CN211262563U - Novel high-overload differential pressure sensor - Google Patents

Novel high-overload differential pressure sensor Download PDF

Info

Publication number
CN211262563U
CN211262563U CN202020171849.6U CN202020171849U CN211262563U CN 211262563 U CN211262563 U CN 211262563U CN 202020171849 U CN202020171849 U CN 202020171849U CN 211262563 U CN211262563 U CN 211262563U
Authority
CN
China
Prior art keywords
oil
base
pressure
oil way
negative pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020171849.6U
Other languages
Chinese (zh)
Inventor
盛雪梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202020171849.6U priority Critical patent/CN211262563U/en
Application granted granted Critical
Publication of CN211262563U publication Critical patent/CN211262563U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Measuring Fluid Pressure (AREA)

Abstract

The utility model belongs to the technical field of measuring instrument, concretely relates to novel high overload differential pressure sensor. The chip base of the utility model is arranged in the groove at the center of the top of the positive pressure base, and a monocrystalline silicon differential pressure chip is stuck inside the chip base; sintering two oil-filled pipes on the chip base, wherein the oil-filled pipes are divided into a positive-pressure end oil-filled pipe and a negative-pressure end oil-filled pipe; oil paths are arranged in the positive pressure base and the negative pressure base, the central overload diaphragm is arranged between the negative pressure base and the positive pressure base, the oil paths in the positive pressure base and the negative pressure base are divided into a positive pressure oil path and a negative pressure oil path, and the volumes of the positive pressure oil path and the negative pressure oil path are equal; and filling silicone oil into the positive pressure oil circuit cavity through the positive pressure end oil filling pipe, filling silicone oil into the negative pressure oil circuit cavity through the negative pressure end oil filling pipe, and after oil filling is finished, plugging and sealing the positive pressure end oil filling pipe and the negative pressure end oil filling pipe through argon arc welding. The utility model discloses guarantee that malleation end and negative pressure end oil circuit volume equal to reach monocrystalline silicon differential pressure chip stable accuracy, improve the stability of sensor.

