CN217111279U - High-temperature pressure sensor for engine - Google Patents

Abstract

The utility model belongs to the technical field of the sensor, especially, relate to a high temperature pressure sensor for engine. Two independent pressure sensor chips with the same basic performance are packaged in the same high-temperature-resistant pressure sensor core body to measure pressure in real time, two pressure sensors are replaced to work, and space is greatly saved. Comprises a sensor core body; the sensor core body adopts a packaging oil-filled structure; the packaging oil filling structure comprises a sintering pipe seat and an elastic metal diaphragm; the elastic metal diaphragm is positioned below the sintering pipe seat and forms a packaging inner cavity together with the sintering pipe seat; the inner cavity of the package is filled with silicone oil; the top wall of the packaging inner cavity is provided with two pressure sensitive chips in parallel, the pressure sensitive chips are fixed on the sintering pipe seat through insulating glue, and the two pressure sensitive chips are arranged in parallel. The sintering pipe seat is provided with ten pins, each pressure sensitive chip corresponds to five pins, and each pressure sensitive chip is connected with the corresponding pin through a gold wire.

Description

High-temperature pressure sensor for engine

Technical Field

The utility model belongs to the technical field of the sensor, especially, relate to a high temperature pressure sensor for engine.

Background

The internal space of the helicopter engine is narrow, a large number of pressure measurement units are needed for oil supply, hydraulic pressure, compression and the like in the control process of the whole system, and meanwhile, in order to ensure the reliability and accuracy of measurement, the sensor is required to realize redundancy measurement of high temperature (200 ℃) in a smaller installation space. In the prior art, two sensors are installed at the same position to collect data of the two sensors to measure pressure, however, the two sensors occupy a large space and are not suitable for compact space installation, and the measured pressure has deviation due to different positions of the two sensors, which causes inaccurate data.

Disclosure of Invention

The utility model discloses just to the defect that prior art exists, provide a high temperature pressure sensor for engine.

In order to achieve the purpose, the utility model adopts the following technical scheme that the sensor comprises a sensor core body; the sensor core is characterized in that a packaging oil filling structure is adopted.

The packaging oil filling structure comprises a sintering pipe seat and an elastic metal diaphragm; the elastic metal diaphragm is positioned below the sintering pipe seat and forms a packaging inner cavity together with the sintering pipe seat; the inner cavity of the package is filled with silicone oil.

The top wall of the packaging inner cavity is provided with two pressure sensitive chips in parallel, the pressure sensitive chips are fixed on the sintering pipe seat through insulating glue, and the two pressure sensitive chips are arranged in parallel.

The sintering pipe seat is provided with ten pins, each pressure sensitive chip corresponds to five pins, and each pressure sensitive chip is connected with the corresponding pin through a gold wire.

Furthermore, the sensor core body is connected with the temperature compensation module, and the temperature compensation module of the sensor core body is connected with the respective signal processing module.

Still further, the temperature compensation module includes: the resistors R1, R2, R3 and R4 are bridges of the pressure sensitive chip and are used as branch I; a resistor B1 is connected in parallel with the bridge resistor R1 to compensate the zero temperature drift; a resistor C3 is connected in series with the bridge resistor R3 and is a compensation zero output which is taken as a branch II; the resistor X is connected with the thermistor RT in series to serve as a branch III; the third branch is connected with the resistor Y in parallel to be used as a fourth branch for compensating the sensitivity temperature drift; v + and V-are power supply excitation input of the sensor core, and OUT + and OUT-are output ends of the sensor core.

Further, the signal processing module comprises chips U1, U2, U3; the chip U1 is used to provide power excitation for the sensor. The VI end of U1 is connected with the Vr end of chip U1, the Iset end of U1 is connected with sensor I +, and the Rset end and the Iset end of U1 are connected through resistor R11.

The chip U2 amplifies the mV signal output of the sensor into a standard signal (0.5-5V) output; the RG1 terminal of the U2 is connected with the RG2 terminal through series resistors R13 and R14, the-IN terminal of the U2 is connected with the temperature compensation module OUT-, the + IN terminal of the U2 is connected with the temperature compensation module OUT +, the OUT terminal of the U2 is used as an output terminal OUT +, and the REF terminal of the U2 is connected with the U3.

