CN112285524A - Aging test tool and method for hybrid integrated circuit - Google Patents

Aging test tool and method for hybrid integrated circuit Download PDF

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CN112285524A
CN112285524A CN201910669311.XA CN201910669311A CN112285524A CN 112285524 A CN112285524 A CN 112285524A CN 201910669311 A CN201910669311 A CN 201910669311A CN 112285524 A CN112285524 A CN 112285524A
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fixed
test
plate
carrier
board
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CN112285524B (en
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温恒娟
陈覃
李骥尧
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Beijing Zhenxing Metrology and Test Institute
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Beijing Zhenxing Metrology and Test Institute
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
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Abstract

本发明提出一种混合集成电路老炼试验工装及方法，包括老炼板、承载板、器件固定结构和测试结构，老炼板和承载板平行固定，两者之间存在一定空隙，器件固定结构和测试结构安装在承载板上，测试结构对称分布在器件固定结构两侧，器件固定结构固定待测器件。本发明采用了特殊的测试结构，金属弹簧探针与器件管脚柔性接触，在保证与器件管脚的有效接触的同时，避免了对管脚的伤害。

Figure 201910669311

The invention proposes a hybrid integrated circuit burn-in test tool and method, which includes a burn-in board, a bearing board, a device fixing structure and a test structure. The burn-in board and the bearing board are fixed in parallel with a certain gap between them, and the device fixing structure And the test structure is installed on the carrier board, the test structure is symmetrically distributed on both sides of the device fixing structure, and the device fixing structure fixes the device to be tested. The invention adopts a special test structure, and the metal spring probe is in flexible contact with the device pins, which avoids damage to the pins while ensuring effective contact with the device pins.

Figure 201910669311

Description

Aging test tool and method for hybrid integrated circuit
Technical Field
The invention relates to a hybrid integrated circuit aging test tool and a method, and belongs to the technical field of component reliability test.
Background
At present, most of mixed integrated circuit aging equipment is integrated by various instruments and instrument systems such as a power supply, an electronic load and the like. The pins of the hybrid integrated circuit device are not consistent in arrangement, number and thickness, and the clamp is lack of standardization and universalization. The conventional clamp adopts a locking seat mode, and has poor effective contact and protection on device pins. When the high-power hybrid integrated circuit is tested, power is consumed for heat dissipation, and if the heat cannot be effectively diffused, the device can be damaged.
Patents CN102435876A, CN202113034U, and CN204989229U provide clamps or test seats for testing chips by using metal spring probes, the chip test clamps are suitable for monolithic integrated circuits, and one clamp can only be used for one monolithic test, which is poor in universality; the chip test fixture can not be applied to the hybrid integrated circuit with large volume, thick metal pins, irregular arrangement and large power dissipation.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a hybrid integrated circuit aging test tool and a method which have good heat dissipation performance and no damage to devices and ensure effective contact with pins.
The technical solution of the invention is as follows: a mixed integrated circuit aging test tool comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap is formed between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and a device to be tested is fixed by the device fixing structure;
the test structure comprises a test first fixed carrier plate, a test second fixed carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the test first fixed carrier plate and the test second fixed carrier plate are fixedly arranged on the carrier plate;
the probe structure constitute by probe mounting panel and a plurality of metal spring probe, the one end at the probe mounting panel is installed to the metal spring probe, the other end fixed mounting of probe mounting panel is on removing the support plate, be connected with guide structure between the first fixed support plate of test and the fixed support plate of test second, it moves between the first fixed support plate of test and the fixed support plate of test second to remove the support plate through guide structure, it removes to the device pin that awaits measuring to drive the probe structure from both ends, metal spring probe and the device pin side contact that awaits measuring, frame locking structure will remove the support plate and fix at the test position.
