CN117030076A - Novel unsettled pressure sensor base - Google Patents
Novel unsettled pressure sensor base Download PDFInfo
- Publication number
- CN117030076A CN117030076A CN202310999799.9A CN202310999799A CN117030076A CN 117030076 A CN117030076 A CN 117030076A CN 202310999799 A CN202310999799 A CN 202310999799A CN 117030076 A CN117030076 A CN 117030076A
- Authority
- CN
- China
- Prior art keywords
- oil filling
- base
- pressure sensor
- chip
- mounting groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 29
- 239000012212 insulator Substances 0.000 claims abstract description 29
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 12
- 239000003921 oil Substances 0.000 description 54
- 238000005245 sintering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/26—Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a novel suspended pressure sensor base, which comprises a base shell, wherein an oil filling cavity is formed in the bottom of the base shell, a second mounting groove is formed in the upper end of the oil filling cavity, a first mounting groove is formed in the upper end of the second mounting groove, a chip supporting pipe is arranged in the first mounting groove, the upper end and the lower end of the chip supporting pipe are suspended, the sensor chip arranged in the novel suspended pressure sensor base is not contacted with the base shell of the novel suspended pressure sensor base, the chip supporting pipe is suspended at the upper end and the lower end, namely, the sensor chip is only contacted with the chip supporting pipe, the independence of the position of the sensor chip is improved through the chip supporting pipe and a first glass insulator sintered by the chip supporting pipe, so that the influence of the base shell on the sensor chip is minimized, the insulativity of the sensor chip is greatly improved, glue for bonding the sensor chip is greatly reduced, the influence of glue on the performance of the sensor chip is greatly improved, and the insulativity is greatly improved at the same time.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to a novel suspended pressure sensor base.
Background
The piezoresistive pressure sensor is manufactured by utilizing the piezoresistive effect of monocrystalline silicon, namely the principle that the resistivity of materials changes along with the change of the applied pressure, generally, the base shell and the chip of the pressure sensor are directly fixed by glue or a boss is arranged to fix the chip by glue, and the insulation between the base and the chip is considered, so that the glue is generally coated relatively thick, the purpose of fixation and insulation is achieved, but the performance of the chip is influenced by the thick glue, and if the glue is coated too little, the insulation cannot be achieved.
Disclosure of Invention
The invention provides a novel suspended pressure sensor base for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a novel unsettled pressure sensor base, includes the base casing, the oil filling chamber has been seted up to the bottom of base casing, the second mounting groove has been seted up to the upper end of oil filling chamber, the upper end of second mounting groove is provided with first mounting groove, be provided with the chip stay tube in the first mounting groove, the chip stay tube is upper and lower extreme unsettled, the outside sintering of chip stay tube has first glass insulator, first glass insulator sintering is on first mounting groove inner wall.
Further, the upper end of the oil filling cavity is provided with a plurality of groups of lead pins penetrating through the base shell along the axial circumference of the base shell, and the outer parts of the lead pins are provided with second glass insulators.
Further, the upper end of the first mounting groove is provided with a second oil filling hole, and a second oil filling pipe extending out of the top of the base shell is arranged in the second oil filling hole.
Further, a third oil filling hole penetrating through the base shell is formed in one side of the second oil filling hole.
Further, the upper end of the oil filling cavity is provided with a first oil filling hole, and a first oil filling pipe extending out of the top of the base shell is arranged in the first oil filling hole.
Further, the outside of first glass insulator is provided with V type groove, V type groove is seted up inside the base casing, first glass insulator fills V type inslot.
Further, the chip supporting tube is a kovar alloy tube.
Further, the diameter of the chip supporting tube is 1.8-2.2 mm.
Compared with the prior art, the invention has the beneficial effects that:
the sensor chip arranged in the invention is not touched with the base shell, and the chip supporting tube is suspended at the upper end and the lower end, namely, the sensor chip is only contacted with the chip supporting tube, and the independence of the position of the sensor chip is improved through the chip supporting tube and the first glass insulator sintered by the chip supporting tube, so that the influence of the base shell on the sensor chip is minimized, the insulativity of the sensor chip is greatly improved, the glue used for bonding the sensor chip is greatly reduced, the influence of the glue on the performance of the sensor chip is reduced, and the insulativity is greatly improved at the same time.