The chip U3 is used for adjusting zero point and full scale output normalization; the OUT1 end of U3 is connected with-IN 1 and then grounded through series resistors R15 and R16, the + IN1 end of U3 is grounded through resistor R12, the + IN2 end of U3 is grounded through R16, and the-IN 2 end of U3 is connected with the OUT2 end and the REF end of U3 respectively.

Compared with the prior art the utility model discloses beneficial effect:

the utility model discloses high temperature pressure sensor is used for testing helicopter engine fuel pressure, is at the pressure sensor chip real-time measurement pressure that two independence of same high temperature resistant pressure sensor core internal packaging are the same nevertheless basic performance, replaces two pressure sensor work, has saved the space by a wide margin, and the sensor core carries out signal processing after temperature compensation, exports two way pressure signal, stable work under high temperature environment.

Drawings

The present invention will be further described with reference to the accompanying drawings and the following detailed description. The scope of protection of the present invention is not limited to the following description.

FIG. 1 is a schematic diagram of a dual die pressure sensor core.

Fig. 2 is a circuit diagram of a pressure sensor temperature compensation.

Fig. 3 is a circuit diagram of a signal processing module.

Fig. 4 is a schematic diagram of a dual-redundancy high-temperature pressure sensor structure.

In the figure, 1 is a pin, 2 is a sintering pipe seat, 3 is a first sensitive chip, 4 is a gold wire, 5 is a metal membrane, 6 is a second sensitive chip, 7 is a pressure interface, 8 is an electric connector, 9 is an electromagnetic compatible element, 10 is a screw, 11 is a signal processing module circuit board, 12 is a first temperature compensation module circuit board, 13 is a second temperature compensation module circuit board, and 14 is a dual-redundancy sensor.

Detailed Description

As shown in fig. 1-4, the specific embodiment: comprises a sensor core body; the sensor core body adopts a packaging oil-filled structure; the packaging oil filling structure comprises a sintering pipe seat 2 and an elastic metal diaphragm 5; the elastic metal diaphragm 5 is positioned below the sintering pipe seat 2 and forms a packaging inner cavity together with the sintering pipe seat 2; the inner cavity of the package is filled with silicone oil; two pressure sensitive chips are arranged on the top wall of the packaging inner cavity in parallel, and the pressure sensitive chips are fixed on the sintering tube seat 2 through insulating glue; the sintering pipe seat 2 is provided with ten pins 1, each pressure sensitive chip corresponds to five pins 1, and each pressure sensitive chip is connected with the corresponding pin 1 through a gold wire 4. The pressure sensitive chips are connected with the temperature compensation modules, and the temperature compensation modules of the two pressure sensitive chips are connected with the signal processing module.

Firstly, a sensor chip.

The high-temperature pressure sensor adopts Silicon On Insulator (SOI) material to manufacture a high-temperature sensor chip. Conventional P-N junction isolationThe performance of a sensor can be deteriorated or even failed due to the failure of a P-N junction of a silicon chip at 120 ℃, and the sensor chip of an SOI material is formed by using SiO as an intermediate layer ₂ The dielectric isolation layer solves the temperature limit of the P-N junction and can work at the temperature of more than 200 ℃.

And secondly, a sensor core body.

The pressure sensor core adopts an isolated packaged oil-filled structure, a sensitive chip is fixed on a sintering pipe seat 2 by insulating glue, the upper part of the sensitive chip is filled with silicon oil, the sensitive chip is packaged in an elastic metal diaphragm 5 to sense the pressure to be measured, and a resistance leading-out point on the sensitive chip is connected with a pin 1 of the sintering pipe seat 2 by a gold wire 4.

And thirdly, a sensor core temperature compensation circuit. As shown in fig. 2, the temperature compensation module includes adjustable resistors R11 and R12 connected in series as a first branch; the resistor R11 is connected with the resistor B1 in parallel; the adjustable resistor R13, the adjustable resistor R14 and the resistor C3 are connected in series to serve as a second branch; the resistor X is connected with the adjustable resistor RT in series to serve as a third branch; the third branch is connected with the resistor Y in parallel and then serves as a fourth branch; after the first branch and the second branch are connected in parallel, a first common end is connected with the sensor as V-, and after the first branch and the second branch are connected in parallel, the first common end is connected with the fourth branch and the resistor Z in series, and the free end of the resistor Z is connected with the sensor as V +; the common connection terminal of the resistors R11 and R12 serves as the output terminal OUT ", and the common connection terminal of the resistors R13 and R14 serves as the output terminal OUT +.

