CN203535078U - Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module - Google Patents
Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module Download PDFInfo
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- CN203535078U CN203535078U CN201320739641.XU CN201320739641U CN203535078U CN 203535078 U CN203535078 U CN 203535078U CN 201320739641 U CN201320739641 U CN 201320739641U CN 203535078 U CN203535078 U CN 203535078U
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- support plate
- hole
- lower support
- plated
- integrated circuit
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- 239000000523 sample Substances 0.000 claims description 55
- 238000001514 detection method Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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Abstract
The utility model discloses a continuity test fixture for a plated-through hole on a thick film hybrid integrated circuit module. The test fixture comprises a working platform, a lower support plate, and an upper support plate. The lower support plate is fixed on the working platform through an elastic mechanism. An installation space is formed between the lower support plate and an upper surface of the working platform. A first needle plate is disposed in the installation space. The first pin plate is provided with a plurality of first conducting pins. The lower support plate is provided with a placing area used for placing the thick film hybrid integrated circuit module. The placing area is provided with a plurality of pin holes corresponding to the first conducting pins. The first conducting pins extend from the pin holes and are exposed to the placing area. The upper support plate is right above the lower support plate and can move on a vertical direction. A lower surface of the upper support plate is provided with a second pin board. The second pin board is provided with a plurality of second conducting pins. The test fixture is simple in structure, and can perform continuity tests on plurality of plated-through holes. The test fixture is high in working efficiency, and good in test performance.
Description
Technical field
The utility model relates to test fixture, relates in particular to a kind of thick film hybrid integrated circuit module plated through-hole continuity test fixture.
Background technology
Thick film hybrid integrated circuit is a kind of miniature electronic functional part, it is to utilize the thick-film techniques such as serigraphy and sintering on same substrate, to make passive network, and assemble discrete semiconductor device chip or monolithic integrated optical circuit or micro element thereon, then the hydrid integrated circuit that forms of additional encapsulation.On this thick film hybrid integrated circuit, generally have pin jack, this pin jack is by after metallization process, and the through hole that formation can be conducted electricity, so that installing electronic elements.
Yet, in metallized process, may there is not complete metal of partial through holes, can not conducting, therefore, in subsequent handling after plated through-hole technique completes, need to test plated through-hole, whether can conducting, existing detection mode if detecting each pin jack, by test instrumentations such as multimeters, detect, two probes that are about to multimeter contact respectively the two ends of pin jack, see whether multimeter can detect current signal, and this mode operates comparatively complicated, inefficiency, is not suitable for a plurality of pin jack is tested.
Utility model content
The purpose of this utility model be to overcome deficiency of the prior art and provide a kind of simple in structure, can carry out to a plurality of plated through-holes the thick film hybrid integrated circuit module plated through-hole continuity test fixture of continuity test.
The technical scheme that the utility model solution prior art problem adopts is: a kind of thick film hybrid integrated circuit module plated through-hole continuity test fixture, it comprises workbench, lower support plate and upper support plate, wherein, described lower support plate is fixed on described workbench by elastic mechanism, between described lower support plate and workbench upper surface, be formed with an installing space, one first needle plate is installed in described installing space, and described the first needle plate is provided with several the first conducting probes;
On described lower support plate, have for placing the rest area of thick film hybrid integrated circuit module, described rest area is provided with pin hole corresponding to several and described the first conducting probe, and described the first conducting probe is stretched out and is revealed in described rest area by described pin hole;
Described upper support plate be positioned at described lower support plate directly over and can on vertical direction, move, its lower surface is provided with the second needle plate, described the second needle plate is provided with several the second conducting probes;
Described in each, the second conducting probe and correspondence position described first conducting probe forms one group of detection agency, the first conducting probe described in every group in detection agency has the point A that can insert described plated through-hole lower end, and the second conducting probe has the point B that can insert described plated through-hole upper end.
Below technique scheme is further elaborated:
Further, also comprise guiding mechanism, described guiding mechanism comprises four guideposts, four corner locations of described upper support plate are respectively equipped with a through hole, described in each, in through hole, be embedded with a guide pin bushing, guidepost be socketed one in each guide pin bushing described in, the lower end of described guidepost and described workbench are fixed.
Further, described elastic mechanism comprises feet and spring, four corner locations corresponding to lower support plate on described workbench are respectively arranged with a through hole, described through hole has a step, four corner locations of described lower support plate arrange one respectively described in feet, the upper end of described feet is fixedly connected with described lower support plate, and lower end is inserted in described through hole;
Spring described in being arranged with one in feet described in each, the upper end of described spring is connected to described lower support plate, and lower end is connected to described step.
