CN112285524B - Hybrid integrated circuit aging test tool and method - Google Patents
Hybrid integrated circuit aging test tool and method Download PDFInfo
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- CN112285524B CN112285524B CN201910669311.XA CN201910669311A CN112285524B CN 112285524 B CN112285524 B CN 112285524B CN 201910669311 A CN201910669311 A CN 201910669311A CN 112285524 B CN112285524 B CN 112285524B
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- 238000012360 testing method Methods 0.000 title claims abstract description 123
- 230000032683 aging Effects 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000523 sample Substances 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 26
- 238000004898 kneading Methods 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000003014 reinforcing effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
Abstract
The invention provides a mixed integrated circuit aging test tool and a method, wherein the mixed integrated circuit aging test tool comprises an aging board, a bearing plate, a device fixing structure and a test structure, wherein the aging board and the bearing plate are parallelly fixed, a certain gap exists between the aging board and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and the device fixing structure is used for fixing a device to be tested. The invention adopts a special test structure, and the metal spring probe is flexibly contacted with the pin of the device, so that the damage to the pin is avoided while the effective contact with the pin of the device is ensured.
Description
Technical Field
The invention relates to a mixed integrated circuit aging test tool and a mixed integrated circuit aging test method, and belongs to the technical field of component reliability tests.
Background
At present, most hybrid integrated circuit aging devices are integrated by various instruments and instrument systems such as power supplies, electronic loads and the like. The pin arrangement, the number and the thickness of the mixed integrated circuit device are not consistent, and the clamp is lack of standardization and generalization. The conventional clamp adopts a locking seat mode, so that the effective contact and the protection of the device pins are poor. When a high-power hybrid integrated circuit is tested, power is consumed for heat dissipation, and if heat cannot be effectively diffused, the device can be damaged.
Patent CN102435876A, CN202113034U, CN204989229U provides a fixture or test seat for testing a chip using a metal spring probe, the chip test fixture is suitable for monolithic integrated circuits, and one fixture can only be used for one monolithic test, and the universality is poor; for a hybrid integrated circuit with large volume, thick metal pins, irregular arrangement and large power dissipation, the chip test fixture cannot be applied.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a mixed integrated circuit aging test tool and a method which have good heat dissipation performance, do not harm devices and ensure effective contact with pins.
The technical solution of the invention is as follows: a mixed integrated circuit aging test fixture comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap exists between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and the device fixing structure is used for fixing a device to be tested;
The test structure comprises a first test fixed carrier plate, a second test fixed carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the first test fixed carrier plate and the second test fixed carrier plate are fixedly arranged on the carrier plate, and the frame locking structure is arranged on the carrier plate and used for positioning the movable carrier plate at a test position and a non-test position;
The probe structure comprises a probe mounting plate and a plurality of metal spring probes, the metal spring probes are mounted at one end of the probe mounting plate, the other end of the probe mounting plate is fixedly mounted on a movable carrier plate, a guide structure is connected between a first test fixed carrier plate and a second test fixed carrier plate, the movable carrier plate moves between the first test fixed carrier plate and the second test fixed carrier plate through the guide structure, the probe structure is driven to move from two ends to pins of a device to be tested, the metal spring probes are in contact with the sides of the pins of the device to be tested, and the movable carrier plate is fixed at a test position by a framework locking structure.
A hybrid integrated circuit aging test method is realized through the following steps:
the method comprises the steps that firstly, a device to be tested is fixed on a bearing plate through a device fixing structure, a proper probe structure is selected according to the device to be tested, the device to be tested is arranged on a movable bearing plate, and the movable bearing plate is locked and positioned through a frame locking structure;
Secondly, the frame locking structure releases the movable carrier, the movable carrier drives the probe structure to move between the first test fixed carrier and the second test fixed carrier, the metal spring probe of the probe structure contacts with the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier;
And thirdly, testing the device to be tested.