A burn-in test method of a hybrid integrated circuit is realized by the following steps:
fixing a device to be tested on a bearing plate by using a device fixing structure, selecting a proper probe structure according to the device to be tested, and installing the probe structure on a movable carrier plate, wherein the movable carrier plate is locked and positioned by a frame locking structure;
secondly, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate for testing and the second fixed carrier plate for testing, a metal spring probe of the probe structure is contacted with the side surface of a pin of a device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and thirdly, testing the device to be tested.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention adopts a special test structure, the metal spring probe is flexibly contacted with the device pin, and the damage to the pin is avoided while the effective contact with the device pin is ensured;
(2) the test structure adopts a split charging structure, the probe structure used for contacting with the pin of the device can be flexibly replaced according to different devices, and the whole tool has good universality;
(3) the device fixing structure has a simple structure, is easy and convenient to operate, and avoids damage to the pins because the pins of the device are not required to be inserted;
(4) the test structure and the device fixing structure are additionally arranged on the bearing plate separated from the aging plate, so that the heat dissipation performance is good;
(5) the invention can install a heat dissipation structure between the bearing plate and the aging plate, thereby further improving the heat dissipation performance of the tool.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the device mounting structure of the present invention (buckled);
FIG. 3 is a front view of the device mounting structure of the present invention (snapped on);
FIG. 4 is a schematic diagram of a test structure of the present invention prior to operation;
FIG. 5 is a diagram illustrating the test structure after operation.
Detailed Description
The invention provides a mixed integrated circuit aging test tool which comprises an aging plate, a bearing plate, a device fixing structure and a test structure, wherein the aging plate and the bearing plate are fixed in parallel, a certain gap is formed between the aging plate and the bearing plate, the device fixing structure and the test structure are arranged on the bearing plate, the test structure is symmetrically distributed on two sides of the device fixing structure, and a device to be tested is fixed by the device fixing structure.
The test structure comprises a first test fixing carrier plate, a second test fixing carrier plate, a probe structure, a frame locking structure and a movable carrier plate, wherein the first test fixing carrier plate and the second test fixing carrier plate are fixedly arranged on the carrier plate, and the frame locking structure is arranged on the carrier plate and used for positioning the movable carrier plate at a test position and a non-test position.
The probe structure is composed of a probe mounting plate and a plurality of metal spring probes, the metal spring probes are mounted at one end of the probe mounting plate, the other end of the probe mounting plate is fixedly mounted on a movable carrier plate, a guide structure is connected between a first test fixed carrier plate and a second test fixed carrier plate, the movable carrier plate moves between the first test fixed carrier plate and the second test fixed carrier plate through the guide structure to drive the probe structure to move from two ends to pins of a device to be tested, the metal spring probes are in contact with the side faces of the pins of the device to be tested, and the movable carrier plate is fixed at a test position through a frame locking structure.
The device fixing structure is used for fixing a device to be tested, and the device to be tested can be tested as long as the device to be tested can be kept not to move on the bearing plate in the testing process.
The frame locking structure is used for positioning the movable carrier plate (probe structure) at a testing position and a non-testing position, and can adopt a structure capable of meeting the positioning requirements at two positions.
The present invention will be described in detail with reference to the following examples and accompanying drawings.
The invention provides a mixed integrated circuit aging test tool as shown in figure 1, which comprises an aging plate 1, a bearing plate 2, a device fixing structure and a test structure, wherein the aging plate 1 and the bearing plate 2 are fixed through an upright post 3, a certain gap is formed between the aging plate 1 and the bearing plate 2, the device fixing structure and the test structure are arranged on the bearing plate 2, and the test structure is symmetrically distributed on two sides of the device fixing structure and is symmetrically distributed along an AB line (a symmetry axis of the device fixing structure) as shown in figure 1.
