CN210640205U - Silicon wafer transmission mechanism - Google Patents

Abstract

The application provides a silicon chip transmission device, silicon chip transmission device include a base, install respectively the base around first mount pad and second mount pad at both ends, transmission motor, be used for installing the motor mount pad of transmission motor, motor mount pad fixed mounting in the base on, first mount pad and second mount pad install a plurality of band pulleys, be rich on the band pulley and have the conveyer belt that is used for transmitting the silicon chip, one of them band pulley quilt in a plurality of band pulleys transmission motor drive. The utility model provides a silicon chip transmission device through the rotation of transmission motor drive band pulley to drive the operation of conveyer belt, the conveyer belt transports the silicon chip forward, and the round trip design of the conveyer belt of this application can adapt to the back-and-forth movement that removes the seat, and the conveyer belt is in the tensioning state all the time. The transmission of the silicon chip is more rapid and convenient.

Description

Silicon wafer transmission mechanism

Technical Field

The application relates to a silicon wafer transmission mechanism.

Background

The silicon chip is a carrier of the solar cell, the quality of the silicon chip directly determines the conversion efficiency of the solar cell, the solar cell needs a large-area PN junction to realize the conversion from light energy to electric energy, and the diffusion furnace is special equipment for manufacturing the PN junction of the solar cell. The tubular diffusion furnace mainly comprises an upper loading part and a lower loading part of a quartz boat, an exhaust gas chamber, a furnace body part, a gas holder part and the like. The diffusion is generally carried out by using a liquid source of phosphorus oxychloride as a diffusion source. The P-type silicon chip is placed in a quartz container of a tubular diffusion furnace, phosphorus oxychloride is brought into the quartz container by using nitrogen at the high temperature of 850-900 ℃, and phosphorus atoms are obtained by the reaction of the phosphorus oxychloride and the silicon chip. After a certain period of time, phosphorus atoms enter the surface layer of the silicon wafer from the periphery, and permeate and diffuse to the interior of the silicon wafer through gaps among the silicon atoms to form an interface of the N-type semiconductor and the P-type semiconductor, namely a PN junction.

Disclosure of Invention

The technical problem that this application will be solved provides a silicon chip transport mechanism.

In order to solve the technical problem, the application provides a silicon chip transmission device, silicon chip transmission device include a base, install respectively the base around first mount pad and second mount pad, transmission motor of both ends, be used for installing the motor mount pad of transmission motor, motor mount pad fixed mounting in the base on, first mount pad and second mount pad install a plurality of band pulleys, the band pulley is gone up and is had the conveyer belt that is used for transmitting the silicon chip, one of them band pulley of a plurality of band pulleys by transmission motor drive.

Preferably, the base is further provided with a sliding rail arranged along the front-back direction, a movable seat capable of moving on the sliding rail, and a driving cylinder for driving the movable seat to move along the sliding rail, the driving cylinder is fixedly mounted on the base, and the movable seat is located between the first mounting seat and the second mounting seat.

Preferably, an extension plate is mounted on the movable seat, the rear end of the extension plate is fixed on the movable seat, and the front end of the extension plate extends forwards relative to the movable seat and is inserted into the flower basket.

Preferably, the second mount pad on install by transmission motor drive's first band pulley, second band pulley, third band pulley, the front end that stretches out the board install the fourth band pulley, the removal seat on install the fifth band pulley, first mount pad on install the sixth band pulley, the second mount pad on still install the seventh band pulley, the conveyer belt walk around first band pulley, second band pulley, third band pulley, fourth band pulley, fifth band pulley, sixth band pulley and seventh band pulley in proper order.

Preferably, the silicon wafer conveying mechanism further comprises two silicon wafer centering mechanisms which are respectively arranged on two sides of the transmission belt.

Preferably, the silicon wafer centering mechanism comprises a fixed seat fixed on the base, a centering cylinder mounted on the fixed seat, and a centering moving block driven by the centering cylinder, a centering sheet is fixed on the centering moving block, a centering wheel mounting seat is mounted at the upper end of the centering sheet, two centering wheels are mounted on the centering wheel mounting seat, the wheel axle direction of the centering wheels is the up-down direction, and the wheel surface of the centering wheel is used for contacting the silicon wafer on the conveyor belt.

Preferably, the silicon wafer transmission mechanism further comprises a first silicon wafer sensor installed on the base, the first silicon wafer sensor is used for detecting whether silicon wafers on the conveyor belt are overlapped, and when the silicon wafers on the conveyor belt are overlapped, the first silicon wafer sensor sends out a signal.

Preferably, the moving seat is further provided with a second silicon chip inductor, and the second silicon chip inductor is used for detecting whether a silicon chip on the conveying belt exists or not.