Further, described rest area is square, a corner location in described square rest area be provided with one with this rest area connect uncovered.
Further, a side of described lower support plate is provided with a notch part, and described notch part extends to described rest area.
Further, the upper surface of described upper support plate is provided with a web member for being connected with external drive mechanism.
Further, described web member is U-shaped web joint.
The beneficial effects of the utility model are: the thick film hybrid integrated circuit module plated through-hole continuity test fixture that the utility model provides, in the rest area of lower support plate, place thick film hybrid integrated circuit module, by driving mechanism, driving support plate to decline fits with lower support plate, now, the second conducting probe on upper support plate is inserted in the plated through-hole upper end of thick film hybrid integrated circuit module, and the first conducting probe on lower support plate is inserted in the plated through-hole lower end of thick film hybrid integrated circuit module, so can test, this clamp structure, can test a plurality of plated through-holes simultaneously, its working effect is higher, operate also convenient, in addition, due between lower support plate and workbench, by elastic mechanism, be connected, so when upper support plate and download plate closing, upper support plate is subject to driving mechanism acting force, depress support plate downwards, spring-compressed now, the first conducting probe and the second conducting probe further stretch in plated through-hole, so, can guarantee the first conducting probe and the second conducting probe and plated through-hole good contact, to improve the accuracy detecting, simultaneously, can avoid the first conducting probe and the second conducting probe because of the stressed excessive bending damage etc. that causes.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the use constitutional diagram of the utility model under test mode;
Fig. 3 is the partial enlarged drawing at A place in Fig. 1;
Fig. 4 is the test system structure schematic diagram with the utility model fixture;
The realization of the utility model object, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Below with reference to drawings and the specific embodiments, describe the technical solution of the utility model in detail, so as clearer, understand invention essence of the present utility model intuitively.
As shown in Figure 1 to Figure 3, the utility model provides a kind of thick film hybrid integrated circuit module plated through-hole continuity test fixture, it comprises workbench 10, lower support plate 21 and upper support plate 20, wherein, lower support plate 21 is fixed on described workbench 10 by elastic mechanism 40, between described lower support plate 21 and workbench 10 upper surfaces, be formed with an installing space, one first needle plate 30 is installed in described installing space, described the first needle plate 30 is provided with several the first conducting probes 301; Simultaneously, on lower support plate 21, have for placing the rest area 211 of thick film hybrid integrated circuit module, described rest area 211 is provided with pin hole corresponding to several and described the first conducting probe 301, and described the first conducting probe 301 is stretched out and is revealed in described rest area 211 by described pin hole.
Because thick film hybrid integrated circuit module is batch making in manufacturing process, on a ceramic substrate, by printing, sintering, laser resistor trimming, form a plurality of identical thick film hybrid integrated circuit modules, in subsequent handling, just by cutting operation, each thick film hybrid integrated circuit module by detecting is cut into standalone module, so above-mentioned rest area 211 is designed to and the suitable size of monolithic ceramic substrate.
Corresponding, upper support plate 20 be positioned at described lower support plate 21 directly over and can on vertical direction, move, its lower surface is provided with the second needle plate, described the second needle plate is provided with several the second conducting probes 201 in parallel.Described in each, the second conducting probe 201 forms one group of detection agency with described first conducting probe 301 of correspondence position, be that every group of detection agency is for detection of the conducting state of a plated through-hole 90, the first conducting probe 301 described in every group in detection agency has the point A that can insert described plated through-hole 90 lower ends, and the second conducting probe 201 has the point B that can insert described plated through-hole 90 upper ends.
In addition, on workbench 10, be also provided with guiding mechanism, described guiding mechanism comprises four guideposts 50, four corner locations of described upper support plate 20 are respectively equipped with a through hole, described in each, in through hole, be embedded with a guide pin bushing 51, guidepost 50 be socketed one in each guide pin bushing 51 described in, the lower end of described guidepost 50 and described workbench 10 are fixing, so, when upper support plate 20 moves up and down, upper support plate 20 can move up and down along guidepost 50, guarantees motion more steadily smoothly, and position when closed with lower support plate 21 is more accurate.
