US5570033A - Spring probe BGA (ball grid array) contactor with device stop and method therefor - Google Patents
Spring probe BGA (ball grid array) contactor with device stop and method therefor Download PDFInfo
- Publication number
- US5570033A US5570033A US08/504,944 US50494495A US5570033A US 5570033 A US5570033 A US 5570033A US 50494495 A US50494495 A US 50494495A US 5570033 A US5570033 A US 5570033A
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- US
- United States
- Prior art keywords
- spring probe
- contactor
- bga
- spring
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Definitions
- This invention relates generally to contactor systems for testing integrated circuits and, more specifically, to a contactor system for testing BGA (Ball Grid Array) devices and method therefor that limits the compression of spring probes within the BGA contactor system.
- BGA All Grid Array
- the contactor elements of the BGA device are inserted into a contactor plate having a plurality of sockets.
- the contactor plate is coupled to a DUT (Device Under Test) board which is coupled to a testing machine.
- the DUT board is, essentially, a printed circuit board that completes an electrical circuit between the BGA contactor elements via the contactor plate and the testing machine.
- the testing machine sends signals to and receives signals from the BGA device via the electrical conductor paths provided by the contactor plate and the DUT board.
- the contactor plate usually contains a plurality of spring probes, i.e. pogo pins. When the contact elements on the BGA device are inserted into the contactor block, the spring probes are compressed. This provides an electrical connection between the contact elements on the BGA device and the contact points on the DUT board.
- BGA contactor plates do not prevent over-driving of the BGA device that is being inserted into the BGA contactor plate.
- the over-driving of the BGA device results in the over-compression of the spring probes within the BGA contactor plate. This results in a loss of flexibility in the spring probes which causes a loss of electrical continuity between the BGA device being tested and the DUT board. While it is possible to replace the damaged spring probes, it is a time consuming and expensive process.
- the improved BGA contactor plate must prevent the over-driving of BGA devices into the BGA contactor plate. This will prevent the over-compression of the spring probes within the BGA contactor plate, thereby limiting the amount of damage to the spring probes.
- an improved spring probe contactor for testing BGA (Ball Grid Array) devices is disclosed.
- the improved spring probe contactor limits the compression of the spring probes within the spring probe contactor when a BGA device is placed in the spring probe contactor.
- the spring probe contactor is comprised of a plurality of spring probe means for providing a connection with a BGA device to be tested when the BGA device is placed in the spring probe contactor.
- a contactor block means is used for holding the plurality of spring probe means.
- the contactor block means has a plurality of apertures therethrough which are used for holding the plurality of spring probe means within the contactor block means.
- a retaining means is coupled to the contactor block means for holding the plurality of spring probe means within the contactor block means.
- the retaining means has a raised portion thereon which limits the compression of the plurality of spring probe means within the contactor block means when the BGA device is placed in the spring probe contactor.
- a method of providing a spring probe contactor for testing BGA devices that limits compression of spring probes within the spring probe contactor when a BGA device is placed in the spring probe contactor is disclosed.
- the method is comprised of the steps of: providing a plurality of spring probe means for providing a connection with each BGA device to be tested when the BGA device is placed in the spring probe contactor; providing contactor block means having a plurality of apertures therethrough for holding the plurality of spring probe means within the contactor block means; and providing retaining means coupled to the contactor block for holding the plurality of spring probe means within the contactor block means, and having means for limiting compression of the plurality of spring probe means when the BGA device is placed in the spring probe contactor.
- FIG. 1 is a cross-sectional side view of the BGA contactor with device stop of the present invention.
- FIG. 2 is a sectional view of the device stop of the BGA contactor of FIG. 1.
- a BGA contactor plate with device stop 10 (hereinafter contactor plate 10) is shown.
- the contactor plate 10 is comprised of a plurality of double ended spring probes 12 (hereinafter spring probes 12), i.e. pogo pins.
- the spring probes 12 are used for providing an electrical connection between a BGA device that is being tested and a DUT board (not shown).
- the spring probes 12 are held within a contactor block 14.
- the contactor block 14 has a plurality of apertures 16 drilled therethrough. The apertures 16 are drilled so as to hold the spring probes 12 within the contactor block 14.
- Isolation rings 26 are coupled to a top portion and a bottom portion of each of the plurality of spring probes 12. The isolation rings are used for ensuring that the plurality of spring probes 12 do not come in contact with the contactor block 14 when the plurality of spring probes 12 are positioned within the contactor block 14.