Description

Novel high-overload differential pressure sensor
Technical Field
The utility model belongs to the technical field of measuring instrument, concretely relates to novel high differential pressure sensor that transships especially relates to a high differential pressure sensor that transships that opens inclined hole, central overload diaphragm hard seal, equals the oil circuit.
Background
The existing differential pressure sensor comprises a capacitance type and a monocrystalline silicon type, the monocrystalline silicon type differential pressure sensor has the problem that the volumes of oil paths at two ends are not equal, when pressure is applied to a positive pressure end or a negative pressure end, if the oil paths at the two ends are not equal, positive pressure or negative pressure is applied to a monocrystalline silicon chip equivalently, measurement errors of the sensor are caused, and temperature compensation data of the sensor are not ideal. When the positive pressure end or the negative pressure end applies pressure far higher than the measuring range, if the oil paths at the two ends are not equal, the monocrystalline silicon chip is also impacted, and the sensor is damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a to the not enough of prior art existence, provide a high overload differential pressure sensor who opens inclined hole, center overload diaphragm and seal firmly, equal oil circuit.
The utility model adopts the technical proposal that:
a novel high-overload differential pressure sensor comprises a chip base, a monocrystalline silicon differential pressure chip, a gold wire, a positive-pressure end oil filling pipe, a negative-pressure end oil filling pipe, a positive-pressure base, a positive-pressure isolation diaphragm, a negative-pressure base, a negative-pressure isolation diaphragm, a central overload diaphragm, pins and a fluorine rubber ring; the chip base is arranged in a groove in the center of the top of the positive pressure base, the chip base is formed by sintering, a monocrystalline silicon differential pressure chip is adhered inside the chip base, and the monocrystalline silicon differential pressure chip is connected with pins on the chip base through gold wires, so that the chip base is electrified and communicated; positive pressure isolation diaphragm welded on positive pressure base by argon arc, negative pressure isolation diaphragm welded on negative pressure base by argon arc, two oil-filled pipes sintered on chip base and divided into positive pressure end oil-filled pipe and negative pressure end oil-filled pipe; oil paths are arranged in the positive pressure base and the negative pressure base, the central overload membrane is arranged between the negative pressure base and the positive pressure base, the negative pressure base and the positive pressure base are extruded concentrically, the central overload membrane, the positive pressure base and the negative pressure base form hard seal, the oil paths in the positive pressure base and the negative pressure base are divided into a positive pressure oil path and a negative pressure oil path, and the volumes of the positive pressure oil path and the negative pressure oil path are equal; and filling silicone oil into the positive pressure oil circuit cavity through the positive pressure end oil filling pipe, filling silicone oil into the negative pressure oil circuit cavity through the negative pressure end oil filling pipe, and after oil filling is finished, plugging and sealing the positive pressure end oil filling pipe and the negative pressure end oil filling pipe through argon arc welding.
The chip base is sleeved with a fluorine rubber ring and is arranged in a groove in the center of the top of the positive pressure base, and the chip base and the positive pressure base are welded in an argon arc mode at the external connecting part to guarantee sealing performance.
A horizontal oil way A is formed in the positive pressure base, and the positive pressure isolating diaphragm is in contact with the oil way A; and a horizontal oil way D corresponding to the oil way A is formed in the negative pressure base, and the negative pressure isolation diaphragm is in contact with the oil way D.
And the two sides of the central overload diaphragm are respectively provided with an oil way J of the positive pressure base and an oil way E of the negative pressure base.
Positive pressure base, negative pressure base are outside junction argon arc welding, guarantee the leakproofness.
The bottom of the chip base is provided with an oil way C, the oil way C is communicated with the oil way A through an oil way B in the positive pressure base, an oil way H is arranged in the chip base, the monocrystalline silicon differential pressure chip separates the oil way C from the oil way H, the side of the oil way C is a positive pressure oil way, and the side of the oil way H is a negative pressure oil way; an oil way G is formed inside the chip base, the positive pressure base and the negative pressure base together and is communicated with the oil way H; and an inclined hole is formed in the negative pressure base to form an oil path F, one end of the oil path F is communicated with the oil path G, and the other end of the oil path F is communicated with the oil path E.
And the oil way of the positive-pressure end oil filling pipe is communicated with the oil way C through the chip base and a gap at the bottom of the positive-pressure base, and the oil way of the negative-pressure end oil filling pipe is communicated with the oil way G.
The central overload membrane is subjected to heat treatment to adjust the mechanical property.
