CN210863949U - Aging test tool for hybrid integrated circuit - Google Patents
Aging test tool for hybrid integrated circuit Download PDFInfo
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- CN210863949U CN210863949U CN201921174734.6U CN201921174734U CN210863949U CN 210863949 U CN210863949 U CN 210863949U CN 201921174734 U CN201921174734 U CN 201921174734U CN 210863949 U CN210863949 U CN 210863949U
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Abstract
The utility model provides a mixed integrated circuit smelts experimental frock always, including smelting board, loading board, device fixed knot structure and test structure always, smelting board and loading board parallel fixed always, have certain space between the two, device fixed knot constructs and test structure installs on the loading board, and test structure symmetric distribution is in device fixed knot structure both sides, the fixed device that awaits measuring of device fixed knot structure. The utility model discloses a special test structure, metal spring probe and device pin flexible contact when guaranteeing with the effective contact of device pin, have avoided the injury to the pin.
Description
Technical Field
The utility model relates to a mixed integrated circuit smelts experimental frock always belongs to components and parts reliability test technical field.
Background
At present, most of mixed integrated circuit aging equipment is integrated by various instruments and instrument systems such as a power supply, an electronic load and the like. The pins of the hybrid integrated circuit device are not consistent in arrangement, number and thickness, and the clamp is lack of standardization and universalization. The conventional clamp adopts a locking seat mode, and has poor effective contact and protection on device pins. When the high-power hybrid integrated circuit is tested, power is consumed for heat dissipation, and if the heat cannot be effectively diffused, the device can be damaged.
Patents CN102435876A, CN202113034U, and CN204989229U provide clamps or test seats for testing chips by using metal spring probes, the chip test clamps are suitable for monolithic integrated circuits, and one clamp can only be used for one monolithic test, which is poor in universality; the chip test fixture can not be applied to the hybrid integrated circuit with large volume, thick metal pins, irregular arrangement and large power dissipation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide a good heat dissipation, to the device injury-free, guarantee with the mixed integrated circuit aging test frock of pin effective contact.
The technical solution of the utility model is as follows: the mixed integrated circuit aging test tool comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap is formed between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and a device to be tested is fixed by the device fixing structure;
the test structure comprises a test first fixed carrier plate, a test second fixed carrier plate, a probe structure, a frame locking structure, a guide structure, a positioning column and a movable carrier plate, wherein the test first fixed carrier plate and the test second fixed carrier plate are fixedly arranged on the carrier plates;
the probe structure constitute by probe mounting panel and a plurality of metal spring probe, the one end at the probe mounting panel is installed to the metal spring probe, the other end fixed mounting of probe mounting panel is on removing the support plate, connect guide structure between the fixed support plate of the first fixed support plate of test and test second, it moves between the fixed support plate of the first fixed support plate of test and test second through guide structure to remove the support plate, it removes to the device pin that awaits measuring to drive the probe structure from both ends, metal spring probe and the device pin side contact that awaits measuring, frame locking structure will remove the support plate and fix at the test position.
The utility model has the advantages of compared with the prior art:
(1) the utility model adopts a special test structure, the metal spring probe flexibly contacts with the pin of the device, and the pin is prevented from being damaged while the effective contact with the pin of the device is ensured;
(2) the utility model adopts a split charging structure, the probe structure contacting with the pin of the device can be flexibly replaced according to different devices, and the whole tool has good universality;
(3) the device fixing structure of the utility model has simple structure and simple operation, and the pins of the device do not need to be inserted, thereby avoiding the damage to the pins;
(4) the utility model has the advantages that the test structure and the device fixing structure are additionally arranged on the bearing plate separated from the aging plate, thus having good heat dissipation;
(5) the utility model discloses can install heat radiation structure between loading board and the burn-in board, further improve the thermal diffusivity of frock.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the fixing structure of the device of the present invention (buckled);
FIG. 3 is a front view (buckled) of the device fixing structure of the present invention;
FIG. 4 is a schematic diagram of the test structure of the present invention before operation;
fig. 5 is a schematic diagram of the test structure according to the present invention after operation.
Detailed Description
The utility model provides a mixed integrated circuit smelts experimental frock always, including smelting board, loading board, device fixed knot structure and test structure always, smelting board and loading board parallel fixed always exist certain space between the two, and device fixed knot constructs and test structure installs on the loading board, and test structure symmetric distribution is in device fixed knot structure both sides, the fixed device that awaits measuring of device fixed knot structure.