Drawings
Fig. 1 is a schematic structural diagram of a suspended novel pressure sensor base of the present invention.
Fig. 2 is an enlarged schematic view of the structure of fig. 1 a according to the present invention.
Fig. 3 is a side cross-sectional view of the present invention.
Fig. 4 is a top view of the present invention.
In the figure: 1. a first oil filling hole; 2. a base housing; 3. a first oil filling pipe; 4. a second oil filling pipe; 5. a second oil filling hole; 6. a third oil filling hole; 7. a first mounting groove; 8. a first glass insulator; 9. a second mounting groove; 10. an oil filling cavity; 11. a chip supporting tube; 12. a V-shaped groove; 13. a pin; 14. and a second glass insulator.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the present invention provides the following technical solutions:
example 1
The novel suspended pressure sensor base comprises a base shell 2, wherein an oil filling cavity 10 is formed in the bottom of the base shell 2, a second mounting groove 9 is formed in the upper end of the oil filling cavity 10, a first mounting groove 7 is formed in the upper end of the second mounting groove 9, a chip supporting tube 11 is arranged in the first mounting groove 7, the upper end and the lower end of the chip supporting tube 11 are suspended, a first glass insulator 8 is sintered outside the chip supporting tube 11, and the first glass insulator 8 is sintered on the inner wall of the first mounting groove 7; the upper end of the oil filling cavity 10 is provided with a plurality of groups of lead pins 13 penetrating through the base shell 2 along the circumference of the axial direction of the base shell 2, and the outer parts of the lead pins 13 are provided with second glass insulators 14; the upper end of the first mounting groove 7 is provided with a second oil filling hole 5, a second oil filling pipe 4 extending out of the top of the base shell 2 is arranged in the second oil filling hole 5, and one side of the second oil filling hole 5 is provided with a third oil filling hole 6 penetrating through the base shell 2 and used for filling oil into the outer cavity; the upper end of the oil filling cavity 10 is provided with a first oil filling hole 1, a first oil filling pipe 3 extending out of the top of the base shell 2 is arranged in the first oil filling hole 1, wherein the first oil filling pipe 3 and the second oil filling pipe 4 can be used for filling oil, when one oil filling pipe is used for filling oil, the other oil filling pipe is used for detecting, when one oil filling pipe is used for filling oil, the oil filling is finished when the oil is discharged from the other oil filling pipe, and the two oil filling pipes are sealed to finish oil filling work; for the stability of the second oil filling pipe 4 and the first oil filling pipe 3, the second oil filling pipe 4 and the first oil filling pipe 3 are respectively fixed inside the second oil filling hole 5 and the first oil filling hole 1 by brazing; in order to make the second oil filling pipe 4 and the first oil filling pipe 3 light in weight, the second oil filling pipe 4 and the first oil filling pipe 3 are American standard 316L stainless steel pipes.
Specifically, the sensor chip is fixed at the bottom of the chip supporting tube 11 in the second mounting groove 9 by using less glue, the sensor chip is not touched with the base shell 2 thereof, and as the chip supporting tube 11 is in suspension at the upper end and the lower end, namely, the sensor chip is only contacted with the chip supporting tube 11, the independence of the position of the sensor chip is improved by the chip supporting tube 11 and the first glass insulator 8 sintered by the chip supporting tube 11, so that the influence of the base shell 2 on the sensor chip is minimized, the insulativity of the sensor chip is greatly improved, the glue used for bonding the sensor chip is greatly reduced, the influence of the glue on the performance of the sensor chip is reduced, the insulativity is greatly improved, and multiple purposes are achieved.
Example 2
As an optional condition, a novel suspended pressure sensor base, the outside of a first glass insulator 8 is provided with a V-shaped groove 12, the V-shaped groove 12 is arranged inside a base shell 2, and the inside of the V-shaped groove 12 is filled with the first glass insulator 8.
Specifically, through set up V type groove 12 in the outside of first glass insulator 8 for first glass insulator 8 fills up V type groove, thereby after the sintering, increases first glass insulator 8's resistance that drops, avoids first glass insulator 8 to produce the gap with base casing 2, makes base casing 2 bear bigger pressure, prevents that the silicone oil from leaking, avoids sensor base atress or sintering process, and first glass insulator 8 and base casing 2 have the gap, makes the drawback that the silicone oil leaked.
