CN211828831U - 一种倒装可焊接cob线路支架 - Google Patents
一种倒装可焊接cob线路支架 Download PDFInfo
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- CN211828831U CN211828831U CN202020729858.2U CN202020729858U CN211828831U CN 211828831 U CN211828831 U CN 211828831U CN 202020729858 U CN202020729858 U CN 202020729858U CN 211828831 U CN211828831 U CN 211828831U
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- 239000010410 layer Substances 0.000 claims abstract description 99
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 239000002335 surface treatment layer Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000004411 aluminium Substances 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 3
- 239000002131 composite material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 4
- 238000005215 recombination Methods 0.000 claims description 2
- 230000006798 recombination Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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CN202020729858.2U CN211828831U (zh) | 2020-05-07 | 2020-05-07 | 一种倒装可焊接cob线路支架 |
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CN202020729858.2U CN211828831U (zh) | 2020-05-07 | 2020-05-07 | 一种倒装可焊接cob线路支架 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112467018A (zh) * | 2020-10-20 | 2021-03-09 | 深圳市隆利科技股份有限公司 | mini-LED/micro-LED面光源及其制造方法 |
CN112682711A (zh) * | 2020-12-24 | 2021-04-20 | 萤尔光电有限公司 | 印刷形成线路板的灯具构造 |
-
2020
- 2020-05-07 CN CN202020729858.2U patent/CN211828831U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112467018A (zh) * | 2020-10-20 | 2021-03-09 | 深圳市隆利科技股份有限公司 | mini-LED/micro-LED面光源及其制造方法 |
CN112467018B (zh) * | 2020-10-20 | 2021-10-15 | 深圳市隆利科技股份有限公司 | mini-LED/micro-LED面光源及其制造方法 |
CN112682711A (zh) * | 2020-12-24 | 2021-04-20 | 萤尔光电有限公司 | 印刷形成线路板的灯具构造 |
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Effective date of registration: 20240520 Address after: 337009 Ganxiang Cooperation Industrial Park (Shangli Industrial Park), Jinshan Town, Shangli County, Pingxiang City, Jiangxi Province Patentee after: Jiangxi Xinju Energy Technology Co.,Ltd. Country or region after: China Address before: 518101 3rd floor, 53 Dapu 2nd Road, Ho Yi Gangtou Industrial Zone, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XIN JU NENG ELECTRONICS CO.,LTD. Country or region before: China |