CN206740922U - A kind of nucleus module test device of stamp hole encapsulation - Google Patents

Abstract

The utility model provides a core module testing device packaged with a stamp hole, which includes a fixture main body, a fixing seat, a retaining spring group and a test PCBA board; The drive splint moves relative to the fixture base, and a clamping space for clamping the core module encapsulated by the stamp hole is formed between the splint and the support plate of the fixture base; the test PCBA board is set on the support plate, and the fixing seat is set on the test PCBA board. The spring set is arranged on the fixed seat, and each spring of the spring set is electrically connected to the test PCBA board; the fixed seat is provided with an area for installing the core module, and each spring is used to connect with each stamp hole pin on the core module. One-to-one correspondence, and conductive contact.

Description

A core module testing device packaged with a postage stamp hole

technical field

The utility model relates to the technical field of stamp hole packaging detection, in particular to a core module testing device for stamp hole packaging.

Background technique

In order to speed up project development and product stability, key devices such as AP chips, baseband chips, Flash, DDR, PMIC, WiFi, RF power amplifier chips, etc. are usually designed as a core module. With the development of chips towards miniaturization and high density, the size of the current core module is getting smaller and smaller, so as to be applicable to more products. Due to the advantages of low cost and easy design, stamp hole packaging technology has become the first choice for core module packaging. In the process of testing the core module, for the pads with small PIN (stamp hole pin) spacing, the current test fixture test signal uses pogo pins, according to the spacing of the stamp hole pins of the PCBA on the test fixture Install the pogo pins, use the spring force of the pogo pins to contact the stamp hole pins of the PCBA, and the pogo pins cover the flying wires to the test board, so as to realize the signal connection for testing. The diameter of the conventional standard pogo pin is 0.95mm, and the PIN pitch of the stamp hole is 1.25mm.

With the miniaturization and high-density development of electronic product components, the PIN pitch of stamp holes is getting smaller and smaller, usually less than 1.25mm, and non-standard pogo pins are usually used for detection, such as pogo pins with a diameter of 0.65. The thinner the pogo pins, the more expensive they are and the shorter their service life. Obviously, this makes the detection of the core module of the stamp hole package difficult. In addition, the number of pins of the core module is increasing, and the difficulty of spring needle sleeve flying leads and subsequent maintenance is increasing. The flying lead method is often prone to interference because the flying lead is too long, and the test efficiency of the test device is low.

Utility model content

The purpose of the utility model is to provide a core module testing device packaged with a stamp hole to solve the problems of low test efficiency and high cost of the current core module packaged with a stamp hole.

In order to achieve the above object, the utility model provides the following technical solutions:

A core module testing device packaged with a stamp hole, including a fixture body, a fixing seat, a spring set and a test PCBA board; wherein:

The clamp body includes a clamp base, a clamping plate and a driving handle, the driving handle is connected to the clamping plate to drive the clamping plate to move relative to the clamping base, and the clamping plate and the support plate of the clamping base form a The clamping space of the core module that clamps the stamp hole package;

The test PCBA board is arranged on the support plate, the fixing seat is arranged on the test PCBA board, the snap ring group is arranged on the fixing seat, and each snap ring of the snap ring group is connected with the The test PCBA board is electrically connected;

The fixed seat is provided with a region for installing the core module, and each of the snap springs is used for one-to-one correspondence with each stamp hole pin on the core module, and is in conductive contact.

Further, the snap spring is an elastic bending part.

Further, one end of the circlip is electrically connected to the PCBA board by welding, and the other end has a bent slope, and the bent slope is in contact with the pin of the stamp hole.

Further, the clamp spring is made of steel or gold-plated copper.

Further, the bottom surface of the splint is provided with a plurality of fixture PCBA ejector pins, and the fixture PCBA ejector pins can move with the splint to clamp the core module.

Further, the clamp base includes the support plate and the vertical plate;

The vertical plate is vertically arranged on the support plate, a guide rail is arranged on the vertical plate, and the clamping plate is slidably matched with the guide rail so as to be away from or close to the support plate.

Further, the guide rail is a guide post, and there are two guide posts, and the two guide posts are respectively arranged on both side edges of the vertical plate;

A slide hole is provided at a position corresponding to the splint and the guide post, and the slide hole is slidably matched with the guide post.