The utility model provides a silicon chip transmission device through the rotation of transmission motor drive band pulley to drive the operation of conveyer belt, the conveyer belt transports the silicon chip forward, and the round trip design of the conveyer belt of this application can adapt to the back-and-forth movement that removes the seat, and the conveyer belt is in the tensioning state all the time. The transmission of the silicon chip is more rapid and convenient.

Specific embodiments of the present application are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the application may be employed. It should be understood that the embodiments of the present application are not so limited in scope. The embodiments of the application include many variations, modifications and equivalents within the spirit and scope of the appended claims.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for assisting the understanding of the present application, and are not particularly limited to the shapes, the proportional sizes, and the like of the respective members in the present application. Those skilled in the art, having the benefit of the teachings of this application, may select various possible shapes and proportional sizes to implement the present application, depending on the particular situation. In the drawings:

FIG. 1 is a schematic structural view of an NG flower basket collection device of the present application;

FIG. 2 is a schematic structural diagram of a flower basket mounting mechanism for mounting a flower basket according to the present application;

FIG. 3 is a schematic structural view of the present invention;

FIG. 4 is a schematic mechanical view of the basket clamping mechanism of the present application;

FIG. 5 is a schematic view of a portion of the construction of the present basket clamping mechanism;

FIG. 6 is a schematic structural view of a silicon wafer transfer mechanism according to the present application;

FIG. 7 is a schematic structural view of a silicon wafer transfer mechanism according to the present application;

FIG. 8 is a schematic structural view of the movement mechanism of the present application;

figure 9 is a schematic diagram of the structure of the silicon wafer centering mechanism of the present application,

wherein: 100. a flower basket; 200. a silicon wafer;

1. a lifting mechanism; 2. a flower basket mounting mechanism; 3. a silicon wafer transmission mechanism;

21. a top plate; 22. a base plate; 23. an upper positioning cylinder; 24. an upper positioning head; 25. a basket clamping mechanism;

251. a clamping cylinder; 252. clamping the piston rod; 253. clamping a moving block; 254. a fixed shaft; 255. a clamping block; 256. a first link; 257. a second link; 2531. a long hole; 2551. a clamping portion;

31. a base; 32. a first silicon wafer sensor; 33. a silicon wafer centering mechanism; 34. a transmission motor;

41. a driving cylinder; 42. a drive piston rod; 43. a slide rail; 44. a movable seat; 45. a motor mounting seat; 46. extending the plate; 47. a second mounting seat; 36. a first mounting seat; 48. a second silicon wafer inductor;

51. a first pulley; 52. a second pulley; 53. a third belt pulley; 54. a fourth pulley; 55. a fifth belt pulley; 56. a sixth pulley; 57. a seventh pulley;

331. a fixed seat; 332. placing the middle piece; 333. a centering wheel mounting seat; 334. placing a middle wheel; 335. a centering cylinder; 336. centering the moving block.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, the NG basket collecting device according to the present application includes a basket mounting mechanism 2 for mounting a basket 100, a lifting mechanism 1 capable of driving the basket mounting mechanism 2 to move up and down, and a silicon wafer conveying mechanism 3 for conveying silicon wafers 200 into the basket 100.

As shown in fig. 2, the basket mounting mechanism 2 is provided with the basket 100 according to the present invention, and as shown in fig. 3, the basket mounting mechanism 2 is provided without the basket 100.

The flower basket mounting mechanism 2 comprises a top plate 21, a bottom plate 22 and a rear side plate, the flower basket is mounted between the top plate 21 and the bottom plate 22, and the rear side plate is mounted on the lifting device and used for driving the flower basket mounting mechanism 2 to move up and down.

The top plate 21 is provided with an upper positioning cylinder 23 and an upper positioning head 24 which can move up and down under the driving of the upper positioning cylinder 23, and the conical structure of the upper positioning head 24 can be inserted into the top of the flower basket 100 and can adapt to the position of the flower basket 100.

A basket seat for placing the basket 100 is further installed on the bottom plate 22 of the basket installation mechanism 2.

The flower basket clamping mechanism 25 is mounted on the bottom plate 22, as shown in fig. 4, the flower basket clamping mechanism 25 of the present application includes a fixed shaft 254, two clamping blocks rotatably sleeved on the fixed shaft 254, a first connecting rod 256 and a second connecting rod 257 connected between the two clamping blocks, a clamping moving block 253 is sleeved on the second connecting rod 257, a clamping cylinder 251 is further mounted on the bottom plate 22, the clamping cylinder 251 includes a clamping piston rod 252, an end of the clamping piston rod 252 is connected to the clamping moving block 253, the clamping moving block 253 moves in a direction perpendicular to the fixed shaft 254 under the driving of the clamping cylinder 251, and the clamping moving block 253 drives the clamping blocks to rotate around the fixed shaft 254.

