CN116295966A - Double-chip multi-parameter pressure sensor base - Google Patents
Double-chip multi-parameter pressure sensor base Download PDFInfo
- Publication number
- CN116295966A CN116295966A CN202310195449.7A CN202310195449A CN116295966A CN 116295966 A CN116295966 A CN 116295966A CN 202310195449 A CN202310195449 A CN 202310195449A CN 116295966 A CN116295966 A CN 116295966A
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- CN
- China
- Prior art keywords
- chip
- supporting seat
- mounting groove
- pressure sensor
- chip supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 39
- 239000012212 insulator Substances 0.000 claims description 39
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910000833 kovar Inorganic materials 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims 5
- 238000005259 measurement Methods 0.000 abstract description 6
- 238000009530 blood pressure measurement Methods 0.000 abstract description 2
- 239000003921 oil Substances 0.000 description 10
- 239000003292 glue Substances 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L2019/0053—Pressure sensors associated with other sensors, e.g. for measuring acceleration, temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
Abstract
The invention discloses a base of a double-chip multi-parameter pressure sensor, which belongs to the technical field of sensors and comprises a base shell, wherein an oil filling cavity is formed in the bottom of the base shell, a first mounting groove is formed in the upper end of the oil filling cavity, a first chip supporting seat is arranged in the first mounting groove, a second mounting groove is formed in one side of the first mounting groove, and a second chip supporting seat is arranged in the second mounting groove. According to the invention, the double-chip supporting seat is arranged and the double-sensor chip is matched, so that the same pressure sensor can simultaneously measure multiple parameters such as absolute pressure, gauge pressure, temperature and the like, different pressure measurement requirements are met, the measurement cost and measurement steps are reduced, and the application range is wide; and the sensor chip is only contacted with the chip supporting seat, so that the independence of the position of the sensor chip is greatly improved, the influence of the base shell on the sensor chip is minimized, and the insulativity of the sensor chip is greatly improved.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to a double-chip multi-parameter pressure sensor base.
Background
Gauge pressure sensors refer to sensors that sense pressure relative to ambient pressure and convert to a usable output signal; the absolute pressure sensor generally takes an internal vacuum cavity as a reference, and a measured pressure value and a vacuum pressure are obtained after subtraction. The absolute pressure sensor can generally measure the pressure of a vacuum pipeline, the liquid level of a vacuum tank body, the atmospheric pressure and the like, a negative cavity of the absolute pressure sensor is isolated from the outside, a membrane (positive cavity) of the absolute pressure sensor is filled with silicone oil, the pressure of a measuring medium is obtained through isolating the membrane and process connection, and then an obtained signal is processed through an electronic component of a microprocessor and then is output by a signal terminal.
Disclosure of Invention
The invention provides a double-chip multi-parameter pressure sensor base for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a two-chip multi-parameter pressure sensor base, includes the base casing, the oil filling chamber has been seted up to the bottom of base casing, first mounting groove has been seted up to the upper end of oil filling chamber, be provided with first chip supporting seat in the first mounting groove, one side of first mounting groove is provided with the second mounting groove, be provided with the second chip supporting seat in the second mounting groove.
Further, the first chip supporting seat and the second chip supporting seat are both arranged in a manner that the upper end and the lower end are suspended, a second glass insulator is sintered outside the first chip supporting seat, and a third glass insulator is sintered outside the second chip supporting seat.
Further, the upper end of the oil filling cavity is provided with a plurality of groups of lead pins penetrating through the base shell along the axial circumference of the base shell, and the outer parts of the lead pins are provided with first glass insulators.
Further, the upper end of first mounting groove is provided with the second air vent, one side of second air vent is provided with the first air vent that runs through the base casing, the second air vent is linked together with first air vent.
Further, the outside of second glass insulator is provided with V type groove, V type groove is seted up inside the base casing, the inside of V type groove is filled to the second glass insulator.
Further, the outside of third glass insulator is provided with the cylindricality groove, the cylindricality groove is seted up inside the base casing, the inside of cylindricality groove is filled to third glass insulator.
Further, the first chip supporting seat and the second chip supporting seat are made of kovar alloy.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the double-chip supporting seat is arranged and the double-sensor chip is matched, so that the same pressure sensor can simultaneously measure multiple parameters such as absolute pressure, gauge pressure, temperature and the like, and the pressure sensor has the advantages of simple structure, small volume, capability of meeting different pressure measurement requirements, reduction of measurement cost and measurement steps, and wide application range; the arranged double-chip supporting seat is suspended at the upper end and the lower end of the base shell in the axial direction, and the double-chip supporting seat is not touched with the base shell, namely, the sensor chip is only contacted with the chip supporting seat, so that the independence of the position of the sensor chip is greatly improved, the stability of the sensor chip is improved, the influence of the base shell on the sensor chip is minimized, and the insulativity of the sensor chip is greatly improved; and the double-chip supporting seat adopts kovar alloy, and can effectively reduce temperature drift and stress by utilizing the characteristic that the thermal expansion coefficient of the kovar alloy is close to that of the diffusion silicon chip, thereby improving the performance of the measuring precision of the sensor.
