plate body, and the manufacturing method thereof is simple and is beneficial to reducing the production cost.
In one embodiment, the heat dissipation structure 1 includes at least two first bridging pieces 13 and at least two second bridging pieces 14, and the first bridging pieces 13 and the second bridging pieces 14 are sequentially and adjacently disposed. It can be understood that the elastic force of the heat dissipation structure 1 can be increased by increasing the number of the first bridging pieces 13 and the second bridging pieces 14, and different numbers of the first bridging pieces 13 and the second bridging pieces 14 can be selected to form the heat dissipation structure 1 with an elastic deformation cavity with appropriate elastic force according to different environmental requirements.
In one embodiment, the side of the first heat sink 11 remote from the elastically deformable cavity is provided with a heat sink 5 for attachment of the chip 2. In this embodiment, the heat dissipation member 5 is a heat conductive silicone, and the heat on the chip 2 can be more effectively transferred to the first heat dissipation plate 11 by the heat conductive silicone.
Another object of the present invention is to provide a chip 2 assembly, which includes the above heat dissipation structure 1 and a chip 2 disposed on the heat dissipation structure 1.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A heat dissipation structure, comprising:
the first radiating fin is used for being connected to the chip;
the second cooling fin is used for being connected to the shell and is arranged at intervals with the first cooling fin;
the first bridging piece is connected between the first radiating fin and the second radiating fin and is an elastic piece; and
the second bridging piece is connected between the first radiating fin and the second radiating fin and arranged at an interval with the first bridging piece, and the second bridging piece is an elastic piece;
the first radiating fin, the second radiating fin, the first bridging piece and the second bridging piece are enclosed to form an elastic deformation cavity.
2. The heat dissipation structure of claim 1, wherein the first bridge piece and/or the second bridge piece has a cross-sectional shape of a "C".
3. The heat dissipation structure of claim 1, wherein the first bridge piece and/or the second bridge piece protrude toward an outside of the elastic deformation chamber.
4. The heat dissipation structure of claim 1, wherein the first bridge piece and/or the second bridge piece protrude toward an inside of the elastic deformation chamber.
5. The heat dissipating structure of claim 1, wherein the first and/or second bridge pieces are resilient members formed by bending.
6. The heat dissipating structure of any one of claims 1 to 5, wherein the second fins extend toward both sides of the elastically deformable cavity.
7. The heat dissipating structure of any one of claims 1 to 5, wherein the first heat sink, the second heat sink, the first bridge piece and the second bridge piece are integrally formed.
8. The heat dissipating structure of any one of claims 1 to 5, comprising at least two of said first bridge pieces and at least two of said second bridge pieces, said first bridge pieces and said second bridge pieces being disposed adjacent to one another in sequence.
9. The heat dissipation structure according to any one of claims 1 to 5, wherein a side of the first heat dissipation fin remote from the elastically deformable cavity is provided with a heat dissipation member for attachment of the chip.
10. A chip assembly comprising the heat dissipation structure of any one of claims 1 to 9 and a chip provided on the heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020165471.9U CN211088250U (en) | 2020-02-12 | 2020-02-12 | Heat radiation structure and chip assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020165471.9U CN211088250U (en) | 2020-02-12 | 2020-02-12 | Heat radiation structure and chip assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211088250U true CN211088250U (en) | 2020-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020165471.9U Expired - Fee Related CN211088250U (en) | 2020-02-12 | 2020-02-12 | Heat radiation structure and chip assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211088250U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113895655A (en) * | 2021-11-10 | 2022-01-07 | 北京微纳星空科技有限公司 | Momentum wheel damping installation component and spacecraft |
-
2020
- 2020-02-12 CN CN202020165471.9U patent/CN211088250U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113895655A (en) * | 2021-11-10 | 2022-01-07 | 北京微纳星空科技有限公司 | Momentum wheel damping installation component and spacecraft |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200724 Termination date: 20220212 |
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| CF01 | Termination of patent right due to non-payment of annual fee |