Further, a base is also included, and a plurality of support rods are arranged between the base and the clamp base.

Further, the support rod is a telescopic adjustment rod.

Further, the bottom of the base is provided with moving rollers.

The test device disclosed by the utility model adopts the snap spring to test the core module packaged in the stamp hole, and the snap spring can be directly fixed on the test PCBA board, which saves the traditional way of connecting the test PCBA board with the spring pin branch line, which can reduce the The risk of electrical signal interference caused by flying leads can enhance the reliability of the test device and improve test efficiency. The use of springs to implement detection can make the pitch of stamp hole pins smaller, and is suitable for core modules packaged with high-density and small-sized stamp holes. At the same time, the cost of the circlip is much lower than that of the pogo pins, and the service life is longer than that of the pogo pins, thereby reducing the testing cost and prolonging the life of the test device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. For some embodiments described, those skilled in the art can also obtain other drawings according to these drawings.

Fig. 1 is the structural schematic diagram of the core module testing device of stamp hole package disclosed by the embodiment of the present invention;

Fig. 2 is a partial structural schematic diagram of a core module testing device packaged with a stamp hole disclosed in an embodiment of the present invention;

Fig. 3 is a schematic diagram of an enlarged structure of part B in Fig. 2;

Fig. 4 is a schematic structural view of the fixing seat in this embodiment;

Fig. 5 is a partial structural schematic diagram of a core module testing device packaged with a stamp hole disclosed in an embodiment of the present invention;

FIG. 6 is an enlarged structural diagram of part A of FIG. 5 .

detailed description

In order to make those skilled in the art better understand the technical solution of the utility model, the utility model will be further introduced in detail below in conjunction with the accompanying drawings.

Please refer to FIGS. 1-6 , the embodiment of the utility model provides a core module testing device packaged with a stamp hole. The testing device includes a fixture body 2 , a fixing seat 6 , a spring set and a test PCBA board 8 .

The clamp body 2 includes a clamp base, a splint 13 and a driving handle 1 . The driving handle 1 is connected with the splint 13 to drive the splint 13 to move relative to the support plate 11 of the fixture base, and the user can grasp the driving handle 1 to drive the splint 13 to move. A clamping space for clamping the core module 5 packaged with stamp holes is formed between the clamping plate 13 and the supporting plate 11 of the fixture base.

The test PCBA board 8 is arranged on the support plate, the fixed seat 6 is arranged on the test PCBA board 8 , the snap ring group is arranged on the fixed seat 6 , and each snap ring 7 of the snap ring group is electrically connected with the test PCBA board 8 .

The fixing seat 6 is arranged in the area where the core module 5 is installed, and each retaining spring 7 is used for one-to-one correspondence with each stamp hole pin on the core module 5 and is in conductive contact.

The test device disclosed in the utility model adopts the snap spring 7 to test the core module 5 packaged in the stamp hole, and the snap spring 7 can be directly fixed on the test PCBA board 8, eliminating the need for the traditional spring pin branch line to connect the test PCBA board 8. This can reduce the risk of electrical signal interference caused by flying leads, thereby enhancing the reliability of the test device and improving test efficiency. Using the snap spring 7 to implement the detection can make the pitch of the pins of the stamp hole designed to be smaller, which is suitable for the core module 5 packaged in a high-density and small-sized stamp hole. At the same time, the cost of the snap ring 7 is much lower than that of the pogo pins, and the service life is longer than that of the pogo pins, thereby reducing the detection cost and prolonging the life of the testing device.

In this embodiment, the clip spring 7 can be an elastic bending part, and the clip spring 7 can be in electrical contact with the stamp hole pin more effectively through the elastic bending part. In a specific embodiment, one end of the snap spring 7 can be electrically connected to the test PCBA board 8 by welding, and the other end has a bent slope, and the bent slope contacts with the pin of the stamp hole. Circlip 7 can adopt materials such as steel, copper plating to make.

Please refer to FIG. 1 again, the bottom surface of the splint 13 is provided with a plurality of fixture PCBA ejector pins 4 , and the fixture PCBA ejector pins 4 can move with the splint 13 to clamp the core module 5 . The core module 5 is tightened point-to-point through the fixture PCBA ejector pin 4 to avoid affecting other components of the core module 5 .