The device fixing structure is shown in fig. 2 and 3 and comprises a first fixing carrier plate 6, a second fixing carrier plate 8, a cover plate 7 and a buckle plate 9, wherein the first fixing carrier plate 6 and the second fixing carrier plate 8 are fixed on the carrier plate 2, a rotating shaft 5 is fixedly arranged on the first fixing carrier plate 6, the fixed end of the cover plate 7 is arranged on the first fixing carrier plate 6 through the rotating shaft 5, the non-fixed end of the cover plate 7 is connected with one end of the buckle plate 9, the other end of the buckle plate 9 is hook-shaped, when the buckle plate 9 is buckled on the second fixing carrier plate 8, the cover plate 7 is fixed between the first fixing carrier plate 6 and the second fixing carrier plate 8, a device to be tested is fixed under the cover plate 7, and when the buckle plate 9 is loosened and not buckled on the second fixing carrier plate 8, the cover plate 7 rotates.
The testing structure is shown in fig. 4 and 5, and includes a testing first fixed carrier 12, a testing second fixed carrier 15, a probe structure, a frame locking structure and a movable carrier 14, wherein the testing first fixed carrier 12 and the testing second fixed carrier 15 are fixedly mounted on the carrier 2.
The probe structure is composed of a probe mounting plate 13 and a plurality of metal spring probes 11, wherein the metal spring probes 11 are mounted at one end of the probe mounting plate 13, the other end of the probe mounting plate 13 is fixedly mounted on the movable carrier plate 14, and a reinforcing plate 24 can be fixedly mounted at the other side of the movable carrier plate 14 and used for reinforcing the movable carrier plate 14.
A guide column 23 and guide cylinders 22 and 25 are connected between the first test fixed carrier board 12 and the second test fixed carrier board 15, the guide cylinder 22 is fixedly connected to the first test fixed carrier board 12, the guide column 23 penetrates through the guide cylinder 22 and is fixed on the first test fixed carrier board 12, the guide cylinder 25 is fixed on the movable carrier board 14, the guide cylinder 22 penetrates through the movable carrier board 14, the guide column 23 is matched with the guide cylinders 22 and 25, and the movable carrier board 14 can move back and forth between the first test fixed carrier board 12 and the second test fixed carrier board 15 along the guide column 23 and the guide cylinders 22 and 25. This embodiment designs the guiding structure of the guiding columns 23 and the guiding cylinders 22 and 25, which is more precise, and also designs only one set of guiding columns at both ends between the first fixed carrier board 12 for testing and the second fixed carrier board 15 for testing, so as to realize the movement of the movable carrier board 14 between the first fixed carrier board 12 for testing and the second fixed carrier board 15 for testing.
The probe mounting plate 13, which is fixedly mounted on the moving carrier plate 14, is movable with the moving carrier plate 14 to below the first fixed carrier plate 12 for testing. The two ends of the first fixed carrier 12 for testing near one side of the movable carrier 14 are provided with positioning pillars 16, and the positioning pillars 16 can penetrate through the movable carrier 14 and the reinforcing plate 24 and pass through the positioning holes 26 of the reinforcing plate 24.
The frame locking structure is composed of frames 17, 19 symmetrically distributed at both ends of the second fixed carrier plate 15, and the frames 17, 19 are respectively installed on the bearing plate 2 through a frame rotating shaft 21. The frames 17, 19 are composed of a fixed end, a connecting portion and a kneading end as shown in fig. 4, the fixed end processing groove 29 and the end portion groove 30, the springs 18, 28 are respectively installed between the connecting portion of the frames 17, 19 and the second fixing carrier plate 15 to be tested after being compressed, and the springs 18, 28 play a flexible contact role, so that the frames 17, 19 and the second fixing carrier plate 15 to be tested are kept in contact during the movement of the moving carrier plate 14.