The test structure comprises a test first fixing support plate, a test second fixing support plate, a probe structure, a frame locking structure, a guide structure, a positioning column and a movable support plate, wherein the test first fixing support plate and the test second fixing support plate are fixedly arranged on the support plates, the frame locking structure is arranged on the support plates and used for positioning the movable support plate at a test position and a non-test position, the positioning column is arranged at two ends of the test first fixing support plate close to one side of the movable support plate, and the positioning column penetrates through the movable support plate in the process of moving the movable support plate to the test first fixing support plate.
The probe structure is composed of a probe mounting plate and a plurality of metal spring probes, the metal spring probes are mounted at one end of the probe mounting plate, the other end of the probe mounting plate is fixedly mounted on a movable carrier plate, a guide structure is connected between a first test fixed carrier plate and a second test fixed carrier plate, the movable carrier plate moves between the first test fixed carrier plate and the second test fixed carrier plate through the guide structure to drive the probe structure to move from two ends to pins of a device to be tested, the metal spring probes are in contact with the side faces of the pins of the device to be tested, and the movable carrier plate is fixed at a test position through a frame locking structure.
The utility model discloses device fixed knot constructs and is used for fixed device under test, as long as can reach and keep the device under test can not be moved in the position on the loading board in the test procedure, can accomplish the test can.
The utility model discloses frame locking structure is used for removing support plate (probe structure) and can adopt the structure that can satisfy two position department location requirements all at the location of test position and non-test position.
The present invention will be described in detail with reference to the following specific examples and accompanying drawings.
The utility model discloses as shown in fig. 1, including smelting always board 1, loading board 2, device fixed knot construct and test structure, smelting always board 1 and loading board 2 fixed through stand 3, make to have certain space between the two, device fixed knot constructs and test structure installs on loading board 2, and test structure symmetric distribution is in device fixed knot constructs both sides, as shown in fig. 1 along AB line (device fixed knot constructs symmetry axis) symmetric distribution.
The device fixing structure is shown in fig. 2 and 3 and comprises a first fixing carrier plate 6, a second fixing carrier plate 8, a cover plate 7 and a buckle plate 9, wherein the first fixing carrier plate 6 and the second fixing carrier plate 8 are fixed on the carrier plate 2, a rotating shaft 5 is fixedly arranged on the first fixing carrier plate 6, the fixed end of the cover plate 7 is arranged on the first fixing carrier plate 6 through the rotating shaft 5, the non-fixed end of the cover plate 7 is connected with one end of the buckle plate 9, the other end of the buckle plate 9 is hook-shaped, when the buckle plate 9 is buckled on the second fixing carrier plate 8, the cover plate 7 is fixed between the first fixing carrier plate 6 and the second fixing carrier plate 8, a device to be tested is fixed under the cover plate 7, and when the buckle plate 9 is loosened and not buckled on the second fixing carrier plate 8, the cover plate 7 rotates.
The testing structure is shown in fig. 4 and 5, and includes a first fixed carrier 12, a second fixed carrier 15, a probe structure, a frame locking structure, a guiding structure, a positioning column 16 and a movable carrier 14, wherein the first fixed carrier 12 and the second fixed carrier 15 are fixedly mounted on the carrier 2.
The probe structure is composed of a probe mounting plate 13 and a plurality of metal spring probes 11, wherein the metal spring probes 11 are mounted at one end of the probe mounting plate 13, the other end of the probe mounting plate 13 is fixedly mounted on the movable carrier plate 14, and a reinforcing plate 24 can be fixedly mounted at the other side of the movable carrier plate 14 and used for reinforcing the movable carrier plate 14.
A guide column 23 and guide cylinders 22 and 25 are connected between the first test fixed carrier board 12 and the second test fixed carrier board 15, the guide cylinder 22 is fixedly connected to the first test fixed carrier board 12, the guide column 23 penetrates through the guide cylinder 22 and is fixed on the first test fixed carrier board 12, the guide cylinder 25 is fixed on the movable carrier board 14, the guide cylinder 22 penetrates through the movable carrier board 14, the guide column 23 is matched with the guide cylinders 22 and 25, and the movable carrier board 14 can move back and forth between the first test fixed carrier board 12 and the second test fixed carrier board 15 along the guide column 23 and the guide cylinders 22 and 25. This embodiment designs the guiding structure of the guiding columns 23 and the guiding cylinders 22 and 25, which is more precise, and also designs only one set of guiding columns at both ends between the first fixed carrier board 12 for testing and the second fixed carrier board 15 for testing, so as to realize the movement of the movable carrier board 14 between the first fixed carrier board 12 for testing and the second fixed carrier board 15 for testing.
