CN112285524A - Aging test tool and method for hybrid integrated circuit - Google Patents
Aging test tool and method for hybrid integrated circuit Download PDFInfo
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- CN112285524A CN112285524A CN201910669311.XA CN201910669311A CN112285524A CN 112285524 A CN112285524 A CN 112285524A CN 201910669311 A CN201910669311 A CN 201910669311A CN 112285524 A CN112285524 A CN 112285524A
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- 238000012360 testing method Methods 0.000 title claims abstract description 114
- 230000032683 aging Effects 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000523 sample Substances 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000004898 kneading Methods 0.000 claims description 5
- 238000010998 test method Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 2
- 241001417490 Sillaginidae Species 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention provides a mixed integrated circuit aging test tool and a method, which comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap is formed between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and a device to be tested is fixed by the device fixing structure. The invention adopts a special test structure, and the metal spring probe is flexibly contacted with the device pin, thereby avoiding the damage to the pin while ensuring the effective contact with the device pin.
Description
Technical Field
The invention relates to a hybrid integrated circuit aging test tool and a method, and belongs to the technical field of component reliability test.
Background
At present, most of mixed integrated circuit aging equipment is integrated by various instruments and instrument systems such as a power supply, an electronic load and the like. The pins of the hybrid integrated circuit device are not consistent in arrangement, number and thickness, and the clamp is lack of standardization and universalization. The conventional clamp adopts a locking seat mode, and has poor effective contact and protection on device pins. When the high-power hybrid integrated circuit is tested, power is consumed for heat dissipation, and if the heat cannot be effectively diffused, the device can be damaged.
Patents CN102435876A, CN202113034U, and CN204989229U provide clamps or test seats for testing chips by using metal spring probes, the chip test clamps are suitable for monolithic integrated circuits, and one clamp can only be used for one monolithic test, which is poor in universality; the chip test fixture can not be applied to the hybrid integrated circuit with large volume, thick metal pins, irregular arrangement and large power dissipation.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a hybrid integrated circuit aging test tool and a method which have good heat dissipation performance and no damage to devices and ensure effective contact with pins.
The technical solution of the invention is as follows: a mixed integrated circuit aging test tool comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap is formed between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and a device to be tested is fixed by the device fixing structure;
the test structure comprises a test first fixed carrier plate, a test second fixed carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the test first fixed carrier plate and the test second fixed carrier plate are fixedly arranged on the carrier plate;
the probe structure constitute by probe mounting panel and a plurality of metal spring probe, the one end at the probe mounting panel is installed to the metal spring probe, the other end fixed mounting of probe mounting panel is on removing the support plate, be connected with guide structure between the first fixed support plate of test and the fixed support plate of test second, it moves between the first fixed support plate of test and the fixed support plate of test second to remove the support plate through guide structure, it removes to the device pin that awaits measuring to drive the probe structure from both ends, metal spring probe and the device pin side contact that awaits measuring, frame locking structure will remove the support plate and fix at the test position.
A burn-in test method of a hybrid integrated circuit is realized by the following steps:
fixing a device to be tested on a bearing plate by using a device fixing structure, selecting a proper probe structure according to the device to be tested, and installing the probe structure on a movable carrier plate, wherein the movable carrier plate is locked and positioned by a frame locking structure;
secondly, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate for testing and the second fixed carrier plate for testing, a metal spring probe of the probe structure is contacted with the side surface of a pin of a device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and thirdly, testing the device to be tested.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention adopts a special test structure, the metal spring probe is flexibly contacted with the device pin, and the damage to the pin is avoided while the effective contact with the device pin is ensured;
(2) the test structure adopts a split charging structure, the probe structure used for contacting with the pin of the device can be flexibly replaced according to different devices, and the whole tool has good universality;
(3) the device fixing structure has a simple structure, is easy and convenient to operate, and avoids damage to the pins because the pins of the device are not required to be inserted;
(4) the test structure and the device fixing structure are additionally arranged on the bearing plate separated from the aging plate, so that the heat dissipation performance is good;
(5) the invention can install a heat dissipation structure between the bearing plate and the aging plate, thereby further improving the heat dissipation performance of the tool.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the device mounting structure of the present invention (buckled);
FIG. 3 is a front view of the device mounting structure of the present invention (snapped on);
FIG. 4 is a schematic diagram of a test structure of the present invention prior to operation;
FIG. 5 is a diagram illustrating the test structure after operation.