Compared with the prior art, the invention has the beneficial effects that:
(1) The invention adopts a special test structure, and the metal spring probe is flexibly contacted with the pin of the device, so that the damage to the pin is avoided while the effective contact with the pin of the device is ensured;
(2) The test structure adopts a split charging structure, and the probe structure used for contacting with the pins of the device can be flexibly replaced according to the different devices, so that the whole tool has good universality;
(3) The device fixing structure is simple in structure and convenient to operate, pins of the device do not need to be inserted, and damage to the pins is avoided;
(4) The test structure and the device fixing structure are additionally arranged on the bearing plate separated from the aging board, so that the heat dissipation performance is good;
(5) According to the invention, the heat dissipation structure can be arranged between the bearing plate and the aging plate, so that the heat dissipation performance of the tool is further improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the device fixing structure (snap-on) of the present invention;
FIG. 3 is a front view (snap-on) of the device securing structure of the present invention;
FIG. 4 is a schematic diagram of the test structure of the present invention before operation;
FIG. 5 is a schematic diagram of the test structure of the present invention after operation.
Detailed Description
The invention provides a mixed integrated circuit aging test fixture which comprises an aging board, a bearing board, device fixing structures and test structures, wherein the aging board and the bearing board are parallelly fixed, a certain gap exists between the aging board and the bearing board, the device fixing structures and the test structures are arranged on the bearing board, the test structures are symmetrically distributed on two sides of the device fixing structures, and the device fixing structures fix devices to be tested.
The test structure comprises a first test fixed carrier plate, a second test fixed carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the first test fixed carrier plate and the second test fixed carrier plate are fixedly arranged on the carrier plate, and the frame locking structure is arranged on the carrier plate and used for positioning the movable carrier plate at a test position and a non-test position.
The probe structure comprises a probe mounting plate and a plurality of metal spring probes, the metal spring probes are mounted at one end of the probe mounting plate, the other end of the probe mounting plate is fixedly mounted on a movable carrier plate, a guide structure is connected between a first test fixed carrier plate and a second test fixed carrier plate, the movable carrier plate moves between the first test fixed carrier plate and the second test fixed carrier plate through the guide structure, the probe structure is driven to move from two ends to a pin of a device to be tested, the metal spring probes are in contact with the side face of the pin of the device to be tested, and the movable carrier plate is fixed at a test position by a framework locking structure.
The device fixing structure is used for fixing the device to be tested, and can complete the test as long as the device to be tested can be kept at a position on the bearing plate without moving in the test process.
The frame locking structure is used for positioning the movable carrier plate (probe structure) at the test position and the non-test position, and can adopt a structure capable of meeting the positioning requirements at the two positions.
The present invention will be described in detail with reference to specific examples and drawings.
The invention provides a mixed integrated circuit aging test fixture as shown in fig. 1, which comprises an aging board 1, a bearing board 2, a device fixing structure and a test structure, wherein the aging board 1 and the bearing board 2 are fixed through stand columns 3, a certain gap exists between the aging board 1 and the bearing board, the device fixing structure and the test structure are arranged on the bearing board 2, the test structure is symmetrically distributed on two sides of the device fixing structure, and the test structure is symmetrically distributed along an AB line (symmetrical axis of the device fixing structure) as shown in fig. 1.
The device fixing structure is shown in fig. 2 and 3, and comprises a first fixing carrier plate 6, a second fixing carrier plate 8, a cover plate 7 and a buckle plate 9, wherein the first fixing carrier plate 6 and the second fixing carrier plate 8 are fixed on the carrier plate 2, a rotating shaft 5 is fixedly installed on the first fixing carrier plate 6, the fixed end of the cover plate 7 is installed on the first fixing carrier plate 6 through the rotating shaft 5, the non-fixed end of the cover plate 7 is connected with one end of the buckle plate 9, the other end of the buckle plate 9 is in a hook shape, when the buckle plate 9 is buckled on the second fixing carrier plate 8, the cover plate 7 is fixed between the first fixing carrier plate 6 and the second fixing carrier plate 8, a device to be tested is fixed below the cover plate 7, when the buckle plate 9 is loosened and is not buckled on the second fixing carrier plate 8, the cover plate 7 rotates around the rotating shaft 5 to be opened, and the device to be tested can be assembled and disassembled.
The test structure is shown in fig. 4 and 5, and comprises a first test fixed carrier plate 12, a second test fixed carrier plate 15, a probe structure, a frame locking structure and a movable carrier plate 14, wherein the first test fixed carrier plate 12 and the second test fixed carrier plate 15 are fixedly arranged on the carrier plate 2.