The probe mounting plate 13, which is fixedly mounted on the moving carrier plate 14, is movable with the moving carrier plate 14 to below the first fixed carrier plate 12 for testing. The two ends of the first fixed carrier 12 for testing near one side of the movable carrier 14 are provided with positioning pillars 16, and the positioning pillars 16 can penetrate through the movable carrier 14 and the reinforcing plate 24 and pass through the positioning holes 26 of the reinforcing plate 24.
The frame locking structure is composed of frames 17, 19 symmetrically distributed at both ends of the second fixed carrier plate 15, and the frames 17, 19 are respectively installed on the bearing plate 2 through a frame rotating shaft 21. The frames 17, 19 are composed of a fixed end, a connecting portion and a kneading end as shown in fig. 4, the fixed end processing groove 29 and the end portion groove 30, the springs 18, 28 are respectively installed between the connecting portion of the frames 17, 19 and the second fixing carrier plate 15 to be tested after being compressed, and the springs 18, 28 play a flexible contact role, so that the frames 17, 19 and the second fixing carrier plate 15 to be tested are kept in contact during the movement of the moving carrier plate 14.
During non-testing, two ends of the movable carrier 14 are respectively inserted into the grooves 29 of the frames 17, 19 to be fixed, during testing, the pinch-in ends of the frames 17, 19 are forced toward each other, the fixed ends of the frames 17, 19 are opened under the action of the springs 18, 29, two ends of the movable carrier 14 are separated from the grooves 29, the movable carrier 14 drives the probe mounting plate 13 to move towards the device direction along the guide posts 23, the positioning posts 16 penetrate through the movable carrier 14 and penetrate out of the positioning holes 26 of the reinforcing plate 24 during the movement of the movable carrier 14 towards the first fixed carrier 12 for testing, the movable carrier 14, the reinforcing plate 24 and the guide cylinders 25 move towards the first fixed carrier 12 for testing, and the guide cylinders 22 are inserted into the movable carrier 14. The metal spring probe 11 fixed on the probe mounting plate 13 moves towards the device pin to be tested and contacts with the side surface of the device pin, the two ends of the movable carrier plate 14 are positioned in the grooves 30 at the end parts of the frames 17 and 19, the position of the movable carrier plate 14 is fixed, and the position of the probe mounting plate 13 is further fixed.
The quantity and the position of the metal spring probe that distribute on the probe mounting panel 13 are confirmed according to the device type that awaits measuring, the utility model discloses when detecting different devices, only need to change probe mounting panel 13 and can realize, have the commonality.
The bearing plate 2 is made of metal materials, so that heat dissipation is facilitated. If necessary, the heat dissipation plate 20 can be fixed on the bottom surface of the bearing plate 2 to increase the heat dissipation strength. A plurality of sets of test tools can be arranged on the bearing plate 2 as required to test the same or different types of devices together.
Various detection circuits are arranged on the aging board 1 and are connected with the metal spring probe data wires according to requirements, and the detection circuits are designed by the known technology in the field.
The detailed description of the present invention is the technology known to those skilled in the art.
Claims (7)
1. Hybrid integrated circuit smelts experimental frock always, its characterized in that: the device fixing structure and the test structure are arranged on the bearing plate, the test structures are symmetrically distributed on two sides of the device fixing structure, and the device fixing structure fixes a device to be tested;
the test structure comprises a test first fixed carrier plate, a test second fixed carrier plate, a probe structure, a frame locking structure, a guide structure, a positioning column and a movable carrier plate, wherein the test first fixed carrier plate and the test second fixed carrier plate are fixedly arranged on the carrier plates;
the probe structure constitute by probe mounting panel and a plurality of metal spring probe, the one end at the probe mounting panel is installed to the metal spring probe, the other end fixed mounting of probe mounting panel is on removing the support plate, connect guide structure between the fixed support plate of the first fixed support plate of test and test second, it moves between the fixed support plate of the first fixed support plate of test and test second through guide structure to remove the support plate, it removes to the device pin that awaits measuring to drive the probe structure from both ends, metal spring probe and the device pin side contact that awaits measuring, frame locking structure will remove the support plate and fix at the test position.
