CN216852647U

CN216852647U - Upper shell structure of inverter for improving heat dissipation efficiency

Info

Publication number: CN216852647U
Application number: CN202123069905.9U
Authority: CN
Inventors: 彭志权; 何金金
Original assignee: Shenzhen Shengnengjie Technology Co ltd
Current assignee: Shenzhen Shengnengjie Technology Co ltd
Priority date: 2021-12-08
Filing date: 2021-12-08
Publication date: 2022-06-28
Anticipated expiration: 2031-12-08

Abstract

The utility model relates to an inverter upper shell structure for improving heat dissipation efficiency, which comprises a shell, wherein a ceramic gasket is arranged in the shell, a bulge corresponding to the position of the ceramic gasket is arranged on the outer side of the shell, the thickness of the bulge is 2.5-3.5mm, ribs are arranged on the outer side of the shell and the outer side of the bulge, and the outer end faces of all the ribs are parallel and level; the utility model aims at providing an improve shell structure on inverter of radiating efficiency, the position that corresponds with ceramic pad position outside the casing increases the arch, this kind of bellied mode of increase has only increased about 0.1 Kg to the total weight of box, but makes IGBT/Diode's the highest temperature drop 1.5 ℃, its effect is equivalent to the fin highly increased 5mm, and the weight that increases is far less than the fin highly increased 5mm again, has higher income.

Description

Upper shell structure of inverter for improving heat dissipation efficiency

Technical Field

The utility model relates to a heat radiation structure field especially relates to an improve shell structure on dc-to-ac converter of radiating efficiency.

Background

The casing of the box body is designed by die-casting aluminum, the thickness of the box body is 2.5mm, and the rear cover of the box body is equivalent to a radiator substrate; the IGBT/Diode radiates heat to the outside air through a main radiating path of a ceramic gasket, a box body rear cover and a radiator fin; the IGBT/Diode is packaged by TO-247 and has the size of about 21 × 16 × 5 mm; the ceramic pad is slightly larger in size, about 26 x 20 x 1mm in size. The ceramic gasket is contacted with the rear cover of the box body, the size of a contact surface is 26 x 20mm, and the contact area is smaller, so that the diffusion thermal resistance on the box body is larger; in addition, the box body is small in thickness (2.5 mm), heat is still concentrated when the heat is transferred from the inner side to the outer side of the rear cover of the box body, so that the temperature of the position where the IGBT/Diode is adhered on the rear cover of the box body is high, the temperature of the position where the IGBT/Diode is not adhered is low, and the temperature distribution on the rear cover of the whole box body is uneven; the heat distribution is concentrated and is very unfavorable for heat dissipation, and for the heat dissipation of the IGBT/Diode adopting the die-casting box body, because the IGBT/Diode takes the rear cover of the die-casting box body as the base plate of the heat radiator, the thickness of the box body is too thin, the diffusion thermal resistance of the IGBT/Diode is larger, and the heat dissipation of the IGBT/Diode is influenced; the common method is to add a copper substrate or an aluminum substrate on the inner side of the back cover, the thickness of the substrate is about 8mm, and the device is heated to the radiator rib after the temperature of the device is equalized by the substrate. The heat conductivity coefficient of copper is higher than that of aluminum, so the temperature equalizing effect of the copper substrate is better; however, this method has the following problems: the increased copper/aluminum substrate has larger size and weight and greatly increased cost; a large area of heat-conducting silicone grease is required to be coated between the copper/aluminum substrate and the rear cover of the box body to fill the gap between the copper/aluminum substrate and the rear cover of the box body, so that the thermal contact resistance is reduced; the copper/aluminum substrate occupies the internal space of the box body, and the internal space is limited, which reflects that the total size of the whole machine is increased inevitably; the improvement of the heat dissipation of the IGBT/Diode by this method is indeed obvious, but the cost is unacceptable.

The other method is to directly thicken the thickness of the rear cover of the box body, and directly thicken the surface tightly attached to the IGBT/Diode to 8mm, so that the coating of heat-conducting silicone grease can be omitted. This also has the following problems: the thermal conductivity of the die-cast aluminum ADC12 is only about 96W/(m-K), which is lower than that of AL6063 and copper, and the heat dissipation effect is inferior to that of a copper/aluminum substrate; the weight of the rear cover of the box body is obviously increased, so that the production cost is obviously increased; if the overall size of the whole machine is not changed, the increased thickness occupies part of the height of the fins of the radiator, so that the heat dissipation of devices in the box body is obviously poor.

How to improve the heat dissipation efficiency and improve the temperature rise performance of the whole machine on the premise of not changing the overall size and increasing the weight of the shell as little as possible becomes a technical problem to be solved urgently.

