CN206740922U - A kind of nucleus module test device of stamp hole encapsulation - Google Patents
A kind of nucleus module test device of stamp hole encapsulation Download PDFInfo
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- CN206740922U CN206740922U CN201720509344.4U CN201720509344U CN206740922U CN 206740922 U CN206740922 U CN 206740922U CN 201720509344 U CN201720509344 U CN 201720509344U CN 206740922 U CN206740922 U CN 206740922U
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- jump ring
- test device
- clamping plate
- nucleus module
- test
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Abstract
The utility model provides a kind of nucleus module test device of stamp hole encapsulation, including jig main body, fixed seat, jump ring group and test PCBA board；Wherein：Jig main body includes clamp base, clamping plate and driving handle, and driving handle is connected with clamping plate, and the grasping part of the nucleus module of clamping stamp hole encapsulation is formed to drive clamping plate to be moved relative to clamp base, between clamping plate and the supporting plate of clamp base；Test PCBA board to set on the supporting plate, fixed seat is arranged in test PCBA board, and jump ring group is arranged in fixed seat, and each jump ring of jump ring group electrically connects with test PCBA board；Fixed seat is provided with the region of installation nucleus module, and each jump ring is used to correspond with each stamp hole pin on nucleus module, and conductive contact.
Description
Technical field
It the utility model is related to stamp hole package detection technical field, more particularly to a kind of nucleus module of stamp hole encapsulation
Test device.
Background technology
In order to accelerate the research and development speed of project and the stability of product, it will usually by device such as AP chips, the base of key
Microarray strip, Flash, DDR, PMIC, WiFi, RF power amplification chip etc. are designed as a nucleus module.As chip is towards small-sized
Change, densification developing direction, the size of current nucleus module is less and less, to can be suitably used for more products.Stamp
Hole encapsulation technology is due to inexpensive, easy the advantages that designing and as the first choice of nucleus module encapsulation.Surveyed to nucleus module
During examination, for the less pad of PIN (stamp hole pin) spacing, current test fixture test signal uses bullet
Spring pin, spring needle is installed on test fixture according to the spacing of PCBA stamp hole pin, with the elastic force of spring needle and PCBA
Stamp hole pin contacts, spring needle guard fly line to test board, so as to realize the connection of signal to be tested.Conventional standard bullet
The diameter of spring pin is 0.95mm, and the PIN spacing of stamp hole is 1.25mm.
As the miniaturization of electronic product components, densification develop, the PIN spacing of stamp hole is less and less, generally low
In 1.25mm, generally detected from off-gauge spring needle, such as a diameter of 0.65 spring needle.The thinner price of spring needle
More expensive, service life is also just shorter.It will be apparent that the detection of this nucleus module for causing stamp hole encapsulation becomes difficult.In addition,
The pin number of nucleus module is more and more, and spring needle guard fly line and the increase of later maintenance difficulty, fly line mode usually can be because of
The long signal of fly line is easily interfered, and make it that the testing efficiency of test device is relatively low.
Utility model content
The purpose of this utility model is to provide a kind of nucleus module test device of stamp hole encapsulation, to solve current postal
The problem of nucleus module testing efficiency of ticket hole encapsulation is relatively low, and cost is higher.
To achieve these goals, the utility model provides following technical scheme：
A kind of nucleus module test device of stamp hole encapsulation, including jig main body, fixed seat, jump ring group and test PCBA
Plate；Wherein：
The jig main body includes clamp base, clamping plate and driving handle, and the driving handle is connected with the clamping plate, with
Drive the clamping plate to be moved relative to the clamp base, clamping is formed between the supporting plate of the clamping plate and the clamp base
The grasping part of the nucleus module of stamp hole encapsulation；
The test PCBA board is arranged in the supporting plate, and the fixed seat is arranged in the test PCBA board, institute
State jump ring group to be arranged in the fixed seat, each jump ring of the jump ring group electrically connects with the test PCBA board；
The fixed seat is provided with the region for installing the nucleus module, and each jump ring is used for and the nucleus module
On each stamp hole pin correspond, and conductive contact.
Further, the jump ring is elastic bending member.