The central overload diaphragm does not deform under the condition of rated pressure, and deforms under overload pressure after the rated pressure is exceeded.
Compared with the prior art, the beneficial effects of the utility model reside in that:
(1) the utility model provides a novel high overload differential pressure sensor, wherein a chip base is sleeved with a fluorine rubber ring and an oil circuit of a separated positive pressure end and a separated negative pressure end;
(2) the utility model provides a novel high-overload differential pressure sensor, the negative pressure base is provided with an inclined hole, the oil circuit is simplified, the oil charge is reduced, the temperature drift performance is improved, and the stability of the sensor is improved;
(3) the utility model provides a novel high overload differential pressure sensor, a central overload diaphragm adopts an extrusion mode, a hard sealing effect is achieved, stress is removed, and the performance of the central overload diaphragm is improved;
(4) the utility model provides a novel high-overload differential pressure sensor guarantees that malleation end or negative pressure end oil circuit volume equals, and monocrystalline silicon differential pressure chip's precision needs the oil circuit that positive and negative both ends equal to guarantee, and it is actually that malleation end and negative pressure end oil mass equal to equal the oil circuit, through 3D accurate calculation monocrystalline silicon differential pressure chip volume of modelling, oil circuit volume etc. at positive and negative both ends oil circuit length of adjustment, reach the oil mass and equal, the oil mass that equals is used in the positive and negative both ends of monocrystalline silicon differential pressure chip to reach monocrystalline silicon differential pressure chip stable accuracy.
Drawings
Fig. 1 is a schematic structural view of a novel high overload differential pressure sensor provided by the present invention;
in the figure: 1. a core body base; 2. a monocrystalline silicon differential pressure chip; 3. gold wire; 4. a positive end oil charge pipe; 5. a negative pressure end oil charge pipe; 6. a positive pressure base; 7. a positive pressure isolation diaphragm; 8. a negative pressure base; 9. a negative pressure isolation diaphragm; 10. a central overload diaphragm; 11. a pin; 12. a fluorine rubber ring.
Detailed Description
The present invention provides a novel high overload differential pressure sensor, which is described in further detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the utility model provides a novel high overload differential pressure sensor, which comprises a chip base 1, a monocrystalline silicon differential pressure chip 2, a gold wire 3, a positive pressure end oil filling pipe 4, a negative pressure end oil filling pipe 5, a positive pressure base 6, a positive pressure isolation diaphragm 7, a negative pressure base 8, a negative pressure isolation diaphragm 9, a central overload diaphragm 10, pins 11 and a fluorine rubber ring 12;
the chip base 1 is formed by sintering, a monocrystalline silicon differential pressure chip 2 is adhered inside the chip base, and the monocrystalline silicon differential pressure chip 2 is connected with a pin 11 on the chip base 1 through a gold wire 3, so that the chip base 1 is electrified and communicated;
a groove is formed in the center of the top of the positive pressure base 6, a fluorine rubber ring 12 is sleeved on the chip base 1, the chip base 1 is installed in the groove, and the chip base 1 and the positive pressure base 6 are welded in an argon arc welding mode at a welding position II to ensure sealing performance;
a positive pressure isolation diaphragm 7 is welded on the positive pressure base 6 in an argon arc mode, a negative pressure isolation diaphragm 9 is welded on the negative pressure base 8 in an argon arc mode, a horizontal oil way A is formed in the positive pressure base 6, and the positive pressure isolation diaphragm 7 is in contact with the oil way A; a horizontal oil way D corresponding to the oil way A is formed in the negative pressure base 8, and the negative pressure isolation diaphragm 9 is in contact with the oil way D;
an oil way J is formed in one side of the positive pressure base 6, an oil way E is formed in one side of the negative pressure base 8, the central overload diaphragm 10 is installed between the oil way J and the oil way E, the negative pressure base 8 and the positive pressure base 6 are extruded concentrically, the central overload diaphragm 10, the positive pressure base 6 and the negative pressure base 8 form hard sealing, and the positive pressure base 6 and the negative pressure base 8 are welded in an argon arc mode at a welding position I to guarantee sealing performance;
the bottom of the chip base 1 is provided with an oil way C, the oil way C is communicated with the oil way A through an oil way B in the positive pressure base 6, an oil way H is arranged in the chip base 1, the monocrystalline silicon differential pressure chip 2 separates the oil way C from the oil way H, the side of the oil way C is a positive pressure oil way, and the side of the oil way H is a negative pressure oil way; an oil path G is formed inside the chip base 1, the positive pressure base 6 and the negative pressure base 8 together, and the oil path G is communicated with the oil path H; an inclined hole is formed in the negative pressure base 8 to form an oil way F, one end of the oil way F is communicated with the oil way G, and the other end of the oil way F is communicated with the oil way E; the inclined hole is formed mainly for shortening an oil path and reducing oil quantity, the high-temperature or low-temperature condition of a measured medium can be met in field application and measurement, the less the oil quantity at the positive end and the negative end is, the smaller the change of the oil influenced by temperature is, and the lower the influence on the monocrystalline silicon differential pressure chip is, so that the precision stability of the monocrystalline silicon differential pressure chip is achieved.
