CN201112412Y - 用于大功率发光二极管散热的封装结构 - Google Patents
用于大功率发光二极管散热的封装结构 Download PDFInfo
- Publication number
- CN201112412Y CN201112412Y CNU2007201718999U CN200720171899U CN201112412Y CN 201112412 Y CN201112412 Y CN 201112412Y CN U2007201718999 U CNU2007201718999 U CN U2007201718999U CN 200720171899 U CN200720171899 U CN 200720171899U CN 201112412 Y CN201112412 Y CN 201112412Y
- Authority
- CN
- China
- Prior art keywords
- radiating plate
- heat radiating
- light
- pedestal
- metallic heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201718999U CN201112412Y (zh) | 2007-09-20 | 2007-09-20 | 用于大功率发光二极管散热的封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007201718999U CN201112412Y (zh) | 2007-09-20 | 2007-09-20 | 用于大功率发光二极管散热的封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201112412Y true CN201112412Y (zh) | 2008-09-10 |
Family
ID=39964159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007201718999U Expired - Fee Related CN201112412Y (zh) | 2007-09-20 | 2007-09-20 | 用于大功率发光二极管散热的封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201112412Y (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102076166A (zh) * | 2009-11-23 | 2011-05-25 | 乐金显示有限公司 | 多层印刷电路板以及具有该印刷电路板的液晶显示设备 |
-
2007
- 2007-09-20 CN CNU2007201718999U patent/CN201112412Y/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102076166A (zh) * | 2009-11-23 | 2011-05-25 | 乐金显示有限公司 | 多层印刷电路板以及具有该印刷电路板的液晶显示设备 |
US8730429B2 (en) | 2009-11-23 | 2014-05-20 | Lg Display Co., Ltd. | Multi-layer printed circuit board and liquid crystal display device having the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HUIZHOU QIRONG LUMINESCENT MATERIALS CO., LTD. Free format text: FORMER OWNER: SHENZHEN CHEERGLORY TECHNOLOGY CO., LTD. Effective date: 20120331 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 516000 HUIZHOU, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120331 Address after: Liang Jing Town 516000 Guangdong province Huizhou city Huiyang District Village (Yinshan Industrial Zone) Patentee after: Huizhou Rong Rong luminous material Co., Ltd. Address before: 518000, 4 floor, 14 Dragon Wall Industrial City, Longgang District, Shenzhen District, Guangdong, Bantian, Buji Patentee before: Shenzhen Cheerglory Technology Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080910 Termination date: 20120920 |