Further, one end of the jump ring is electrically connected by way of welding with the PCBA board, and the other end has curved
Inclined-plane is rolled over, the bending inclined-plane contacts with the stamp hole pin.
Further, the jump ring is made up of steel or copper gilding.
Further, the bottom surface of the clamping plate is provided with multiple fixture PCBA push rods, and the fixture PCBA push rods can be with institute
Clamping plate movement is stated to clamp the nucleus module.
Further, the clamp base includes the supporting plate and riser；
The riser is vertically set in the supporting plate, and guide rail is provided with the riser, and the clamping plate is led with described
Rail is slidably matched with the remote or close supporting plate.
Further, the guide rail is guide pillar, and the guide pillar is two, and two guide pillars are separately positioned on the riser
Both sides of the edge；
The clamping plate position corresponding with the guide pillar is provided with slide opening, and the slide opening is slidably matched with the guide pillar.
Further, in addition to base, more support bars are provided between the base and the clamp base.
Further, the support bar is telescopic advance lever.
Further, the bottom of the base is provided with shifting roller.
Test device disclosed in the utility model using jump ring come test stamp hole encapsulation nucleus module, can directly by
Jump ring is fixed in test PCBA board, eliminates the mode of traditional spring needle separated time connecting test PCBA board, this can be reduced
The risk that the electrical signal caused by fly line disturbs, and then the reliability of test device can be strengthened, improve testing efficiency.Using card
Spring examinations enable to the smaller of the line space design of stamp hole pin, are encapsulated suitable for the stamp hole of high density small size
Nucleus module.Simultaneously jump ring cost be far below spring needle cost, the life-span is also longer than spring needle, so as to reduce detection into
This, the life-span of extended testing system device.
Brief description of the drawings
, below will be to institute in embodiment in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only described in the utility model
Some embodiments, for those of ordinary skill in the art, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the nucleus module test device that stamp hole disclosed in the utility model embodiment encapsulates；
Fig. 2 is the partial structurtes signal for the nucleus module test device that stamp hole disclosed in the utility model embodiment encapsulates
Figure；
Fig. 3 is the mplifying structure schematic diagram of part B in Fig. 2；
Fig. 4 is the structural representation of fixed seat in the present embodiment；
Fig. 5 is the partial structurtes signal for the nucleus module test device that stamp hole disclosed in the utility model embodiment encapsulates
Figure；
Fig. 6 is the mplifying structure schematic diagram of Fig. 5 part A.
Embodiment
In order that those skilled in the art more fully understands the technical solution of the utility model, below in conjunction with accompanying drawing pair
The utility model is further detailed.
Fig. 1-6 are refer to, the utility model embodiment provides a kind of nucleus module test device of stamp hole encapsulation, the survey
Trial assembly is put including jig main body 2, fixed seat 6, jump ring group and test PCBA board 8.
Jig main body 2 includes clamp base, clamping plate 13 and driving handle 1.Driving handle 1 is connected with clamping plate 13, with driving
Clamping plate 13 moves relative to the supporting plate 11 of clamp base, and user can grasp driving handle 1 to drive clamping plate 13 to move.Clamping plate
The grasping part of the nucleus module 5 of clamping stamp hole encapsulation is formed between 13 and the supporting plate 11 of clamp base.
Test PCBA board 8 is set on the supporting plate, and fixed seat 6 is arranged in test PCBA board 8, and jump ring group is arranged on fixation
On seat 6, each jump ring 7 of jump ring group electrically connects with test PCBA board 8.
Fixed seat 6 is arranged on the region of installation nucleus module 5, and each jump ring 7 is used for and each stamp on nucleus module 5
Hole pin corresponds, and conductive contact.
Test device disclosed in the utility model tests the nucleus module 5 of stamp hole encapsulation using jump ring 7, can be direct
Jump ring 7 is fixed in test PCBA board 8, eliminates the mode of traditional spring needle separated time connecting test PCBA board 8, this can
The risk that the electrical signal caused by fly line disturbs is reduced, and then the reliability of test device can be strengthened, improves testing efficiency.Adopt
The smaller of the line space design of stamp hole pin is enabled to the examinations of jump ring 7, suitable for the stamp hole of high density small size
The nucleus module 5 of encapsulation.The cost of jump ring 7 is far below the cost of spring needle simultaneously, and the life-span is also longer than spring needle, so as to reduce
Testing cost, the life-span of extended testing system device.
