CN212695150U

CN212695150U - LED packaging product

Info

Publication number: CN212695150U
Application number: CN202120298615.2U
Authority: CN
Inventors: 李振宁; 胡再励
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2021-03-12
Anticipated expiration: 2031-02-03

Abstract

The utility model relates to a LED encapsulates product, including insulating substrate and chip, insulating substrate's the fixed positive circuit that is provided with in front, insulating substrate's the fixed back circuit that is provided with in back, the front circuit with back line connection switches on, all be provided with the line on insulating substrate and the front line circuit, the chip is fixed to be arranged in the front circuit the line is on the way, the chip with front circuit electric connection, be provided with the encapsulation on the insulating substrate the encapsulation of insulating substrate, front circuit and chip is glued. Compared with the prior art, the utility model discloses utilize the line to hold unnecessary silver and glue, can avoid unnecessary silver to glue and spill over short circuit or the electric leakage that positive circuit leads to.

Description

LED packaging product

Technical Field

The utility model relates to a LED technical field, particularly, in particular to LED encapsulates product.

Background

An LED packaging product in the prior art comprises a support, an RGB three-color chip fixedly arranged on the support, and a bonding wire for connecting the chip and the support. The support adopts a flat BT substrate which comprises a front circuit, a back circuit and an insulating base material arranged between the front circuit and the back circuit.

Specifically, the front surface circuit is divided into a die bonding functional area and a wire bonding functional area. The red light chip is fixed on the red light die bonding functional area by adopting silver adhesive, and the blue light and green light chips are fixed on the corresponding die bonding functional areas by adopting insulating adhesive. The two ends of the bonding wire respectively connect the electrodes of the red light chip, the green light chip and the blue light chip with the corresponding bonding wire functional regions for realizing electrical interconnection, and the common anode is shown in fig. 1. The back circuit is used for being welded with a PCB of the LED display screen module, and the front circuit and the back circuit are connected and conducted through the through hole.

The prior art also has the following problems: the die bonding functional area and the wire bonding functional area on the substrate are both higher than the insulating base material, namely the die bonding functional area and the wire bonding functional area are both higher than the insulating isolation area. The silver colloid has fluidity and conductivity, so that the phenomenon of excessive colloid or colloid throwing is easy to occur in the manufacturing process of the LED packaging product, the silver colloid overflows from the solid crystal functional region and flows into the insulating isolation region, and then two or more independent functional regions are connected together, so that the LED packaging product is subjected to electric leakage or short circuit, and the LED packaging product is invalid.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the above-mentioned technical problem among the prior art to a certain extent at least. Therefore, an object of the present invention is to provide an LED package product capable of avoiding short circuit or electric leakage.

The utility model provides an above-mentioned technical problem's technical scheme as follows: including insulating base plate and chip, insulating base plate's the fixed positive circuit that is provided with in front, insulating base plate's the fixed back circuit that is provided with in back, the front circuit with back line connection switches on, all be provided with the line on insulating base plate and the positive line circuit, the chip is fixed to be arranged in the positive circuit the line is on the road, the chip with positive circuit electric connection, be provided with the encapsulation on the insulating base plate the encapsulation of insulating base plate, positive circuit and chip is glued.

The utility model has the advantages that: utilize the line to hold unnecessary silver glue, can avoid unnecessary silver glue to spill over short circuit or the electric leakage that positive circuit leads to reduce quality anomaly in the LED encapsulation product production process, improve production efficiency, be used for satisfying a large amount of demands of high-end LED booth apart from the display screen well.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Further, the chips comprise a blue light chip, a green light chip and a red light chip, the blue light chip, the green light chip and the red light chip are fixed on the front surface circuit, the blue light chip, the green light chip and the red light chip are all connected with the front surface circuit through bonding wires, and the red light chip is located on the lines of the front surface circuit.

The beneficial effect of adopting the further scheme is that: the lines are used for accommodating the overflow glue generated in the fixing process of the red light chip, and the short circuit or the electric leakage caused by the overflow of the redundant silver glue on the front circuit can be avoided.

Further, the front circuit comprises a die bonding area and a wire bonding area which are fixedly arranged on the insulating substrate, the blue chip, the green chip and the red chip are fixedly arranged on the die bonding area, the blue chip, the green chip and the red chip are electrically connected with the wire bonding area through the bonding wires, and the lines are arranged on the die bonding area where the red chip is located and the circumferential insulating substrate.

The beneficial effect of adopting the further scheme is that: the lines are used for accommodating the overflow glue generated in the fixing process of the red light chip, so that the short circuit or electric leakage caused by the overflow of the redundant silver glue in the die bonding area can be avoided.