Detailed Description
The invention provides a mixed integrated circuit aging test tool which comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap is formed between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and a device to be tested is fixed by the device fixing structure.
The test structure comprises a first test fixing carrier plate, a second test fixing carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the first test fixing carrier plate and the second test fixing carrier plate are fixedly arranged on the carrier plate, and the frame locking structure is arranged on the carrier plate and used for positioning the movable carrier plate at a test position and a non-test position.
The probe structure is composed of a probe mounting plate and a plurality of metal spring probes, the metal spring probes are mounted at one end of the probe mounting plate, the other end of the probe mounting plate is fixedly mounted on a movable carrier plate, a guide structure is connected between a first test fixed carrier plate and a second test fixed carrier plate, the movable carrier plate moves between the first test fixed carrier plate and the second test fixed carrier plate through the guide structure to drive the probe structure to move from two ends to pins of a device to be tested, the metal spring probes are in contact with the side faces of the pins of the device to be tested, and the movable carrier plate is fixed at a test position through a frame locking structure.
The device fixing structure is used for fixing a device to be tested, and the device to be tested can be tested as long as the device to be tested can be kept not to move on the bearing plate in the testing process.
The frame locking structure is used for positioning the movable carrier plate (probe structure) at a testing position and a non-testing position, and can adopt a structure capable of meeting the positioning requirements at two positions.
The present invention will be described in detail with reference to the following examples and accompanying drawings.
The invention provides a mixed integrated circuit aging test tool as shown in figure 1, which comprises an aging plate 1, a bearing plate 2, a device fixing structure and a test structure, wherein the aging plate 1 and the bearing plate 2 are fixed through an upright post 3, a certain gap is formed between the aging plate 1 and the bearing plate 2, the device fixing structure and the test structure are arranged on the bearing plate 2, and the test structure is symmetrically distributed on two sides of the device fixing structure and is symmetrically distributed along an AB line (a symmetry axis of the device fixing structure) as shown in figure 1.
The device fixing structure is shown in fig. 2 and 3 and comprises a first fixing carrier plate 6, a second fixing carrier plate 8, a cover plate 7 and a buckle plate 9, wherein the first fixing carrier plate 6 and the second fixing carrier plate 8 are fixed on the carrier plate 2, a rotating shaft 5 is fixedly arranged on the first fixing carrier plate 6, the fixed end of the cover plate 7 is arranged on the first fixing carrier plate 6 through the rotating shaft 5, the non-fixed end of the cover plate 7 is connected with one end of the buckle plate 9, the other end of the buckle plate 9 is hook-shaped, when the buckle plate 9 is buckled on the second fixing carrier plate 8, the cover plate 7 is fixed between the first fixing carrier plate 6 and the second fixing carrier plate 8, a device to be tested is fixed under the cover plate 7, and when the buckle plate 9 is loosened and not buckled on the second fixing carrier plate 8, the cover plate 7 rotates.
The testing structure is shown in fig. 4 and 5, and includes a testing first fixed carrier 12, a testing second fixed carrier 15, a probe structure, a frame locking structure and a movable carrier 14, wherein the testing first fixed carrier 12 and the testing second fixed carrier 15 are fixedly mounted on the carrier 2.
The probe structure is composed of a probe mounting plate 13 and a plurality of metal spring probes 11, wherein the metal spring probes 11 are mounted at one end of the probe mounting plate 13, the other end of the probe mounting plate 13 is fixedly mounted on the movable carrier plate 14, and a reinforcing plate 24 can be fixedly mounted at the other side of the movable carrier plate 14 and used for reinforcing the movable carrier plate 14.