- a bottom keeper plate 18 is coupled to a bottom portion of the contactor block 14.
- the bottom keeper plate 18 is used to hold the plurality of spring probes 12 within the contactor block 14.
- a top keeper plate 20 is coupled to a top portion of the contactor block 14 and is also used for holding the plurality of spring probes 12 within the contactor block 14.
- a guide plate 24 is coupled to the top keeper plate 20 and the contactor block 14.
- the guide plate 24 has a centrally located aperture 24A therethrough. The guide plate 24 helps in aligning and holding the BGA device in the contactor plate 10.
- the raised portion 22 is a BGA device stop which prevents over-insertion of a BGA device into the contactor plate 10.
- a user of the contactor plate 10 can limit the amount of compression of the spring probes 12. This will extend the life of both the spring probes 12 and the contactor plate 10.
- the raised portion 22 is of a suitable height to limit the compression of the plurality of spring probes 12 to less than 75% of a fully compressed spring probe 12. The 75% figure was chosen in order to eliminate the occurrence of damage to the plurality of spring probes 12 while ensuring a sufficient electrical connection between the plurality of spring probes 12 and the BGA device in the contactor plate 10.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/504,944 US5570033A (en) | 1995-07-20 | 1995-07-20 | Spring probe BGA (ball grid array) contactor with device stop and method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/504,944 US5570033A (en) | 1995-07-20 | 1995-07-20 | Spring probe BGA (ball grid array) contactor with device stop and method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
US5570033A true US5570033A (en) | 1996-10-29 |
Family
ID=24008363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/504,944 Expired - Lifetime US5570033A (en) | 1995-07-20 | 1995-07-20 | Spring probe BGA (ball grid array) contactor with device stop and method therefor |
Country Status (1)
Country | Link |
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US (1) | US5570033A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2309836A (en) * | 1996-01-31 | 1997-08-06 | Hewlett Packard Co | Ball grid array probe assembly |
US6036503A (en) * | 1996-11-15 | 2000-03-14 | Advantest Corporation | IC socket for a BGA package |
US6075255A (en) * | 1998-09-14 | 2000-06-13 | Silicon Integrated Systems Company | Contactor system for a ball grid array device |
US6342398B1 (en) | 1998-12-17 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company | Method of backside emission analysis for BGA packaged IC's |
US6373268B1 (en) | 1999-05-10 | 2002-04-16 | Intel Corporation | Test handling method and equipment for conjoined integrated circuit dice |
US6404212B1 (en) | 1999-02-18 | 2002-06-11 | St Assembly Test Services Pte Ltd | Testing of BGA and other CSP packages using probing techniques |
US6464513B1 (en) | 2000-01-05 | 2002-10-15 | Micron Technology, Inc. | Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
US6489788B2 (en) * | 2000-01-20 | 2002-12-03 | Earl Sausen | Contactor assembly for common grid array devices |
US6491527B1 (en) * | 2001-05-17 | 2002-12-10 | Ericsson Inc. | Dual compression connector |
US20030042595A1 (en) * | 2001-08-29 | 2003-03-06 | Canella Robert L. | Substrate with contact array and substrate assemblies |
US20040137767A1 (en) * | 2002-10-28 | 2004-07-15 | Yamaichi Electronics Co., Ltd. | IC socket for a fine pitch IC package |
US20050067687A1 (en) * | 2001-08-21 | 2005-03-31 | Canella Robert L. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US20050110505A1 (en) * | 2003-11-26 | 2005-05-26 | Asm Assembly Automation Ltd. | Spring contact probe device for electrical testing |
US7123034B2 (en) * | 2001-08-14 | 2006-10-17 | Earl William Sausen | Contactor assembly for common grid array devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5376010A (en) * | 1994-02-08 | 1994-12-27 | Minnesota Mining And Manufacturing Company | Burn-in socket |
US5400220A (en) * | 1994-05-18 | 1995-03-21 | Dell Usa, L.P. | Mechanical printed circuit board and ball grid array interconnect apparatus |
US5418471A (en) * | 1994-01-26 | 1995-05-23 | Emulation Technology, Inc. | Adapter which emulates ball grid array packages |
US5419710A (en) * | 1994-06-10 | 1995-05-30 | Pfaff; Wayne K. | Mounting apparatus for ball grid array device |
-
1995