Further, the lines are of a net structure.

The beneficial effect of adopting the further scheme is that: redundant silver colloid on the grids among the grains flows into the grains at the periphery of the grids, so that short circuit or electric leakage caused by overflow of the redundant silver colloid in the solid crystal region can be avoided.

Further, an insulating layer is arranged on the insulating substrate and surrounds the front surface circuit.

The beneficial effect of adopting the further scheme is that: the insulating layer insulates and separates the die bonding area and the welding wire area on the front circuit, and short circuit or electric leakage of the front circuit is avoided.

Furthermore, the height of the top end of the insulating layer relative to the insulating substrate is higher than that of the top end of the front circuit relative to the insulating substrate.

The beneficial effect of adopting the further scheme is that: the silver colloid has the effect of isolating and blocking the solid crystal area and the welding line area, and short circuit or electric leakage caused by overflow of the silver colloid from the solid crystal area is avoided.

Drawings

FIG. 1 is a front view of a prior art LED package product;

FIG. 2 is a cross-sectional view of a prior art LED package product;

fig. 3 is a front view of the LED packaged product of the present invention with respect to the first embodiment;

fig. 4 is a cross-sectional view of the LED packaged product of the present invention with respect to the first embodiment;

fig. 5 is a front view of the LED packaged product of the present invention with respect to a second embodiment;

fig. 6 is a sectional view of the LED package product according to the second embodiment of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. an insulating substrate;

2. 2.1 chip, blue light chip, 2.2 chip, green light chip, 2.3 chip, red light chip;

3. a front circuit 3.1, a die bonding area 3.2 and a wire bonding area;

4. a back side circuit;

5. lines;

6. silver glue;

7. a bonding wire;

8. an insulating layer;

9. and (7) packaging the glue.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

Example 1:

as shown in fig. 3 and fig. 4, the structure of the first embodiment of the LED packaged product of the present invention is schematically illustrated. The utility model provides a LED encapsulation product, including insulating substrate 1 and chip 2, insulating substrate 1's the fixed positive circuit 3 that is provided with in front, insulating substrate 1's the fixed back circuit 4 that is provided with in the back, positive circuit 3 with back circuit 4 is connected and is switched on, all be provided with line 5 on insulating substrate 1 and the positive circuit 3, chip 2 is fixed to be arranged in positive circuit 3 on the line 5, chip 2 with 3 electric connection of positive circuit, be provided with the encapsulation on insulating substrate 1 the encapsulation of insulating substrate 1, positive circuit 3 and chip 2 is glued 9.

Specifically, the lines 5 are shallow grooves formed in the insulating substrate 1 and the front surface line 3 by etching or other prior art; the grains 5 are arranged in parallel or staggered with each other and are arranged in the circumferential direction of the chip 2; the lines 5 are not easy to be too deep, and the too deep lines 5 can reduce the strength of the insulating substrate 1 and influence the quality of LED packaging products; the texture 5 is not too shallow, and the ability to contain the silver paste 6 is reduced if the texture 5 is too shallow.

In the above embodiment, the chip 2 includes a blue chip 2.1, a green chip 2.2, and a red chip 2.3, the blue chip 2.1, the green chip 2.2, and the red chip 2.3 are fixed on the front surface circuit 3, the blue chip 2.1, the green chip 2.2, and the red chip 2.3 are all connected to the front surface circuit 3 through a bonding wire 7, and the red chip 2.3 is located on the grain 5 of the front surface circuit 3.

Furthermore, the blue light chip 2.1 and the green light chip 2.2 are fixed on the front circuit 3 through insulating glue, and the red light chip 2.3 is fixed on the lines 5 of the front circuit 3 through silver glue 6. At ruddiness chip 2.3 solid brilliant in-process, the extrusion that red light chip 2.3 received silver colloid 6 can take place to overflow gluey, if the silver colloid 6 is glued more, then overflow gluey phenomenon is more serious, usable line 5 holds unnecessary silver colloid 6 this moment, in order to avoid unnecessary silver colloid 6 to overflow the short circuit or the electric leakage that positive circuit 3 leads to, thereby reduce the quality anomaly in the LED encapsulation product production process, and the production efficiency is improved, in order to satisfy a large amount of demands of high-end LED booth apart from the display screen well.