A guide column 23 and guide cylinders 22 and 25 are connected between the first test fixed carrier board 12 and the second test fixed carrier board 15, the guide cylinder 22 is fixedly connected to the first test fixed carrier board 12, the guide column 23 penetrates through the guide cylinder 22 and is fixed on the first test fixed carrier board 12, the guide cylinder 25 is fixed on the movable carrier board 14, the guide cylinder 22 penetrates through the movable carrier board 14, the guide column 23 is matched with the guide cylinders 22 and 25, and the movable carrier board 14 can move back and forth between the first test fixed carrier board 12 and the second test fixed carrier board 15 along the guide column 23 and the guide cylinders 22 and 25. This embodiment designs the guiding structure of the guiding columns 23 and the guiding cylinders 22 and 25, which is more precise, and also designs only one set of guiding columns at both ends between the first fixed carrier board 12 for testing and the second fixed carrier board 15 for testing, so as to realize the movement of the movable carrier board 14 between the first fixed carrier board 12 for testing and the second fixed carrier board 15 for testing.
The probe mounting plate 13, which is fixedly mounted on the moving carrier plate 14, is movable with the moving carrier plate 14 to below the first fixed carrier plate 12 for testing. The two ends of the first fixed carrier 12 for testing near one side of the movable carrier 14 are provided with positioning pillars 16, and the positioning pillars 16 can penetrate through the movable carrier 14 and the reinforcing plate 24 and pass through the positioning holes 26 of the reinforcing plate 24.
The frame locking structure is composed of frames 17, 19 symmetrically distributed at both ends of the second fixed carrier plate 15, and the frames 17, 19 are respectively installed on the bearing plate 2 through a frame rotating shaft 21. The frames 17, 19 are composed of a fixed end, a connecting portion and a kneading end as shown in fig. 4, the fixed end processing groove 29 and the end portion groove 30, the springs 18, 28 are respectively installed between the connecting portion of the frames 17, 19 and the second fixing carrier plate 15 to be tested after being compressed, and the springs 18, 28 play a flexible contact role, so that the frames 17, 19 and the second fixing carrier plate 15 to be tested are kept in contact during the movement of the moving carrier plate 14.
During non-testing, two ends of the movable carrier 14 are respectively inserted into the grooves 29 of the frames 17, 19 to be fixed, during testing, the pinch-in ends of the frames 17, 19 are forced toward each other, the fixed ends of the frames 17, 19 are opened under the action of the springs 18, 29, two ends of the movable carrier 14 are separated from the grooves 29, the movable carrier 14 drives the probe mounting plate 13 to move towards the device direction along the guide posts 23, the positioning posts 16 penetrate through the movable carrier 14 and penetrate out of the positioning holes 26 of the reinforcing plate 24 during the movement of the movable carrier 14 towards the first fixed carrier 12 for testing, the movable carrier 14, the reinforcing plate 24 and the guide cylinders 25 move towards the first fixed carrier 12 for testing, and the guide cylinders 22 are inserted into the movable carrier 14. The metal spring probe 11 fixed on the probe mounting plate 13 moves towards the device pin to be tested and contacts with the side surface of the device pin, the two ends of the movable carrier plate 14 are positioned in the grooves 30 at the end parts of the frames 17 and 19, the position of the movable carrier plate 14 is fixed, and the position of the probe mounting plate 13 is further fixed.
The number and the positions of the metal spring probes distributed on the probe mounting plate 13 are determined according to the types of the devices to be detected, and the method can be realized only by replacing the probe mounting plate 13 when different devices are detected, so that the method has universality.
The bearing plate 2 is made of metal materials, so that heat dissipation is facilitated. If necessary, the heat dissipation plate 20 can be fixed on the bottom surface of the bearing plate 2 to increase the heat dissipation strength. A plurality of sets of test tools can be arranged on the bearing plate 2 as required to test the same or different types of devices together.
