CN210928141U - 一种高效散热的电路板 - Google Patents
一种高效散热的电路板 Download PDFInfo
- Publication number
- CN210928141U CN210928141U CN201922071019.6U CN201922071019U CN210928141U CN 210928141 U CN210928141 U CN 210928141U CN 201922071019 U CN201922071019 U CN 201922071019U CN 210928141 U CN210928141 U CN 210928141U
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- soldering tin
- louvre
- tin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000005476 soldering Methods 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000003292 glue Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922071019.6U CN210928141U (zh) | 2019-11-27 | 2019-11-27 | 一种高效散热的电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922071019.6U CN210928141U (zh) | 2019-11-27 | 2019-11-27 | 一种高效散热的电路板 |
Publications (1)
Publication Number | Publication Date |
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CN210928141U true CN210928141U (zh) | 2020-07-03 |
Family
ID=71350739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201922071019.6U Active CN210928141U (zh) | 2019-11-27 | 2019-11-27 | 一种高效散热的电路板 |
Country Status (1)
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CN (1) | CN210928141U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113225902A (zh) * | 2021-05-18 | 2021-08-06 | 深圳市中孚能电气设备有限公司 | 一种印刷电路结构、矿灯和整流器 |
-
2019
- 2019-11-27 CN CN201922071019.6U patent/CN210928141U/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113225902A (zh) * | 2021-05-18 | 2021-08-06 | 深圳市中孚能电气设备有限公司 | 一种印刷电路结构、矿灯和整流器 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240529 Address after: Room 302, Unit 3, Building 7, Provincial Administration for Industry and Commerce Dormitory, No. 316 Tiyu South Street, Yuhua District, Shijiazhuang City, Hebei Province, 050000 Patentee after: Fan Shubo Country or region after: China Address before: 215600, 4th Floor, Building H, Zhangjiagang Economic and Technological Development Zone (Municipal High tech Entrepreneurship Service Center), Suzhou City, Jiangsu Province (Fidelity) Patentee before: SUZHOU FEIDAXU MICRO-ELECTRONICS Co.,Ltd. Country or region before: China |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240703 Address after: 050000 Tianshan Science Park 6-504, No. 319 Xiangjiang Road, Shijiazhuang High-tech Zone, Hebei Province Patentee after: Hebei Maoshun Electronic Technology Co.,Ltd. Country or region after: China Address before: Room 302, Unit 3, Building 7, Provincial Administration for Industry and Commerce Dormitory, No. 316 Tiyu South Street, Yuhua District, Shijiazhuang City, Hebei Province, 050000 Patentee before: Fan Shubo Country or region before: China |