CN212411140U - CPU-imitating radiator - Google Patents
CPU-imitating radiator Download PDFInfo
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- CN212411140U CN212411140U CN202020867305.3U CN202020867305U CN212411140U CN 212411140 U CN212411140 U CN 212411140U CN 202020867305 U CN202020867305 U CN 202020867305U CN 212411140 U CN212411140 U CN 212411140U
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- copper sheet
- heat
- base
- cpu
- heat dissipation
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Abstract
The utility model discloses an imitative CPU radiator, the on-line screen storage device comprises a base, install the electric heat copper sheet on the base, heat abstractor is installed to the upper end of electric heat copper sheet, just heat abstractor and electric heat copper sheet contact each other, the protection casing is installed to heat abstractor's periphery, the protection casing sets up on the upper surface of base, be provided with the otic placode on one side of base upper surface. The beneficial effects of the utility model are that, the utility model have the advantages of heat radiation structure is simple effective, and degree of automation is high, and the heat dissipation flexible operation is convenient to and good, the convenient to use of electronic equipment radiating effect, the utility model discloses the protection casing and otic placode and bakelite base fixed connection of radiator, and heat abstractor pass through fastening bolt and electric heat copper sheet fixed connection, through this kind of mode, make things convenient for the equipment and the dismantlement of protection casing and heat abstractor and bakelite base and otic placode to the convenient maintenance to radiator internals.
Description
Technical Field
The utility model relates to a radiator technical field, especially an imitative CPU radiator.
Background
Electronic equipment, such as printers and projectors, lack a heat dissipation device, so that an external heat dissipation device is required to ensure normal use during high-load operation. The existing heat radiators are mostly placed on the ground to directly perform simple air blowing heat dissipation, and the problems of inconvenience in use and poor heat dissipation effect exist.
The patent publication number is CN202443384U, and the china utility model patent that bulletins day is 2012.09.19 discloses a computer heat dissipation machine case, including the box, the lateral wall of box is equipped with the heat dissipation window, still includes the temperature acquisition controller, inlays on the heat dissipation window and is equipped with semiconductor cooler and radiator fan, and the temperature acquisition controller includes temperature acquisition module, host system and power conversion module, and semiconductor cooler, radiator fan, power conversion module and temperature acquisition module all are connected with the host system electricity.
But the heat dissipation machine case in this utility model patent has the problem that the automation degree of heat dissipation operation is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem, a simulated CPU radiator is designed.
Realize above-mentioned purpose the technical scheme of the utility model be, an imitative CPU radiator, the on-line screen storage device comprises a base, install the electric heat copper sheet on the base, heat abstractor is installed to the upper end of electric heat copper sheet, just heat abstractor and electric heat copper sheet contact each other, the protection casing is installed to heat abstractor's periphery, be provided with the otic placode on one side of base upper surface, the protection casing sets up in one side of otic placode.
The base is further explained, a circular through wire hole is formed in the base and used for heating the electric heating copper sheet through a wire, and a groove is formed in the upper surface of the base and used for mounting the electric heating copper sheet.
Further, the electric heating copper sheet is embedded in a groove in the base, screw holes are formed in the electric heating copper sheet, and the screw holes are used for fixing the electric heating copper sheet and the base.
The heat dissipation device is further explained, and the heat dissipation device comprises a plurality of heat dissipation fins and water cooling tubes, wherein the heat dissipation fins are vertically arranged on the upper surface of the electric heating copper sheet, and are used for absorbing heat of the electric heating copper sheet and reducing the temperature of the electric heating copper sheet.
Further, the water-cooling pipe runs through in the inside of fin and contacts with the fin, the water-cooling pipe is irregular shape, the temperature transmission of fin is for the water-cooling pipe, the inside flow of water-cooling pipe has cold water, can take away the heat of water-cooling pipe and make the water-cooling pipe temperature reduce.
The protective cover is further explained, the protective cover is integrally columnar, rectangular ventilation openings are respectively formed in the upper end face and one side end face of the protective cover, and the protective cover is fixed on one side of the ear plate.
The lug plate is further explained, a plurality of strip-shaped notches are formed in the lug plate, positioning holes are formed in the notches, and the lug plate is fixedly connected to one side of the upper surface of the base through the positioning holes.