During non-testing, two ends of the movable carrier 14 are respectively inserted into the grooves 29 of the frames 17, 19 to be fixed, during testing, the pinch-in ends of the frames 17, 19 are forced toward each other, the fixed ends of the frames 17, 19 are opened under the action of the springs 18, 29, two ends of the movable carrier 14 are separated from the grooves 29, the movable carrier 14 drives the probe mounting plate 13 to move towards the device direction along the guide posts 23, the positioning posts 16 penetrate through the movable carrier 14 and penetrate out of the positioning holes 26 of the reinforcing plate 24 during the movement of the movable carrier 14 towards the first fixed carrier 12 for testing, the movable carrier 14, the reinforcing plate 24 and the guide cylinders 25 move towards the first fixed carrier 12 for testing, and the guide cylinders 22 are inserted into the movable carrier 14. The metal spring probe 11 fixed on the probe mounting plate 13 moves towards the device pin to be tested and contacts with the side surface of the device pin, the two ends of the movable carrier plate 14 are positioned in the grooves 30 at the end parts of the frames 17 and 19, the position of the movable carrier plate 14 is fixed, and the position of the probe mounting plate 13 is further fixed.
The number and the positions of the metal spring probes distributed on the probe mounting plate 13 are determined according to the types of the devices to be detected, and the method can be realized only by replacing the probe mounting plate 13 when different devices are detected, so that the method has universality.
The bearing plate 2 is made of metal materials, so that heat dissipation is facilitated. If necessary, the heat dissipation plate 20 can be fixed on the bottom surface of the bearing plate 2 to increase the heat dissipation strength. A plurality of sets of test tools can be arranged on the bearing plate 2 as required to test the same or different types of devices together.
Various detection circuits are arranged on the aging board 1 and are connected with the metal spring probe data wires according to requirements, and the detection circuits are designed by the known technology in the field.
Further, the invention also provides a mixed integrated circuit aging test method, which is realized by the following steps:
1. fixing a device to be tested on the bearing plate by using a device fixing structure, selecting a proper probe structure according to the device to be tested, and installing the probe structure on a movable carrier plate, wherein the movable carrier plate is locked and positioned by a frame locking structure;
secondly, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate for testing and the second fixed carrier plate for testing, a metal spring probe of the probe structure is contacted with the side surface of a pin of a device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and thirdly, testing the device to be tested.
Further also comprises
Fourthly, after the test is finished, the frame locking structure loosens the movable carrier plate, the movable carrier plate drives the probe structure to move between the first fixed carrier plate and the second fixed carrier plate, the metal spring probe of the probe structure is separated from the side surface of the pin of the device to be tested, and the frame locking structure locks and positions the movable carrier plate;
and fifthly, opening the device fixing structure to take out the device to be tested.
The invention has not been described in detail and is in part known to those of skill in the art.

Claims (10)