Various detection circuits are arranged on the aging board 1 and are connected with the metal spring probe data wires according to requirements, and the detection circuits are designed by the known technology in the field.
Further, the invention also provides a mixed integrated circuit aging test method, which is realized by the following steps:
1. fixing a device to be tested on the bearing plate by using a device fixing structure, selecting a proper probe structure according to the device to be tested, and installing the probe structure on a movable carrier plate, wherein the movable carrier plate is locked and positioned by a frame locking structure;
secondly, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate for testing and the second fixed carrier plate for testing, a metal spring probe of the probe structure is contacted with the side surface of a pin of a device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and thirdly, testing the device to be tested.
Further also comprises
Fourthly, after the test is finished, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate and the second fixed carrier plate, the metal spring probe of the probe structure is separated from the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and fifthly, opening the device fixing structure to take out the device to be tested.
The invention has not been described in detail and is in part known to those of skill in the art.
Claims (10)
1. The utility model provides a mixed integrated circuit smelts experimental frock always which characterized in that: the device fixing structure and the test structure are arranged on the bearing plate, the test structures are symmetrically distributed on two sides of the device fixing structure, and the device fixing structure fixes a device to be tested;
the test structure comprises a test first fixed carrier plate, a test second fixed carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the test first fixed carrier plate and the test second fixed carrier plate are fixedly arranged on the carrier plate;
the probe structure constitute by probe mounting panel and a plurality of metal spring probe, the one end at the probe mounting panel is installed to the metal spring probe, the other end fixed mounting of probe mounting panel is on removing the support plate, be connected with guide structure between the first fixed support plate of test and the fixed support plate of test second, it moves between the first fixed support plate of test and the fixed support plate of test second to remove the support plate through guide structure, it removes to the device pin that awaits measuring to drive the probe structure from both ends, metal spring probe and the device pin side contact that awaits measuring, frame locking structure will remove the support plate and fix at the test position.
2. The hybrid integrated circuit aging test tool according to claim 1, characterized in that: the frame locking structure is composed of a first frame and a second frame which are symmetrically distributed at two ends of a second fixed carrier plate to be tested, the first frame and the second frame are respectively arranged on the carrier plate through a frame rotating shaft, the first frame and the second frame are composed of fixed ends, connecting parts and kneading ends, the fixed ends are provided with grooves and end part grooves, springs are respectively arranged between the connecting parts of the first frame and the second fixed carrier plate to be tested after being compressed, the first frame and the second frame are kept in contact with the second fixed carrier plate to be tested in the moving process of the movable carrier plate, when the movable carrier plate is not tested, two ends are respectively inserted into the grooves of the first frame and the second frame to be fixed, when testing is carried out, the kneading ends of the first frame and the second frame exert force in opposite directions, the fixed ends of the first frame and the second frame are opened under the action of the springs, two ends of the movable carrier plate are, after the side surface of the pin of the device to be tested is contacted with the metal spring probe, two ends of the movable carrier plate are positioned in the end part grooves of the first frame and the second frame, the position of the movable carrier plate is fixed, and then the position of the probe mounting plate is fixed.
3. The hybrid integrated circuit aging test tool according to claim 1, characterized in that: the guide structure comprises guide posts, a first guide cylinder and a second guide cylinder, the first guide cylinder is fixedly connected to a first test fixing carrier plate, the guide posts penetrate through the first guide cylinder and are fixed to the first test fixing carrier plate, the second guide cylinder is fixed to a movable carrier plate, the first guide cylinder penetrates through the movable carrier plate, the guide posts are matched with the first guide cylinder and the second guide cylinder, and the movable carrier plate can move along the guide posts and the first guide cylinder and the second guide cylinder.