The scheme in this embodiment may be selectively used in combination with the scheme in other embodiments.
Example 3
As an optional case, a novel suspended pressure sensor base, in order to be matched and firmly sealed with a first glass insulator 8, a chip supporting tube 11 is a kovar alloy tube, the model is 4J29, the diameter is 1.8-2.2 mm, and the chip supporting tube and the first glass insulator 8 are sintered on a base shell 2 to be a sintered part;
specifically, experiments prove that the chip support tube 11 with the diameter of less than 1.8mm is not bonded and falls off.
The following table shows experimental data after bonding the sensor base to the chip, wherein 316L is made of stainless steel, and the maximum temperature drift error (-20-60 ℃ maximum drift divided by the total measuring range).
Summarizing, the data show that the sintering part chip supporting tube 11 adopts a kovar alloy tube with the diameter of 1.8-2.2 mm, has small temperature drift error and good effect, wherein the temperature drift error of the structure with the diameter of 2mm is minimum, and the effect is best, thereby ensuring the measurement precision.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a novel unsettled pressure sensor base, includes base casing (2), its characterized in that: the novel glass insulator is characterized in that an oil filling cavity (10) is formed in the bottom of the base shell (2), a second mounting groove (9) is formed in the upper end of the oil filling cavity (10), a first mounting groove (7) is formed in the upper end of the second mounting groove (9), a chip supporting tube (11) is arranged in the first mounting groove (7), the upper end and the lower end of the chip supporting tube (11) are suspended, a first glass insulator (8) is sintered outside the chip supporting tube (11), and the first glass insulator (8) is sintered on the inner wall of the first mounting groove (7).
2. The suspended novel pressure sensor base of claim 1, wherein: the upper end of the oil filling cavity (10) is provided with a plurality of groups of lead pins (13) penetrating through the base shell (2) along the axial circumference of the base shell (2), and the outer parts of the lead pins (13) are provided with second glass insulators (14).
3. The suspended novel pressure sensor base of claim 1, wherein: the upper end of the first mounting groove (7) is provided with a second oil filling hole (5), and a second oil filling pipe (4) extending out of the top of the base shell (2) is arranged in the second oil filling hole (5).
4. The suspended novel pressure sensor base of claim 1, wherein: one side of the second oil filling hole (5) is provided with a third oil filling hole (6) penetrating through the base shell (2).
5. The suspended novel pressure sensor base of claim 1, wherein: the upper end of the oil filling cavity (10) is provided with a first oil filling hole (1), and a first oil filling pipe (3) extending out of the top of the base shell (2) is arranged in the first oil filling hole (1).
6. The suspended novel pressure sensor base of claim 1, wherein: the novel glass insulator is characterized in that a V-shaped groove (12) is formed in the outer portion of the first glass insulator (8), the V-shaped groove (12) is formed in the base shell (2), and the V-shaped groove (12) is filled in the first glass insulator (8).
7. The suspended novel pressure sensor base of claim 1, wherein: the chip supporting tube (11) is a kovar alloy tube.
8. The suspended novel pressure sensor base of claim 7, wherein: the diameter of the chip supporting tube (11) is 1.8-2.2 mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2023101645667 | 2023-02-25 | ||
| CN202310164566.7A CN116448289A (en) | 2023-02-25 | 2023-02-25 | Novel unsettled pressure sensor base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117030076A true CN117030076A (en) | 2023-11-10 |
Family
ID=87122691
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310164566.7A Pending CN116448289A (en) | 2023-02-25 | 2023-02-25 | Novel unsettled pressure sensor base |
| CN202310999799.9A Pending CN117030076A (en) | 2023-02-25 | 2023-08-10 | Novel unsettled pressure sensor base |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310164566.7A Pending CN116448289A (en) | 2023-02-25 | 2023-02-25 | Novel unsettled pressure sensor base |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN116448289A (en) |
-
2023
- 2023-02-25 CN CN202310164566.7A patent/CN116448289A/en active Pending
- 2023-08-10 CN CN202310999799.9A patent/CN117030076A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116448289A (en) | 2023-07-18 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |