CN209183527U - A kind of automatic positioning detection device for wafer - Google Patents
A kind of automatic positioning detection device for wafer Download PDFInfo
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- CN209183527U CN209183527U CN201821872363.4U CN201821872363U CN209183527U CN 209183527 U CN209183527 U CN 209183527U CN 201821872363 U CN201821872363 U CN 201821872363U CN 209183527 U CN209183527 U CN 209183527U
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- wafer
- carried
- load carrier
- sliding
- mechanical arm
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Abstract
The utility model relates to a kind of automatic positioning detection device for wafer, solve the problems, such as that the mode for manually carrying out positioning placement to wafer is difficult to improve production efficiency, its key points of the technical solution are that, comprising: workbench;It is carried on manipulator mechanism on the workbench, for shifting wafer;It is carried on load carrier on the workbench, that the wafer and the driving wafer rotation are placed for the manipulator mechanism;Be carried on it is on the load carrier and be located at it is above the load carrier, in the wafer rotation carried on the load carrier, to the center of circle of the wafer, lack side or notch carries out the alignment sensor of detection and localization;And it is electrically connected to the controller of the alignment sensor, achieve the purpose that carry out localization process to wafer automatically and is shifted automatically.
Description
Technical field
The utility model relates to wafer production equipment technology, in particular to a kind of automatic positioning for wafer
Detection device.
Background technique
A kind of wafer is to melt by purifying, after distillation, silicon crystal stick is made, fab takes this again silicon
A little silicon crystal stick grindings, polishing and the circular piece for being sliced manufactured standard, it is uncomfortable since circular wafer itself is without directionality
The transmission of electronics is closed, therefore can generally cut out a side or V-groove notch on the circumference of these wafers.
Wafer after processing needs to carry out performance detection, and then whether the wafer detected after processing is qualified product, people
When wafer is placed on platform to be detected by work, need to carry out the scarce side of wafer or V-notch according to preset direction
Placement, it is manually lower to the mode working efficiency that wafer carries out positioning placement, it is unfavorable for producing in batches.
Utility model content
The purpose of the utility model is to provide a kind of automatic positioning detection devices for wafer, automatically to wafer into
Row positions and is shifted to the wafer after positioning and effectively increase working efficiency.
The above-mentioned technical purpose of the utility model has the technical scheme that a kind of for wafer
It is automatically positioned detection device, comprising: workbench;It is carried on manipulator mechanism on the workbench, for shifting wafer;
Be carried on it is on the workbench, holding for the wafer and driving wafer rotation is placed for the manipulator mechanism
Mounted mechanism;Be carried on it is on the load carrier and be located at it is above the load carrier, carried on the load carrier
Wafer rotation when, to the center of circle of the wafer, lack side or notch carries out the alignment sensor of detection and localization;And
Be electrically connected to the alignment sensor, indicate in the wafer in the inductive signal of the alignment sensor
When heart position and the inconsistent center of the load carrier, control the manipulator mechanism pickup wafer and to institute
Position of the wafer on the load carrier is stated to be adjusted and indicate the crystalline substance in the inductive signal of the alignment sensor
The center of disk is consistent with the center of the load carrier and when detecting the scarce side or the notch, control institute
It states manipulator mechanism and the wafer is transferred to the controller that detection station detects.
By using above-mentioned technical proposal, wafer is placed on load carrier by manipulator mechanism, load carrier driving
Whether wafer rotation, alignment sensor unanimously detect the center of wafer and the center of load carrier,
When the center of the center of the inductive signal of alignment sensor instruction wafer and load carrier is inconsistent, positioning is passed
The inductive signal of sensor is transmitted to controller, and controller control manipulator mechanism picks up wafer and adjusts wafer in carrying machine
Position on structure, when the center of the inductive signal instruction wafer of alignment sensor and the center one of load carrier
Cause and at the scarce side or gap position for navigating to wafer, the inductive signal of alignment sensor is transmitted to controller, controller
Wafer is transferred to detection station and detected by control manipulator mechanism, with the mode for manually carrying out positioning placement to wafer
It compares, alignment sensor positions the scarce side of wafer or gap position, and passes through manipulator mechanism and load carrier tune
The position of whole wafer effectively increases the location efficiency to wafer, is conducive to batch production, while can be improved to wafer
Positioning accuracy.