2. The hybrid integrated circuit burn-in test tool of claim 1, wherein: the frame locking structure is composed of a first frame and a second frame which are symmetrically distributed at two ends of a second fixed carrier plate to be tested, the first frame and the second frame are respectively arranged on the carrier plate through a frame rotating shaft, the first frame and the second frame are composed of fixed ends, connecting parts and kneading ends, the fixed ends are provided with grooves and end part grooves, springs are respectively arranged between the connecting parts of the first frame and the second fixed carrier plate to be tested after being compressed, the first frame and the second frame are kept in contact with the second fixed carrier plate to be tested in the moving process of the movable carrier plate, when the movable carrier plate is not tested, two ends are respectively inserted into the grooves of the first frame and the second frame to be fixed, when testing is carried out, the kneading ends of the first frame and the second frame exert force in opposite directions, the fixed ends of the first frame and the second frame are opened under the action of the springs, two ends of the movable carrier plate are, after the side surface of the pin of the device to be tested is contacted with the metal spring probe, two ends of the movable carrier plate are positioned in the end part grooves of the first frame and the second frame, the position of the movable carrier plate is fixed, and then the position of the probe mounting plate is fixed.
3. The hybrid integrated circuit burn-in test tool of claim 1, wherein: the guide structure comprises guide posts, a first guide cylinder and a second guide cylinder, the first guide cylinder is fixedly connected to a first test fixing carrier plate, the guide posts penetrate through the first guide cylinder and are fixed to the first test fixing carrier plate, the second guide cylinder is fixed to a movable carrier plate, the first guide cylinder penetrates through the movable carrier plate, the guide posts are matched with the first guide cylinder and the second guide cylinder, and the movable carrier plate can move along the guide posts and the first guide cylinder and the second guide cylinder.
4. The hybrid integrated circuit burn-in test tool of claim 1, wherein: the device fixing structure comprises a first fixing support plate, a second fixing support plate, a cover plate and a buckle plate, wherein the first fixing support plate and the second fixing support plate are fixed on the support plate, a rotating shaft is fixedly installed on the first fixing support plate, the fixed end of the cover plate is installed on the first fixing support plate through a rotating shaft, the non-fixed end of the cover plate is connected with one end of the buckle plate, the other end of the buckle plate is in a hook shape, when the buckle plate is buckled on the second fixing support plate, the cover plate is fixed between the first fixing support plate and the second fixing support plate, a device to be tested is fixed under the cover plate, when the buckle plate is loosened, the buckle plate is not buckled on the second fixing support plate, the cover plate.
5. The hybrid integrated circuit burn-in test tool of claim 1, wherein: the probe mounting plate is replaceable, and the number and the positions of the metal spring probes distributed on the probe mounting plate are determined according to the type of the device to be tested.
6. The hybrid integrated circuit burn-in test tool of claim 1, wherein: the bearing plate is made of metal materials, and a heat dissipation plate is fixed on the bottom surface of the bearing plate.
7. The hybrid integrated circuit burn-in test tool of claim 1, wherein: and a reinforcing plate is fixedly arranged on one side of the movable carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921174734.6U CN210863949U (en) | 2019-07-24 | 2019-07-24 | Aging test tool for hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921174734.6U CN210863949U (en) | 2019-07-24 | 2019-07-24 | Aging test tool for hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210863949U true CN210863949U (en) | 2020-06-26 |
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ID=71289876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921174734.6U Active CN210863949U (en) | 2019-07-24 | 2019-07-24 | Aging test tool for hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210863949U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112285524A (en) * | 2019-07-24 | 2021-01-29 | 北京振兴计量测试研究所 | Aging test tool and method for hybrid integrated circuit |
| CN115308454A (en) * | 2022-10-10 | 2022-11-08 | 杭州三海电子有限公司 | Resistance clamp for burn-in test and resistance burn-in test system |
-
2019
- 2019-07-24 CN CN201921174734.6U patent/CN210863949U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112285524A (en) * | 2019-07-24 | 2021-01-29 | 北京振兴计量测试研究所 | Aging test tool and method for hybrid integrated circuit |
| CN112285524B (en) * | 2019-07-24 | 2024-06-07 | 北京振兴计量测试研究所 | Hybrid integrated circuit aging test tool and method |
| CN115308454A (en) * | 2022-10-10 | 2022-11-08 | 杭州三海电子有限公司 | Resistance clamp for burn-in test and resistance burn-in test system |
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