The probe structure is composed of a probe mounting plate 13 and a plurality of metal spring probes 11, wherein the metal spring probes 11 are mounted at one end of the probe mounting plate 13, the other end of the probe mounting plate 13 is fixedly mounted on the movable carrier plate 14, and a reinforcing plate 24 can be fixedly mounted at the other side of the movable carrier plate 14 and used for reinforcing the movable carrier plate 14.
A guide post 23, guide cylinders 22 and 25 are connected between the first fixed carrier plate 12 and the second fixed carrier plate 15, the guide cylinder 22 is fixedly connected to the first fixed carrier plate 12, the guide post 23 penetrates through the guide cylinder 22 and is fixed to the first fixed carrier plate 12, the guide cylinder 25 is fixed to the movable carrier plate 14, the guide cylinder 22 penetrates through the movable carrier plate 14, the guide post 23 is matched with the guide cylinders 22 and 25, and the movable carrier plate 14 can move back and forth between the first fixed carrier plate 12 and the second fixed carrier plate 15 along the guide post 23 and the guide cylinders 22 and 25. The present embodiment designs the guiding structures such as the guiding posts 23 and the guiding cylinders 22 and 25, so that the guiding is more accurate, and only one group of guiding posts is designed at two ends between the first testing fixed carrier plate 12 and the second testing fixed carrier plate 15, so that the moving carrier plate 14 can move between the first testing fixed carrier plate 12 and the second testing fixed carrier plate 15.
The probe mounting plate 13, which is fixedly mounted on the mobile carrier plate 14, is movable with the mobile carrier plate 14 under the test first fixed carrier plate 12. Positioning columns 16 are mounted at two ends of the first fixed carrier plate 12 near one side of the movable carrier plate 14, and the positioning columns 16 can penetrate through the movable carrier plate 14 and the reinforcing plate 24 and penetrate out of positioning holes 26 of the reinforcing plate 24.
The frame locking structure is composed of frames 17 and 19 symmetrically distributed at two ends of the second fixed carrier plate 15, and the frames 17 and 19 are respectively arranged on the carrier plate 2 through frame rotating shafts 21. The frames 17 and 19 are composed of fixed ends, connecting parts and kneading ends, the fixed ends are provided with grooves 29 and end grooves 30, springs 18 and 28 are respectively arranged between the connecting parts of the frames 17 and 19 and the test second fixed carrier plate 15 after being compressed, the springs 18 and 28 play a flexible contact role, and the frames 17 and 19 are kept in contact with the test second fixed carrier plate 15 in the moving process of the movable carrier plate 14.
During non-test, two ends of the movable carrier plate 14 are respectively inserted into the grooves 29 of the frames 17 and 19 to be fixed, during test, kneading ends of the frames 17 and 19 are forced towards each other, under the action of the springs 18 and 29, the fixed ends of the frames 17 and 19 are opened, two ends of the movable carrier plate 14 are separated from the grooves 29, the movable carrier plate 14 drives the probe mounting plate 13 to move towards the device along the guide posts 23, during the movement of the movable carrier plate 14 towards the first fixed carrier plate 12, the positioning posts 16 penetrate through the positioning holes 26 of the reinforcing plate 24 through the movable carrier plate 14, the reinforcing plate 24 and the guide cylinders 25 move towards the first fixed carrier plate 12, and the guide cylinders 22 are inserted into the movable carrier plate 14. The metal spring probes 11 fixed on the probe mounting plate 13 move to the pins of the tested device and are contacted with the sides of the pins of the tested device, the two ends of the movable carrier plate 14 are positioned in the grooves 30 at the end parts of the frames 17 and 19, the positions of the movable carrier plate 14 are fixed, and then the positions of the probe mounting plate 13 are fixed.
The number and the positions of the metal spring probes distributed on the probe mounting plate 13 are determined according to the types of devices to be detected, and the invention can be realized only by replacing the probe mounting plate 13 when detecting different devices, and has universality.
The bearing plate 2 is made of metal materials, so that heat dissipation is facilitated. If necessary, the heat dissipation plate 20 can be fixed on the bottom surface of the bearing plate 2, so as to increase the heat dissipation force. And a plurality of test tools can be installed on the bearing plate 2 according to the requirement, and the test of the same or different types of devices can be carried out together.
The aging board 1 is provided with various detection circuits which are connected with the metal spring probe data wires according to the requirement and are designed as known in the art.