Furthermore, the base adopts the bakelite material, the bakelite has higher mechanical strength, good insulating property, still has heat-resisting, corrosion-resistant.
Its beneficial effects lie in, 1, the utility model has the advantages of heat radiation structure is simple effective, and degree of automation is high, and the heat dissipation flexible operation is convenient to and good, the convenient to use of electronic equipment radiating effect.
2. The utility model discloses the protection casing and the otic placode and the bakelite base fixed connection of radiator, and heat abstractor pass through fastening bolt and electric heat copper sheet fixed connection, through this kind of mode, make things convenient for the equipment and the dismantlement of protection casing and heat abstractor and bakelite base and otic placode to the convenient maintenance to radiator internals.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the present invention with the protective cover removed;
FIG. 3 is a schematic structural view of the base and the ear plate of the present invention;
in the figure, 1, a base; 2. an electric copper heating sheet; 3. a heat sink; 4. a protective cover; 5. an ear plate; 6. a through hole; 7. a groove; 8. a screw hole; 9. a heat sink; 10. a water-cooled tube; 11. a vent; 12. a notch; 13. positioning holes; 14. bakelite.
Detailed Description
The purpose of the utility model is firstly explained and proposed, current heat radiator puts on the ground most and directly carries out simple heat dissipation of blowing, and it is inconvenient to have the use to and the poor problem of radiating effect, so proposed the utility model solves the above problems.
The utility model is described in detail with reference to the accompanying drawings, as shown in fig. 1, a CPU-simulated radiator comprises a base 1, wherein the base 1 is made of bakelite 14, the bakelite 14 has high mechanical strength, good insulation property, heat resistance and corrosion resistance, an electric heating copper sheet 2 is mounted on the base 1, a heat dissipation device 3 is mounted at the upper end of the electric heating copper sheet 2, the heat dissipation device 3 is in contact with the electric heating copper sheet 2, a protection cover 4 is mounted at the periphery of the heat dissipation device 3, the protection cover 4 is wholly columnar, rectangular ventilation openings 11 are respectively arranged on the upper end surface and one side end surface of the protection cover 4, the protection cover 4 is fixed on one side of an ear plate 5, a plurality of strip-shaped notches 12 are arranged on the ear plate 5, positioning holes 13 are arranged inside the notches 12, the positioning holes 13 fixedly connect the ear plate 5 on one side of the upper surface of the base 1, an ear plate 5 is arranged on one side of the upper surface of the base 1, and the protective cover 4 is arranged on one side of the ear plate 5.
In order to heat electric heat copper sheet 2, be provided with circular shape line hole 6 that leads to on base 1, it is used for the line to lead to the line hole 6 and gives electric heat copper sheet 2 heating, the upper surface of base 1 is provided with recess 7, recess 7 is used for installing electric heat copper sheet 2, electric heat copper sheet 2 inlays in recess 7 on base 1, be provided with screw hole 8 on electric heat copper sheet 2, screw hole 8 is used for fixing electric heat copper sheet 2 and base 1.
The heat dissipation device 3 is used for cooling the electric heating copper sheet 2, the heat dissipation device 3 comprises a plurality of heat dissipation fins 9 and water cooling tubes 10, the heat dissipation fins 9 are vertically arranged on the upper surface of the electric heating copper sheet 2, and the heat dissipation fins 9 are used for absorbing heat of the electric heating copper sheet 2 and reducing the temperature of the electric heating copper sheet 2.
The cooling fin 9 is cooled, the water-cooling pipe 10 penetrates through the inside of the cooling fin 9 and is in contact with the cooling fin 9, the water-cooling pipe 10 is irregular, the temperature of the cooling fin 9 is transmitted to the water-cooling pipe 10, cold water flows in the water-cooling pipe 10, and the heat of the water-cooling pipe 10 can be taken away to reduce the temperature of the water-cooling pipe 10.