In the present embodiment, elastic mechanism 40 comprises feet 401 and spring 402, four corner locations corresponding to lower support plate 21 on described workbench 10 are respectively arranged with a through hole, described through hole has a step 101, four corner locations of described lower support plate 21 arrange one respectively described in feet 401, the upper end of described feet 401 is fixedly connected with described lower support plate 21, and lower end is inserted in described through hole; Spring 402 described in being arranged with one in feet 401 described in each, the upper end of described spring 402 is connected to described lower support plate 21, and lower end is connected to described step 101.So, when when upper support plate 20 and lower support plate 21 are closed, upper support plate 20 is subject to driving mechanism acting force, depress support plate 21 downwards, now spring 402 compressions, the first conducting probe 301 and the second conducting probe 201 further stretch in plated through-hole 90, so, can guarantee the first conducting probe 301 and the second conducting probe 201 and plated through-hole 90 good contacts, to improve the accuracy detecting, meanwhile, can avoid the first conducting probe 301 and the second conducting probe 201 because of the stressed excessive bending damage etc. that causes.
Further, rest area 211 is square, a corner location in described square rest area 211 be provided with one with this rest area 211 connect uncovered 213; Ceramic substrate generally has a unfilled corner position, in put procedure, this unfilled corner position corresponding uncovered 213 can be placed, and so, can play sign positioning action.Meanwhile, a side of lower support plate 21 is provided with a notch part 212, and described notch part 212 extends to described rest area 211, in the time of need to taking out ceramic substrate, can be affectedly bashful ceramic substrate from these notch part 212 positions, so that the taking-up of ceramic substrate.
Further, the upper surface of described upper support plate 20 is provided with a web member for being connected with external drive mechanism, and this web member is U-shaped web joint 202, and this U-shaped web joint 202 can make support plate 20 stressed evenly, and in assurance, support plate 20 moves up and down smoothly.
Shown in Fig. 4, Fig. 4 is the structural representation of a kind of application of the utility model fixture, in concrete application, adopt and drive cylinder 60 as driving mechanism, by driving cylinder 60 to drive upper support plate 20 to move up and down, simultaneously, the first conducting probe 301 and the second conducting probe 201 are connected to respectively to supply module, when between described the first conducting probe 301 and corresponding the second conducting probe 201 during conducting, form independently power circuit, on power circuit described in each, be connected with a display lamp 71.Be that each first conducting probe 301 and second conducting probe 201 are connected in one independently in loop, in this loop, using supply module as power supply, using display lamp 71 as load, whether using the first conducting probe 301 and the second conducting probe 201 conductings as switch, as long as the first conducting probe 301 and the second conducting probe 201 conductings (being equivalent to switch closure), to the display lamp 71 in should loop, can be lit.
In test process, first open total power switch 80 and power switch 81, now, upper support plate 20 and lower support plate 21 are in upper and lower released state, operating personnel are positioned over whole ceramic substrate (containing a plurality of thick film hybrid integrated circuit modules) in the rest area 211 of lower support plate 21, guarantee point A on the first conducting probe 301 on lower support plate 21 can with the lower end good contact of plated through-hole on ceramic substrate 90, press again starting switch 82, drive cylinder 60 actions, cylinder rod 61 stretches out downwards, in driving, support plate 20 moves downward, finally with lower support plate 21 closures, now go up the point B of the second conducting probe 201 and the upper end in contact of plated through-hole 90 on support plate 20, simultaneously, each display lamp 71 on lamp plate 70 shows corresponding state, when a certain plated through-hole 90 can conducting, the state of corresponding display lamp 71 is bright, and when a certain plated through-hole 90 can not conducting, the state of corresponding display lamp 71 is not for working, operating personnel can judge whether to exist the not situation of conducting of plated through-hole 90 very intuitively.
In sum, the thick film hybrid integrated circuit module plated through-hole continuity test fixture that the utility model provides, at the interior placement thick film hybrid integrated circuit module in the rest area 211 of lower support plate 21, by driving mechanism, drive support plate 20 to decline and lower support plate 21 laminatings, now, the second conducting probe 201 on upper support plate 20 is inserted in plated through-hole 90 upper ends of thick film hybrid integrated circuit module, and the first conducting probe 301 on lower support plate 21 is inserted in plated through-hole 90 lower ends of thick film hybrid integrated circuit module, so can test, this clamp structure, can test a plurality of plated through-holes 90 simultaneously, its working effect is higher, operate also convenient.