Disclosure of Invention

The utility model aims at providing an improve shell structure on inverter of radiating efficiency, the position that corresponds with ceramic pad position outside the casing increases the arch, this kind of bellied mode of increase has only increased about 0.1 Kg to the total weight of box, but makes IGBT/Diode's the highest temperature drop 1.5 ℃, its effect is equivalent to the fin highly increased 5mm, and the weight that increases is far less than the fin highly increased 5mm again, has higher income.

In order to realize the above purpose, the utility model discloses a technical scheme be: the utility model provides an improve shell structure on dc-to-ac converter of radiating efficiency, includes the casing, the casing in be provided with ceramic gasket, the outside of casing be provided with the arch that corresponds with ceramic gasket position, bellied thickness be 2.5-3.5mm, the outside and the bellied outside of casing are provided with the fin, and the outer terminal surface parallel and level of all fins.

Preferably, the area of the bulge is 3-4 times of the area of the ceramic gasket, and the bulge corresponds to the central position of the ceramic gasket.

Preferably, when the corresponding protrusions of two or more ceramic gaskets have overlapping portions, the corresponding protrusions are connected into one piece.

The utility model has the advantages that:

the bulge is added at the position corresponding to the position of the ceramic gasket outside the shell, the total weight of the box body is only increased by about 0.1 Kg by the bulge increasing mode, but the highest temperature of the IGBT/Diode is reduced by 1.5 ℃, the effect is equivalent to that the height of the fin is increased by 5mm, the increased weight is far less than that of the fin, the height of the fin is increased by 5mm, the high gain is realized, and the popularization can be realized.

Drawings

Fig. 1 is a perspective view illustrating an upper case structure of an inverter for improving heat dissipation efficiency.

Fig. 2 is a front view of an upper case structure of an inverter for improving heat dissipation efficiency.

Fig. 3 is a reverse perspective view illustrating an upper case structure of an inverter for improving heat dissipation efficiency.

The text labels shown in the figures are represented as: 1. a housing; 2. a ceramic gasket; 3. ribs; 4. and (4) protruding.

Detailed Description

In order to make the technical solution of the present invention better understood, the present invention is described in detail below with reference to the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention.

As shown in fig. 1-3, the specific structure of the present invention is: an upper shell structure of an inverter for improving heat dissipation efficiency comprises a shell 1, wherein a ceramic gasket 2 is arranged in the shell 1, a protrusion 4 corresponding to the ceramic gasket 2 is arranged on the outer side of the shell 1, the thickness of the protrusion 4 is 2.5-3.5mm, fins 3 are arranged on the outer side of the shell 1 and the outer side of the protrusion 4, and the outer end faces of all the fins 3 are flush; the area of the bulge 4 is 3-4 times of the area of the ceramic gasket 2, and the bulge 4 corresponds to the center position of the ceramic gasket 2; when the corresponding protrusions 4 of two or more ceramic gaskets 2 have overlapping portions, the corresponding protrusions 4 are connected integrally.

In the specific use process of the shell structure, heat generated by the IGBT/Diode is transferred to the shell 1 through the ceramic gasket and then diffused into the protrusions 4, and then the cylindrical fins 3 are diffused out, so that compared with the shell structure without the protrusions 4, the average temperature of all the IGBT/Diode is reduced by 1 ℃, and particularly the temperature of the BOOST IGBT/Diode extending out of the edge of the radiator is reduced by more (about 1.5 ℃); for natural heat dissipation, the temperature rise improvement of 1.5 ℃ is obtained at the cost of 0.1 Kg, and the benefit is worth; if the forced heat dissipation is carried out, the income is larger; the total weight of the die-casting shell is increased by about 0.1 Kg, the increased cost is low, and the die opening difficulty is not increased; the total size of the shell is not changed, the temperature of the IGBT/Diode is obviously reduced, and the overall temperature of the die-casting box body is also slightly reduced.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes can be made without departing from the principle of the present invention, and the above technical features can be combined in a proper manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.

Claims

1. The utility model provides an improve shell structure on inverter of radiating efficiency, includes casing (1), casing (1) in be provided with ceramic gasket (2), its characterized in that, the outside of casing (1) be provided with arch (4) that correspond with ceramic gasket (2) position, the thickness of arch (4) be 2.5-3.5mm, the outside of casing (1) and the outside of arch (4) are provided with fin (3), and the outer terminal surface parallel and level of all fin (3).

2. The structure of the upper case for an inverter for improving heat dissipation efficiency as claimed in claim 1, wherein the area of the protrusion (4) is 3-4 times the area of the ceramic spacer (2), and the protrusion (4) corresponds to the center of the ceramic spacer (2).

3. The upper case structure for inverter for improving heat dissipation efficiency according to claim 2, wherein the corresponding protrusions (4) of two or more ceramic gaskets (2) are integrally connected when the corresponding protrusions (4) have overlapping portions.