The pressure sensor core outputs two paths of mV signals, and in order to ensure the consistency and precision of the two paths of signals, the temperature compensation and normalization processing are carried out on the two paths of signals, so that the requirements of the consistency and the precision of the full temperature zone of the sensor are met.

And fourthly, a sensor signal processing circuit. As shown in FIG. 3, the chip of Shanxi Crystal is shown in the specification of U1 model HJU122, U2 HJ826 and U3 HJ1207 AW.

The mV signals generated by the two pressure sensor chips on the pressure sensor core body are converted into standard voltage signals (0.5-5V) through an amplifying circuit and then output, and the circuit considers the following two aspects: 1. high temperature environment (200 ℃); 2. the space is compact. The two points are combined to require that a special high-temperature integrated operational amplifier is selected to complete the processing function of the pressure signal, the whole circuit is simple and reliable, and the high-temperature precision requirement can be ensured. Through the double compensation of the temperature compensation of the sensor core body and the temperature compensation of the amplifying circuit, the temperature drift of the sensor in a full temperature range of-55-200 ℃ can be lower than 0.02% FS/DEG C, each pressure sensor chip is matched with one amplifying circuit, and the two circuits are mutually independent and do not generate interference.

The utility model discloses high temperature pressure sensor carries out temperature compensation and normalization to two pressure sensitive chip package in a pressure sensor core respectively, through two way standard signal of circuit processing output, realizes two redundancy measurements, has saved the space by a wide margin, has reduced weight, has improved the precision of product.

It should be understood that the above detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can still be modified or equivalently replaced to achieve the same technical effects; as long as the use requirement is satisfied, the utility model is within the protection scope.

Claims (4)

1. A high-temperature pressure sensor for an engine comprises a sensor core body; the method is characterized in that: the sensor core body adopts a packaging oil-filled structure;

the packaging oil filling structure comprises a sintering pipe seat and an elastic metal diaphragm; the elastic metal diaphragm is positioned below the sintering pipe seat and forms a packaging inner cavity together with the sintering pipe seat; the inner cavity of the package is filled with silicone oil;

the top wall of the packaging inner cavity is provided with two pressure sensitive chips in parallel, the pressure sensitive chips are fixed on the sintering pipe seat through insulating glue, and the two pressure sensitive chips are arranged in parallel;

the sintering pipe seat is provided with pins, and each pressure sensitive chip is connected with the corresponding pin through a gold wire.

2. A high temperature pressure sensor for an engine as claimed in claim 1, wherein: the sensor core body is connected with the temperature compensation module, and the temperature compensation module of the sensor core body is connected with the respective signal processing module.

3. A high temperature pressure sensor for an engine as set forth in claim 2, wherein: the temperature compensation module includes: the resistors R1, R2, R3 and R4 are bridges of the pressure sensitive chip and are used as branch I; a resistor B1 is connected in parallel with the bridge resistor R1 to compensate the zero temperature drift; a resistor C3 is connected in series with the bridge resistor R3 and is a compensation zero output which is taken as a branch II; the resistor X is connected with the thermistor RT in series to serve as a branch III; the third branch is connected with the resistor Y in parallel to be used as a fourth branch for compensating the sensitivity temperature drift; v + and V-are power supply excitation input of the sensor core, and OUT + and OUT-are output ends of the sensor core.

4. A high temperature pressure sensor for an engine as set forth in claim 3, wherein: the signal processing module comprises chips U1, U2 and U3; the chip U1 is used for providing power supply excitation for the sensor; the VI end of U1 is connected with the Vr end of chip U1, the Iset end of U1 is connected with sensor I +, the Rset end of U1 is connected with the Iset end through resistor R11;

the chip U2 amplifies the sensor mV signal output into a standard signal output; an RG1 terminal of U2 is connected with an RG2 terminal through series resistors R13 and R14, an-IN terminal of U2 is connected with a temperature compensation module OUT-, an + IN terminal of U2 is connected with a temperature compensation module OUT +, an OUT terminal of U2 is used as an output terminal OUT +, and a REF terminal of U2 is connected with U3;

the chip U3 is used for adjusting zero point and full scale output normalization; the OUT1 end of U3 is connected with-IN 1 and then grounded through series resistors R15 and R16, the + IN1 end of U3 is grounded through resistor R12, the + IN2 end of U3 is grounded through R16, and the-IN 2 end of U3 is connected with the OUT2 end and the REF end of U3 respectively.

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