In a specific embodiment, the clamp base includes a support plate 11 and a vertical plate 10, the vertical plate 10 is vertically arranged on the support plate 11, a guide rail is provided on the vertical plate 10, and the splint 13 slides and fits with the guide rail to move away from or approach the support plate 11, thereby realizing the clamping of the core module 5 . The setting of the guide rail can improve the stability of the sliding of the splint 13 , and thus can realize more accurate and stable clamping of the core module 5 .

Please refer to Fig. 1 again, the guide rail can be a guide post 3, specifically, there can be two guide posts 3, and the two guide posts 3 are respectively arranged on both side edges of the vertical plate 10, so as to realize a more balanced guide for the splint 13 . A slide hole 12 is provided at the corresponding part of the splint 13 and the guide post 3 , and the slide hole 12 is slidably matched with the guide post 3 .

Please refer to FIG. 1 , the test device disclosed in the embodiment of the present application may further include a base 14 , and a plurality of support rods 9 are arranged between the base 14 and the fixture main body 2 . The support rod 9 can be a telescopic adjustment rod, and the height of the clamping space of the entire test device can be adjusted through the adjustment of the support rod 9, which is convenient for operation.

In order to facilitate the movement of the entire testing device, preferably, the bottom of the base 14 is provided with moving rollers, and the entire testing device can be moved as a whole by moving the moving rollers. In the embodiment of the present application, a receiving groove may be provided on the fixing seat 6, and the receiving groove is used to better position the core module 5, thereby providing better conditions for subsequent clamping.

In this embodiment, the shape of the retaining spring 7 can be a triangle or other polygons, and the retaining spring 7 can be directly welded on the test PCBA board 8, or can be electrically connected through other fixing methods.

Some exemplary embodiments of the present utility model have been described above only by way of illustration. Needless to say, those skilled in the art can use various Modifications are made to the described embodiments. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present utility model.

Claims (10)

1. a kind of nucleus module test device of stamp hole encapsulation, it is characterised in that including jig main body, fixed seat, jump ring group With test PCBA board；Wherein：

The jig main body includes clamp base, clamping plate and driving handle, and the driving handle is connected with the clamping plate, with driving The clamping plate is moved relative to the clamp base, and clamping stamp is formed between the supporting plate of the clamping plate and the clamp base The grasping part of the nucleus module of hole encapsulation；

The test PCBA board is arranged in the supporting plate, and the fixed seat is arranged in the test PCBA board, the card Spring group is arranged in the fixed seat, and each jump ring of the jump ring group electrically connects with the test PCBA board；

The fixed seat is provided with the region for installing the nucleus module, each jump ring be used for on the nucleus module Each stamp hole pin corresponds, and conductive contact.

2. test device according to claim 1, it is characterised in that the jump ring is elastic bending member.

3. test device according to claim 2, it is characterised in that one end of the jump ring is by way of welding and institute PCBA board electrical connection is stated, the other end has bending inclined-plane, and the bending inclined-plane contacts with the stamp hole pin.

4. test device according to claim 2, it is characterised in that the jump ring is made up of steel or copper gilding.

5. test device according to claim 1, it is characterised in that the bottom surface of the clamping plate is provided with multiple fixture PCBA Push rod, the fixture PCBA push rods can clamp the nucleus module with the clamping plate movement.

6. test device according to claim 1, it is characterised in that the clamp base includes the supporting plate and stood Plate；

The riser is vertically set in the supporting plate, and guide rail is provided with the riser, and the clamping plate is slided with the guide rail It is dynamic to coordinate with the remote or close supporting plate.

7. test device according to claim 6, it is characterised in that the guide rail is guide pillar, and the guide pillar is two, two Guide pillar described in root is separately positioned on the both sides of the edge of the riser；

The clamping plate position corresponding with the guide pillar is provided with slide opening, and the slide opening is slidably matched with the guide pillar.

8. according to any described test devices of claim 1-7, it is characterised in that also including base, the base with it is described More support bars are provided between clamp base.

9. test device according to claim 8, it is characterised in that the support bar is telescopic advance lever.

10. test device according to claim 8, it is characterised in that the bottom of the base is provided with shifting roller.