Two oil filling pipes are sintered on the chip base 1 and are divided into a positive-pressure-end oil filling pipe 4 and a negative-pressure-end oil filling pipe 5; the oil way of the positive-pressure end oil filling pipe 4 is communicated with the oil way C through the chip base 1 and a gap at the bottom of the positive-pressure base 6, and the oil way of the negative-pressure end oil filling pipe 5 is communicated with the oil way G;
the central overload membrane 10 can be adjusted in mechanical properties in a large range through heat treatment, for example, in order to obtain high mechanical strength and fatigue resistance, the service performance can be obtained through controlling phase change and precipitation hardening treatment, and the treated central overload membrane can resist 60000 times of impact, has no cracks and cannot deform.
And filling silicone oil into the oil circuit cavity at the positive pressure end through the oil filling pipe 4 at the positive pressure end, filling silicone oil into the oil circuit cavity at the negative pressure end through the oil filling pipe 5 at the negative pressure end, and after the oil filling is finished, blocking and sealing the oil filling pipe 4 at the positive pressure end and the oil filling pipe 5 at the negative pressure end through argon arc welding.
The chip base 1, the positive pressure end oil filling pipe 4, the negative pressure end oil filling pipe 5 and the pins 11 are connected by adopting a metal-glass packaging technology, and a metal shell enables a product to be firm and durable, and has high environmental adaptability and good sealing performance. The working temperature can reach-55-300 ℃, the insulation resistance is more than or equal to 2000 MOmega, the withstand voltage is 1000V (50Hz), and the sealing performance is less than or equal to 1 x 10-9Pa.cm3(S), withstand voltage 40MPa 1 h.
The utility model discloses a theory of operation does:
when rated pressure is applied to the positive pressure isolation diaphragm 7, the pressure pushes silicon oil to act on the positive pressure end of the monocrystalline silicon differential pressure chip 2 through the oil way A, the oil way B and the oil way C, and the chip generates a positive pressure signal; when rated pressure is applied to the negative pressure isolation diaphragm 9, the pressure pushes the silicon oil to act on the negative pressure end of the monocrystalline silicon differential pressure chip 2 through the oil way D, the oil way E, the oil way F, the oil way G and the oil way H, and the chip generates a negative pressure signal; at this time, since the chip base 1 is covered with the fluorine rubber ring 12, the positive pressure oil path and the negative pressure oil path can be separated from each other up and down on the chip base 1.
When high overload pressure is applied to the positive pressure isolation diaphragm 7, the rated pressure pushes the silicon oil to act on the positive pressure end of the monocrystalline silicon differential pressure chip 2 through the oil way A, the oil way B and the oil way C; overload pressure passes through oil circuit A, oil circuit I, oil circuit J, acts on central overload diaphragm 10 for central overload diaphragm 10 takes place deformation toward the negative pressure end, thereby promotes silicon oil and passes through oil circuit F, oil circuit G, oil circuit H, acts on monocrystalline silicon differential pressure chip 2 negative pressure end, makes monocrystalline silicon differential pressure chip 2's positive and negative pressure end effort simultaneously, reaches the static pressure effect, has protected monocrystalline silicon differential pressure chip 2 not to receive high pressure overload to damage.
When high overload pressure is applied to the negative pressure isolation diaphragm 9, the rated pressure pushes the silicon oil to act on the negative pressure end of the monocrystalline silicon differential pressure chip 2 through the oil path D, the oil path E, the oil path F, the oil path G and the oil path H; overload pressure passes through oil circuit D, oil circuit E, acts on central overload diaphragm 10 for central overload diaphragm 10 is to positive pressure end emergence deformation, thereby promotes silicon oil and passes through oil circuit I, oil circuit B, oil circuit C, acts on 2 positive pressure ends of monocrystalline silicon differential pressure chip, makes the effort when 2 positive and negative pressure ends of monocrystalline silicon differential pressure chip, reaches the static pressure effect, has protected monocrystalline silicon differential pressure chip 2 not to receive high pressure overload to damage.
The central overload diaphragm is not deformed under the condition of rated pressure, and can be deformed only when the central overload diaphragm becomes the overload pressure after the central overload diaphragm exceeds the rated pressure.
The above description is only the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution of the present invention and the inventive concept thereof equally within the technical scope disclosed in the present invention, and all the modifications should be covered within the protection scope of the present invention.