The working principle is as follows: the method comprises the steps of installing an electrothermal copper sheet 2 on a base 1, installing a protective cover 4 on an ear plate 5, electrifying and heating the electrothermal copper sheet 2, measuring the temperature of the electrothermal copper sheet 2 at the moment by using a temperature measurer, installing a heat dissipation device 3 on the base 1, installing the protective cover 4 on the periphery of the heat dissipation device, enabling a cooling fin 9 on the heat dissipation device 3 to absorb the heat of the electrothermal copper sheet 2, enabling a water cooling pipe 10 on the heat dissipation device 3 to be communicated with cold water to circulate and take away the heat generated on the cooling fin 9, fully cooling the electrothermal copper sheet 2, measuring the temperature of the electrothermal copper sheet 2 at the moment by using the temperature measurer, comparing the temperature of the electrothermal copper sheet 2 and the temperature of the electrothermal copper sheet 2, wherein the temperature of the electrothermal copper sheet 2 provided with the heat dissipation device 3 is obviously lower than.
Above-mentioned technical scheme has only embodied the utility model discloses technical scheme's preferred technical scheme, some changes that this technical field's technical personnel probably made to some parts wherein have all embodied the utility model discloses a principle belongs to within the protection scope of the utility model.
Claims (8)
1. The utility model provides an imitative CPU radiator, includes base (1), its characterized in that, install electric heat copper sheet (2) on base (1), heat abstractor (3) are installed to the upper end of electric heat copper sheet (2), just heat abstractor (3) and electric heat copper sheet (2) contact each other, protection casing (4) are installed to the periphery of heat abstractor (3), be provided with otic placode (5) on one side of base (1) upper surface, protection casing (4) set up in one side of otic placode (5).
2. The CPU-simulated radiator according to claim 1, wherein a circular through hole (6) is formed in the base (1), the through hole (6) is used for heating the electric heating copper sheet (2), a groove (7) is formed in the upper surface of the base (1), and the groove (7) is used for mounting the electric heating copper sheet (2).
3. The CPU-simulated radiator according to claim 2, wherein the electrothermal copper sheet (2) is embedded in a groove (7) on the base (1), a screw hole (8) is arranged on the electrothermal copper sheet (2), and the screw hole (8) is used for fixing the electrothermal copper sheet (2) and the base (1).
4. The simulated CPU radiator according to claim 1, wherein the heat dissipation device (3) comprises a plurality of heat dissipation fins (9) and water cooling pipes (10), the heat dissipation fins (9) are vertically arranged on the upper surface of the electrothermal copper sheet (2), and the heat dissipation fins (9) are used for absorbing heat of the electrothermal copper sheet (2) and reducing the temperature of the electrothermal copper sheet (2).
5. The simulated CPU radiator according to claim 4, wherein the water cooling tube (10) penetrates through the inside of the cooling fin (9) and is in contact with the cooling fin (9), the temperature of the cooling fin (9) is transmitted to the water cooling tube (10), and cold water flows inside the water cooling tube (10) and can take away the heat of the water cooling tube (10) to reduce the temperature of the water cooling tube (10).
6. The simulated CPU radiator according to claim 1, wherein the protective cover (4) is cylindrical as a whole, rectangular ventilation openings (11) are respectively formed in the upper end face and one side end face of the protective cover (4), and the protective cover (4) is fixed to one side of the lug plate (5).
7. The simulated CPU heat sink as claimed in claim 1, wherein the ear plate (5) is provided with a plurality of strip-shaped notches (12), the notches (12) are internally provided with positioning holes (13), and the positioning holes (13) fixedly connect the ear plate (5) to one side of the upper surface of the base (1).
8. The simulated CPU radiator of claim 1, wherein the base (1) is made of bakelite (14), and the bakelite (14) has high mechanical strength, high insulation, high heat resistance and high corrosion resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020867305.3U CN212411140U (en) | 2020-05-21 | 2020-05-21 | CPU-imitating radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020867305.3U CN212411140U (en) | 2020-05-21 | 2020-05-21 | CPU-imitating radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212411140U true CN212411140U (en) | 2021-01-26 |
Family
ID=74403976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020867305.3U Active CN212411140U (en) | 2020-05-21 | 2020-05-21 | CPU-imitating radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212411140U (en) |
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2020
- 2020-05-21 CN CN202020867305.3U patent/CN212411140U/en active Active
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