4. The hybrid integrated circuit aging test tool according to claim 1, characterized in that: the device fixing structure comprises a first fixing support plate, a second fixing support plate, a cover plate and a buckle plate, wherein the first fixing support plate and the second fixing support plate are fixed on the support plate, a rotating shaft is fixedly installed on the first fixing support plate, the fixed end of the cover plate is installed on the first fixing support plate through a rotating shaft, the non-fixed end of the cover plate is connected with one end of the buckle plate, the other end of the buckle plate is in a hook shape, when the buckle plate is buckled on the second fixing support plate, the cover plate is fixed between the first fixing support plate and the second fixing support plate, a device to be tested is fixed under the cover plate, when the buckle plate is loosened, the buckle plate is not buckled on the second fixing support plate, the cover plate.
5. The hybrid integrated circuit aging test tool according to claim 1, characterized in that: the probe mounting plate is replaceable, and the number and the positions of the metal spring probes distributed on the probe mounting plate are determined according to the type of the device to be tested.
6. The hybrid integrated circuit aging test tool according to claim 1, characterized in that: the bearing plate is made of metal materials, and a heat dissipation plate is fixed on the bottom surface of the bearing plate.
7. The method for testing the aging test tool of the hybrid integrated circuit according to claim 1, which is implemented by the following steps:
fixing a device to be tested on a bearing plate by using a device fixing structure, selecting a proper probe structure according to the device to be tested, and installing the probe structure on a movable carrier plate, wherein the movable carrier plate is locked and positioned by a frame locking structure;
secondly, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate for testing and the second fixed carrier plate for testing, a metal spring probe of the probe structure is contacted with the side surface of a pin of a device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and thirdly, testing the device to be tested.
8. The hybrid integrated circuit burn-in test method of claim 7, wherein: also comprises
Fourthly, after the test is finished, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate and the second fixed carrier plate, the metal spring probe of the probe structure is separated from the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and fifthly, opening the device fixing structure to take out the device to be tested.
9. The hybrid integrated circuit burn-in test method of claim 7, wherein: the frame locking structure is composed of a first frame and a second frame which are symmetrically distributed at two ends of a second fixed carrier plate to be tested, the first frame and the second frame are respectively arranged on a bearing plate through a frame rotating shaft, the first frame and the second frame are composed of fixed ends, connecting parts and kneading ends, the fixed ends are provided with grooves and end part grooves, springs are respectively arranged between the connecting parts of the first frame and the second fixed carrier plate to be tested after being compressed, the first frame and the second frame are kept in contact with the second fixed carrier plate to be tested in the moving process of the movable carrier plate, when the movable carrier plate is not tested, two ends are respectively inserted into the grooves of the first frame and the second frame to be fixed, when testing is carried out, the kneading ends of the first frame and the second frame exert opposite force, under the action of the springs, the fixed ends of the first frame and the second frame are opened, two ends of the movable carrier plate are, after the side surface of the pin of the device to be tested is contacted with the metal spring probe, two ends of the movable carrier plate are positioned in the end part grooves of the first frame and the second frame, the position of the movable carrier plate is fixed, and then the position of the probe mounting plate is fixed.
10. The hybrid integrated circuit burn-in test method of claim 7, wherein: the device fixing structure comprises a first fixing support plate, a second fixing support plate, a cover plate and a buckle plate, wherein the first fixing support plate and the second fixing support plate are fixed on the support plate, a rotating shaft is fixedly arranged on the first fixing support plate, the fixed end of the cover plate is arranged on the first fixing support plate through a rotating shaft, the non-fixed end of the cover plate is connected with one end of the buckle plate, the other end of the buckle plate is hook-shaped, when the buckle plate is buckled on the second fixing support plate, the cover plate is fixed between the first fixing support plate and the second fixing support plate, a device to be tested is fixed under the cover plate, when the buckle plate is loosened, and when the buckle plate is not buckled on the second fixing support plate, the.
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| CN201910669311.XA CN112285524B (en) | 2019-07-24 | 2019-07-24 | Hybrid integrated circuit aging test tool and method |
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| CN201910669311.XA CN112285524B (en) | 2019-07-24 | 2019-07-24 | Hybrid integrated circuit aging test tool and method |
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