In the above embodiment, the front surface circuit 3 includes a die attach region 3.1 and a wire attach region 3.2 fixedly disposed on the insulating substrate 1, the blue light chip 2.1, the green light chip 2.2 and the red light chip 2.3 are fixedly disposed on the die attach region 3.1, the blue light chip 2.1, the green light chip 2.2 and the red light chip 2.3 are electrically connected to the wire attach region 3.2 through the bonding wire 7, and the grain 5 is disposed on the die attach region 3.1 where the red light chip 2.3 is located and the circumferential insulating substrate 1.

The grains 5 are arranged on the solid crystal region 3.1 where the red light chip 2.3 is located and the circumferential insulating substrate 1, and overflow glue generated in the fixing process of the red light chip 2.3 is contained by the grains 5, so that short circuit or electric leakage caused when the redundant silver glue 6 overflows the solid crystal region 3.1 can be avoided.

In the above embodiment, the texture 5 is a net structure.

Lines 5 are of a net structure, a plurality of grids are constructed between lines 5, the height of the top of each grid is higher than that of the bottom of each line 5, and the lines 5 surround the grids. Because of the fluidity and the electric conductivity of the silver colloid 6, the redundant silver colloid on the grids between the grids 5 flows to the grids circumferential direction of the grids 5, the flow path of the redundant silver colloid is short, the flow speed is slow, and the short circuit or the electric leakage caused by the overflow of the redundant silver colloid 6 to the solid crystal region 3.1 can be avoided. Furthermore, increasing the density of the vein 5 allows the vein 5 to accommodate more silver paste 6.

Example 2:

as shown in fig. 5 and fig. 6, the structure of the LED packaged product according to the second embodiment of the present invention is schematically illustrated. The utility model provides a LED encapsulates the product, on embodiment 1's basis, be provided with insulating layer 8 on the insulating substrate 1, insulating layer 8 encircles positive circuit 3.

The insulating layer 8 is made of ink or plastic, and the insulating layer 8 can be well adhered to the insulating substrate 1 by using the viscosity of the ink or plastic. Meanwhile, the insulating layer 8 surrounds the die bonding area 3.1 and the welding wire area 3.2, and insulates and separates the die bonding area 3.1 and the welding wire area 3.2 on the front circuit 3, so that short circuit or electric leakage of the front circuit 3 can be avoided.

In the above embodiment, the height of the top end of the insulating layer 8 relative to the insulating substrate 1 is slightly higher than the height of the top end of the front surface circuit 3 relative to the insulating substrate 1, and the height of the top end of the insulating layer 8 relative to the insulating substrate 1 is lower than the height of the top end of the bonding wire 7 relative to the insulating substrate 1.

The top height of insulating layer 8 is higher than the top height of positive circuit 3, just is higher than solid crystalline region 3.1 and bonding wire area 3.2, plays the effect of keeping apart and stopping solid crystalline region 3.1 and bonding wire area 3.2, when solid crystalline region 3.1 carries out solid crystal and the gummosis appears the silvery and glues much or the whirl coating, can avoid the silvery to spill over the short circuit or the electric leakage that solid crystalline region 3.1 leads to.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

LED encapsulation product, including insulating substrate and chip, insulating substrate's the fixed front circuit that is provided with in front, insulating substrate's the fixed back circuit that is provided with in back, the front circuit with back line connection switches on its characterized in that: all be provided with the line on insulating substrate and the positive line circuit, the chip is fixed to be arranged in the positive circuit on the line, the chip with positive circuit electric connection, be provided with the encapsulation on the insulating substrate, positive circuit and chip are glued.
2. The LED packaged product of claim 1, wherein: the chip comprises a blue light chip, a green light chip and a red light chip, wherein the blue light chip, the green light chip and the red light chip are fixed on the front surface circuit, the blue light chip, the green light chip and the red light chip are all connected with the front surface circuit through bonding wires, and the red light chip is positioned on the lines of the front surface circuit.
3. The LED packaged product of claim 2, wherein: the front circuit comprises a die bonding area and a bonding wire area which are fixedly arranged on the insulating substrate, the blue chip, the green chip and the red chip are fixedly arranged on the die bonding area, the blue chip, the green chip and the red chip are electrically connected with the bonding wire area through the bonding wire, and the grains are arranged on the die bonding area where the red chip is located and the circumferential insulating substrate.
4. The LED packaged product of claim 1, wherein: the lines are of a net structure.
5. The LED package product according to any one of claims 1 to 4, wherein: an insulating layer is arranged on the insulating substrate and surrounds the front circuit.
6. The LED package product of claim 5, wherein: the height of the top end of the insulating layer relative to the insulating substrate is higher than that of the top end of the front circuit relative to the insulating substrate.