The invention further provides a hybrid integrated circuit aging test method, which is realized through the following steps:
1. fixing a device to be tested on a bearing plate by using a device fixing structure, selecting a proper probe structure according to the device to be tested, and installing the probe structure on a mobile bearing plate, wherein the mobile bearing plate is locked and positioned by a frame locking structure;
Secondly, the frame locking structure releases the movable carrier, the movable carrier drives the probe structure to move between the first test fixed carrier and the second test fixed carrier, the metal spring probe of the probe structure contacts with the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier;
And thirdly, testing the device to be tested.
Further also include
Fourth, after the test is completed, the frame locking structure releases the movable carrier, the movable carrier drives the probe structure to move between the first fixed carrier and the second fixed carrier, the metal spring probe of the probe structure is separated from the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier;
And fifthly, opening the device fixing structure to take out the device to be tested.
The invention is not described in detail in a manner known to those skilled in the art.
Claims (7)
1. A hybrid integrated circuit aging test fixture is characterized in that: the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and the device fixing structure is used for fixing a device to be tested;
The test structure comprises a first test fixed carrier plate, a second test fixed carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the first test fixed carrier plate and the second test fixed carrier plate are fixedly arranged on the carrier plate, and the frame locking structure is arranged on the carrier plate and used for positioning the movable carrier plate at a test position and a non-test position;
The probe structure consists of a probe mounting plate and a plurality of metal spring probes, the metal spring probes are mounted at one end of the probe mounting plate, the other end of the probe mounting plate is fixedly mounted on a movable carrier plate, a guide structure is connected between a first test fixed carrier plate and a second test fixed carrier plate, the movable carrier plate moves between the first test fixed carrier plate and the second test fixed carrier plate through the guide structure to drive the probe structure to move from two ends to pins of a device to be tested, the metal spring probes are in contact with the side surfaces of the pins of the device to be tested, and the movable carrier plate is fixed at a test position by a frame locking structure;
The frame locking structure consists of a first frame and a second frame which are symmetrically distributed at two ends of a second fixed test carrier plate, the first frame and the second frame are respectively arranged on the carrier plate through frame rotating shafts, the first frame and the second frame are respectively composed of fixed ends, connecting parts and kneading ends, the fixed ends are provided with grooves and end grooves, after springs are compressed, the fixed ends are respectively arranged between the connecting parts of the first frame and the second fixed test carrier plate, the first frame and the second frame are enabled to keep contact with the second fixed test carrier plate in the moving process of the movable carrier plate, when the movable carrier plate is not tested, the two ends are respectively inserted into fixed positions in the grooves of the first frame and the second frame, during testing, the kneading ends of the first frame and the second frame are forced in opposite directions, under the action of springs, the fixed ends of the first frame and the second frame are opened, the two ends of the movable carrier plate are separated from the grooves, the movable carrier plate drives a probe mounting plate to move towards a device to be tested along the direction of a guide structure, and after the pin side surfaces of the device to be tested are contacted with a metal spring probe, the two ends of the movable carrier plate are positioned in the end grooves of the first frame and the movable carrier plate, and the position of the probe mounting plate is fixed;
The guide structure consists of a guide column, a first guide cylinder and a second guide cylinder, wherein the first guide cylinder is fixedly connected to a first test fixed carrier plate, the guide column penetrates through the first guide cylinder and is fixed on the first test fixed carrier plate, the second guide cylinder is fixed on a movable carrier plate, the first guide cylinder penetrates through the movable carrier plate, the guide column is matched with the first guide cylinder and the second guide cylinder, and the movable carrier plate can move along the guide column and the first guide cylinder and the second guide cylinder;
The device fixing structure comprises a first fixing carrier plate, a second fixing carrier plate, a cover plate and a buckle plate, wherein the first fixing carrier plate and the second fixing carrier plate are fixed on the carrier plate, a rotating shaft is fixedly installed on the first fixing carrier plate, the fixed end of the cover plate is installed on the first fixing carrier plate through the rotating shaft, the non-fixed end of the cover plate is connected with one end of the buckle plate, the other end of the buckle plate is in a hook shape, when the buckle plate is buckled on the second fixing carrier plate, the cover plate is fixed between the first fixing carrier plate and the second fixing carrier plate, a device to be tested is fixed under the cover plate, when the buckle plate is loosened and not buckled on the second fixing carrier plate, the cover plate rotates around the rotating shaft to be opened, and the device to be tested can be assembled and disassembled.