Drawings
FIG. 1 is a schematic diagram of a dual-chip multi-parameter pressure sensor base according to the present invention.
Fig. 2 is a side cross-sectional view of the present invention.
Fig. 3 is an enlarged schematic view of the structure of fig. 1 a according to the present invention.
Fig. 4 is an enlarged schematic view of the structure of fig. 2B according to the present invention.
Fig. 5 is a top view of the present invention.
In the figure: 1. a base housing; 2. a pin; 3. a first air vent; 4. a second air guide hole; 5. a first glass insulator; 6. a first mounting groove; 7. a first chip support base; 8. a second glass insulator; 9. a V-shaped groove; 10. a second mounting groove; 11. a second chip support base; 12. a cylindrical groove; 13. a third glass insulator; 14. and (5) an oil filling cavity.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, the present invention provides the following technical solutions:
example 1
The double-chip multi-parameter pressure sensor base comprises a base shell 1, an oil filling cavity 14 is formed in the bottom of the base shell 1, medium oil in the oil filling cavity 14 comes from an oil filling system outside the base shell 1, a first mounting groove 6 is formed in the upper end of the oil filling cavity 14, a first chip supporting seat 7 is arranged in the first mounting groove 6, the first chip supporting seat 7 is arranged into a tube shape, a sensor chip is mounted at the lower end of the first chip supporting seat 7 and used for measuring gauge pressure, a second mounting groove 10 is formed in one side of the first mounting groove 6, a second chip supporting seat 11 is arranged in the second mounting groove 10, the second chip supporting seat 11 is arranged into a column shape, another sensor chip is mounted at the lower end of the second chip supporting seat 11 and used for measuring absolute pressure, a plurality of groups of lead pins 2 penetrating through the base shell 1 are arranged at the upper end of the oil filling cavity 14 along the circumference of the axial direction of the base shell 1, the lead pins 2 are connected with two chips, and a first glass insulator 5 is arranged outside the lead pins 2; the upper end of the first mounting groove 6 is provided with a second air vent 4, one side of the second air vent 4 is provided with a first air vent 3 penetrating through the base shell 1, and the second air vent 4 is communicated with the first air vent 3 and is used for leading in the ambient atmosphere.
Specifically, through setting up two chip supporting seats, installation two chips to but multiple parameter such as measurement absolute pressure, gauge pressure and temperature, thereby satisfy on-the-spot multiple parameter measurement demand such as different pressures, this base simple structure, small reduces measuring cost and measuring step for different occasions, its application scope is wide.
Example 2
As an optional condition, a dual-chip multi-parameter pressure sensor base, a first chip supporting seat 7 and a second chip supporting seat 11 are all arranged to be suspended at the upper end and the lower end, a second glass insulator 8 is sintered outside the first chip supporting seat 7, the second glass insulator 8 is sintered on the inner wall of a first mounting groove 6, the material of the first chip supporting seat 7 is kovar alloy for being matched and firmly sealed with the second glass insulator 8, the model is 4J29, a third glass insulator 13 is sintered outside the second chip supporting seat 11, the third glass insulator 13 is sintered on the inner wall of a second mounting groove 10, and the material of the second chip supporting seat 11 is kovar alloy for being matched and firmly sealed with the third glass insulator 13, and the model is 4J29.
Specifically, the two sensor chips are fixed at the bottoms of the first chip supporting seat 7 and the second chip supporting seat 11 respectively by using less glue, the sensor chips are not touched with the base shell 1 thereof, and as the first chip supporting seat 7 and the second chip supporting seat 11 are positioned at the upper end and the lower end in suspension, namely the sensor chips are only contacted with the first chip supporting seat 7 or the second chip supporting seat 11, the independence of the positions of the sensor chips is improved by the first chip supporting seat 7, the second chip supporting seat 7 and the third glass insulator 13 sintered by the first chip supporting seat 11, so that the influence of the base shell 1 on the sensor chips is minimized, the insulativity of the sensor chips is greatly improved, and the glue used for bonding the sensor chips is greatly reduced, thereby reducing the influence of the glue on the performance of the sensor chips, and simultaneously greatly improving the insulativity.
The solution in this embodiment can be selectively combined with the solutions in other embodiments
Example 3
As an optional case, a double-chip multi-parameter pressure sensor base, a V-shaped groove 9,V type groove 9 is arranged outside a second glass insulator 8 and is arranged inside a base shell 1, and the second glass insulator 8 fills the inside of the V-shaped groove 9; the outside of the third glass insulator 13 is provided with a cylindrical groove 12, the cylindrical groove 12 is opened inside the base housing 1, and the inside of the cylindrical groove 12 is filled with the third glass insulator 13.
Specifically, through set up V type groove 9 in second glass insulator 8 outside, the outside of third glass insulator 13 is provided with cylindrical groove 12 for first glass insulator 8 fills V type groove, third glass insulator 13 fills cylindrical groove 12, thereby after the sintering, increase second glass insulator 8 and third glass insulator 13's resistance that drops, avoid second glass insulator 8 or third glass insulator 13 to produce the gap with base casing 1, make base casing 1 bear bigger pressure, prevent that the silicone oil from leaking, avoid sensor base atress or sintering in-process, first glass insulator 8, third glass insulator 13 and base casing 1 have the gap, make the drawback that the silicone oil leaked.