1.一种混合集成电路老炼试验工装，其特征在于：包括老炼板、承载板、器件固定结构和测试结构，老炼板和承载板平行固定，两者之间存在一定空隙，器件固定结构和测试结构安装在承载板上，测试结构对称分布在器件固定结构两侧，器件固定结构固定待测器件；1. A hybrid integrated circuit burn-in test tooling is characterized in that: comprising a burn-in board, a bearing plate, a device fixing structure and a test structure, the burn-in board and the bearing board are fixed in parallel, and there is a certain gap between the two, and the device is fixed. The structure and the test structure are installed on the carrier board, the test structure is symmetrically distributed on both sides of the device fixing structure, and the device fixing structure fixes the device to be tested; 所述的测试结构包括测试第一固定载板、测试第二固定载板、探针结构、框架锁紧结构和移动载板，测试第一固定载板和测试第二固定载板固定安装在承载板上，框架锁紧结构安装在承载板上，用于移动载板在测试位置和非测试位置的定位；The test structure includes a test first fixed carrier board, a test second fixed carrier board, a probe structure, a frame locking structure and a moving carrier board, and the test first fixed carrier board and the test second fixed carrier board are fixedly installed on the bearing On the board, the frame locking structure is installed on the carrier board, which is used for the positioning of the mobile carrier board in the test position and the non-test position; 所述的探针结构由探针安装板和若干金属弹簧探针构成，金属弹簧探针安装在探针安装板的一端，探针安装板的另一端固定安装在移动载板上，测试第一固定载板和测试第二固定载板之间连接有导向结构，移动载板通过导向结构在测试第一固定载板和测试第二固定载板之间移动，带动探针结构从两端向待测器件管脚移动，金属弹簧探针与待测器件管脚侧面接触，框架锁紧结构将移动载板固定在测试位置。The probe structure is composed of a probe mounting plate and several metal spring probes. The metal spring probes are mounted on one end of the probe mounting plate, and the other end of the probe mounting plate is fixedly mounted on the moving carrier plate. A guide structure is connected between the fixed carrier board and the second test fixed carrier board, and the movable carrier board moves between the test first fixed carrier board and the test second fixed carrier board through the guide structure, and drives the probe structure from both ends to the to-be-tested carrier board. The pins of the device under test move, the metal spring probes are in contact with the side surfaces of the pins of the device under test, and the frame locking structure fixes the mobile carrier board in the test position. 2.根据权利要求1所述的一种混合集成电路老炼试验工装，其特征在于：所述的框架锁紧结构由对称分布在测试第二固定载板两端的第一框架和第二框架构成，第一、二框架分别通过框架转轴安装在承载板上，第一、二框架由固定端、连接部和捏合端组成，固定端加工凹槽和端部凹槽，弹簧压缩后分别安装在第一、二框架连接部和测试第二固定载板之间，在移动载板移动过程中，使得第一、二框架与测试第二固定载板保持接触，移动载板非测试时，两端分别插入到第一、二框架的凹槽中固定位置，测试时，第一、二框架的捏合端相向用力，在弹簧作用下，第一、二框架的固定端张开，移动载板两端脱离凹槽，移动载板沿导向结构带动探针安装板向待测器件方向移动，待测器件管脚侧面与金属弹簧探针接触后，移动载板两端位于第一、二框架的的端部凹槽内，固定移动载板位置，进而将探针安装板的位置固定。2 . A hybrid integrated circuit burn-in test tool according to claim 1 , wherein the frame locking structure is composed of a first frame and a second frame symmetrically distributed at both ends of the test second fixed carrier plate. 3 . The first and second frames are respectively installed on the bearing plate through the frame rotating shaft. The first and second frames are composed of a fixed end, a connecting part and a kneading end. The fixed end is machined with grooves and end grooves. Between the connecting parts of the first and second frames and the second fixed carrier for testing, during the movement of the moving carrier, the first and second frames are kept in contact with the second fixed carrier for testing. When the moving carrier is not tested, the two ends are respectively Insert it into the grooves of the first and second frames to fix the position. During the test, the pinch ends of the first and second frames are pressed against each other. Under the action of the spring, the fixed ends of the first and second frames are opened, and the two ends of the moving carrier plate are separated from each other. In the groove, the moving carrier plate drives the probe mounting plate to move toward the device under test along the guide structure. After the side surface of the pin of the device under test is in contact with the metal spring probe, the two ends of the moving carrier plate are located at the ends of the first and second frames. In the groove, the position of the mobile carrier plate is fixed, thereby fixing the position of the probe mounting plate. 3.根据权利要求1所述的一种混合集成电路老炼试验工装，其特征在于：所述的导向结构由导向柱、第一导向筒和第二导向筒组成，第一导向筒固定连接在测试第一固定载板上，导向柱穿在第一导向筒内，并固定在测试第一固定载板上，第二导向筒固定在移动载板上，第一导向筒穿过移动载板，导向柱与第一、第二导向筒配合，移动载板可以沿导向柱和第一、第二导向筒移动。3. A hybrid integrated circuit burn-in test tool according to claim 1, wherein the guide structure is composed of a guide column, a first guide cylinder and a second guide cylinder, and the first guide cylinder is fixedly connected to the Test the first fixed carrier board, the guide column is passed through the first guide cylinder and fixed on the first fixed carrier board for testing, the second guide cylinder is fixed on the movable carrier board, and the first guide cylinder passes through the movable carrier board, The guide posts are matched with the first and second guide cylinders, and the moving carrier plate can move along the guide posts and the first and second guide cylinders. 4.根据权利要求1所述的一种混合集成电路老炼试验工装，其特征在于：所述的器件固定结构包括第一固定载板、第二固定载板、盖板和扣板，第一固定载板和第二固定载板固定在承载板上，转轴固定安装在第一固定载板上，盖板的固定端通过转轴安装在第一固定载板上，盖板的非固定端与扣板一端连接，扣板另一端呈钩状，当扣板扣在第二固定载板上时，将盖板固定在第一固定载板、第二固定载板之间，盖板下固定待测器件，当扣板松开，不扣在第二固定载板上时，盖板绕转轴旋转打开，可以装卸待测器件。4. A hybrid integrated circuit burn-in test tool according to claim 1, wherein the device fixing structure comprises a first fixing carrier, a second fixing carrier, a cover and a gusset, the first The fixed carrier board and the second fixed carrier board are fixed on the carrier board, the rotating shaft is fixedly installed on the first fixed carrier board, the fixed end of the cover plate is mounted on the first fixed carrier board through the rotating shaft, and the non-fixed end of the cover board is connected to the buckle. One end of the plate is connected, and the other end of the gusset plate is hook-shaped. When the gusset plate is buckled on the second fixed carrier plate, the cover plate is fixed between the first fixed carrier plate and the second fixed carrier plate, and the cover plate is fixed under the test. device, when the buckle plate is released and not buckled on the second fixed carrier plate, the cover plate rotates around the rotating shaft to open, and the device to be tested can be loaded and unloaded. 5.根据权利要求1所述的一种混合集成电路老炼试验工装，其特征在于：所述的探针安装板可更换，探针安装板上分布的金属弹簧探针的数量和位置根据待测器件种类确定。5. A hybrid integrated circuit burn-in test tool according to claim 1, wherein the probe mounting plate is replaceable, and the number and position of the metal spring probes distributed on the probe mounting plate are based on the The type of test device is determined. 6.根据权利要求1所述的一种混合集成电路老炼试验工装，其特征在于：所述的承载板采用金属材料，在承载板底面固定散热板。6 . The hybrid integrated circuit burn-in test tool according to claim 1 , wherein the bearing plate is made of metal material, and a heat dissipation plate is fixed on the bottom surface of the bearing plate. 7 . 7.利用权利要求1所述一种混合集成电路老炼试验工装的测试方法，其特征在于，通过以下步骤实现：7. utilize the test method of a kind of hybrid integrated circuit burn-in test tool described in claim 1, is characterized in that, realizes through the following steps: 第一步，用器件固定结构将待测器件固定在承载板上，根据待测器件选择合适的探针结构，并安装在移动载板上，移动载板由框架锁紧结构锁紧定位；The first step is to fix the device to be tested on the carrier board with the device fixing structure, select the appropriate probe structure according to the device to be tested, and install it on the mobile carrier board, and the mobile carrier board is locked and positioned by the frame locking structure; 第二步，框架锁紧结构松开移动载板，移动载板带动探针结构在测试第一固定载板、测试第二固定载板之间移动，探针结构的金属弹簧探针与待测器件管脚侧面接触，框架锁紧结构将移动载板锁紧定位；In the second step, the frame locking structure releases the moving carrier plate, and the moving carrier plate drives the probe structure to move between the first fixed carrier plate for testing and the second fixed carrier plate for testing. The side of the device pins is in contact, and the frame locking structure locks and positions the mobile carrier board; 第三步，待测器件进行试验。The third step is to test the device under test. 8.