2. The hybrid integrated circuit burn-in fixture of claim 1, wherein: the probe mounting plate is replaceable, and the number and the positions of the metal spring probes distributed on the probe mounting plate are determined according to the types of the devices to be tested.
3. The hybrid integrated circuit burn-in fixture of claim 1, wherein: the bearing plate is made of metal materials, and the radiating plate is fixed on the bottom surface of the bearing plate.
4. The testing method using the hybrid integrated circuit burn-in test fixture according to claim 1, characterized by comprising the following steps:
the method comprises the steps that firstly, a device to be tested is fixed on a bearing plate through a device fixing structure, a proper probe structure is selected according to the device to be tested, the device to be tested is arranged on a movable bearing plate, and the movable bearing plate is locked and positioned through a frame locking structure;
Secondly, the frame locking structure releases the movable carrier, the movable carrier drives the probe structure to move between the first test fixed carrier and the second test fixed carrier, the metal spring probe of the probe structure contacts with the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier;
And thirdly, testing the device to be tested.
5. The method for testing the hybrid integrated circuit burn-in test fixture of claim 4, wherein: and also comprises
Fourth, after the test is completed, the frame locking structure releases the movable carrier, the movable carrier drives the probe structure to move between the first fixed carrier and the second fixed carrier, the metal spring probe of the probe structure is separated from the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier;
And fifthly, opening the device fixing structure to take out the device to be tested.
6. The method for testing the hybrid integrated circuit burn-in test fixture of claim 4, wherein: the frame locking structure is composed of a first frame and a second frame which are symmetrically distributed at two ends of a second fixed test carrier plate, the first frame and the second frame are respectively installed on the bearing plate through frame rotating shafts, the first frame and the second frame are composed of fixed ends, connecting parts and kneading ends, the fixed ends are provided with grooves and end grooves, after springs are compressed, the first frame and the second frame are respectively installed between the connecting parts of the first frame and the second fixed test carrier plate, in the moving process of the moving carrier plate, the first frame and the second frame are enabled to keep contact with the second fixed test carrier plate, in the non-test process of the moving carrier plate, the two ends are respectively inserted into fixed positions in the grooves of the first frame and the second frame, in the test process, the kneading ends of the first frame and the second frame exert force in opposite directions, under the action of springs, the fixed ends of the first frame and the second frame are opened, the two ends of the moving carrier plate are separated from the grooves, the moving carrier plate drives the probe mounting plate to move towards a device to be tested along the direction of the guide structure, after pins of the device to be tested are contacted with metal spring probes, the two ends of the moving carrier plate are located in the end grooves of the first frame and the second frame, and the position of the moving carrier plate is fixed, and then the position of the probe mounting plate is fixed.
7. The method for testing the hybrid integrated circuit burn-in test fixture of claim 4, wherein: the device fixing structure comprises a first fixing carrier plate, a second fixing carrier plate, a cover plate and a buckle plate, wherein the first fixing carrier plate and the second fixing carrier plate are fixed on the carrier plate, the rotating shaft is fixedly installed on the first fixing carrier plate, the fixed end of the cover plate is installed on the first fixing carrier plate through the rotating shaft, the non-fixed end of the cover plate is connected with one end of the buckle plate, the other end of the buckle plate is in a hook shape, when the buckle plate is buckled on the second fixing carrier plate, the cover plate is fixed between the first fixing carrier plate and the second fixing carrier plate, the device to be tested is fixed under the cover plate, when the buckle plate is loosened and not buckled on the second fixing carrier plate, the cover plate rotates around the rotating shaft to be opened, and the device to be tested can be assembled and disassembled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910669311.XA CN112285524B (en) | 2019-07-24 | Hybrid integrated circuit aging test tool and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910669311.XA CN112285524B (en) | 2019-07-24 | Hybrid integrated circuit aging test tool and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112285524A CN112285524A (en) | 2021-01-29 |
| CN112285524B true CN112285524B (en) | 2024-06-07 |
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| Non-invasive Brain Stimulation: Probing Intracortical Circuits and Improving Cognition in the Aging Brain;Cabral, Danylo L. F.;FRONTIERS IN AGING NEUROSCIENCE;20181228;全文 * |
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