The first connecting rod 256 and the second connecting rod 257 are respectively located at the upper and lower sides of the fixed shaft 254.

As shown in fig. 5, which is a partial structural schematic view of the basket clamping mechanism 25 of the present application, the clamping block is provided with a clamping portion 2551, and the clamping portion 2551 is a recessed area into which the bottom of the basket 100 can be inserted. The clamping moving block 253 is provided with a long hole 2531 arranged along the vertical direction, and the second connecting rod passes through the long hole 2531 and can move up and down relative to the long hole 2531.

The clamping portion 2551 is positioned above the fixed shaft 254.

The process of installing the basket of flowers 100 by the basket of flowers installation mechanism 2 is that the basket of flowers 100 is installed on the basket of flowers installation mechanism 2, the bottom of the basket of flowers 100 is supported on the basket of flowers placing seat, the upper positioning cylinder 23 controls the upper positioning head 24 to be inserted into the top of the basket of flowers 100, and the upper positioning of the basket of flowers 100 is realized. The clamping cylinder 251 controls the clamping moving block 253 to horizontally move along a direction perpendicular to the fixed shaft 254, and the clamping moving block 253 drives the clamping moving block 253 to rotate around the fixed shaft 254, so that the bottom of the flower basket 100 is clamped into the clamping portion 2551 of the clamping block.

Since the hole of the clamping moving block 253 through which the second connecting rod 257 passes is the long hole 2531, the clamping block is not blocked in the process of rotating around the fixed shaft 254.

As shown in fig. 6, for the silicon wafer conveying mechanism 3 of the present application, the silicon wafer conveying mechanism 3 includes a base 31, a first mounting seat 36 and a second mounting seat 47 respectively installed at the front end and the rear end of the base 31, a conveying motor 34, and a motor mounting seat 45 for mounting the conveying motor 34, the motor mounting seat 45 is fixedly installed on the base 31, the first mounting seat 36 and the second mounting seat 47 are installed with a plurality of belt pulleys, a conveying belt for conveying the silicon wafer 200 is wound on the belt pulleys, and one of the belt pulleys is driven by the conveying motor 34.

In a preferred embodiment, a slide rail 43 is further installed on the base 31 along the front-back direction, a movable base 44 is movably installed on the slide rail 43, and a driving cylinder 41 is installed on the base 31 for driving the movable base 44 to move along the slide rail 43. The movable base 44 is located between the first mounting base 36 and the second mounting base 47.

The movable base 44 is provided with an extension plate 46, the rear end of the extension plate 46 is fixed on the movable base 44, and the front end of the extension plate 46 extends forwards relative to the movable base 44 and is inserted into the flower basket 100.

In a preferred embodiment, as shown in fig. 7 and 8, the second mounting seat 47 is provided with a first pulley 51, a second pulley 52 and a third pulley 53 driven by the transmission motor 34, the front end of the extension plate 46 is provided with a fourth pulley 54, the moving seat 44 is provided with a fifth pulley 55, the first mounting seat 36 is provided with a sixth pulley 56, and the second mounting seat 47 is further provided with a seventh pulley 57. The belt passes around a first pulley 51, a second pulley 52, a third pulley 53, a fourth pulley 54, a fifth pulley 55, a sixth pulley 56 and a seventh pulley 57 in this order.

The silicon wafer transmission mechanism 3 works on the principle that the driving cylinder 41 drives the moving seat 44 to move back and forth along the pulley to adjust the position of the extending plate 46, and in actual operation, the silicon wafer transmission mechanism can be adjusted according to the position of the flower basket 100.

The belt wheel is driven to rotate by the transmission motor 34, so that the belt wheel runs, and the silicon wafer 200 is conveyed forwards by the belt wheel. The design of detouring of the conveyer belt of this application can adapt to the back-and-forth movement of removing seat 44, and the conveyer belt is in the tensioning state all the time.

The silicon wafer transmission mechanism 3 further comprises two silicon wafer centering mechanisms 33 respectively installed on two sides of the transmission belt, as shown in fig. 9, the silicon wafer centering mechanism 33 of the present application includes a fixed seat 331 fixed on the base 31, a centering cylinder 335 installed on the fixed seat 331, and a centering moving block 336 driven by the centering cylinder 335, a centering sheet 332 is fixed on the centering moving block 336, a centering wheel installation seat 333 is installed at the upper end of the centering sheet 332, and two centering wheels 334 are installed on the centering wheel installation seat 333.

The wheel axis direction of the centering wheel 334 is the up-down direction, and the wheel surface of the centering wheel 334 is used for contacting the silicon chip 200 on the conveyor belt.