In the present embodiment, jump ring 7 can be elastic bending member, and jump ring 7 and stamp hole pin are realized by elastic bending member
More effectively make electrical contact with.In a kind of specific embodiment, one end of jump ring 7 can be by way of welding with testing PCBA
Plate 8 electrically connects, and the other end has bending inclined-plane, and bending inclined-plane contacts with stamp hole pin.Jump ring 7 can use steel, copper gold-plated
It is made Deng material.
Referring again to Fig. 1, the bottom surface of clamping plate 13 is provided with multiple fixture PCBA push rods 4, and fixture PCBA push rods 4 can be with folder
Plate 13 is moved to clamp nucleus module 5.Nucleus module 5 is implemented by fixture PCBA push rods 4 it is point-to-point hold out against, avoid influence core
Other parts of core module 5.
In a kind of specific embodiment, clamp base includes supporting plate 11 and riser 10, and riser 10 is vertically set on branch
On fagging 11, guide rail is provided with riser 10, clamping plate 13 is slidably matched with remote or close supporting plate 11, so as to realize with guide rail
Clamping to nucleus module 5.The setting of guide rail can improve the stability of the slip of clamping plate 13, and then can realize to nucleus module 5
It is more accurate, stably clamp.
Referring again to Fig. 1, guide rail can be guide pillar 3, specifically, guide pillar 3 can be two, two guide pillars 3 are set respectively
Put in the both sides of the edge of riser 10, clamping plate 13 is implemented more balancedly to guide so as to realize.Clamping plate 13 is corresponding with guide pillar 3
Position is provided with slide opening 12, and slide opening 12 is slidably matched with guide pillar 3.
Fig. 1 is refer to, test device disclosed in the embodiment of the present application can also include base 14, base 14 and jig main body
More support bars 9 are provided between 2.Support bar 9 can be telescopic advance lever, and whole test can be adjusted by the regulation of support bar 9
The height of the grasping part of device, it is easy to operation.
For the ease of the movement of whole test device, it is preferred that the bottom of base 14 is provided with shifting roller, passes through movement
The whole test device of mobile realization of roller moves integrally.In the embodiment of the present application, receiving can be provided with fixed seat 6
Groove, holding tank is used to preferably position nucleus module 5, and then provides preferable condition for follow-up clamping.
In the present embodiment, the shape of jump ring 7 can be triangle or other polygons, and jump ring 7 can be directly welded at survey
Try in PCBA board 8, can also be realized and electrically connected by other fixed forms.
Some one exemplary embodiments of the present utility model are only described by way of explanation above, undoubtedly, for
One of ordinary skill in the art, can be with a variety of in the case of without departing from spirit and scope of the present utility model
Mode is modified to described embodiment.Therefore, above-mentioned accompanying drawing and description are inherently illustrative, should not be construed as
Limitation to the utility model claims protection domain.
Claims (10)
1. a kind of nucleus module test device of stamp hole encapsulation, it is characterised in that including jig main body, fixed seat, jump ring group
With test PCBA board；Wherein：
The jig main body includes clamp base, clamping plate and driving handle, and the driving handle is connected with the clamping plate, with driving
The clamping plate is moved relative to the clamp base, and clamping stamp is formed between the supporting plate of the clamping plate and the clamp base
The grasping part of the nucleus module of hole encapsulation；
The test PCBA board is arranged in the supporting plate, and the fixed seat is arranged in the test PCBA board, the card
Spring group is arranged in the fixed seat, and each jump ring of the jump ring group electrically connects with the test PCBA board；
The fixed seat is provided with the region for installing the nucleus module, each jump ring be used for on the nucleus module
Each stamp hole pin corresponds, and conductive contact.
2. test device according to claim 1, it is characterised in that the jump ring is elastic bending member.
3. test device according to claim 2, it is characterised in that one end of the jump ring is by way of welding and institute
PCBA board electrical connection is stated, the other end has bending inclined-plane, and the bending inclined-plane contacts with the stamp hole pin.