Claims (9)

1. A novel high overload differential pressure sensor is characterized in that: the device comprises a chip base (1), a monocrystalline silicon differential pressure chip (2), a gold wire (3), a positive pressure end oil filling pipe (4), a negative pressure end oil filling pipe (5), a positive pressure base (6), a positive pressure isolation diaphragm (7), a negative pressure base (8), a negative pressure isolation diaphragm (9), a central overload diaphragm (10), pins (11) and a fluorine rubber ring (12); the chip base (1) is arranged in a groove in the center of the top of the positive pressure base (6), the chip base (1) is formed by sintering, a monocrystalline silicon differential pressure chip (2) is adhered inside the chip base, and the monocrystalline silicon differential pressure chip (2) is connected with pins (11) on the chip base (1) through gold wires (3), so that the chip base (1) is electrified and communicated; a positive pressure isolation diaphragm (7) is welded on the positive pressure base (6) in an argon arc mode, a negative pressure isolation diaphragm (9) is welded on the negative pressure base (8) in an argon arc mode, and two oil filling pipes are sintered on the chip base (1) and are divided into a positive pressure end oil filling pipe (4) and a negative pressure end oil filling pipe (5); oil ways are arranged inside the positive pressure base (6) and the negative pressure base (8), the central overload diaphragm (10) is arranged between the negative pressure base (8) and the positive pressure base (6), the negative pressure base (8) and the positive pressure base (6) are extruded concentrically, the central overload diaphragm (10), the positive pressure base (6) and the negative pressure base (8) form hard seal, the oil ways in the positive pressure base (6) and the negative pressure base (8) are divided into a positive pressure oil way and a negative pressure oil way, and the volumes of the positive pressure oil way and the negative pressure oil way are equal; and filling silicon oil into the positive pressure oil circuit cavity through the positive pressure end oil filling pipe (4), filling silicon oil into the negative pressure oil circuit cavity through the negative pressure end oil filling pipe (5), and after oil filling is finished, plugging and sealing the positive pressure end oil filling pipe (4) and the negative pressure end oil filling pipe (5) through argon arc welding.
2. The novel high overload differential pressure sensor according to claim 1, wherein: the chip base (1) is sleeved with a fluorine rubber ring (12) and is arranged in a groove in the center of the top of the positive pressure base (6), and the chip base (1) and the positive pressure base (6) are welded at the outer joint in an argon arc mode to guarantee sealing performance.
3. The novel high overload differential pressure sensor according to claim 2, wherein: a horizontal oil way A is formed in the positive pressure base (6), and a positive pressure isolating diaphragm (7) is in contact with the oil way A; a horizontal oil way D corresponding to the oil way A is arranged in the negative pressure base (8), and the negative pressure isolation diaphragm (9) is in contact with the oil way D.
4. The novel high overload differential pressure sensor according to claim 3, wherein: and the two sides of the central overload diaphragm (10) are respectively an oil way J of the positive pressure base (6) and an oil way E of the negative pressure base (8).
5. The novel high overload differential pressure sensor according to claim 1, wherein: positive pressure base (6), negative pressure base (8) are in outside junction argon arc welding, guarantee the leakproofness.
6. The novel high overload differential pressure sensor according to claim 4, wherein: the bottom of the chip base (1) is provided with an oil way C which is communicated with the oil way A through an oil way B in the positive pressure base (6), an oil way H is arranged in the chip base (1), the monocrystalline silicon differential pressure chip (2) separates the oil way C from the oil way H, the side of the oil way C is a positive pressure oil way, and the side of the oil way H is a negative pressure oil way; an oil way G is formed inside the chip base (1), the positive pressure base (6) and the negative pressure base (8) together, and the oil way G is communicated with the oil way H; an inclined hole is formed in the negative pressure base (8) to form an oil way F, one end of the oil way F is communicated with the oil way G, and the other end of the oil way F is communicated with the oil way E.
7. The novel high overload differential pressure sensor according to claim 6, wherein: and the oil way of the positive-pressure end oil filling pipe (4) is communicated with the oil way C through a gap at the bottom of the chip base (1) and the positive-pressure base (6), and the oil way of the negative-pressure end oil filling pipe (5) is communicated with the oil way G.
8. The novel high overload differential pressure sensor according to claim 4, wherein: the central overload membrane (10) is subjected to heat treatment to adjust the mechanical properties.
9. The novel high overload differential pressure sensor according to claim 8, wherein: the central overload diaphragm (10) does not deform under the condition of rated pressure, and deforms under overload pressure after the rated pressure is exceeded.
CN202020171849.6U 2020-02-15 2020-02-15 Novel high-overload differential pressure sensor Active CN211262563U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020171849.6U CN211262563U (en) 2020-02-15 2020-02-15 Novel high-overload differential pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020171849.6U CN211262563U (en) 2020-02-15 2020-02-15 Novel high-overload differential pressure sensor