The silicon wafer centering mechanism 33 works by driving the centering moving block 336 through the centering cylinder 335, and the centering moving block 336 drives the centering plate 332 to move, so as to drive the centering wheel 334 to move. The centering wheels 334 of the silicon wafer centering mechanisms 33 positioned on both sides of the conveyor belt respectively contact both sides of the silicon wafer 200 to play a role in centering the silicon wafer 200.

The silicon wafer transmission mechanism 3 further comprises a first silicon wafer sensor 32 installed on the base 31, wherein the first silicon wafer sensor 32 is used for detecting whether the silicon wafers 200 on the conveyor belt are overlapped, and when the silicon wafers 200 on the conveyor belt are overlapped, the first silicon wafer sensor 32 sends out a signal.

The moving seat 44 is further provided with a second silicon wafer sensor 48, and the second silicon wafer sensor 48 is used for detecting whether the silicon wafer 200 on the conveyor belt exists or not.

The NG basket of flowers collection device of this application, through silicon chip transport mechanism with silicon chip 200 piece by piece spread into basket of flowers 100, basket of flowers installation mechanism 2 moves downwards gradually under elevating system 1's drive simultaneously, accomplishes silicon chip 200's automatic collection. The device is used for collecting reworkable bad pieces after color difference detection, and the bad pieces are regularly loaded into the flower basket 100. The former bad slices are randomly put into a material box and piled together, and the later stage needs to manually insert the bad slices into the flower basket 100 by one slice, so that the silicon slices 200 are easily damaged in the later stage, and the cost is wasted. The collecting device can automatically collect the chips, is high in working efficiency, cannot cause damage to the bad chips, and saves cost.

It is to be noted that, in the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified.

All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.

A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego the subject matter and should not be construed as an admission that the applicant does not consider such subject matter to be part of the disclosed subject matter.

Claims (8)

1. The silicon wafer transmission mechanism is characterized by comprising a base, a first mounting seat and a second mounting seat which are respectively arranged at the front end and the rear end of the base, a transmission motor and a motor mounting seat for mounting the transmission motor, wherein the motor mounting seat is fixedly arranged on the base, a plurality of belt wheels are arranged on the first mounting seat and the second mounting seat, a conveying belt for conveying the silicon wafers is wound on the belt wheels, and one of the belt wheels is driven by the transmission motor.

2. The silicon wafer conveying mechanism according to claim 1, wherein: still install a slide rail that sets up along the fore-and-aft direction on the base, can the slide rail on the removal seat that removes, be used for the drive the removal seat along the drive actuating cylinder of slide rail removal, drive actuating cylinder fixed mounting be in the base on, the removal seat be located between first mount pad and the second mount pad.

3. The silicon wafer conveying mechanism according to claim 2, wherein: the movable seat is provided with an extension plate, the rear end of the extension plate is fixed on the movable seat, and the front end of the extension plate extends forwards relative to the movable seat and is inserted into the flower basket.

4. The silicon wafer conveying mechanism according to claim 3, wherein: the second mount pad on install by transmission motor driven first band pulley, second band pulley, third band pulley, the front end that stretches out the board install the fourth band pulley, the removal seat on install the fifth band pulley, first mount pad on install the sixth band pulley, the second mount pad on still install the seventh band pulley, the conveyer belt walk around first band pulley, second band pulley, third band pulley, fourth band pulley, fifth band pulley, sixth band pulley and seventh band pulley in proper order.

5. The silicon wafer conveying mechanism according to claim 1, wherein: the silicon wafer transmission mechanism also comprises two silicon wafer centering mechanisms which are respectively arranged on two sides of the transmission belt.

6. The silicon wafer conveying mechanism according to claim 5, wherein: the silicon wafer centering mechanism comprises a fixed seat fixed on a base, a centering cylinder installed on the fixed seat and a centering moving block driven by the centering cylinder, a centering sheet is fixed on the centering moving block, a centering wheel installation seat is installed at the upper end of the centering sheet, two centering wheels are installed on the centering wheel installation seat, the wheel axle direction of the centering wheels is the up-down direction, and the wheel surface of the centering wheel is used for contacting a silicon wafer on a conveyor belt.

7. The silicon wafer conveying mechanism according to claim 1, wherein: the silicon wafer transmission mechanism further comprises a first silicon wafer sensor arranged on the base, the first silicon wafer sensor is used for detecting whether silicon wafers on the conveying belt are overlapped or not, and when the silicon wafers on the conveying belt are overlapped, the first silicon wafer sensor sends out a signal.

8. The silicon wafer conveying mechanism according to claim 2, wherein: the moving seat is also provided with a second silicon chip inductor which is used for detecting whether a silicon chip on the conveying belt exists or not.

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