The further setting of the utility model, the manipulator mechanism include: the rotary pneumatic being carried on the workbench
Cylinder;The mounting table being assemblied in above the rotary cylinder;Machinery on the mounting table, for shifting the wafer
Arm;And it is carried on sliding assembly on the mounting table, that the driving mechanical arm is mobile relative to the mounting table.
Center and carrying by using above-mentioned technical proposal, when the inductive signal instruction wafer of alignment sensor
When the center of mechanism is inconsistent, controller controls the movement of sliding assembly driving manipulator arm, so that mechanical arm is to wafer
Position of the piece on load carrier is adjusted, center and carrying when the inductive signal instruction wafer of alignment sensor
The center of mechanism is consistent and at the scarce side or gap position for navigating to wafer, and mechanical arm picks up wafer, rotation
Cylinder drives mounting table rotation, so that wafer is transferred to detection station by mechanical arm.
The further setting of the utility model, the sliding assembly include: be carried on it is on the mounting table, for the machine
The sliding rail of tool arm sliding;Be fixedly arranged on described mechanical arm one end, for driving the mechanical arm sliding on the sliding rail
Dynamic sliding block;The driving motor for driving the sliding block to slide on the sliding rail;It is mutually filled with described driving motor output shaft one end
The belt pulley set matched;And be sheathed on it is in the belt pulley set and be arranged in it is in the sliding block, for driving the cunning
The mobile belt of block.
By using above-mentioned technical proposal, mechanical arm is slidably connected on sliding rail by sliding block, in the drive of driving motor
Under movement is used, belt pulley set and belt band movable slider slide on the slide rail, so that mechanical arm slides on the slide rail, and then realize
Pickup and placement operation to wafer.
The further setting of the utility model, the load carrier include: be carried on it is on the mounting table, for carrying
The turntable of the wafer;Drive the rotating electric machine of the turntable rotation;And it is carried on the mounting table, drive
Lifting cylinder moving turntable lifting, picking and placing the wafer for the mechanical arm;The one of the mechanical arm
End is equipped with the groove passed through for the turntable.
By using above-mentioned technical proposal, lifting cylinder driving turntable rises and turntable is made to pass through mechanical arm
Groove, and then the wafer on mechanical arm is held up, rotating electric machine drives turntable rotation, so that alignment sensor is to wafer
The circle of piece is new, lack side or gap position is detected.
The further setting of the utility model, the mechanical arm are located at the groove side equipped with several for drawing institute
State the suction hole of wafer.
By using above-mentioned technical proposal, mechanical arm draws wafer by way of vacuum suction, so that wafer
What can be consolidated is carried on mechanical arm, and is not easy relative mechanical arm and is subjected to displacement, and avoids and wafer is placed or picked up
It damages or crushes caused by during taking.
The further setting of the utility model, the mechanical arm include: the basal plate being fixed on the sliding block;Sliding
It is connected to the sliding panel of the basal plate;And the sliding panel is lock onto the clamping screw of the basal plate.
By using above-mentioned technical proposal, sliding panel slides along basal plate and is conveniently adjusted the position of sliding panel to being suitable for pair
Wafer is picked up, clamping screw it is stable to the locking of sliding panel effect sliding panel be fixed on basal plate.
The further setting of the utility model, the mechanical arm are equipped with the rubber mat for carrying the wafer.
By using above-mentioned technical proposal, when mechanical arm adsorbs wafer, wafer is carried on mechanical arm
Rubber mat on, rubber mat quality is softer and is not easy to cause to damage to wafer.
In conclusion the utility model has the following beneficial effects:
1. being matched by alignment sensor, manipulator mechanism and load carrier to the scarce side of wafer or gap position
Automatically it is positioned, effectively increases positioning and fall, conducive to the batch production to wafer;
2. rubber mat is arranged on mechanical arm and effectively prevent wafer scraping collision mechanical arm, wafer damage is in turn resulted in
The case where occur.
Detailed description of the invention
Fig. 1 is the structural schematic diagram in the utility model embodiment for the automatic positioning detection device of wafer;
Fig. 2 is the connection relationship of alignment sensor in the utility model embodiment, turntable, rotating electric machine and lifting cylinder
Schematic diagram;
Fig. 3 is the company of sliding rail in the utility model embodiment, sliding block, driving motor, belt pulley set, belt and mechanical arm
Connect relation schematic diagram;
Fig. 4 is the structural schematic diagram of mechanical arm in the utility model embodiment.
Appended drawing reference: 1, workbench;2, manipulator mechanism;21, rotary cylinder;22, mounting table;23, mechanical arm;231,
Groove;232, basal plate;233, sliding panel;234, clamping screw;235, rubber mat;24, sliding assembly;241, sliding rail;242, sliding
Block;243, driving motor;244, belt pulley set;245, belt;3, load carrier;31, turntable;32, rotating electric machine;33, it rises
Sending down abnormally ascending cylinder;4, alignment sensor;5, suction hole;6, wafer.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Embodiment: a kind of automatic positioning detection device for wafer, as shown in Figure 1,
It include: workbench 1;It is carried on the manipulator mechanism 2 on workbench 1 and for shifting wafer 6;It is carried on work
Platform 1 and the load carrier 3 for being used to carry wafer 6 and wafer 6 is driven to rotate;It is carried on load carrier 3 and is located at carrying machine
The alignment sensor 4 of 3 top of structure;And it is electrically connected to the controller of alignment sensor 4.
Load carrier 3 drives wafer 6 to rotate, and alignment sensor 4 judges wafer by picking up the circumference of wafer 6
Whether 6 center location is consistent with the predeterminated position on load carrier 3, when the inductive signal of alignment sensor 4 indicates wafer 6
Center location and load carrier 3 on predeterminated position it is inconsistent when, controller control manipulator mechanism 2 pick up wafer 6, and
Adjust position of the wafer 6 on load carrier 3, when alignment sensor 4 inductive signal instruction wafer 6 center location with
When predeterminated position on load carrier 3 is consistent, then the position of scarce side or notch is found, when the inductive signal of alignment sensor 4 refers to
Show after searching out scarce side or gap position, controller controls manipulator mechanism 2 and picks up wafer 6, and shifts wafer 6 to performance
Detection station is detected.
As shown in Figure 1 and Figure 4, manipulator mechanism 2 includes: the rotary cylinder 21 being carried on workbench 1;It is assemblied in rotation
Mounting table 22 on 21 output shaft of cylinder;The mechanical arm 23 being carried on mounting table 22;And it is carried on mounting table 22 and drives
The mobile sliding assembly 24 of dynamic mechanical arm 23;One end machine-shaping of mechanical arm 23 has to be partially passed through for load carrier 3
Groove 231, and mechanical arm 23 carries wafer 6 by way of vacuum suction, in conjunction with Fig. 2, load carrier 3 includes: carrying
In the turntable 31 on mounting table 22 and for carrying wafer 6;The rotating electric machine 32 for driving turntable 31 to rotate;And it holds
It is loaded in the lifting cylinder 33 on the mounting table 22 and for driving turntable 31 to go up and down;24 driving manipulator arm 23 of sliding assembly
It is moved to 31 top of turntable, lifting cylinder 33 drives turntable 31 to rise, and turntable 31 passes through the groove on mechanical arm 23
231 and wafer 6 is held up, 24 driving manipulator arm 23 of sliding assembly leaves turntable 31, and rotating electric machine 32 drives turntable
31 rotations, and the center location of wafer 6, scarce side or gap position are judged for alignment sensor 4, work as alignment sensor
4 when navigating to the scarce side of wafer 6 or gap position, and 24 driving manipulator arm 23 of sliding assembly is moved to 31 lower section of turntable,
Lifting cylinder 33 drives turntable 31 to decline, so that wafer 6 drops down on mechanical arm 23,21 driving manipulator arm of rotary cylinder
23 rotations, are detected so that wafer 6 is transferred to performance detection station by mechanical arm 23.
As shown in figures 1 and 3, sliding assembly 24 includes: the cunning for being carried on mounting table 22 and sliding for mechanical arm 23
Rail 241;The sliding block 242 for playing the role of carrying to 23 one end of mechanical arm and being slided along sliding rail 241;It is carried on mounting table 22
Driving motor 243;The belt pulley set 244 being assemblied on the output output shaft of driving motor 243;And it is socketed on belt pulley set 244
And the belt 245 mobile with movable slider 242;Mechanical arm 23 is slidably connected on sliding rail 241 by sliding block 242, in driving electricity
Under the driving effect of machine 243, belt pulley set 244 and belt 245 slide on sliding rail 241 with movable slider 242, so that mechanical arm
23 slide on sliding rail 241, and then realize the pickup and placement operation to wafer 6.
As shown in Figure 1 and Figure 4, mechanical arm 23 includes: the basal plate 232 being carried on sliding block 242;It is slidably connected to base
The sliding panel 233 of laminate 232;And sliding panel 233 is lock onto the clamping screw 234 of basal plate 232;Sliding panel 233 is along base
Laminate 232 slides and is conveniently adjusted the position of sliding panel 233 to being suitable for being picked up wafer 6,234 pairs of clamping screw slidings
Plate 233 locking effect make sliding panel 233 it is stable be fixed on basal plate 232, the one end of sliding panel 233 far from basal plate 232
The suction hole 5 that several pairs of wafers 6 carried out absorption is formed, mechanical arm 23 draws wafer by way of vacuum suction
6, enable what wafer 6 consolidated to be carried on mechanical arm 23, and be not easy relative mechanical arm 23 and be subjected to displacement, it avoids
To wafer 6 place or pick process in caused by damage or crush, and rubber mat 235, mechanical arm are equipped on sliding panel 233
When 23 pairs of wafers 6 adsorb, wafer 6 is carried on the rubber mat 235 of mechanical arm 23,235 quality of rubber mat it is softer without
Easily wafer 6 is caused to damage.
The course of work and principle: wafer 6 is placed on load carrier 3 by manipulator mechanism 2, and load carrier 3 drives
Wafer 6 rotates, and whether alignment sensor 4 unanimously examines the center of wafer 6 and the center of load carrier 3
It surveys, when the center of the center of the inductive signal of alignment sensor 4 instruction wafer 6 and load carrier 3 is inconsistent,
The inductive signal of alignment sensor 4 is transmitted to controller, and controller control manipulator mechanism 2 picks up wafer 6 and adjusts wafer
Position of the piece 6 on load carrier 3, center and load carrier when the inductive signal instruction wafer 6 of alignment sensor 4
3 center is consistent and at the scarce side or gap position for navigating to wafer 6, and the inductive signal of alignment sensor 4 transmits
Wafer 6 is transferred to detection station and detects by controller, controller control manipulator mechanism 2, with manually to wafer 6 into
The mode that row positioning is placed is compared, and alignment sensor 4 positions the scarce side of wafer 6 or gap position, and passes through machinery
The position that mobile phone structure 2 and load carrier 3 adjust wafer 6 effectively increases the location efficiency to wafer 6, and it is raw to be conducive to batch
It produces, while can be improved the positioning accuracy to wafer 6.
Claims (7)
1. a kind of automatic positioning detection device for wafer characterized by comprising
Workbench (1);
It is carried on manipulator mechanism (2) on the workbench (1), for shifting wafer (6);
Be carried on it is on the workbench (1), the wafer (6) and the driving crystalline substance are placed for the manipulator mechanism (2)
The load carrier (3) of disk (6) rotation;
Be carried on it is on the load carrier (3) and be located at the load carrier (3) above, on the load carrier (3)
The positioning for carrying out detection and localization when wafer (6) rotation carried, to the center of circle, scarce side or notch of the wafer (6) passes
Sensor (4);And
Be electrically connected to the alignment sensor (4), in the inductive signal of the alignment sensor (4) indicate the wafer
(6) when the center of center and the load carrier (3) is inconsistent, manipulator mechanism (2) pickup institute is controlled
It states wafer (6) and position of the wafer (6) on the load carrier (3) is adjusted and is passed in the positioning
The inductive signal of sensor (4) indicate the center of the wafer (6) it is consistent with the center of the load carrier (3) and
It detects when the scarce side or the notch, the wafer (6) is transferred to detection station by the control manipulator mechanism (2)
The controller detected.
2. a kind of automatic positioning detection device for wafer according to claim 1, which is characterized in that the machinery
Mobile phone structure (2) includes:
The rotary cylinder (21) being carried on the workbench (1);
The mounting table (22) being assemblied in above the rotary cylinder (21);
Mechanical arms (23) on the mounting table (22), for shifting the wafer (6);And
It is carried on sliding on the mounting table (22), that the driving mechanical arm (23) is mobile relative to the mounting table (22)
Component (24).
3. a kind of automatic positioning detection device for wafer according to claim 2, which is characterized in that the sliding
Component (24) includes:
It is carried on sliding rail (241) on the mounting table (22), for the mechanical arm (23) sliding;
Be fixedly arranged on the mechanical arm (23) one end, for driving the mechanical arm (23) sliding on the sliding rail (241)
Dynamic sliding block (242);
The driving motor (243) for driving the sliding block (242) to slide on the sliding rail (241);
The belt pulley set (244) mutually assembled with the driving motor (243) output shaft one end;And
Be sheathed on it is on the belt pulley set (244) and be arranged in it is in the sliding block (242), for driving the sliding block
(242) mobile belt (245).
4. a kind of automatic positioning detection device for wafer according to claim 2, which is characterized in that the carrying
Mechanism (3) includes:
It is carried on turntables (31) on the mounting table (22), for carrying the wafer (6);
The rotating electric machine (32) for driving the turntable (31) to rotate;And
Be carried on it is on the mounting table (22), the driving turntable (31) lifting, so that the mechanical arm (23) takes
Put the lifting cylinder (33) of the wafer (6);
One end of the mechanical arm (23) is equipped with the groove (231) passed through for the turntable (31).
5. a kind of automatic positioning detection device for wafer according to claim 4, which is characterized in that the machinery
Arm (23) is located at the groove (231) side and is equipped with several suction holes (5) for being used to draw the wafer (6).
6. a kind of automatic positioning detection device for wafer according to claim 3, which is characterized in that the machinery
Arm (23) includes:
The basal plate (232) being fixed on the sliding block (242);
It is slidably connected to the sliding panel (233) of the basal plate (232);And
The sliding panel (233) is lock onto the clamping screw (234) of the basal plate (232).
7. a kind of automatic positioning detection device for wafer according to claim 2, which is characterized in that the machinery
Arm (23) is equipped with the rubber mat (235) for carrying the wafer (6).
Priority Applications (1)
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CN201821872363.4U CN209183527U (en) | 2018-11-14 | 2018-11-14 | A kind of automatic positioning detection device for wafer |
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CN201821872363.4U CN209183527U (en) | 2018-11-14 | 2018-11-14 | A kind of automatic positioning detection device for wafer |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110379747A (en) * | 2019-08-14 | 2019-10-25 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer piece cleans patch all-in-one machine |
CN117393453A (en) * | 2023-12-12 | 2024-01-12 | 迈为技术(珠海)有限公司 | Wafer notch detection device and detection method |
-
2018
- 2018-11-14 CN CN201821872363.4U patent/CN209183527U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110379747A (en) * | 2019-08-14 | 2019-10-25 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer piece cleans patch all-in-one machine |
CN110379747B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer cleaning and pasting integrated machine |
CN117393453A (en) * | 2023-12-12 | 2024-01-12 | 迈为技术(珠海)有限公司 | Wafer notch detection device and detection method |
CN117393453B (en) * | 2023-12-12 | 2024-02-13 | 迈为技术(珠海)有限公司 | Wafer notch detection device and detection method |
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Address after: 518172 Longgang District, Shenzhen City, Guangdong Province Patentee after: Silicon electric semiconductor equipment (Shenzhen) Co., Ltd Address before: 518172 Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN SIDEA SEMICONDUCTOR EQUIPMENT Co.,Ltd. |