- 1995-07-20 US US08/504,944 patent/US5570033A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5418471A (en) * | 1994-01-26 | 1995-05-23 | Emulation Technology, Inc. | Adapter which emulates ball grid array packages |
US5376010A (en) * | 1994-02-08 | 1994-12-27 | Minnesota Mining And Manufacturing Company | Burn-in socket |
US5400220A (en) * | 1994-05-18 | 1995-03-21 | Dell Usa, L.P. | Mechanical printed circuit board and ball grid array interconnect apparatus |
US5419710A (en) * | 1994-06-10 | 1995-05-30 | Pfaff; Wayne K. | Mounting apparatus for ball grid array device |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5859538A (en) * | 1996-01-31 | 1999-01-12 | Hewlett-Packard Company | Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both |
GB2309836B (en) * | 1996-01-31 | 2000-04-19 | Hewlett Packard Co | Ball grid array probe assembly |
GB2309836A (en) * | 1996-01-31 | 1997-08-06 | Hewlett Packard Co | Ball grid array probe assembly |
US6036503A (en) * | 1996-11-15 | 2000-03-14 | Advantest Corporation | IC socket for a BGA package |
US6075255A (en) * | 1998-09-14 | 2000-06-13 | Silicon Integrated Systems Company | Contactor system for a ball grid array device |
US6342398B1 (en) | 1998-12-17 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company | Method of backside emission analysis for BGA packaged IC's |
US6535004B2 (en) | 1999-02-18 | 2003-03-18 | St Assembly Test Service Ltd. | Testing of BGA and other CSP packages using probing techniques |
US6791346B2 (en) | 1999-02-18 | 2004-09-14 | St. Assembly Test Services Pte Ltd | Testing of BGA and other CSP packages using probing techniques |
US6404212B1 (en) | 1999-02-18 | 2002-06-11 | St Assembly Test Services Pte Ltd | Testing of BGA and other CSP packages using probing techniques |
US6373268B1 (en) | 1999-05-10 | 2002-04-16 | Intel Corporation | Test handling method and equipment for conjoined integrated circuit dice |
US6843661B2 (en) | 2000-01-05 | 2005-01-18 | Micron Technology, Inc. | Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
US20020196598A1 (en) * | 2000-01-05 | 2002-12-26 | Saeed Momenpour | Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
US7326066B2 (en) | 2000-01-05 | 2008-02-05 | Micron Technology, Inc. | Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
US6464513B1 (en) | 2000-01-05 | 2002-10-15 | Micron Technology, Inc. | Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
US6489788B2 (en) * | 2000-01-20 | 2002-12-03 | Earl Sausen | Contactor assembly for common grid array devices |
US6491527B1 (en) * | 2001-05-17 | 2002-12-10 | Ericsson Inc. | Dual compression connector |
US7123034B2 (en) * | 2001-08-14 | 2006-10-17 | Earl William Sausen | Contactor assembly for common grid array devices |
US7279788B2 (en) | 2001-08-21 | 2007-10-09 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US7192806B2 (en) | 2001-08-21 | 2007-03-20 | Micron Technology, Inc. | Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US7094065B2 (en) | 2001-08-21 | 2006-08-22 | Micron Technology, Inc. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US20050067687A1 (en) * | 2001-08-21 | 2005-03-31 | Canella Robert L. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US20050070133A1 (en) * | 2001-08-21 | 2005-03-31 | Canella Robert L. | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
US20040058470A1 (en) * | 2001-08-29 | 2004-03-25 | Canella Robert L. | Methods of forming a contact array in situ on a substrate and resulting substrate assemblies |
US7120999B2 (en) | 2001-08-29 | 2006-10-17 | Micron Technology, Inc. | Methods of forming a contact array in situ on a substrate |
US20030042595A1 (en) * | 2001-08-29 | 2003-03-06 | Canella Robert L. | Substrate with contact array and substrate assemblies |
US6821131B2 (en) * | 2002-10-28 | 2004-11-23 | Yamaichi Electronics Co., Ltd. | IC socket for a fine pitch IC package |
US20040137767A1 (en) * | 2002-10-28 | 2004-07-15 | Yamaichi Electronics Co., Ltd. | IC socket for a fine pitch IC package |
US6967492B2 (en) * | 2003-11-26 | 2005-11-22 | Asm Assembly Automation Ltd. | Spring contact probe device for electrical testing |
US20050110505A1 (en) * | 2003-11-26 | 2005-05-26 | Asm Assembly Automation Ltd. | Spring contact probe device for electrical testing |
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Owner name: VLSI TECHNOLOGY, INC, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:STAAB, CRAIG C.;REEL/FRAME:007591/0145 Effective date: 19950718 |
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