4. test device according to claim 2, it is characterised in that the jump ring is made up of steel or copper gilding.
5. test device according to claim 1, it is characterised in that the bottom surface of the clamping plate is provided with multiple fixture PCBA
Push rod, the fixture PCBA push rods can clamp the nucleus module with the clamping plate movement.
6. test device according to claim 1, it is characterised in that the clamp base includes the supporting plate and stood
Plate；
The riser is vertically set in the supporting plate, and guide rail is provided with the riser, and the clamping plate is slided with the guide rail
It is dynamic to coordinate with the remote or close supporting plate.
7. test device according to claim 6, it is characterised in that the guide rail is guide pillar, and the guide pillar is two, two
Guide pillar described in root is separately positioned on the both sides of the edge of the riser；
The clamping plate position corresponding with the guide pillar is provided with slide opening, and the slide opening is slidably matched with the guide pillar.
8. according to any described test devices of claim 1-7, it is characterised in that also including base, the base with it is described
More support bars are provided between clamp base.
9. test device according to claim 8, it is characterised in that the support bar is telescopic advance lever.
10. test device according to claim 8, it is characterised in that the bottom of the base is provided with shifting roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720509344.4U CN206740922U (en) | 2017-05-09 | 2017-05-09 | A kind of nucleus module test device of stamp hole encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720509344.4U CN206740922U (en) | 2017-05-09 | 2017-05-09 | A kind of nucleus module test device of stamp hole encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206740922U true CN206740922U (en) | 2017-12-12 |
Family
ID=60564987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720509344.4U Active CN206740922U (en) | 2017-05-09 | 2017-05-09 | A kind of nucleus module test device of stamp hole encapsulation |
Country Status (1)
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| CN (1) | CN206740922U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108072832A (en) * | 2018-01-26 | 2018-05-25 | 深圳市布谷鸟科技有限公司 | A kind of test fixture of the pcb board with stamp hole |
| CN108776300A (en) * | 2018-08-04 | 2018-11-09 | 北方联创通信有限公司 | Four side stamp hole package module test fixtures and application method |
| CN110456111A (en) * | 2019-08-30 | 2019-11-15 | 北方联创通信有限公司 | Both sides stamp hole package module test fixture and operating method |
| CN110494036A (en) * | 2019-09-29 | 2019-11-22 | 格力电器（武汉）有限公司 | Machine core test device and machine core test method |
| CN111273059A (en) * | 2018-12-05 | 2020-06-12 | 西华大学 | Stamp hole packaging module testing bottom plate |
-
2017
- 2017-05-09 CN CN201720509344.4U patent/CN206740922U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108072832A (en) * | 2018-01-26 | 2018-05-25 | 深圳市布谷鸟科技有限公司 | A kind of test fixture of the pcb board with stamp hole |
| CN108776300A (en) * | 2018-08-04 | 2018-11-09 | 北方联创通信有限公司 | Four side stamp hole package module test fixtures and application method |
| CN111273059A (en) * | 2018-12-05 | 2020-06-12 | 西华大学 | Stamp hole packaging module testing bottom plate |
| CN110456111A (en) * | 2019-08-30 | 2019-11-15 | 北方联创通信有限公司 | Both sides stamp hole package module test fixture and operating method |
| CN110494036A (en) * | 2019-09-29 | 2019-11-22 | 格力电器（武汉）有限公司 | Machine core test device and machine core test method |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518126 Building No. 5B, Taihua Wutong Industrial Park, Guyu Development Zone, Hangcheng Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Jubo Intelligent Technology Co., Ltd. Address before: 518000 22nd Floor of China Energy Storage Building, 3099 South Road, Yuehai Street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Bo nuoou Intelligent Technology Co., Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong 4 Baoan District City, Shenzhen Province, the third floor of the community of Taihang Wutong Industrial Park, 9A Patentee after: Shenzhen Rubu Technology Co.,Ltd. Address before: 518126 Building No. 5B, Taihua Wutong Industrial Park, Guyu Development Zone, Hangcheng Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Jubo Intelligent Technology Co.,Ltd. |