The foregoing is only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model instructions and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (7)
1. a thick film hybrid integrated circuit module plated through-hole continuity test fixture, it is characterized in that: it comprises workbench, lower support plate and upper support plate, wherein, described lower support plate is fixed on described workbench by elastic mechanism, between described lower support plate and workbench upper surface, be formed with an installing space, one first needle plate is installed in described installing space, and described the first needle plate is provided with several the first conducting probes;
On described lower support plate, have for placing the rest area of thick film hybrid integrated circuit module, described rest area is provided with pin hole corresponding to several and described the first conducting probe, and described the first conducting probe is stretched out and is revealed in described rest area by described pin hole;
Described upper support plate be positioned at described lower support plate directly over and can on vertical direction, move, its lower surface is provided with the second needle plate, described the second needle plate is provided with several the second conducting probes;
Described in each, the second conducting probe and correspondence position described first conducting probe forms one group of detection agency, the first conducting probe described in every group in detection agency has the point A that can insert described plated through-hole lower end, and the second conducting probe has the point B that can insert described plated through-hole upper end.
2. thick film hybrid integrated circuit module plated through-hole continuity test fixture according to claim 1, it is characterized in that: also comprise guiding mechanism, described guiding mechanism comprises four guideposts, four corner locations of described upper support plate are respectively equipped with a through hole, described in each, in through hole, be embedded with a guide pin bushing, guidepost be socketed one in each guide pin bushing described in, the lower end of described guidepost and described workbench are fixed.
3. thick film hybrid integrated circuit module plated through-hole continuity test fixture according to claim 1 and 2, it is characterized in that: described elastic mechanism comprises feet and spring, four corner locations corresponding to lower support plate on described workbench are respectively arranged with a through hole, described through hole has a step, four corner locations of described lower support plate arrange one respectively described in feet, the upper end of described feet is fixedly connected with described lower support plate, and lower end is inserted in described through hole;
Spring described in being arranged with one in feet described in each, the upper end of described spring is connected to described lower support plate, and lower end is connected to described step.
4. thick film hybrid integrated circuit module plated through-hole continuity test fixture according to claim 3, is characterized in that: described rest area is square, a corner location in described square rest area be provided with one with this rest area connect uncovered.
5. thick film hybrid integrated circuit module plated through-hole continuity test fixture according to claim 4, is characterized in that: a side of described lower support plate is provided with a notch part, and described notch part extends to described rest area.
6. thick film hybrid integrated circuit module plated through-hole continuity test fixture according to claim 1, is characterized in that: the upper surface of described upper support plate is provided with a web member for being connected with external drive mechanism.
7. thick film hybrid integrated circuit module plated through-hole continuity test fixture according to claim 6, is characterized in that: described web member is U-shaped web joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739641.XU CN203535078U (en) | 2013-11-20 | 2013-11-20 | Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739641.XU CN203535078U (en) | 2013-11-20 | 2013-11-20 | Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module |
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| Publication Number | Publication Date |
|---|---|
| CN203535078U true CN203535078U (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320739641.XU Expired - Lifetime CN203535078U (en) | 2013-11-20 | 2013-11-20 | Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module |
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| CN (1) | CN203535078U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104793098A (en) * | 2015-04-28 | 2015-07-22 | 华东光电集成器件研究所 | Substrate via-hole on-off test device |
| CN106154142A (en) * | 2016-09-26 | 2016-11-23 | 伟创力电子技术(苏州)有限公司 | Solve pin bending and cause the universal test support plate that false failure rate is high |
| CN104181340B (en) * | 2014-09-01 | 2017-01-25 | 苏州市吴中区胥口广博模具加工厂 | Lamination-stroke-adjustable test lamination frame |
| CN108555790A (en) * | 2018-01-18 | 2018-09-21 | 昀智科技（北京）有限责任公司 | A kind of air-actuated jaw and its application method |
| CN112224877A (en) * | 2020-09-28 | 2021-01-15 | 东莞市盟拓智能科技有限公司 | Vacuum adsorption mechanism for LED (light-emitting diode) flexible substrate |
-
2013
- 2013-11-20 CN CN201320739641.XU patent/CN203535078U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181340B (en) * | 2014-09-01 | 2017-01-25 | 苏州市吴中区胥口广博模具加工厂 | Lamination-stroke-adjustable test lamination frame |
| CN104793098A (en) * | 2015-04-28 | 2015-07-22 | 华东光电集成器件研究所 | Substrate via-hole on-off test device |
| CN106154142A (en) * | 2016-09-26 | 2016-11-23 | 伟创力电子技术(苏州)有限公司 | Solve pin bending and cause the universal test support plate that false failure rate is high |
| CN108555790A (en) * | 2018-01-18 | 2018-09-21 | 昀智科技（北京）有限责任公司 | A kind of air-actuated jaw and its application method |
| CN112224877A (en) * | 2020-09-28 | 2021-01-15 | 东莞市盟拓智能科技有限公司 | Vacuum adsorption mechanism for LED (light-emitting diode) flexible substrate |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20140409 |