根据权利要求7所述的一种混合集成电路老炼试验测试方法，其特征在于：还包括8. a kind of hybrid integrated circuit burn-in test method according to claim 7, is characterized in that: also comprises: 第四步，试验完成后，框架锁紧结构松开移动载板，移动载板带动探针结构在测试第一固定载板、测试第二固定载板之间移动，探针结构的金属弹簧探针与待测器件管脚侧面脱离，框架锁紧结构将移动载板锁紧定位；The fourth step, after the test is completed, the frame locking structure releases the moving carrier plate, and the moving carrier plate drives the probe structure to move between the test first fixed carrier plate and the test second fixed carrier plate, and the metal spring of the probe structure probes. The needle is detached from the side of the pin of the device under test, and the frame locking structure locks and positions the mobile carrier board; 第五步，打开器件固定结构将待测器件取出。The fifth step is to open the device fixing structure and take out the device under test. 9.根据权利要求7所述的一种混合集成电路老炼试验测试方法，其特征在于：所述框架锁紧结构由对称分布在测试第二固定载板两端的第一框架和第二框架构成，第一、二框架分别通过框架转轴安装在承载板上，第一、二框架由固定端、连接部和捏合端组成，固定端加工凹槽和端部凹槽，弹簧压缩后分别安装在第一、二框架连接部和测试第二固定载板之间，在移动载板移动过程中，使得第一、二框架与测试第二固定载板保持接触，移动载板非测试时，两端分别插入到第一、二框架的凹槽中固定位置，测试时，第一、二框架的捏合端相向用力，在弹簧作用下，第一、二框架的固定端张开，移动载板两端脱离凹槽，移动载板沿导向结构带动探针安装板向待测器件方向移动，待测器件管脚侧面与金属弹簧探针接触后，移动载板两端位于第一、二框架的的端部凹槽内，固定移动载板位置，进而将探针安装板的位置固定。9 . The hybrid integrated circuit burn-in test method according to claim 7 , wherein the frame locking structure is composed of a first frame and a second frame symmetrically distributed at both ends of the test second fixed carrier board. 10 . The first and second frames are respectively installed on the bearing plate through the frame rotating shaft. The first and second frames are composed of a fixed end, a connecting part and a kneading end. The fixed end is machined with grooves and end grooves. Between the connecting parts of the first and second frames and the second fixed carrier for testing, during the movement of the moving carrier, the first and second frames are kept in contact with the second fixed carrier for testing. When the moving carrier is not tested, the two ends are respectively Insert it into the grooves of the first and second frames to fix the position. During the test, the pinch ends of the first and second frames are pressed against each other. Under the action of the spring, the fixed ends of the first and second frames are opened, and the two ends of the moving carrier plate are separated from each other. In the groove, the moving carrier plate drives the probe mounting plate to move toward the device under test along the guide structure. After the side surface of the pin of the device under test is in contact with the metal spring probe, the two ends of the moving carrier plate are located at the ends of the first and second frames. In the groove, the position of the mobile carrier plate is fixed, thereby fixing the position of the probe mounting plate. 10.根据权利要求7所述的一种混合集成电路老炼试验测试方法，其特征在于：所述器件固定结构包括第一固定载板、第二固定载板、盖板和扣板，第一固定载板和第二固定载板固定在承载板上，转轴固定安装在第一固定载板上，盖板的固定端通过转轴安装在第一固定载板上，盖板的非固定端与扣板一端连接，扣板另一端呈钩状，当扣板扣在第二固定载板上时，将盖板固定在第一固定载板、第二固定载板之间，盖板下固定待测器件，当扣板松开，不扣在第二固定载板上时，盖板绕转轴旋转打开，可以装卸待测器件。10 . The hybrid integrated circuit burn-in test method according to claim 7 , wherein the device fixing structure comprises a first fixing carrier, a second fixing carrier, a cover and a gusset, and the first The fixed carrier board and the second fixed carrier board are fixed on the carrier board, the rotating shaft is fixedly installed on the first fixed carrier board, the fixed end of the cover plate is mounted on the first fixed carrier board through the rotating shaft, and the non-fixed end of the cover board is connected to the buckle. One end of the plate is connected, and the other end of the gusset plate is hook-shaped. When the gusset plate is buckled on the second fixed carrier plate, the cover plate is fixed between the first fixed carrier plate and the second fixed carrier plate, and the cover plate is fixed under the test. device, when the buckle plate is released and not buckled on the second fixed carrier plate, the cover plate rotates around the rotating shaft to open, and the device to be tested can be loaded and unloaded.
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