The scheme in this embodiment may be selectively used in combination with the scheme in other embodiments.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a two-chip multiparameter pressure sensor base, includes base casing (1), its characterized in that: an oil filling cavity (14) is formed in the bottom of the base shell (1), a first mounting groove (6) is formed in the upper end of the oil filling cavity (14), a first chip supporting seat (7) is arranged in the first mounting groove (6), a second mounting groove (10) is formed in one side of the first mounting groove (6), and a second chip supporting seat (11) is arranged in the second mounting groove (10).
2. A dual chip multiparameter pressure sensor base according to claim 1, wherein: the first chip supporting seat (7) and the second chip supporting seat (11) are both arranged to be suspended at the upper end and the lower end, a second glass insulator (8) is sintered outside the first chip supporting seat (7), and a third glass insulator (13) is sintered outside the second chip supporting seat (11).
3. A dual chip multiparameter pressure sensor base according to claim 1, wherein: the upper end of the oil filling cavity (14) is provided with a plurality of groups of lead pins (2) penetrating through the base shell (1) along the axial circumference of the base shell (1), and the outer parts of the lead pins (2) are provided with first glass insulators (5).
4. A dual chip multiparameter pressure sensor base according to claim 1, wherein: the upper end of first mounting groove (6) is provided with second air vent (4), one side of second air vent (4) is provided with first air vent (3) that run through base casing (1), second air vent (4) are linked together with first air vent (3).
5. A dual chip multiparameter pressure sensor base according to claim 1, wherein: the outside of second glass insulator (8) is provided with V type groove (9), V type groove (9) are seted up inside base casing (1), inside V type groove (9) are filled to second glass insulator (8).
6. A dual chip multiparameter pressure sensor base according to claim 1, wherein: the outside of third glass insulator (13) is provided with cylindrical groove (12), cylindrical groove (12) are seted up inside base casing (1), inside cylindrical groove (12) are filled to third glass insulator (13).
7. A dual-chip multi-parameter pressure sensor base, characterized by: the first chip supporting seat (7) and the second chip supporting seat (11) are made of kovar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310195449.7A CN116295966A (en) | 2023-03-03 | 2023-03-03 | Double-chip multi-parameter pressure sensor base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310195449.7A CN116295966A (en) | 2023-03-03 | 2023-03-03 | Double-chip multi-parameter pressure sensor base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116295966A true CN116295966A (en) | 2023-06-23 |
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ID=86837256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310195449.7A Pending CN116295966A (en) | 2023-03-03 | 2023-03-03 | Double-chip multi-parameter pressure sensor base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116295966A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040187588A1 (en) * | 2001-08-01 | 2004-09-30 | Keiji Miyazawa | Pressure sensor |
| JP2007327976A (en) * | 2007-09-14 | 2007-12-20 | Yamatake Corp | Pressure sensor |
| US20090314094A1 (en) * | 2008-06-19 | 2009-12-24 | Kulite Semiconductor Products, Inc. | Compact absolute and gage pressure transducer |
| CN203100967U (en) * | 2013-02-08 | 2013-07-31 | 安徽省易达电子有限公司 | Integrated sealing base of gauge pressure sensor |
| CN111373235A (en) * | 2017-11-23 | 2020-07-03 | 恩德莱斯和豪瑟尔欧洲两合公司 | Pressure measuring device |
| CN217111279U (en) * | 2022-03-16 | 2022-08-02 | 沈阳仪表科学研究院有限公司 | High-temperature pressure sensor for engine |
| CN217179808U (en) * | 2022-02-11 | 2022-08-12 | 蚌埠市创业电子有限责任公司 | Sensor base capable of preventing silicone oil leakage |
-
2023
- 2023-03-03 CN CN202310195449.7A patent/CN116295966A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040187588A1 (en) * | 2001-08-01 | 2004-09-30 | Keiji Miyazawa | Pressure sensor |
| JP2007327976A (en) * | 2007-09-14 | 2007-12-20 | Yamatake Corp | Pressure sensor |
| US20090314094A1 (en) * | 2008-06-19 | 2009-12-24 | Kulite Semiconductor Products, Inc. | Compact absolute and gage pressure transducer |
| CN203100967U (en) * | 2013-02-08 | 2013-07-31 | 安徽省易达电子有限公司 | Integrated sealing base of gauge pressure sensor |
| CN111373235A (en) * | 2017-11-23 | 2020-07-03 | 恩德莱斯和豪瑟尔欧洲两合公司 | Pressure measuring device |
| CN217179808U (en) * | 2022-02-11 | 2022-08-12 | 蚌埠市创业电子有限责任公司 | Sensor base capable of preventing silicone oil leakage |
| CN217111279U (en) * | 2022-03-16 | 2022-08-02 | 沈阳仪表科学研究院有限公司 | High-temperature pressure sensor for engine |
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