Publications (1)

Publication Number Publication Date
CN211262563U true CN211262563U (en) 2020-08-14

Family

ID=71960870

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020171849.6U Active CN211262563U (en) 2020-02-15 2020-02-15 Novel high-overload differential pressure sensor

Country Status (1)

Country Link
CN (1) CN211262563U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111157171A (en) * 2020-02-15 2020-05-15 盛雪梅 Novel high-overload differential pressure sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111157171A (en) * 2020-02-15 2020-05-15 盛雪梅 Novel high-overload differential pressure sensor

Similar Documents

Publication Publication Date Title
CN212807437U (en) Core body of differential pressure sensor
CN202141554U (en) Ceramic structure metal sensitive diaphragm capacitance pressure transducer
CN111157171A (en) Novel high-overload differential pressure sensor
CN211262563U (en) Novel high-overload differential pressure sensor
CN204924513U (en) Silica -based pressure sensor
CN109060201A (en) High temperature resistant silicon piezoresistive pressure sensing element
CN208833416U (en) A kind of high temperature modification film absolute pressure sensor
CN103292947A (en) Novel capacitance plate suspension structure of differential motion metal capacitance diaphragm capsule
CN102944353B (en) Capacitance film type pressure sensor capable of resisting thermal distortion
CN105157907A (en) Differential pressure sensor with overload protecting function
CN207636232U (en) A kind of strain-type differential pressure pickup
CN103759880A (en) Leadless packaging structure and SOI absolute pressure sensitive device of leadless packaging structure
CN200989838Y (en) Pressure sensor
CN205027465U (en) Two remaining pressure tube structures
CN106644238B (en) Film differential pressure core
CN105021325B (en) Capacitance pressure transducer,
CN203719813U (en) SOI absolute pressure sensitive device employing no-leading-wire packaging structure
CN113483941A (en) Leadless packaging dynamic pressure sensor integrated with ASIC chip
CN209961389U (en) Monocrystalline silicon high overvoltage protection type pressure sensor
CN201707160U (en) Piezoresistive pressure sensor integrated base
CN106979840A (en) Using Welding and with overload protection function differential pressure pick-up
CN207456431U (en) High-precision integral type hydrostatic level
CN217111279U (en) High-temperature pressure sensor for engine
CN115790954A (en) Capacitive pressure core
CN115196582A (en) High-pressure-resistant MEMS pressure sensor packaging structure and packaging method

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant